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Supplier: TE Connectivity
Description: Material Thickness : .076 MICM [3 MICIN ] IC Socket Type : LGA 2010 Product Type Features Connector & Contact Terminates To : Flexible Printed Circuit (FPC)
- Current Rating: 0.5000 amps
- Mounting: SMT
- Number of Contacts: 100
- Operating Temperature: -25 to 105 C
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Supplier: TE Connectivity
Description: ) (AMP) : .5 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] IC Socket Type : LGA 7529
- Current Rating: 0.5000 amps
- Mounting: SMT, Other
- Number of Contacts: 7529
- Package Type: LGA
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Supplier: TE Connectivity
Description: MICM [30 MICIN ] IC Socket Type : LGA 257 Housing Features Centerline (Pitch) : 1 MM [.039 INCH ] Housing Color : Black
- Contacts Pitch: 1 mm
- Current Rating: 1 amps
- Mounting: SMT, Other
- Number of Contacts: 257
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Supplier: TE Connectivity
Description: Body Features Frame Style : C Shape Configuration Features Grid Spacing : 1 x 1 MM [.039 x .039 INCH ] Number of Positions : 250 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold (Au) Housing Features Centerline
- Contacts Pitch: 1 mm
- Current Rating: 0.5000 amps
- Mounting: SMT, Other
- Number of Contacts: 250
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Supplier: Utmel Electronic Limited
Description: IC & Component Sockets 1-2134711-1 Dust Cover LGA 13XX
- Operating Temperature: -25 to 100 C
- Package Type: LGA
- Product Type: IC Socket
- RoHS Compliant: Yes
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Supplier: Advanced Interconnections Corp.
Description: Using our exclusive, field-proven eutectic solder ball terminal design, the SMT Adapter from Advanced provides a reliable solution for mounting or socketing LGA or re-worked BGA devices. Use in connection with our BGA Sockets for LGA to BGA conversion or board to board
- Contact / Pin Type: Low Profile Pins, Solder Tail Pins, Other
- Contact Plating: Gold Plating, Other
- Contacts Pitch: 0.8000 to 1.27 mm
- Features: Machined Pins
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Supplier: Aries Electronics, Inc.
Description: (compressed): 0.45mm PITCH: Released to <0.4mm – Mixed Pitch Available PACKAGES: BGA, LGA, QFN, DFN, CSP, POP – Full and Partial Arrays Available STRUCTURE: Silmat® Interposer with Patented Core INTERPOSER MATERIALS: Ag Particles in Silicone Elastomer
- Contacts Pitch: 10.16 mm
- Current Rating: 4 amps
- Features: Clamshell Socket
- Operating Temperature: -55 to 200 C
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Supplier: Rego Electronics Inc.
Description: We offer a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Our products are well designed in thermal performance based on our professional manufacturing know how. We also have the sophisticated equipment
- Device: Active Heat Sink
- Fan Speed: 4500 rpm
- Height: 67.7 mm
- Length: 94 mm
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Supplier: Rego Electronics Inc.
Description: We offer a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Our products are well designed in thermal performance based on our professional manufacturing know how. We also have the sophisticated equipment
- Device: Active Heat Sink
- Fan Speed: 5000 rpm
- Height: 64 mm
- Length: 90.7 mm
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Supplier: Rego Electronics Inc.
Description: We offer a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Our products are well designed in thermal performance based on our professional manufacturing know how. We also have the sophisticated equipment
- Device: Active Heat Sink
- Fan Speed: 6000 rpm
- Height: 27 mm
- Length: 87.6 mm
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Supplier: Rego Electronics Inc.
Description: We offer a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Our products are well designed in thermal performance based on our professional manufacturing know how. We also have the sophisticated equipment
- Device: Active Heat Sink
- Fan Speed: 4300 rpm
- Height: 41.6 mm
- Length: 92 mm
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Supplier: Aries Electronics, Inc.
Description: KEY PERFORMANCE ELEMENTS – Series AR4HT High-Temperature 200°C (high-frequency bandwidth, low inductance, and high-current applications in a reliable and durable socket housing) Excellent Compliance (shorter than other low-profile contacts, enables reliable ATE
- Contacts Pitch: 2.54 mm
- Features: Clamshell Socket
- Operating Temperature: -67 to 392 C
- Package Type: BGA, CSP, LGA, QFN, Test / Prototyping Socket, Other
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Description: PE115127-4041-01H
- Package Type: LGA
- Product Type: IC Socket
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Supplier: Global American, Inc.
Description: 2808008 - Extended ATX Industrial Motherboard with Dual Socket LGA 1366 for Intel Xeon 5500/5600 Server Processors
- Chipset Type: Intel® Chipset
- LAN / Networking: 1
- Max Speed: 0.8000 to 1.37 GHz
- Memory Capacity: 48 to 192 GB
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Supplier: Sensata Technologies
Description: Open Top Compression Surface Mount Spring and probe contact Pointed probe contacts DUT pad Pointed probe maintains continuous contact to PCB Spring loaded floating locater plate Any pitch or pitch combination .4mm and greater Threaded inserts available Available with high performance pin
- Contact Plating: Gold Plating
- Contact Resistance: 350 milliohms
- Operating Temperature: 125 C
- Product Type: IC Socket
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Supplier: Sensata Technologies
Description: Clamshell design, compression surface mount Spring and probe contact Pointed probe maintains continuous contact to PCB Spring loaded pressure pad and locater plate Pointed top interface to DUT pad Multi-site options are available Any pitch or pitch combination .4mm and greater Threaded inserts
- Contact Plating: Gold Plating
- Contact Resistance: 350 milliohms
- Operating Temperature: 125 C
- Product Type: IC Socket
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Supplier: Ironwood Electronics, Inc.
Description: SS-BGA sockets provide high bandwidth in a small, cost effective ZIF socket for prototype, test and burn-in applications. SS-BGA socket is a simple, mechanical socket based on spring pin technology. SS-BGA socket is a solder-less socket that can be mounted
- Contact / Pin Type: Spring Loaded
- Contact Plating: Gold Plating
- Contacts Pitch: 0.8000 mm
- Features: Solderless, ZIF Lock, Clamshell Socket
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Supplier: Global American, Inc.
Description: 2808195- ATX Industrial Motherboard with Socket LGA 1156 for Intel Core i7 / i5 / i3 series Desktop processors
- Chipset Type: Intel® Chipset
- ISA Slots: 1
- LAN / Networking: 2
- Max Speed: 1.07 to 1.33 GHz
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Supplier: Global American, Inc.
Description: DH57JG Mini-ITX Industrial Motherboard with Socket LGA 1156 for Intel Core i5 / i3 series Desktop processors
- Chipset Type: Intel® Chipset
- LAN / Networking: 1
- Max Speed: 1.07 to 1.33 GHz
- Memory Capacity: 8 GB
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Supplier: Global American, Inc.
Description: LV-67C-G- Mini-ITX Motherboard with Socket LGA 1156 for Intel Core i7 / i5 / i3 series Desktop processors
- Chipset Type: Intel® Chipset
- LAN / Networking: 2
- Max Speed: 1.07 to 1.33 GHz
- Memory Capacity: 8 GB
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Supplier: Xoxide
Description: The dawn of a new age has come for your high performance desktop. That's right, the new Socket LGA 1366 revolution is here, and your CPU cooler is going to need to be prepared. These unique 4-way mounting clips are designed to make all available Scythe CPU Coolers fully compatible with
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Supplier: Powell Electronics, Inc.
Description: DUAL LGA,257 POS, DMD SOCKET
- Package Type: LGA
- Product Type: IC Socket
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Supplier: Utmel Electronic Limited
Description: Connector Accessories ILM Wide LGA Socket Stainless Steel
- Geometry: Straight, Other
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Supplier: Xoxide
Description: The future of PC modding is here. If you ain't ready yet, well, you best get prepared. An ideal accessory for your upgraded PC, this Gelid Solutions LGA-1366 Mounting Clip enables the Silent Spirit CPU Cooler to fit perfectly with Intel’s LGA-1366 socket (also known as
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Supplier: Win Source Electronics
Description: Category: Heatsink Win Source Part Number: 1435515-SUPERMICRO SNK-P0077P - Supermicro 1U Passive CPU Heat Sink Socket LGA4189 Manufacturer: Supermicro
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Supplier: Advantech
Description: Compact Fanless System with 8th Gen Intel® Core™ i CPU Socket (LGA 1151) Intel® 8th Gen Core™ i CPU socket-type (LGA1151) with Intel® Q370/H310 chipset Wide operating temperature (-10 ~ 50 °C) VGA and HDMI output 2 x Giga
- IDE Disks Capacity: 32 GB
- Processor: Intel®, Other
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Supplier: JC Cherry, Inc.
Description: Test & Burn-In Socket GU22 Frame Series Size 22x22mm / 0.87"x0.87" Can also be used as Burn in Socket ?Highly reliable M-pin Probes as contact parts ?High Frequency For BGA Device, QFN Device 0.4mm/0.016" Pitch : 16x16 Contact Max 0.5mm/0.020" Pitch : 10x10 Contact Max
- Contact Resistance: 100 milliohms
- Contacts Pitch: 0.4000 to 0.5000 mm
- Current Rating: 1 amps
- Operating Temperature: -40 to 150 C
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Supplier: Plastronics Socket Company, Inc.
Description: the H-Pin® to leverage an LGA socket platform that serves the demanding requirements of today’s market. Plastronics LGA sockets using the H-Pin provide a high-performance socket that is affordable for all burn-in operations. These LGA sockets meet the
- Contact Plating: Gold Plating
- Contact Resistance: 35 milliohms
- Contacts Pitch: 0.4000 to 0.8000 mm
- Current Rating: 1 amps
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Supplier: Accuris
Description: Detail Specification for Production Land Grid Array (LGA) Socket for Use in Electronic Equipment
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Supplier: Molex Signal Tech Industrial Ltd.
Description: Features & Benefits Patented, low profile contact Solderless memory replacement Short signal path Conformal to recessed LGAs High speed signal integrity Electrically transparent contact High frequency
- Package Type: LGA, Test / Prototyping Socket
- Product Type: IC Socket
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Supplier: Computer Express L.L.C.
Description: • Intel Core 2 Duo/Pentium D Processor in LGA775 Socket with 533/800/1066MHz FSB • 2 x 240-pin Dual Channels DDRII DIMM 533/667MHz up to 2GB • 1 x 1000 Base-T PCIe GbE LAN • 4 x SATA Ports • PICMG 1.0 Specification • 6 x USB 2.0 Ports
- Chipset Type: Intel® Chipset
- Hard Drive Support?: IDE Interface
- I/O Bus Specifications: ISA / EISA, PCI, USB
- Operating Humidity: 0.0 to 90 %
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Supplier: CSA Group
Description: IEC 60191-6-16:2007 gives a glossary of semiconductor sockets for BGA, LGA, FBGA and FLGA. This standard intends to establish definitions and unification of terminology relating to tests and burn-in sockets for BGA, LGA, FBGA and FLGA.
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Description: IEC 60191-6-16:2007 gives a glossary of semiconductor sockets for BGA, LGA, FBGA and FLGA. This standard intends to establish definitions and unification of terminology relating to tests and burn-in sockets for BGA, LGA, FBGA and FLGA.
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Supplier: Advantech
Description: LGA1155 Intel® Core™ i7/i5/i3/Pentium ATX with DVI/VGA, Dual GbE LAN Supports Intel® Core™ i7/i5/i3/Pentium processor with H61 chipset Two DIMM sockets support up to 16 GB DDR3 1066/1333 Supports dual display VGA/DVI-D and dual GbE LAN Supports RS232/422/485 with auto flow control
- Chipset Type: Intel® Chipset, Other
- Max Speed: 3.4 GHz
- Processor / CPU Type: Other
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Supplier: Advantech
Description: PCE-5125WG2, the PICMG 1.3 form-factor single host board is designed with the Intel 3450 Express platform for industrial applications. It supports LGA1156 socket Intel Core i5/i3, Pentium, XEON processors with new micro-architectures and DDR3 up to 8 GB. It performs excellent graphic
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interconnections between system devices.? Greater number of memory channels enable speed intensive applications such as artificial intelligence and machine learning. Next Generation Hardware With DDR5 support, LGA 4677 (read more)
Browse IC Sockets and Headers Datasheets for TE Connectivity -
The Levan Elastomeric socket family is engineered specifically with precision. The elastomeric grid of Levan features conductive columns that guarantee accurate and consistent test results across a spectrum of devices. The conductive columns in the elastomeric grid ensure accurate and (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
, Kepler is the only solution that provides two-axis of motion during a single actuation of the socket, an innovation set to pioneer the semiconductor test industry. As a result, Kepler provides a boosted first pass yield (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
, High Performance Server Socket R LGA 2011 Coolers_RG4110 Outline Dimension : 90 x 90 x 28.15 mm Heat Sink : Skived C1100, 90 x 90 x 11.5 mm Blower : 80 x 80 x 15 mm, Two Ball Bearing, 6000 RPM, Noise Level : 55.8 dB(A) Connector Type : 2510-4P Thermal (read more)
Browse CPU Coolers Datasheets for Rego Electronics Inc. -
.18 °C/W ( TDP(max) : 150 watts ) Noise Level : 44 d B(A) Socket H LGA1155, 1150, 1156 Coolers_RG3120 Outline Dimension : 87.6 x 81.0 x 27 mm Heat Sink : Skived C1100, 83 x 81 x 12 mm Blower : 80 x 80 x 15 mm, Two Ball Bearing, 6000 RPM, Noise (read more)
Browse CPU Coolers Datasheets for Rego Electronics Inc. -
LGA 4710 Socket and Hardware TE Connectivity's (TE) LGA 4710 socket for next-generation server processors adopts the same form-factor as for LGA 4677 and provide more connections between the main board and the (read more)
Browse Electrical Contacts Datasheets for TE Connectivity -
Rego Cooler Information- Part Number : RG3223 Solution : 2U & Up Server CPU Socket : 1155 / 1156 / 1150 Outline Dimension : 90.75 x 89.50 x 65.25mm Heat Sink : 78.0 x 62.5 x 61.6mm, Copper Base & Aluminum Fins with Heatpipes embedded Fan : 60 x 60 x 25 mm, Two (read more)
Browse CPU Coolers Datasheets for Rego Electronics Inc. -
architectures. AdrenaLINE Catapult Near chip connector utilizing uLGA socket technology. Socketed technology enables excellent signal-integrity at 224G data rates. Available in varied configurations of differential pairs 16DP, 32DP (read more)
Browse Multiconductor Cables Datasheets for TE Connectivity -
, Plugs and Cable Assemblies Powering 224G Operations ORv3, IT Gear, 48V, CROWN CLIP, ELCON, MULTI-BEAM PSU, DTC Cable, Busbar, ICCON, and RAPID LOCK Interconnects Sockets and Hardware Co-Packaged, uLGA, CPU, Switch ASIC, and AI ASIC (read more)
Browse Network Cables Datasheets for TE Connectivity -
The HDMI modulator is very important, allowing the distribution of HD video and audio over coaxial cable networks. HDMI modulators are a cheap, simple, and complete solution for a wide variety of applications for both residential and commercial, and institutional applications. This article reviews HDMI modulators, some basic features, and their applications.
(read more)
Browse Drive Sockets and Adapters Datasheets for ODG (Origin Data Global)
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Socket-Adapter Systems: A Practical Test Alternative (.pdf)
Traditional one-piece, clam¬shell-design test sockets are useful diagnostic tools for establishing or evaluating device functionality. However, they tend to be less satisfactory for validating fine-pitch packages such as ball grid ar¬ray (BGA) and land grid array (LGA), which are gaining popularity
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IC Component Sockets
7.1.2 S ingle-Sided Contact Design 7.1.3 Double-Sided Contact Design 7.1.4 F our-Point Crown Contact Design 7.2 Summary References 8 Component Sockets for LGA Packages 8.1 LGA Socket Designs 8.1.1 …
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Printed Circuits Handbook, Sixth Edition > LAND GRID ARRAY INTERCONNECT
It has lands to accommodate electrical interconnect of the LGA socket to the board.
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http://www-us-east.intel.com/content/dam/www/public/us/en/documents/design-guides/xeon-7500-xeon-e7-8800-4800-2800-families-guide.pdf
LGA Socket .
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http://dspace.mit.edu/bitstream/handle/1721.1/67760/766761082-MIT.pdf?sequence=2
Figure 8: Intel LGA Socket (LGA 775)............................................................................................23 .
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High frequency modeling and characterization of pin and land grid array sockets
Figure 1.PGA and LGA socket test hoard A variety of signaling configurations were examined with this test structure, including uncoupled single-ended limes, coupled singled-ended limes, single pair differential limes and coupled differential lines.
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Reliability Assessment of Land Grid Array Sockets Subjected to Mixed Flowing Gas Environment
Abstract—Land grid array ( LGA ) sockets are used as sep- arable interconnects between printed circuit boards, and high I/O integrated circuit components.
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Characterization of die stresses in microprocessor packages subjected to thermal cycling
Flex LGA Socket .
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Squeezing the chip: The buildup of compressive stress in a microprocessor chip by packaging and heat sink clamping
The LGA socket used in this work consisted of an array of metal “spring” contacts that were embedded in a flexible substrate “shell”.
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High Current Testing for Land Grid Array Sockets
Land grid array ( LGA ) sockets are currently used for industry standard and custom microprocessors to meet the increased performance challenges for a variety of server applications.
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Measurement of die stress distributions in flip chip CBGA packaging
The LGA socket used in this work consisted of an array of metal “spring” contacts that were embedded in a flexible substrate “shell”.