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Supplier: TE Connectivity
Description: Configuration Features Grid Spacing (MM) : 0.7424x0.259 Number of Positions : 100 Contact Features Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material Thickness : .076 MICM [3 MICIN ] IC Socket Type : LGA 2010 Product Type Features Connector & Contact
- Current Rating: 0.5 amps
- Operating Temperature: -25 to 105 C
- Number of Contacts: 100
- Product Type: IC Socket
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Supplier: Utmel Electronic Limited
Description: Connector Accessories ILM Wide LGA Socket Stainless Steel
- Features: Other
- Geometry: Straight
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Supplier: Newark, An Avnet Company
Description: LGA SOCKET, 1944 POSITION, SMD; No. of Contacts:1944Contacts; Connector Type:LGA Socket; Pitch Spacing:-; Product Range:-; Row Pitch:-; Contact Material:Copper Alloy; Contact Plating:Gold Plated Contacts RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: LGA SOCKET, 3647POS; No. of Contacts:3647Contacts; Connector Type:LGA Socket; Pitch Spacing:-; Product Range:-; Row Pitch:-; Contact Material:Copper Alloy; Contact Plating:Gold Plated Contacts RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: LGA SOCKET, 2011 POSITION, SMD; No. of Contacts:2011Contacts; Connector Type:LGA Socket; Pitch Spacing:1.016mm; Product Range:-; Row Pitch:0.881mm; Contact Material:Copper Alloy; Contact Plating:Gold Plated Contacts RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: LGA SOCKET, 257POS, SMT; No. of Contacts:257Contacts; Connector Type:LGA Socket; Pitch Spacing:1mm; Product Range:-; Row Pitch:-; Contact Material:Copper Alloy; Contact Plating:Gold Plated Contacts; SVHC:No SVHC (27-Jun- RoHS Compliant: Yes
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Supplier: Rego Electronics Inc.
Description: We offer a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Our products are well designed in thermal performance based on our professional manufacturing know how. We also have the sophisticated equipment
- Length: 92.00000000000001 mm
- Width: 90 mm
- Height: 41.6 mm
- Weight: 626 g
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Supplier: Ironwood Electronics, Inc.
Description: SS-BGA sockets provide high bandwidth in a small, cost effective ZIF socket for prototype, test and burn-in applications. SS-BGA socket is a simple, mechanical socket based on spring pin technology. SS-BGA socket is a solder-less socket that can be mounted
- Number of Contacts: 376
- Contacts Pitch: 1 mm
- Socket Type: BGA
- Features: Clamshell Socket, Other, Solderless, ZIF Lock
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Supplier: Utmel Electronic Limited
Description: IC & Component Sockets 1-2134711-1 Dust Cover LGA 13XX
- Operating Temperature: -25 to 100 C
- Product Type: IC Socket
- Socket Type: LGA
- RoHS Compliant: RoHS Compliant
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Supplier: Rego Electronics Inc.
Description: We offer a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Our products are well designed in thermal performance based on our professional manufacturing know how. We also have the sophisticated equipment
- Length: 82 mm
- Width: 80.00000000000001 mm
- Height: 25.500000000000004 mm
- Weight: 325 g
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Supplier: Xoxide
Description: The dawn of a new age has come for your high performance desktop. That's right, the new Socket LGA 1366 revolution is here, and your CPU cooler is going to need to be prepared. These unique 4-way mounting clips are designed to make all available Scythe CPU Coolers fully compatible with
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Supplier: Rego Electronics Inc.
Description: We offer a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Our products are well designed in thermal performance based on our professional manufacturing know how. We also have the sophisticated equipment
- Length: 104 mm
- Width: 70 mm
- Height: 67 mm
- Weight: 660 g
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Supplier: Ironwood Electronics, Inc.
Description: ZIF sockets, such as as our GHzBGA sockets ,allow for repeated hand insertions of IC devices. Production sockets are less expensive than typical ZIF's, but do not hold up to as many insertion cycles.
- Number of Contacts: 360
- Contacts Pitch: 1.27 mm
- Socket Type: BGA
- Features: Clamshell Socket, Other, Solderless, ZIF Lock
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Supplier: Accuris
Description: Detail Specification for Production Land Grid Array (LGA) Socket for Use in Electronic Equipment
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Supplier: Advanced Interconnections Corp.
Description: Using our exclusive, field-proven eutectic solder ball terminal design, the SMT Adapter from Advanced provides a reliable solution for mounting or socketing LGA or re-worked BGA devices. Use in connection with our BGA Sockets for LGA to BGA conversion or board to board
- Number of Contacts: 4 to 1,936
- Contacts Pitch: 0.8 to 1.27 mm
- Socket Type: BGA, LGA, Test / Prototyping Socket
- Contact Plating: Gold Plating
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Supplier: Global American, Inc.
Description: 3301720 - Full-Size PICMG 1.0 SBC with LGA 775 (Socket T) for Intel Pentium 4, Celeron D, or Pentium
- Max Speed: 0.266 to 0.4 GHz
- Memory Capacity: 2 GB
- Processor / CPU: Intel® Celeron®
- Chipset: Intel® Chipset
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Supplier: Global American, Inc.
Description: 2808008 - Extended ATX Industrial Motherboard with Dual Socket LGA 1366 for Intel Xeon 5500/5600 Server Processors
- Max Speed: 0.8 to 1.366 GHz
- Memory Capacity: 48 to 192 GB
- PCI Slots: 2
- LAN / Networking: 1
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Supplier: ToneCooling Technology Co., Ltd
Description: The TC-LGA2011-R16 CPU Cooler is a reliable and high-efficiency thermal solution designed for Intel® Xeon® processors using the LGA 2011 socket. Engineered to deliver exceptional heat dissipation and long-term stability, the R16 is ideal for performance-critical applications in
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Supplier: Aries Electronics, Inc.
Description: innovative, protected, validated and released product with capacity and quality control available to meet existing and emerging customer needs MECHANICAL CONTACT LENGTH (compressed): 0.45mm PITCH: Released to <0.4mm – Mixed Pitch Available PACKAGES: BGA, LGA, QFN, DFN, CSP, POP – Full and
- Current Rating: 4 amps
- Operating Temperature: -55 to 200 C
- Contacts Pitch: 10.16 mm
- Socket Type: BGA, LGA, QFN, Test / Prototyping Socket
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Supplier: Xoxide
Description: This CPU cooler for socket 1156 chips features a push-pin design for easy installation. Specifications: Dimensions: 95 x 95 x 40 mm Bearing Type: Ever Lubricate long-life bearing RPM: 2600±10% RPM Noise: <33 dBA
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Supplier: Global American, Inc.
Description: 2808195- ATX Industrial Motherboard with Socket LGA 1156 for Intel Core i7 / i5 / i3 series Desktop processors
- Max Speed: 1.066 to 1.333 GHz
- Memory Capacity: 16 GB
- ISA Slots: 1
- PCI Slots: 4
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Supplier: Xoxide
Description: This CPU cooler for socket 1366 chips features a push-pin design for easy installation. Specifications: Dimensions: 95 x 95 x 65 mm Bearing Type: Ever Lubricate long-life bearing RPM: 2600±10% RPM Noise: <33 dBA
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Supplier: Global American, Inc.
Description: 2808001 - MicroATX Industrial Motherboard with Dual Socket LGA 1366 for Intel Xeon 5400 / 5300 / 5200 / 5100 Server Processors
- Max Speed: 0.533 to 0.667 GHz
- Memory Capacity: 48 GB
- PCI Slots: 1
- LAN / Networking: 2
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Supplier: ToneCooling Technology Co., Ltd
Description: The TC-LGA2011-1U3CC CPU Cooler is a compact, high-performance cooling solution engineered for Intel® Xeon® processors with LGA 2011 sockets. Built to meet the demanding requirements of 1U rackmount servers, this cooler provides reliable thermal management in high-density computing
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Supplier: ToneCooling Technology Co., Ltd
Description: The TC-LGA115X-1U3CC CPU Cooler is a highly efficient, low-profile cooling solution designed for Intel® LGA115X socket processors, including LGA1150, LGA1151, LGA1155, and LGA1156. This cooler is tailored for 1U rackmount server systems, offering a perfect balance of space efficiency and
- Device: Thermo-Electric Cooler
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Supplier: Win Source Electronics
Description: Category: Heatsink Win Source Part Number: 1435515-SUPERMICRO SNK-P0077P - Supermicro 1U Passive CPU Heat Sink Socket LGA4189 Manufacturer: Supermicro
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Supplier: Sensata Technologies
Description: Clamshell design, compression surface mount Spring and probe contact Pointed probe maintains continuous contact to PCB Spring loaded pressure pad and locater plate Pointed top interface to DUT pad Multi-site options are available Any pitch or pitch combination .4mm and greater Threaded inserts
- Contact Resistance: 349.99999999999994 milliohms
- Operating Temperature: 125 C
- Contact Plating: Gold Plating
- Product Type: IC Socket
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Supplier: Sensata Technologies
Description: Open Top Compression Surface Mount Spring and probe contact Pointed probe contacts DUT pad Pointed probe maintains continuous contact to PCB Spring loaded floating locater plate Any pitch or pitch combination .4mm and greater Threaded inserts available Available with high performance pin
- Contact Resistance: 349.99999999999994 milliohms
- Operating Temperature: 125 C
- Contact Plating: Gold Plating
- Product Type: IC Socket
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Supplier: Aries Electronics, Inc.
Description: KEY PERFORMANCE ELEMENTS – Series AR4HT High-Temperature 200°C (high-frequency bandwidth, low inductance, and high-current applications in a reliable and durable socket housing) Excellent Compliance (shorter than other low-profile contacts, enables reliable ATE testing and burn-in). Excellent
- Operating Temperature: -67 to 392 C
- Contacts Pitch: 2.54 mm
- Socket Type: BGA, CSP, LGA, QFN, Test / Prototyping Socket
- Features: Clamshell Socket, Other
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: LGA Sockets SOCKET ASSY LGA1151 0.38AU Product overview: 2287402-1 from TE Connectivity is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and
- Operating Temperature: -25 C
- Features: Other
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Supplier: ToneCooling Technology Co., Ltd
Description: The TC-LGA115X-1U1C CPU Cooler is a low-profile, high-efficiency cooling solution designed for Intel® LGA115X socket processors, including LGA1150, LGA1151, LGA1155, and LGA1156. Engineered for 1U rackmount server environments, this cooler delivers reliable thermal performance in
- Device: Thermo-Electric Cooler
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Supplier: Xoxide
Description: The future of PC modding is here. If you ain't ready yet, well, you best get prepared. An ideal accessory for your upgraded PC, this Gelid Solutions LGA-1366 Mounting Clip enables the Silent Spirit CPU Cooler to fit perfectly with Intel’s LGA-1366 socket (also known as
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Supplier: Powell Electronics, Inc.
Description: DUAL LGA,257 POS, DMD SOCKET
- Product Type: IC Socket
- Socket Type: LGA
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Supplier: Advantech
Description: Compact Fanless System with 10th Gen Intel® Xeon®/Core™ i CPU Socket (LGA 1200) Intel® 10th Gen Xeon®/Core™ i CPU socket-type (LGA1200) with Intel® W480E/H420E chipset Wide operating temperature (-10 ~ 60 °C), 9 ~ 36 VDC input power range 2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x
- Processor: Intel®
- Features: Other
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include SMD, LGA. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, SMD, LGA, Memory IC and Storage Component,
- Operating Temperature: -25 C
- Features: Other
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Featured Products Top
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interconnections between system devices.? Greater number of memory channels enable speed intensive applications such as artificial intelligence and machine learning. Next Generation Hardware With DDR5 support, LGA 4677 (read more)
Browse IC Sockets and Headers Datasheets for TE Connectivity -
The Levan Elastomeric socket family is engineered specifically with precision. The elastomeric grid of Levan features conductive columns that guarantee accurate and consistent test results across a spectrum of devices. The conductive columns in the elastomeric grid ensure accurate and (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
, Kepler is the only solution that provides two-axis of motion during a single actuation of the socket, an innovation set to pioneer the semiconductor test industry. As a result, Kepler provides a boosted first pass yield (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
, High Performance Server Socket R LGA 2011 Coolers_RG4110 Outline Dimension : 90 x 90 x 28.15 mm Heat Sink : Skived C1100, 90 x 90 x 11.5 mm Blower : 80 x 80 x 15 mm, Two Ball Bearing, 6000 RPM, Noise Level : 55.8 dB(A) Connector Type : 2510-4P Thermal (read more)
Browse CPU Coolers Datasheets for Rego Electronics Inc. -
.18 °C/W ( TDP(max) : 150 watts ) Noise Level : 44 d B(A) Socket H LGA1155, 1150, 1156 Coolers_RG3120 Outline Dimension : 87.6 x 81.0 x 27 mm Heat Sink : Skived C1100, 83 x 81 x 12 mm Blower : 80 x 80 x 15 mm, Two Ball Bearing, 6000 RPM, Noise (read more)
Browse CPU Coolers Datasheets for Rego Electronics Inc. -
LGA 4710 Socket and Hardware TE Connectivity's (TE) LGA 4710 socket for next-generation server processors adopts the same form-factor as for LGA 4677 and provide more connections between the main board and the (read more)
Browse Electrical Contacts Datasheets for TE Connectivity -
Rego Cooler Information- Part Number : RG3223 Solution : 2U & Up Server CPU Socket : 1155 / 1156 / 1150 Outline Dimension : 90.75 x 89.50 x 65.25mm Heat Sink : 78.0 x 62.5 x 61.6mm, Copper Base & Aluminum Fins with Heatpipes embedded Fan : 60 x 60 x 25 mm, Two (read more)
Browse CPU Coolers Datasheets for Rego Electronics Inc. -
architectures. AdrenaLINE Catapult Near chip connector utilizing uLGA socket technology. Socketed technology enables excellent signal-integrity at 224G data rates. Available in varied configurations of differential pairs 16DP, 32DP (read more)
Browse Multiconductor Cables Datasheets for TE Connectivity -
, Plugs and Cable Assemblies Powering 224G Operations ORv3, IT Gear, 48V, CROWN CLIP, ELCON, MULTI-BEAM PSU, DTC Cable, Busbar, ICCON, and RAPID LOCK Interconnects Sockets and Hardware Co-Packaged, uLGA, CPU, Switch ASIC, and AI ASIC (read more)
Browse Network Cables Datasheets for TE Connectivity -
Specify reliability and durability for projects in Energy, Oil & Gas. From demanding field applications to mass produced consumer products.
(read more)
Browse IC Sockets and Headers Datasheets for Harwin Plc
Conduct Research Top
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Socket-Adapter Systems: A Practical Test Alternative (.pdf)
Traditional one-piece, clam¬shell-design test sockets are useful diagnostic tools for establishing or evaluating device functionality. However, they tend to be less satisfactory for validating fine-pitch packages such as ball grid ar¬ray (BGA) and land grid array (LGA), which are gaining popularity
More Information Top
Indicates content that may require registration and/or purchase.
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IC Component Sockets
7.1.2 S ingle-Sided Contact Design 7.1.3 Double-Sided Contact Design 7.1.4 F our-Point Crown Contact Design 7.2 Summary References 8 Component Sockets for LGA Packages 8.1 LGA Socket Designs 8.1.1 …
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Printed Circuits Handbook, Sixth Edition > LAND GRID ARRAY INTERCONNECT
It has lands to accommodate electrical interconnect of the LGA socket to the board.
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http://www-us-east.intel.com/content/dam/www/public/us/en/documents/design-guides/xeon-7500-xeon-e7-8800-4800-2800-families-guide.pdf
LGA Socket .
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http://dspace.mit.edu/bitstream/handle/1721.1/67760/766761082-MIT.pdf?sequence=2
Figure 8: Intel LGA Socket (LGA 775)............................................................................................23 .
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High frequency modeling and characterization of pin and land grid array sockets
Figure 1.PGA and LGA socket test hoard A variety of signaling configurations were examined with this test structure, including uncoupled single-ended limes, coupled singled-ended limes, single pair differential limes and coupled differential lines.
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Reliability Assessment of Land Grid Array Sockets Subjected to Mixed Flowing Gas Environment
Abstract—Land grid array ( LGA ) sockets are used as sep- arable interconnects between printed circuit boards, and high I/O integrated circuit components.
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Characterization of die stresses in microprocessor packages subjected to thermal cycling
Flex LGA Socket .
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Squeezing the chip: The buildup of compressive stress in a microprocessor chip by packaging and heat sink clamping
The LGA socket used in this work consisted of an array of metal “spring” contacts that were embedded in a flexible substrate “shell”.
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High Current Testing for Land Grid Array Sockets
Land grid array ( LGA ) sockets are currently used for industry standard and custom microprocessors to meet the increased performance challenges for a variety of server applications.
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Measurement of die stress distributions in flip chip CBGA packaging
The LGA socket used in this work consisted of an array of metal “spring” contacts that were embedded in a flexible substrate “shell”.