Immersion Gold Plating

Description: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

Description: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards

Description: Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

Description: Specification for Electroless Nickel/Electroless Palladium Immersion Gold (ENEPIG) Plating for Printed Boards

Description: times; Good oxidation resistance due to the hard-gold plating process to the PCB pads. Difference between hard gold plating and flash gold plating To make a less valuable metal appear gold, a layer of gold that is less than 0.25 microns thick

Description: Replenishable PGC based immersion gold chemistry. It will deposit 2-4 microinches of gold on electroless nickel in 10 minutes. Techni IM Gold AT 6000 has a high tolerance for metallic contamination, yielding a longer bath life which lowers operating cost. The deposit is

• Chemical / Composition: Gold Plating

Description: Product Overview Our silver and gold electrolytic, immersion, and solvent-based organic post treatment solutions include: Silver Post Treatments Electrolytic, high-speed, water-based organic solution. Electrolytic, high speed, Pd base, high heat resistance. Immersion solution,

• Chemical / Composition: Gold Plating, Silver Plating, Tin Plating

Description: ENIG process designed for Pb-free reflow temperatures. Excellent solder joint strength. Equiaxal nickel grain structure.

• Chemical / Composition: Gold Plating, Nickel Plating - Hard

Description: TechniPad ENEPIG provides a very stable true electroless palladium for gold wire bonding capability and better wear resistance for multiple contacts.

• Chemical / Composition: Electroless, Gold Plating, Nickel Plating - Hard
• Features: Other

Description: A cyanide immersion gold process operating on a completely novel mechanism of gold reduction in the presence of nickel and Techni IM Gold AT6100 additive. During this reaction Ni is not removed from the substrate. This eliminates all of the corrosion associated with black

• Chemical / Composition: Gold Plating

Description: Immersion gold electrolyte for ENIG Gobright® TLA-77 is a special neutral immersion gold electrolyte. It is suitable for ENIG plating on PCB and ceramic substrates. The gold concentration in the electrolyte is just 0.4 g/l. This means a dramatically cost

Description: Immersion gold electrolyte for ENIG Gobright® TLA-77 is a special neutral immersion gold electrolyte. It is suitable for ENIG plating on PCB and ceramic substrates. The gold concentration in the electrolyte is just 0.4 g/l. This means a dramatically cost

Description: Plating of direct immersion gold Ever increasing electric components density and high frequencies of signal transmission require new concepts of final finishes in PCB manufacturing, too. By direct gold plating on copper (DIG) beside ISIG and EPIG a further process

Description: Plating of direct immersion gold Ever increasing electric components density and high frequencies of signal transmission require new concepts of final finishes in PCB manufacturing, too. By direct gold plating on copper (DIG) beside ISIG and EPIG a further process

Description: Immersion silver and semi-autocatalytic gold plating Umicores´ silver and gold plating process (ISIG) provides customers a high performance nickel-free coating which meets most of the common assembly requirements like multiple solderability and bondability with

Description: Electroless nickel - immersion gold Electroless nickel – immersion gold (ENIG) is a flat, solderable, metallic finish on printed circuit boards and ceramic substrates. It serves to protect the copper from oxidation and ensures solderability and bondability with aluminium

Description: FEATURES Lead-free RoHS/WEEE-compliant A cost-effective means of upgrading to a PLCC package type Clock Chip without changing your PCB layout GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 thick FR-406 or IS410 per IPC 4101C/26 with 1-oz. Cu traces, both sides PADS: finished with ENIG

• Operating Temperature: 105 C
• Number of Contacts: 20 to 16
• Contacts Pitch: 2.54 mm
• Socket Type: DIP, PLCC

Description: IS410 per IPC 4101C/26 with 1-oz. Cu traces, both sides finished with ENIG (Immersion Au over electroless Ni) PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M PIN PLATING: 10µ [0.25µ] Au per MIL-G-45204 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B OPERATING TEMPERATURE: 221°F

• Operating Temperature: 105 C
• Number of Contacts: 14 to 28
• Contacts Pitch: 0.4 to 0.6 mm
• Socket Type: DIP

Description: BODY: 0.062 [1.58] thick FR-406 or IS410 per IPC 4101C/26 with 1-oz. Cu traces, both sides PADS: finished with ENIG (Immersion Au over Electroless Ni) PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M PIN PLATING: 10µ [0.25µ] min. Au per MIL-G-45204 over 100µ [2.54µ] min. Ni per

• Current Rating: 1 amps
• Operating Temperature: 105 C
• Number of Contacts: 14 to 28
• Contacts Pitch: 2.54 mm

Description: Cu traces, both sides PADS: Finished with ENIG (Immersion Au over Electroless Ni) PINS: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00 PIN PLATING: 10µ [2.54µ] min. Au per MIL-G-45204 over 100µ [2.54µ] min. Ni per SAE AMS-QQ-N-290B OPERATING TEMPERATURE: 105°C max. MOUNTING

• Operating Temperature: 40.55555555555556 C
• Number of Contacts: 8 to 28
• Contacts Pitch: 0.4 to 0.6 mm
• Socket Type: DIP, SOIC / SOP

Description: Quality industrial plating and metal finishing services including: nickel, chromium, zinc, cadmium, silver, gold and tin. Electroless nickel, black chrome, hard chrome, black nickel. Expertise includes specialized masking operations and selective plating processes. Certified to

• Capabilities - Cleaning / Surface Preparation: Abrasive / Blasting, Anodizing, Buffing / Polishing, Deburring / Deflashing, Degreasing, Electropolishing, Mass Finishing (Tumbling / Vibratory), Oxygen Cleaning, Passivation, Peening, Pickling / Chemical Deburring, Sanding / Grinding, Ultrasonic Cleaning
• Materials: Aluminum, Ceramic, Copper / Copper Alloys, Iron / Cast Iron, Metal, Nickel / Nickel Alloys, Plastic / Polymer, Precious Metals, Stainless Steel, Steel / Steel Alloys, Titanium
• Capabilities - Recoating: Black Oxide, Chemical Finish / Conversion, Dip / Immersion Coating, Dry Lubricant Coating, Phosphate Coating, Plating / Electroplating
• Features: North America, Northeast US Only, Other, United States Only

Description: including Electroless Nickel/Immersion Gold (ENIG), silver, Organic Solderability Preservative (OSP), and immersion tin finishes.

• Industry: Electronics, Semiconductors / IC Packaging
• Features: Film / Sheet, Liquid, Other
• Substrate Compatibility: Metal

Description: Product Overview The Affinity Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) process is easy to operate, providing uniform nickel, palladium, and gold deposits with high reliability for soldering and wire bonding applications at the lowest cost of ownership.

• Type: Cleaner / Cleaning Agent, Surface Treatment
• Industry Applications: Electrical / Electronics

Description: ENIG Series Miniature multipliers featuring Electroless Immersion Nickel Gold (ENIG) plating for improved solderability and ease of installation. Voltage multipliers are AC to DC conversion devices that produce a high potential DC voltage from a lower voltage, AC source. VMI

• AC Input Voltage (V_p-p): 1,200 volts
• DC Output Voltage: 7,000 volts
• Input Frequency: 10 to 100 kHz
• Output Current: 0 to 50 µA

Description: including Surface Mount Pads Board Finishes · Alpha Silver · Hot Air Leveled · Solder Mask Over Bare Copper (SMOBC) · Immersion Gold · Electrolytic Gold · OSP (Organic Solderability Preservative)

• PCB Type: Double-Sided Boards, Flexible Boards, Multi-Layer Boards, Rigid-Flexible Boards, SMT Components, Single-Sided Boards, THT Components
• Features: East Asia / Pacific Only, North America, Southwest US Only, United States Only
• Supplier Capability: Just-In-Time Capability, PCB Assembly, Production Quantities, Prototype Quantities, Testing and Evaluation

Description: OF PPH Our company creates flexible printed circuit boards: up to 410 mm x 270 mm; A-class of complexity; Based on various types of DuPont films (non-adhesive, adhesive, top coat); With coatings of various types, including immersion and electroplating gilding, as well as immersion tin

• Thickness: 0.011811023622047244 inches
• Type: Film / Flexible Substrate