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Supplier: Indium Corporation
Description: Features Specifically designed for laser reflow Low solder ball and solder splattering Consistent fine pitch print deposition No-clean residue Meets RMA criteria ( QQ-S-571F) Superior tack strength Works in both air and nitrogen Halogen-containing
- Alloy: Indium (In)
- Approvals / Conformance: Other
- Form / Shape: Paste
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Supplier: Indium Corporation
Description: Features Specifically designed for laser reflow Very fine pitch print deposition Excellent wetting on multiple surfaces (OSP, Immersion Ag, Immersion Sn, ENIG) No-clean residue Works in both air and nitrogen Halogen-free
- Alloy: Indium (In)
- Approvals / Conformance: Other
- Form / Shape: Paste
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Supplier: Indium Corporation
Description: • Suitable for use down to 0.3mm pitch Application Solder paste is applied to the spheres in a doctor-bladed dipping process. • Typical package-on-package applications only need dipping to 25-45% of the sphere height Care must be taken to avoid contaminating the bottom of the package
- Form / Shape: Paste
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Supplier: Indium Corporation
Description: Indium10.8HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders.
- Approvals / Conformance: Other
- Form / Shape: Paste
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Supplier: Gesswein Co., Inc.
Description: Manufactured for Gesswein under strict quality guidelines so that composition, temperature and color are consistent and uniform from lot to lot. Contains no cadmium, no indium.
- Brazing Filler Alloys: Gold Alloy Braze
- Cadmium Free: Yes
- Form / Shape: Paste
- Melting Range: 1350 F
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Supplier: 3X Ceramic Parts Company Limited
Description: binder, is applied to the welded parts of ceramics and metals. The solder (pure silver, silver-copper solder or low-temperature solder such as lead, tin and indium) is directly added to the metal parts without sintering, and then it is fired in vacuum at one time. The two
- Density: 3.6 to 3.9 g/cc
- Material Type: Alumina / Aluminum Oxide
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Our offering includes leading lead-free, no-clean, halogen-free solder paste technologies for applications such as fine feature printing, low temperature processing, and many others. Alpha's® solder pastes are available in a wide range of alloy offerings, including low-Ag SACX (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
ALPHA OM-362, next-generation ultra-low voiding solder paste This lead-free, zero-halogen, no-clean paste can deliver less than 10 (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
ALPHA OM-565 HRL3 low temperature solder paste is designed to mitigate warpage induced defects in temperature sensitive chip-scale packages. The solder paste enables peak reflow temperatures of 175 °C and superior wettability to minimize post reflow defects (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
ALPHA® OM-377, a no-clean solder paste engineered for ultra-fine feature printing in advanced electronics assemblies. The formulation is designed to support long-term electrochemical reliability while helping manufacturers (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
ALPHA OM-220 innovative chemistry enables peak reflow temperatures below 150°C, making it ideal for soldering heat sensitive components and sub-assemblies. ALPHA OM-220 permits cascaded / hierarchical soldering, as well as novel hermetic sealing solutions. This (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
ALPHA® Exactalloy® Preforms in tape and reel packaging are used with solder paste to selectively increase solder volume using standard pick and place equipment. The preform is placed directly into the solder paste prior to assembly reflow. Alpha (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
MacDermid Alpha Electronics Solutions Expands Singapore Production Facility to Meet Growing Global Demand for Argomax® Silver Sintering Paste This strategic initiative marks a significant milestone in the company’s growth. At the heart of the (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
. “Reliability is never the result of a single material or process,” said Scott Lewin, Technical Business Development Director at MacDermid Alpha Electronics Solutions. “It comes from selecting a coordinated set of materials engineered to work together - solder pastes, alloys, reinforcements (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
award celebrates a collaboration of more than two decades, during which MacDermid Alpha has supplied advanced solder alloys, pastes, adhesives, and cleaners to support Syrma SGS’s expansion into one of India’s most technologically advanced manufacturers. In 2025, MacDermid Alpha (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
iron powder or hydride powder, with binder, is applied to the welded parts of ceramics and metals. The solder (pure silver, silver-copper solder or low-temperature solder such as lead, tin and indium) is directly added to the metal parts without sintering, and then it is fired in vacuum at one time (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited
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LED-Based Optical Device for Chronic In Vivo Cerebral Blood Volume Measurement
Low-melting- point indium solder paste is dispensed on the bonding attach- ment pads, and the LED and photodetector are positioned on the paste.
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Development of a simplified hybrid ambient low frequency, low intensity vibration energy scavenger system
Standard eutectic SnPb solder consumes the Ni/Ti/Au contact on the PZT beam, so indium solder paste is reflowed at 150˚C to attach the wires.
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Is it Really Impossible? Combining Superior Anti-Oxidation and Superior Print
Fig. 3 Soldering performance of solder pastes Indium 8.9ATG, 5, and 0.
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Rugged, low-cost pigtailing approach for LiNbO3 integrated optic devices
In order to attach the gyro chip to the mount, small dots of solder paste ( Indium Corporation of America #7, melting point = 209°C) were applied to the mount using a microdispenser.
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TiO2 nanoparticles functionalized Sn/3.0Ag/0.5Cu lead-free solder
Thus, the present work focuses on a lead-free solder paste Indium 8.9 (Snl3.0AglO.SCu) mixed with various weight ratios of Ti02, and investigates its wetability, shear strength, melting point, and metallographic structure.
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Interfacial reaction and dissolution behavior of Cu substrate in molten Sn-3.8Ag-0.7Cu-nano Mo composite solder
In these experiments commercial molybdenum nano powder (99.8% trace metal basis) was manually mixed with Sn-3.8Ag-0.7Cu (SAC) solder paste ( Indium Corporation of America) up to 5 wt. percent.
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ZCP2011MSTP0121
Experimental Procedure Composite solders were prepared by manual mixing of Mo nanoparticles (Aldrich, 99.8% trace metal basis) with Sn-3.8Ag-0.7Cu (SAC) solder paste ( Indium Corporation of America).
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Environmental tests for automotive electronic devices produced by lead-free technology
Materials used for production processes are as follows: for mounting of electronic components on circuit board - solder paste Indium 241-LF; for soldering "wave"-type and microwaves soldering - .
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X-ray and scanning acoustic microscopy analysis on lead-free automotive electronic module
Materials used for production processes are as follows: for mounting of electronic components on circuit board - solder paste Indium 241-LF; for soldering "wave"-type and microwaves soldering - .
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C-band low-loss phase shifter >360° for WLAN applications
The M/A-COM varactor diode was epoxied with solder paste ( Indium corporation) on the Duroid substrate, and the via-holes were done using a 10 mils bit (0.100 Stub Endmill, T-Tech Inc.).