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Supplier: ECSI Fibrotools
Description: titanium. All parts can be easily disassembled for maintenance. Dual power supply for precision reverse pulse plating or potentiostatic operation. IKoStation’s arrangement of wafer holder, reciprocating anode, reverse pulse rectifier and pump ensure surpassing performance
- Application / Industry: Medical Devices, Semiconductor / Wafer
- Equipment / System Type: Batch - Vibratory / Ultrasonic, Laboratory / Pilot System
- Process / Technology: Electrochemical Deposition (ECD), Electroplating, Specialty / Other
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Supplier: ECSI Fibrotools
Description: arrangement of wafer holder, reciprocating anode, reverse pulse rectifier and pump ensure surpassing performance: Wafer holder, ergonomically designed for easy processing and handling. IKo™ can accommodate various wafer sizes. A full-circle, elastic electric contact provides
- Application / Industry: Medical Devices, Semiconductor / Wafer
- Equipment / System Type: Batch - Vibratory / Ultrasonic, Laboratory / Pilot System
- Process / Technology: Electrochemical Deposition (ECD), Electroplating, Specialty / Other
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Supplier: ECSI Fibrotools
Description: wafer holder, reciprocating anode, reverse pulse rectifier and pump ensure surpassing performance: Wafer holder, ergonomically designed for easy processing and handling. IKo™ can accommodate various wafer sizes. A full-circle, elastic electric contact provides uniform
- Application / Industry: Medical Devices, Semiconductor / Wafer
- Equipment / System Type: Batch - Vibratory / Ultrasonic, Laboratory / Pilot System
- Process / Technology: Electrochemical Deposition (ECD), Electroplating, Specialty / Other
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Supplier: ECSI Fibrotools
Description: Rectifier, contributes to equipment versatility. Reverse-pulse current during processing efficiently controls plating thickness distribution along the Z-axis. Fan-out Pump with constant filtration (regardless of fine filter medium). Provides a constant flow of high-quality bulk
- Application / Industry: Medical Devices, Semiconductor / Wafer
- Equipment / System Type: Batch - Vibratory / Ultrasonic, Laboratory / Pilot System
- Process / Technology: Electrochemical Deposition (ECD), Electroplating, Specialty / Other
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Characterization and microhardness of Co−W coatings electrodeposited at different pH using gluconate bath: A comparative study
The PC electrodeposition was also carried out galvanostatically using cathodic square wave unipolar double pulse plating rectifier from Trans Pulse Electronics.
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Corrosion properties of double layer nickel coatings obtained by pulse plating techniques
All the experiments were carried out galvanostatically with a PE86C plating electronic pulse rectifier ( Plating Electronic GmbH, Denzlingen, Germany).
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Copper electrodeposition in sulphate solutions in the presence of benzotriazole
Pulse plating was carried out using a PARAM4 pulse plating rectifier (LWD Scientific), with the elec- trode potential during electrolysis being monitored on a digital oscilloscope (Agilent 54624A) using a standard 3-electrode system.
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Achieving a Finer Grain Structure Using the Indium Sulfamate Plating Bath (.pdf)
This process involves a special pulse plate rectifier that is specifically designed for periodically reversing the .
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http://www.nanotech.dtu.dk/~/media/institutter/nanotech/research/research-groups/magnetic_systems/publications/phd%20theses/thesis_final_w_papers_2.ashx
… only differences between the experiments are a higher chloride content in the new bath (called “This work” in Figure 2) and that in this work we did not compensate for a known inaccuracy in the pulse plating rectifier (TCD research, double cathode …
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Thermal, Power and Electrical Engineering
The 24-pulse R.U contains a 12- pulse plate diode rectifier which is made of silicon .
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ZASMHBA0001250
A rectifier for converting altemating current to direct current or a pulse - plating rectifier , which allows more precise control of electrical parameters, can be used.
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Pulse plating of nickel: influence of electrochemical parameters and composition of electrolyte
For all pulse plating experiments, a PE86 plating electronic pulse rectifier was used applying peak current densities up to 0.05 A cm22 .
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Synthesis of Fe2O3/TiO2
nanorod–nanotube arrays by filling
TiO2
nanotubes with Fe
A DC rectifier cou- pled with pulse plating software (TCD Teknologi, Denmark) was used for the controlled deposition.
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Electrodeposition of compositionally modulated Au/Co alloy layers
A Computer Aided Pulse Plating (CAPP) system with a rectifier from Axel A˚ kerman A/S was used for the plating.