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Supplier: Budnick Converting, Inc.
Description: 304-1 is a 2.5 mil polyimide film used in electrical applications.
- Adhesive: Specialty / Other
- Carrier / Backing Material: Plastic / Polymer
- Peel Strength / Adhesion: 1.56 lbs/in
- Thickness: 0.0025 inches
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Supplier: Polyonics
Description: Polyonics® clear polyimide overlaminates are designed to protect printed images from extreme environmental conditions, including high (and low) heat, abrasion, organic solvents and harsh chemicals. Our overlaminates ensure image readability where color is not important, are dimensionally
- Thickness: 1.00E-3 to 0.0020 inches
- Type: Film / Flexible Substrate
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Supplier: Caplugs
Description: KP-SH polyimide tapes are typically used in electronics coating such as parylene coating, solder wave and conformal coating. They can also be used in other high temp processes such as masking gold leaves during PCB processes. Withstands high-temperatures up to 500°F (260°C)
- Backing: Specialty / Other
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Supplier: Caplugs
Description: Polyimide tapes are typically used in electronics coating such as parylene coating, solder wave and conformal coating. Can also be used in other high-temp processes such as masking gold leaves during PCB processes. Withstands high-temperatures up to 500°F (260°C)
- Backing: Specialty / Other
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Supplier: DeWAL
Description: This tape consisting of a 1 mil polyimide film and silicone adhesive has been designed for high temperature masking applications. In electrical insulation applications this product does meet class H requirements. APPLICATION INFORMATION The primary uses for this product are gold finger
- Adhesive: Silicone
- Backing: Plastic / Polymer, Polyimide (e.g., Kapton®)
- Dielectric Strength: 3.15E8 V/m
- Features: Dielectric / Insulating
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Supplier: DeWAL
Description: This tape consisting of a 5 mil Polyimide Film and silicone adhesive is designed for high temperature masking applications, including the protection of printed circuit board gold finger contacts during wave soldering. This product can also be used in electrical insulation applications
- Adhesive: Silicone
- Backing: Plastic / Polymer, Polyimide (e.g., Kapton®)
- Dielectric Strength: 7.87E8 V/m
- Peel Strength / Adhesion: 1.25 lbs/in
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Supplier: DeWAL
Description: This tape consisting of a 2 mil Polyimide Film and silicone adhesive has been design for high temperature masking applications. In electrical insulation applications this product does meet class H requirements. This product can be removed cleanly without adhesive residue after
- Adhesive: Silicone
- Backing: Plastic / Polymer, Polyimide (e.g., Kapton®)
- Dielectric Strength: 4.72E8 V/m
- Features: Dielectric / Insulating
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Supplier: Custom Fabricating & Supplies
Description: This tape is manufactured from commercial grade polyimide film with a special silicone adhesive. The polyimide carrier is only 1 Mil, making this tape extremely conformable for irregular shapes and surfaces. Polyimide tape has the ability to maintain its excellent physical,
- Adhesive: Silicone
- Carrier / Backing Material: Plastic / Polymer, Polyimide (e.g., Kapton®), Specialty / Other
- Features: Dielectric / Insulating, Removable
- Peel Strength / Adhesion: 1.56 lbs/in
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Supplier: Custom Fabricating & Supplies
Description: These discs/dots are manufactured from commercial grade polyimide film with a special silicone adhesive. The polyimide carrier is only 1 Mil, making this tape extremely conformable for irregular shapes and surfaces. Designed for high temperature masking found in conformal coating of
- Adhesive: Silicone
- Carrier / Backing Material: Plastic / Polymer, Polyimide (e.g., Kapton®), Specialty / Other
- Features: Dielectric / Insulating, Removable
- Peel Strength / Adhesion: 1.56 lbs/in
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Supplier: DuPont Electronics & Imaging
Description: DuPont™ Pyralux® HXI is DuPont™ Kapton® black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired. It offers thinner construction than Pyralux® HXC, but similar mechanical and process properties. It is coated on one
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Electrical Insulation / Dielectric
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: ICO RALLY
Description: Produced using a high-temperature polyimide film. Suitable for various high temperature applications and commonly used in printed circuit board applications. Aside from its high-temperature characteristics, it also exhibits high mechanical and thermal stability, as well as resistance to
- Adhesive: Acrylic
- Backing: Plastic / Polymer, Polyimide (e.g., Kapton®)
- Peel Strength / Adhesion: 1.88 lbs/in
- Performance Features: Other, Thermally Insulating / Insulative
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Supplier: DuPont Electronics & Imaging
Description: DuPont™ Pyralux® HXC is DuPont™ Kapton® MBC black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired. It is coated on one side with a proprietary B-staged modified epoxy adhesive. The Pyralux® HXC coverlay is used to
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Electrical Insulation / Dielectric
- Dielectric Constant (Relative Permittivity): 3.6 to 3.7
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Polyonics
Description: Improved Heat Resistance: Engineered for extreme thermal cycles, ensuring your labels remain secure and readable. Improved Chemical and Flux Resistance: Withstands the harshest PCB processes, including high-pressure washes and aggressive fluxes. Precision
- Backing / Base: Plastic / Film
- Features: Print Receptive / Treated, Other
- Pressure Sensitive (PSA): Yes
- Thickness: 1.00E-3 to 0.0020 inches
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Supplier: Saint-Gobain Tape Solutions
Description: CHR K100 is manufactured from polyimide film with high-temperature silicone adhesive on both sides. CHR K100 has excellent mechanical and electrical properties. Applications: Electronic assembly Electrical insulation applications Used in high voltage insulation
- Adhesive: Silicone
- Backing: Polyimide (e.g., Kapton®)
- Temperature Resistance: -73 C
- Thickness: 0.0045 inches
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Supplier: Saint-Gobain Tape Solutions
Description: CHR KCL Cling Polyimide is polyimide film coated with a high temperature UV resistant cling adhesive. KCL Cling Polyimide has excellent temperature and chemical resistance. Applications: Used in electronic, aerospace, automotive, and other markets as a protective tape for
- Backing: Polyimide (e.g., Kapton®)
- Performance Features: UV / Weather Resistant, Protective Tape
- Temperature Resistance: -73 C
- Thickness: 0.0020 inches
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Supplier: Custom Fabricating & Supplies
Description: This tape is manufactured from commercial grade polyimide film with a special silicone adhesive. Polyimide tape has the ability to maintain its excellent physical, mechanical and electrical properties over a wide temperature range. Designed for high temperature masking found in
- Adhesive: Silicone
- Carrier / Backing Material: Plastic / Polymer, Polyimide (e.g., Kapton®), Specialty / Other
- Features: Dielectric / Insulating, Removable
- Peel Strength / Adhesion: 1.31 lbs/in
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Supplier: Custom Fabricating & Supplies
Description: These discs/dots are manufactured from commercial grade polyimide film with a special silicone adhesive. Designed for high temperature masking found in conformal coating of PCBs, protection of gold fingers during circuit board soldering and electrical insulation of high temperature
- Adhesive: Silicone
- Carrier / Backing Material: Plastic / Polymer, Polyimide (e.g., Kapton®), Specialty / Other
- Features: Dielectric / Insulating, Removable
- Peel Strength / Adhesion: 1.31 lbs/in
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Supplier: DuPont Electronics & Imaging
Description: clad laminate with superior handling and processing High copper polyimide resistor foil adhesion strength Low coefficient of thermal expansion for flex and rigid multi-layer PCBs Excellent thermal resistance Constructions: Resistivity
- Features: Tested to IPC, UL Listed
- Length: 3 ft
- Materials of Construction: Plastic / Polymer, Polyimide (e.g., Kapton®)
- Temperature Resistance: 180 C
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Supplier: FX PCB Co., Ltd.
Description: Description A FLEXIBLE PCB CONSISTS OF SEVERAL LAYERS: For the base layer of a flexible printed circuit board today, two of the most popular materials are used – polyamide and polyester. Polyimide materials are most widely used due to their ability to withstand the
- Thickness: 0.0118 inches
- Type: Film / Flexible Substrate
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Supplier: FX PCB Co., Ltd.
Description: starts, which involves creating a blueprint of the design, specifying the materials, and selecting the right manufacturing process. 3. Flex PCB Manufacturing: The next step is to print circuit traces onto a flexible substrate material, such as polyimide, using specialized machines.
- Location: United States Only, East Asia / Pacific Only
- PCB Type: Flexible Boards
- Supplier Capability: PCB Assembly
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Supplier: Adhesive Applications
Description: PolySil™ SP590 offers optimum performance in electrical and thermal insulation. The continuous service temperature range is -100°F to 500°F (-73°C to 260°C) with short term, intermittent service to 600°F (315°C). Provides clean removal in high-temperature masking applications. High temperature
- Adhesive: Silicone
- Backing: Polyimide (e.g., Kapton®)
- Peel Strength / Adhesion: 1.62 lbs/in
- Performance Features: Dielectric / Insulating, Abrasion / Scratch Resistant, Removable, Thermally Insulating / Insulative
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Supplier: DuPont Electronics & Imaging
Description: polyimide film for high speed digital and high frequency flexible circuit applications. Its use in flex interconnect applications provide exceptional electrical performance. Copper Clad Features: Certified to IPC 4203A/13 Available in dielectric thicknesses of 2, 3, and
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Electrical Insulation / Dielectric
- Dielectric Constant (Relative Permittivity): 2.3 to 2.6
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: FX PCB Co., Ltd.
Description: normally 2 different types of thin PCB, one is Fr4 material(rigid board), and another one is polyimide material (FPC). We usually use the BT material of the Fr4 to make the thin rigid PCB, BT is a black core material with high Tg. The dimension expansion and contraction,
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Supplier: FX PCB Co., Ltd.
Description: -free substrate options include polyimide (PI) and PTFE-based materials. Conductive Traces: The conductive traces on a PCB are typically made of copper, which is an excellent conductor of electricity. Copper traces are deposited onto the substrate using processes such as etching or
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Supplier: IDENTCO International
Description: type of demanding durable labeling requirements inherent to various PCB applications and electronics components production,” said Victor Holbein, Chief Operating Officer for IDENTCO. “Its special polyimide allows it to provide exceptional levels of durability and functionality at an
- Backing / Base: Specialty / Other
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Supplier: TE Connectivity
Description: Body Features Assembly Process Feature Material : Polyimide Film Connector Profile : Standard Primary Product Color : Black Configuration Features Board
- Contact Plating: Gold Plating, Other
- Mounting: Other
- Product Type: Pin Receptacles
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Supplier: TE Connectivity
Description: Body Features Assembly Process Feature Material : Polyimide Film Connector Profile : Standard Primary Product Color : Black Configuration Features Connector Contact Load
- Contact Plating: Gold Plating, Other
- Mounting: Other
- Product Type: Pin Receptacles
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Supplier: TE Connectivity
Description: Body Features Assembly Process Feature Material : Polyimide Film Primary Product Color : Natural Configuration Features Board-to-Board Configuration : Parallel Number of
- Contact Plating: Other
- Contacts Pitch: 0.8000 mm
- Current Rating: 0.5000 amps
- Dielectric Withstanding Voltage: 0.5000 kilovolts
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Supplier: TE Connectivity
Description: Body Features Assembly Process Feature Material : Polyimide Film Primary Product Color : Natural Configuration Features Board-to-Board Configuration : Parallel Number of
- Contact Plating: Other
- Contacts Pitch: 0.8000 mm
- Current Rating: 0.5000 amps
- Dielectric Withstanding Voltage: 0.5000 kilovolts
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Description: Low-Flow Flame Retardant Adhesive on Polyimide Film Description T1779 Bus Bond® insulations combine our proprietary low flow flame retardant adhesive with polyimide film and are designed for laminated busbar applications requiring a formable, higher temperature
- Adhesive: Specialty / Other
- Backing: Plastic / Polymer, Polyimide (e.g., Kapton®)
- Dielectric Strength: 2.05E8 V/m
- Peel Strength / Adhesion: 8 lbs/in
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Supplier: All-Spec Industries
Description: The Dadas Tapes 1656-12 is an amber color high-temperature polyimide film tape. Dadas Tapes 1656-12 Features: Thin and conformable for masking of uneven surfaces High-performance silicone pressure sensitive adhesive Can be safely and cleanly removed
- Adhesive: Silicone
- Backing: Plastic / Polymer, Polyimide (e.g., Kapton®)
- Dielectric Strength: 6800 to 7500 V/m
- Performance Features: Other, Dielectric / Insulating, Removable
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Supplier: K & F Electronics, Inc.
Description: TYPES OF BOARDS MANUFACTURED: Single sided, double sided, multi-layer, Teflon, Polyimide, Rogers Materials, Aluminum, Flex, Blind And Burried Via. MANUFACTURING VOLUMES: 1 piece prototypes through production volumes MAXIMUM NUMBER OF LAYERS: 24
- Location: North America, United States Only, Midwest US Only
- PCB Type: Single-Sided Boards, Double-Sided Boards, Multi-Layer Boards, Flexible Boards, Rigid-Flexible Boards, SMT Components, THT Components
- Supplier Capability: PCB Design / Layout, Prototype Quantities, Production Quantities, Testing and Evaluation, PCB Assembly, Just-In-Time Capability
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Supplier: Henkel Corporation - Electronics
Description: DC0114 epoxy underfill is suitable for high reliability applications due to its combination of properties. It can be applied to ceramic or organic substrates, including solder masks and polyimide.
- Coeff. of Thermal Expansion (CTE): 38.89 µin/in-F
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Gap Filling Compound
- Viscosity: 20000 cP
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Description: The SHEEN's SC Series Thermal Films are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, with options ranging from 0.8 to 5.0 W/m·K. ? Optional fiberglass or polyimide film can be used as the reinforcement carrier
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 4
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Henkel Corporation - Electronics
Description: Gap Pad® 1000HD was designed to with-stand applications requiring high durability. The coated polyimide carrier on one side of the material allows easy rework, excellent handling characteristics and puncture resistance. The conformable and elastic nature of Gap Pad® 1000HD
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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PCB Polyimide Label Materials - Polyimide label materials are (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for Polyonics -
Polyonics® clear and white top-coated polyimide and polyester (PET) flexible films are designed for a wide variety of flexible applications related to the electronics industry. Our light weight polyimide materials are ideal for applications requiring a high degree of dimensional stability (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for Polyonics -
Need labels that can handle 500°F and still stay readable? Polyimide labels are your go-to for electronics, aerospace, and automotive applications. ?? Extreme heat resistance (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for Polyonics -
Let’s be honest – when your latest wearable design needs to survive being twisted, folded, and worn daily, standard rigid PCBs just won’t cut it. That’s where PET flex circuits come in, and they’re quickly becoming the MVP for designers who need reliable flexibility (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
circuits can dissipate heat at much better rates than do other dielectric materials. Economical. Designers can reduce the packaging and material costs because the thin and flexible polyimide film requires a far smaller area. Flexibility. The elastic (read more)
Browse Printed Circuit Board (PCB) Fabrication Services Datasheets for Summit Interconnect -
include FR-4, which is inherently halogen-free. Other halogen-free substrate options include polyimide (PI) and PTFE-based materials. Conductive Traces: The conductive traces on a PCB are typically made of copper, which is an excellent conductor of electricity. Copper (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
are normally 2 different types of thin PCB, one is Fr4 material(rigid board), and another one is polyimide material (FPC). We usually use the BT material of the Fr4 to make the thin rigid PCB, BT is a black core material with high Tg. The dimension expansion and contraction, stability are better (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
With the development of FPC and Rigid PCB, it comes to a new product called rigid-flex PCB. The rigid flex PCB combines the flexible PCB and rigid PCB characteristics after the lamination and other processes. Rigid flex board can be categorized into: single-layer, double-layer, and multilayer (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
, tracking, manufacturing and protection. Available Performance Label and Tag Materials PCB Labels: Tracking (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for Polyonics -
Transparent PCB can also be called clear PCB, and this unique circuit board not only has potential for aesthetically designed products but also advantages in optical applications. It is unlike the traditional normal PCB, the transparent PCB has high transparency. It consists of the (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd.
Conduct Research Top
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Mobile Device Manufactured to Operate in Harsh Environments
A leading global provider of innovative portable detection solutions chose Epec to supply products that would help them protect people and properties from hazardous gas leaks. They were in search of a supplier for printed circuit boards, a membrane switch with a polyimide flexible PCB and a custom
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Study of a high spatial resolution 10B-based thermal neutron detector
for application in neutron reflectometry: the Multi-Blade prototype
Detail of a cassette (right): the two polyimide PCBs surrounding the coated blade.
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Characteristics of environmental factor for electrochemical migration on printed circuit board
The resistance of ECM with polyimide PCB was greater than that with FR-4 (flame resistant-4) PCB.
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Packaging of a silicon-based biochip
In principle, MFI is a combination between a custom designed flexible polyimide PCB interconnection and an adapted conventional ball bond technique (Fig. 2).
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Seamless integration of CMOS and microfluidics using flip chip bonding
PDMS is attached to the flexible polyimide PCB using a combination of oxygen plasma treatment and chemical bonding with 3-aminopropyltriethoxysilane.
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The RF telecommunications system for the New Horizons mission to Pluto
On one side, a multilayer, polyimide PCB contains the circuitry required for the RF, IF, analog, and digital portions of the X-band carrier tracking receiver, ranging tone demodulation, and the WBIF channel.
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Failure analysis of μBGA-new approaches in fault isolation
Furthermore, the use of polyimide PCB and elastomer encapsulant call for new methods/chemicals for package removal.
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Microvias: For Low Cost, High Density Interconnects > Special High-Density Interconnects for Flip Chip Applications
A rigid multilayer polyimide PCB has a T g of 260ºC, which is above the curing temperature of BCB (250ºC), and the right TCE characteristics.
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Development of High Temperature Telemetry Systems for Long Term Borehole Monitoring Systems in Riser Holes
The polyimide PCB has been used in this life test.
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Multichannel neural cuff electrodes with integrated multiplexer circuit
Fig. 7 shows the planar polyimide PCB and the electronic components of the multiplexer module before assembly.
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X-band digital receiver for the New Horizons spacecraft
On one side, a multilayer, polyimide PCB contains the circuitry for the radio frequency (RF), intermediate frequency (IF), analog, and digital sections of the X-band camer tracking receiver, ranging tone demodulation, and a wideband IF channel for radiometrics modes.