Immersion Gold Plating

Description: Description What is Selective Gold Plating PCB Firstly you need to know that Gold plating is frequently used to improve electrical conductivity while making printed circuit boards (PCBs). Gold plating, a new method of PCB manufacturers for bonding

Description: Replenishable PGC based immersion gold chemistry. It will deposit 2-4 microinches of gold on electroless nickel in 10 minutes. Techni IM Gold AT 6000 has a high tolerance for metallic contamination, yielding a longer bath life which lowers operating cost. The deposit is

• Chemical / Process: Gold Plating

Description: ENIG process designed for Pb-free reflow temperatures. Excellent solder joint strength. Equiaxal nickel grain structure.

• Chemical / Process: Gold Plating, Nickel Plating - Hard

Description: TechniPad ENEPIG provides a very stable true electroless palladium for gold wire bonding capability and better wear resistance for multiple contacts.

• Chemical / Process: Gold Plating, Nickel Plating - Hard, Other
• Electroless: Yes

Description: Electrolytic, high-speed, and water-based organic solutions. Product Overview Our silver and gold electrolytic, immersion, and solvent-based organic post treatment solutions include: Silver Post Treatments Electrolytic, high-speed, water-based organic

• Chemical / Process: Gold Plating, Tin Plating

Description: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards

Description: Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

Description: Specification for Electroless Nickel/Electroless Palladium Immersion Gold (ENEPIG) Plating for Printed Boards

Description: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

Description: A cyanide immersion gold process operating on a completely novel mechanism of gold reduction in the presence of nickel and Techni IM Gold AT6100 additive. During this reaction Ni is not removed from the substrate. This eliminates all of the corrosion associated with black

• Chemical / Process: Gold Plating

Description: Immersion gold electrolyte for ENIG Gobright® TLA-77 is a special neutral immersion gold electrolyte. It is suitable for ENIG plating on PCB and ceramic substrates. The gold concentration in the electrolyte is just 0.4 g/l. This means a dramatically cost

Description: Electrolytic, high-speed, water-based, and Pd-based solutions; immersion solutions; and solvent-based organic solutions. Product Overview Our range of silver and gold electrolytic, immersion, and solvent-based organic post treatment solutions include: Silver Post

• Chemical / Process: Silver Plating, Tin Plating

Description: Immersion silver and semi-autocatalytic gold plating Umicores´ silver and gold plating process (ISIG) provides customers a high performance nickel-free coating which meets most of the common assembly requirements like multiple solderability and bondability with

Description: Plating of direct immersion gold Ever increasing electric components density and high frequencies of signal transmission require new concepts of final finishes in PCB manufacturing, too. By direct gold plating on copper (DIG) beside ISIG and EPIG a further process

Description: Electroless nickel - immersion gold Electroless nickel – immersion gold (ENIG) is a flat, solderable, metallic finish on printed circuit boards and ceramic substrates. It serves to protect the copper from oxidation and ensures solderability and bondability with aluminium

Description: , both sides PADS: finished with ENIG (Immersion Au over Electroless Ni) PINS: 1/2-hard Brass 360 per UNS C36000, ASTM B16/B16M PIN PLATING: 10µ [0.25µ] min. Au per MIL-G-45204 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B OPERATING TEMPERATURE: 221°F [105°C] max. MOUNTING CONSIDERATIONS

• Contact Plating: Gold Plating, Nickel Plating
• Contacts Pitch: 2.54 mm
• Military Standards: Other
• Mounting: Through-hole

Description: consigned ICs, consult factory GENERAL SPECIFICATIONS ADAPTER BODY: 0.062 [1.58] thick FR-406 or IS410 per IPC 4101C/26 with 1-oz. Cu traces, both sides PADS: finished with ENIG (Immersion Au over Electroless Ni) PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16

• Contact Plating: Gold Plating, Nickel Plating
• Contacts Pitch: 2.54 mm
• Current Rating: 1 amps
• Mounting: Through-hole

Description: SPECIFICATIONS BOARD MATERIAL: 0.062 [1.58] thick FR-4 or IS410 per IPC 4101C/26 with 1-oz. Cu traces, both sides finished with ENIG (Immersion Au over electroless Ni) PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M PIN PLATING: 10µ [0.25µ] Au per MIL

• Contact Plating: Gold Plating, Nickel Plating
• Contacts Pitch: 0.4000 to 0.6000 mm
• Military Standards: Other
• Mounting: Through-hole

Description: GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 [1.58] thick FR-4 or IS410 per IPC 4101C/26 with 1-oz. Cu traces, both sides PADS: finished with ENIG (Immersion Au over Electroless Ni) PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M PIN PLATING: 10µ

• Contact / Pin Type: Straight Pins
• Contact Plating: Gold Plating, Nickel Plating
• Contacts Pitch: 0.3000 to 0.6000 mm
• Military Standards: Other

Description: constructed of aluminum which provides heatsinking up to 7.5 watts. Custom heatsinks can easily be designed for higher power dissipation. The user simply places the IC into the socket, closes the lid, and rotates the heatsink screw to seat the IC. PCB finish on pads can be HASL, Immersion,

• Contact / Pin Type: Spring Loaded
• Contact Plating: Gold Plating
• Contacts Pitch: 1.27 mm
• Features: Solderless, ZIF Lock, Clamshell Socket

Description: constructed of aluminum which provides heatsinking up to 7.5 watts. Custom heatsinks can easily be designed for higher power dissipation. The user simply places the IC into the socket, closes the lid, and rotates the heatsink screw to seat the IC. PCB finish on pads can be HASL, Immersion,

• Contact / Pin Type: Spring Loaded
• Contact Plating: Gold Plating
• Contacts Pitch: 1.27 mm
• Features: Solderless, ZIF Lock, Clamshell Socket

Description: Quality industrial plating and metal finishing services including: nickel, chromium, zinc, cadmium, silver, gold and tin. Electroless nickel, black chrome, hard chrome, black nickel. Expertise includes specialized masking operations and selective plating processes. Certified to

• Location: North America, United States Only, Northeast US Only
• Material / Substrate Capabilities: Aluminum, Ceramic, Copper / Copper Alloys, Iron / Cast Iron, Metal, Nickel / Nickel Alloys, Precious Metals, Plastic / Polymer, Stainless Steel, Steel / Steel Alloys, Titanium
• Recoating: Black Oxide, Chemical Finish / Conversion, Dip / Immersion Coating, Dry Lubricant Coating, Phosphate Coating, Plating / Electroplating, Other
• Refinishing / Surface Treatment: Abrasive / Blasting, Anodizing, Buffing / Polishing, Deburring / Deflashing, Electropolishing, Mass Finishing (Tumbling / Vibratory), Oxygen Cleaning, Passivation, Peening, Pickling / Chemical Deburring, Sanding / Grinding

Description: ENIG Series Miniature multipliers featuring Electroless Immersion Nickel Gold (ENIG) plating for improved solderability and ease of installation. Voltage multipliers are AC to DC conversion devices that produce a high potential DC voltage from a lower voltage, AC source

• AC Input Voltage (V_p-p): 800 volts
• DC Output Voltage: 2000 volts
• Input Frequency: 10 to 100 kHz
• Number of Stages: 6

Description: through-hole plating and solder mask coating Board Options · RoHS Compliance · Gold on Nickel Contact Fingers · CNC Routing · Scoring (V Grooving) · Panel Routing · Screen Printed Component Legends · Liquid Photoimageable Solder Mask

• Location: North America, United States Only, Southwest US Only, East Asia / Pacific Only
• PCB Type: Single-Sided Boards, Double-Sided Boards, Multi-Layer Boards, Flexible Boards, Rigid-Flexible  Boards, SMT Components, THT Components
• Supplier Capability: Prototype Quantities, Production Quantities, Testing and Evaluation, PCB Assembly, Just-In-Time Capability

Description: contacts. Operating temperature -55 to +85° C. Corrosion resistance 48 hours (salt spray) Number of Contacts = 7 Gender = Female Mounting Type = Panel Mount Termination Method = Solder Contact Gender = Male Body Orientation = Straight Series = CB Contact Plating = Gold

• Gender: Male / Plug, Female / Jack
• Geometry: Straight
• Number of Contacts: 7 #

Description: : hot-dip tinning (HASL), immersion coatings (nickel-gold, silver, tin), organic protective coatings (OSP), etc. PRODUCTION OF FLEXIBLE PRINTED CIRCUIT BOARDS IN CHINA Do you want to order the production of flexible printed circuit boards in China? Our company is at your service! Also,

• Thickness: 0.0118 inches
• Type: Film / Flexible Substrate