Non Silicone Thermal Compounds

Description: Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and

• Chemical / Polymer System Type: Specialty / Other
• Composition: Unfilled
• Cure Type / Technology: Single Component System
• Industry: Electronics, Semiconductors / IC Packaging

Description: Techsil® HTC is a non-silicone heat transfer compound with a high thermal conductivity (0.9W/mK) designed for thermal coupling of electrical components. HTC is recommended where the efficient and reliable thermal coupling of electrical and electronic components is

• Compound Type: Thermal Compound / Thermally Conductive
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Use Temperature: -50 to 130 F

Description: The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ? Available in various thicknesses from 0.5 to

• Chemical / Polymer System Type: Silicone
• Dielectric Constant (Relative Permittivity): 7.5
• Dielectric Strength: 2.03E-4 kV/in
• Elongation: 70 %

Description: Offers the best thermal conductivity performance, combined with the advantage of using a non-silicone base oil. Product Overview HTCP Non-Silicone Thermal Interface Material is a "Plus" version of Electrolube’s successful HTC, offering ultimate thermal conductivity

• Chemical / Polymer System Type: Silicone
• Features: Electrical Insulation / Dielectric
• Industry: Electronics, Semiconductors / IC Packaging
• Material Type: Grease / Paste

Description: Heat transfer compound for efficient and reliable thermal coupling of electrical and electronic components. Product Overview HTC Heat Transfer Compound is a non-silicone thermal interface material recommended for efficient and reliable thermal coupling of

• Chemical / Polymer System Type: Silicone
• Industry: Electronics, Semiconductors / IC Packaging
• Material Type: Grease / Paste
• Thermal Conductivity: 0.9000 W/m-K

Description: The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ? Available in various thicknesses from 0.5 to

• Chemical / Polymer System Type: Silicone
• Dielectric Constant (Relative Permittivity): 6
• Dielectric Strength: 2.03E-4 kV/in
• Elongation: 70 %

Description: The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ? Available in various thicknesses from 0.5 to

• Chemical / Polymer System Type: Silicone
• Dielectric Constant (Relative Permittivity): 10
• Dielectric Strength: 2.03E-4 kV/in
• Elongation: 30 %

Description: The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ? Available in various thicknesses from 0.5 to

• Chemical / Polymer System Type: Silicone
• Dielectric Constant (Relative Permittivity): 5.5
• Dielectric Strength: 2.03E-4 kV/in
• Elongation: 100 %

Description: LiPOLY N-putty series is silicone-free and dispensable thermally conductive material. With a thermal conductivity from 3.5 W/m*K, this product can be used successfully to remove manufacturing tolerances. It is ideally suited for dispensing using the N-putty dispensing robot.

• Chemical / Polymer System Type: Specialty / Other
• Dielectric Strength: 300 kV/in
• Industry: Electronics
• Material Type: Specialty / Other

Description: PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature

• Chemical / Polymer System Type: Silicone
• Coeff. of Thermal Expansion (CTE): 3056 µin/in-F
• Composition: Unfilled
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: MG Chemicals 860 Silicone Heat Transfer Compound is a low thermal resistance grease with a silicone base. It is electrically insulating, non-corrosive and used to improve the thermal interface contact conductivity between heat sinks, LEDs, motors, and heat

• Chemistry / Constituents: Silicone

Description: gap. Research and Development of LiPOLY is providing our best thermal solution to customers, which can satisfy customer special requirement on advanced.

• Chemical / Polymer System Type: Epoxy (EP)
• Dielectric Strength: 350 kV/in
• Industry: Electronics
• Material Type: Gap Filling Compound, Specialty / Other

Description: Non-Silicone Thermal Compound N800AH is made of non-silicon resin material and none low-molecular-weight siloxane. N800AH helps avoid electrical contact problems. N800 is flexible and has great thermal conduction, making the thermal resistance as low as

• Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
• Chemical / Polymer System Type: Specialty / Other
• Dielectric Strength: 203 kV/in
• Industry: Electronics

Description: Non-Silicone Thermal Compound N700C is made of non-silicon resin material and none low-molecular-weight siloxane. N700C helps avoid electrical contact problems. N700 is flexible and has great thermal conduction, making the thermal resistance as low as

• Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
• Chemical / Polymer System Type: Specialty / Other
• Dielectric Strength: 203 kV/in
• Industry: Electronics

Description: A metal oxide-filled silicone oil offers efficient thermal conductivity and operates effectively across a wide temperature range. Product Overview HTS Silicone Heat Transfer Compound is a metal oxide-filled silicone oil, providing an extremely efficient and

• Chemical / Polymer System Type: Silicone
• Composition: Filled
• Features: Electrically Conductive
• Industry: Electronics, Semiconductors / IC Packaging

Description: Provides the ultimate in thermal conductivity with a very wide temperature range obtained by using silicone base oils. Product Overview HTSP Silicone Heat Transfer Compound Plus is a modified "Plus" version of Electrolube’s successful HTS, offering superior thermal

• Chemical / Polymer System Type: Silicone
• Features: Electrical Insulation / Dielectric
• Industry: Electronics, Semiconductors / IC Packaging
• Material Type: Grease / Paste

Description: the benefits of a silicone-based compound without the problem of contamination. FEATURES: Silicone and non-silicone formulations Thermal conductivity up to 2.6 W/m°K Low bleed and evaporation No migration for non-silicone formulations over wide

• Chemical / Polymer System Type: Specialty / Other
• Dielectric Strength: 314 kV/in
• Industry: Electronics, Semiconductors / IC Packaging
• Material Type: Grease / Paste

Description: SARCON® NR-c is a highly conformable, thermally conductive, non-flammable acrylate resin (non-silicone) sheet with thermally conductive fillers. Available in sheets and die-cut forms for formal interface uses wherever gap filler pads are traditionally used. No

• Applied Thickness / Gap Fill: 0.0197 inch
• Chemical / Polymer System Type: Acrylic / Polyacrylate
• Features: UL Approved
• Industry: Electronics, Semiconductors / IC Packaging

Description: TSE3281-G is a thermally conductive silicone adhesive from Momentive Performance Materials. This one component material is non-corrosive and has excellent adhesion properties to a wide variety of substrates. Potential applications for TSE3281-G include sealing and bonding for

• Chemical / Polymer System Type: Silicone
• Industry: Electronics
• Rubber Based / Elastomeric: Yes

Description: MasterSil 323AO-LO is a two component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications. This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the

• Applied Thickness / Gap Fill: 0.0020 to 0.0030 inch
• Chemical / Polymer System Type: Silicone
• Coeff. of Thermal Expansion (CTE): 77.78 to 94.44 µin/in-F
• Composition: Unfilled

Description: Momentive TIA350R is a one-component, heat curable silicone adhesive designed for thermally conductive applications. This grade cures quickly upon exposure to heat and adheres well to a wide variety of substrates. Recommended for use as a thermal interface material between dies

• Chemical / Polymer System Type: Silicone
• Industry: Electronics
• Rubber Based / Elastomeric: Yes
• Use Temperature: -40 to 200 F

Description: Master Bond MasterSil 705TC is a one component, thermally conductive, electrically isolating silicone for bonding, sealing and coating applications. It features outstanding thermal conductivity and is well suited for applications that require flexibility and high temperature

• Chemical / Polymer System Type: Silicone
• Composition: Unfilled
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System
• Dielectric Constant (Relative Permittivity): 4.2

Description: of the pads is excellent for filling ai r gaps and uneven surfaces. Realized low thermal resistance due to the best thermal conductivity Meets the requirement UL94 V-0 class. Content of Low Molecular Siloxane is small

• Applied Thickness / Gap Fill: 0.0394 to 0.0787 inch
• Chemical / Polymer System Type: Silicone
• Elongation: 40 %
• Features: UL Approved

Description: greases offer all the benefits of a silicone-based compound without the problem of contamination. FEATURES: Silicone and non-silicone formulations Thermal conductivity up to 2.6 W/m°K Low bleed and evaporation No migration for non-silicone

• Chemical / Polymer System Type: Silicone
• Dielectric Strength: 386 kV/in
• Industry: Electronics, Semiconductors / IC Packaging
• Material Type: Grease / Paste

Description: BERGQUIST SIL PAD TSP 1416, a highly thermally conductive, electrically insulating silicone elastomeric material BERGQUIST® SIL PAD TSP 1416 is a highly thermally conductive, electrically insulating silicone elastomeric material. Excellent cut-through resistance Added

• Chemical / Polymer System Type: Silicone
• Thermal Conductivity: 1.6 W/m-K
• Use Temperature: 76 to 356 F

Description: BERGQUIST GAP PAD TGP 3500ULM, Highly Conformable, Thermally Conductive, Ultra-Low Modulus, Fiberglass Reinforced, Silicone Based Pad BERGQUIST® GAP PAD TGP 3500ULM (ultra low-modulus) is an extremely soft gap filling material rated at a thermal conductivity of 3.5 W/m-K. The

• Chemical / Polymer System Type: Silicone
• Material Type: Gap Filling Compound
• Thermal Conductivity: 3.5 W/m-K
• Use Temperature: 76 to 392 F

Description: BERGQUIST SIL PAD TSP 1800, Exceptional Performance, Silicone based, Fiberglass-reinforce d, Thermally Conductive Elastomeric Material BERGQUIST® SIL PAD TSP 1800 is a silicone based, fiberglass-reinforce d thermal interface material featuring a smooth, highly compliant

• Chemical / Polymer System Type: Silicone
• Thermal Conductivity: 1.8 W/m-K

Description: Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity

• Chemical / Polymer System Type: Silicone
• Coeff. of Thermal Expansion (CTE): 61.11 to 77.78 µin/in-F
• Composition: Unfilled
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: WACKER’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in

• Cure Type / Technology: Thermosetting / Crosslinking
• Features: Electrically Conductive
• Industry: Electronics, OEM / Industrial

Description: Pourable, addition-curing, two-component silicone rubber that vulcanizes at room temperature. Special features very good flowability and self-deaeration fast and non-shrink cure at room temperature which can be accelerated considerably by the application of heat

• Chemical / Polymer System Type: Silicone
• Elongation: 120 %
• Features: Thermally Conductive
• Filler Material: Unfilled

Description: Introducing Innovation Cooling's latest offering, the IC Perihelion! This high-performance ceramic thermal compound features a ceramic base with a high bulk loading of over 91% to prevent pump out due to thermal cycling. It is completely silicone-free and

• Compound Type: Thermally Conductive

Description: MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling

• Chemical / Polymer System Type: Silicone
• Coeff. of Thermal Expansion (CTE): 6.67E7 to 8.33E7 µin/in-F
• Composition: Filled
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System

Description: BERGQUIST GAP FILLER TGF 3010APS, a 2 part, 3.0 W/m-K, Silicone Free Gap Filler with High Dispense Rate. BERGQUIST® GAP FILLER TGF 3010APS is a non-silicone, 2-part room temperature curable gap filler suitable for use in high throughput assembly applications. With a 3.0 W/m-K

• Material Type: Gap Filling Compound
• Thermal Conductivity: 3 W/m-K
• Use Temperature: 104 to 176 F

Description: Techspray Silicone Free Heat Sink Compound is used to cool thermistors, calrods, thermocouple wells, and other electrical components. It is non-ozone depleting, easy to apply, and will not harden, separate, or crack. 4 oz Tube.

• Chemical / Polymer System Type: Silicone
• Compound Type: Thermally Conductive
• Cure Type / Technology: Single Component System
• Thermal Conductivity: 0.7000 W/m-K

Description: Dow DOWSIL™ SC 102 Thermally Conductive Compound White is a one component, non-curing, silicone paste that is used to gap fill material between heat sinks and electronic heat sources. It offers low bleed, high temperature stability and thermal conductivity. 1 kg

• Compound Type: Thermally Conductive
• Cure Type / Technology: Single Component System
• Dielectric Strength: 210 kV/in
• Thermal Conductivity: 0.8000 W/m-K

Description: WACKER’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in

• Chemical / Polymer System Type: Silicone
• Industry: Electronics
• Rubber Based / Elastomeric: Yes

Description: SEMICOSIL® 987 GR is a non-slump, thermally curable, addition curing one-part silicone rubber.

• Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing
• Elongation: 200 %
• Features: Flexible / Dampening
• Industry: Electronics