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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview HTCP Non-Silicone Thermal Interface Material is a "Plus" version of Electrolube’s successful HTC, offering ultimate thermal conductivity along with the benefits of a non-silicone base oil. The exceptional properties of HTCP result from the
- Use Temperature: -58 to 266 F
- Thermal Conductivity: 2.5 W/m-K
- Dielectric Strength: 1,066.8000000000022 kV/in
- Viscosity: 101,000 to 112,000 cP
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Supplier: Allied Electronics, Inc.
Description: high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane. The Non-Silicone Heat Transfer compound is designed to eliminate the potential problems of silicone-based compounds caused by
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Supplier: Allied Electronics, Inc.
Description: heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane. The Non-Silicone Heat Transfer compound is designed to eliminate the potential problems of silicone-based compounds caused by migration and component contamination.
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Supplier: Nordson EFD
Description: Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and
- Use Temperature: -40 to 392 F
- Thermal Conductivity: 0.92 W/m-K
- Features: Air Setting / Film Drying, Specialty / Other, Thermally Conductive
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Shiu Li Technology Co., Ltd
Description: Non-Silicone Thermal Compound N800AH is made of non-silicon resin material and none low-molecular-weight siloxane. N800AH helps avoid electrical contact problems. N800 is flexible and has great thermal conduction, making the thermal resistance as low
- Applied Thickness / Gap Fill: 0.01968505 to 0.1968505 inch
- Use Temperature: -76 to 257 F
- Thermal Conductivity: 7 W/m-K
- Dielectric Strength: 203.20000000000041 kV/in
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Thermal Compounds and Thermal Interface Materials - Non-Silicone Thermal Conductive Putty -- N-PuttySupplier: Shiu Li Technology Co., Ltd
Description: LiPOLY N-putty series is silicone-free and dispensable thermally conductive material. With a thermal conductivity from 3.5 W/m*K, this product can be used successfully to remove manufacturing tolerances. It is ideally suited for dispensing using the N-putty dispensing robot.
- Viscosity: 15,000 cP
- Use Temperature: -76 to 302 F
- Thermal Conductivity: 3.5 W/m-K
- Dielectric Strength: 300 kV/in
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Supplier: Techsil Limited
Description: Techsil® HTC is a non-silicone heat transfer compound with a high thermal conductivity (0.9W/mK) designed for thermal coupling of electrical components. HTC is recommended where the efficient and reliable thermal coupling of electrical and electronic
- Use Temperature: -50 to 130 F
- Industry: Electronics
- Features: Thermal Compound / Thermally Conductive
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Description: The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ◆ Available in various thicknesses from
- Use Temperature: -40 to 257 F
- Thermal Conductivity: 3 W/m-K
- Tensile Strength (Break): 7.977026164645835 psi
- Elongation: 70 %
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Supplier: Fujipoly® America Corp.
Description: a silicone-based compound without the problem of contamination. FEATURES: Silicone and non-silicone formulations Thermal conductivity up to 2.6 W/m°K Low bleed and evaporation No migration for non-silicone formulations over wide temperature
- Use Temperature: -40 to 392 F
- Thermal Conductivity: 0.75 W/m-K
- Dielectric Strength: 313.99999999999943 kV/in
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Fujipoly® America Corp.
Description: SARCON® NR-c is a highly conformable, thermally conductive, non-flammable acrylate resin (non-silicone) sheet with thermally conductive fillers. Available in sheets and die-cut forms for formal interface uses wherever gap filler pads are traditionally used. No silicone
- Applied Thickness / Gap Fill: 0.01968505 inch
- Use Temperature: -40 to 221 F
- Thermal Conductivity: 1.5 W/m-K
- Chemical System: Acrylic / Polyacrylate
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Supplier: Fujipoly® America Corp.
Description: benefits of a silicone-based compound without the problem of contamination. FEATURES: Silicone and non-silicone formulations Thermal conductivity up to 2.6 W/m°K Low bleed and evaporation No migration for non-silicone formulations over wide
- Use Temperature: -67 to 401 F
- Thermal Conductivity: 2.6 W/m-K
- Dielectric Strength: 411.9999999999988 kV/in
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Xoxide
Description: Introducing Innovation Cooling's latest offering, the IC Perihelion! This high-performance ceramic thermal compound features a ceramic base with a high bulk loading of over 91% to prevent pump out due to thermal cycling. It is completely silicone-free and
- Features: Thermally Conductive
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Supplier: Shiu Li Technology Co., Ltd
Description: gap. Research and Development of LiPOLY is providing our best thermal solution to customers, which can satisfy customer special requirement on advanced.
- Viscosity: 100,000 cP
- Use Temperature: -76 to 302 F
- Thermal Conductivity: 2.5 W/m-K
- Dielectric Strength: 350 kV/in
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Description: The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ◆ Available in various thicknesses from
- Use Temperature: -40 to 257 F
- Thermal Conductivity: 2 W/m-K
- Tensile Strength (Break): 7.977026164645835 psi
- Elongation: 70 %
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Supplier: Master Bond, Inc.
Description: Master Bond MasterSil 705TC is a one component, thermally conductive, electrically isolating silicone for bonding, sealing and coating applications. It features outstanding thermal conductivity and is well suited for applications that require flexibility and high temperature
- Use Temperature: -60 to 400 F
- Thermal Conductivity: 2.1 W/m-K
- Tensile Strength (Break): 210 psi
- Elongation: 70 %
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Supplier: Newark, An Avnet Company
Description: HEAT SINK COMPOUND, NON-SILICONE, 1OZ, TUBE; Dispensing Method:Tube; Volume:-; Weight:1oz; Product Range:- RoHS Compliant: Yes
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Description: The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ◆ Available in various thicknesses from
- Use Temperature: -40 to 248 F
- Thermal Conductivity: 8 W/m-K
- Tensile Strength (Break): 4.35110518071591 psi
- Elongation: 30 %
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Supplier: Wacker Chemical Corp.
Description: WACKER’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in
- Features: Electrically Conductive, Gel, Rubber Based / Elastomeric
- Industry: Electronics, OEM / Industrial
- Chemical System: Silicone
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Fujipoly® America Corp.
Description: excellent for filling ai r gaps and uneven surfaces. Realized low thermal resistance due to the best thermal conductivity Meets the requirement UL94 V-0 class. Content of Low Molecular Siloxane is small
- Applied Thickness / Gap Fill: 0.0393701 to 0.0787402 inch
- Thermal Conductivity: 11 W/m-K
- Tensile Strength (Break): 29.0073678714394 psi
- Elongation: 40 %
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Description: The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ◆ Available in various thicknesses from
- Use Temperature: -40 to 257 F
- Thermal Conductivity: 1 W/m-K
- Tensile Strength (Break): 10.877762951789775 psi
- Elongation: 100 %
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Supplier: Newark, An Avnet Company
Description: NON-SILICONE THERMAL PAD, 200X1MM, GRY ROHS COMPLIANT: YES
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Supplier: Newark, An Avnet Company
Description: NON-SILICONE THERMAL PAD, 150X2MM, BLU ROHS COMPLIANT: YES
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Supplier: Newark, An Avnet Company
Description: NON-SILICONE THERMAL PAD, 200X2MM, GRY ROHS COMPLIANT: YES
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Supplier: Shiu Li Technology Co., Ltd
Description: Non-Silicone Thermal Compound G3380N is made of non-silicon resin material and pollution of optical surfaces. Low thermal resistance and great thermal conductivity. G3380N has been used extensively in Consumer electronics and Microprocessors for their
- Operating / Use Temperature: -76 to 302 F
- Thermal Conductivity: 1.3 to 6 W/m-K
- Dielectric Strength: 11,000,000 to 14,000,000 V/m
- Density / Specific Gravity (@15.6°C, 60°F): 2.2 to 2.8 specific gravity
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Supplier: Master Bond, Inc.
Description: MasterSil 323AO-LO is a two component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications. This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the aerospace,
- Applied Thickness / Gap Fill: 0.002 to 0.003 inch
- Viscosity: 300,000 to 400,000 cP
- Use Temperature: -65 to 400 F
- Thermal Conductivity: 1.15 to 1.3 W/m-K
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Supplier: Allied Electronics, Inc.
Description: with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane. The Non-Silicone Heat Transfer compound is designed to eliminate the potential problems of silicone-based compounds caused by migration and component
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Supplier: Techsil Limited
Description: MG Chemicals 860 Silicone Heat Transfer Compound is a low thermal resistance grease with a silicone base. It is electrically insulating, non-corrosive and used to improve the thermal interface contact conductivity between heat sinks, LEDs, motors, and heat
- Composition / Chemistry: Silicone
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Supplier: Techsil Limited
Description: TSE3281-G is a thermally conductive silicone adhesive from Momentive Performance Materials. This one component material is non-corrosive and has excellent adhesion properties to a wide variety of substrates. Potential applications for TSE3281-G include sealing and bonding for thermally
- Industry: Electronics
- Chemical System: Rubber Based / Elastomeric, Silicone
- Features: Thermal Compound / Heat Conductive
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Supplier: Master Bond, Inc.
Description: Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity
- Viscosity: 35,000 to 50,000 cP
- Use Temperature: -65 to 221 F
- Thermal Conductivity: 1.1538 to 1.2981 W/m-K
- Coeff. of Thermal Expansion (CTE): 61.11 to 77.77999999999999 µin/in-F
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Supplier: Wacker Chemical Corp.
Description: Pourable, addition-curing, two-component silicone rubber that vulcanizes at room temperature. Special features very good flowability and self-deaeration fast and non-shrink cure at room temperature which can be accelerated considerably by the application of heat high hardness (Shore A
- Tensile Strength (Break): 652.665777107386 psi
- Elongation: 120 %
- Type: Elastomer / Rubber
- Chemical System: Silicone
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Supplier: Protavic America, Inc.
Description: PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature
- Viscosity: 400 cP
- Thermal Conductivity: 0.5 W/m-K
- Coeff. of Thermal Expansion (CTE): 3,055.5555555555557 µin/in-F
- Dielectric Strength: 635.0000000000014 kV/in
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Supplier: Allied Electronics, Inc.
Description: factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane. The Non-Silicone Heat Transfer compound is designed to eliminate the potential problems of silicone-based compounds caused by migration and
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Supplier: Techsil Limited
Description: Momentive TIA350R is a one-component, heat curable silicone adhesive designed for thermally conductive applications. This grade cures quickly upon exposure to heat and adheres well to a wide variety of substrates. Recommended for use as a thermal interface material between dies and
- Use Temperature: -40 to 200 F
- Industry: Electronics
- Chemical System: Rubber Based / Elastomeric, Silicone
- Features: Thermal / Heat Conductive
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MG Chemicals - 8610-1P - Chemicals - Thermal Compounds & Greases - Allied Electronics
A non - silicone compound for improving thermal connections .
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Thermal and mechanical analysis and design of the IBM Power 775 water cooled supercomputing central electronics complex
The first way was to replace the traditionally used, non - silicone based Advanced Thermal Compound [12] with a cure-in-place silicone elastomer.
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MG Chemicals - 8610-60G - Chemicals - Thermal Compounds & Greases - Allied Electronics
Heat Transfer Compound ; non - silicone ; high thermal conductivity; 2 oz tub .
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Chemtronics - CW7270 - Chemicals - Thermal Compounds & Greases - Allied Electronics
Heat Transfer Compound ; non - silicone ; high thermal conductivity; 2 oz tub .
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Vishay PCS - VS-36MB40A - Diodes - Bridge Rectifiers - Allied Electronics
Heat Transfer Compound ; non - silicone ; high thermal conductivity; 1 pt tub .
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Thermal Compounds & Greases - Chemicals & Adhesives from Allied Electronics
Heat Transfer Compound ; non - silicone ; high thermal conductivity; 2 oz tub .
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Chemicals - Chemicals & Adhesives from Allied Electronics
Heat Transfer Compound ; non - silicone ; high thermal conductivity; 2 oz tub .
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MG Chemicals - from Allied Electronics
Heat Transfer Compound ; non - silicone ; high thermal conductivity; 2 oz tub .
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MG Chemicals - 860-60G - Chemicals - Thermal Compounds & Greases - Allied Electronics
Heat Transfer Compound ; non - silicone ; high thermal conductivity; 2 oz tub .
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Chemicals - Chemicals & Adhesives from Allied Electronics
Heat Transfer Compound ; non - silicone ; high thermal conductivity; 2 oz tub .