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  • MICRO: Controlling particles in sputter deposition modules
    dc bias to a target (or cathode) made from the desired deposition material. The positive ions generated in the plasma are accelerated toward the target and, through momentum transfer, the atoms at the target surface are sputtered into the chamber as a
  • MICRO: Process Tool Support
    semiconductor manufacturing processes, some of which are also used in the manufacture of disk media and flat-panel displays. Processes that deposit thin films, such as sputtering and CVD, and processes that remove thin films, such as plasma etching and CMP, are especially prone to contamination from process

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