Semiconductor Sputtering Target

Description: CIGS solar cells. But how to produce molybdenum thin films? In the magnetron sputtering method tiny metal particles are vaporized from the sputtering targets and are then deposited as a thin film on the glass substrate. In this fast, economical coating process, all the

• Type: Sputtering Target

Description: stable. Using the world's largest hot rolling mill for refractory metals, we recently succeeded in manufacturing the largest tungsten sputtering target on Earth. The benefit to you of our large formats: The coating process is more stable and the deposited layers are of higher quality

• Type: Sputtering Target

Description: therefore determines the quality of the obtained image. Totally pure. Impurities in the sputtering targets impair the electrical conductivity of the material. Impurities in the form of titanium, phosphorous, calcium, iron, chromium and selenium are particularly critical. These metals

• Type: Sputtering Target

Description: displays, these layers are exposed to atmospheric humidity and perspiration from the user's hand. The answer to corrosion: Plansee's molybdenum-tantalum solutions. High density. We use hot forming processes to compact our MoTa sputtering targets to 99.5 % and more. The

• Type: Sputtering Target

Description: MICRODYN TECHNOLOGY MicroDyn is DSI’s proprietary version of magnetron sputtering optimized for high throughput. MicroDyn utilizes an octagonally shaped chamber, where electrically conductive (metal or semiconductor) coating targets are arranged around the periphery, and the

• Functional / Performance: Abrasion Resistant, Antireflective, Chemical Resistant, Dielectric, Heat Resistant / High Temperature, Reflective
• Hard Coating / Treatment: Yes
• Industry: Aerospace, Automotive, Electronics, Government, Medical / Healthcare, Military Specification, OEM / Industrial, Other
• Material / Substrate Capabilities: Aluminum, Metal, Nickel / Nickel Alloys, Precious Metals, Titanium, Specialty / Other

Description: 1.1 This specification covers pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices. 1.2 This standard sets purity grade levels, physical attributes, analytical methods, and packaging.

Description: This specification covers high purity titanium sputtering targets for use as raw material in the fabrication of semiconductor electronic thin films. Material covered by this specification comprises Grades 4N, 4N5, and 5N titanium sputtering targets, the grades of

Description: This specification covers high purity titanium sputtering targets for use as raw material in the fabrication of semiconductor electronic thin films. Material covered by this specification comprises Grades 4N, 4N5, and 5N titanium sputtering targets, the grades of

Description: 1.1 This specification covers pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices. 1.2 This standard sets purity grade levels, physical attributes, analytical methods, and packaging. 1.2.1 The grade designation is a measure of

Description: panel display and touchscreen in use today. In fact, IGZO (combining indium, gallium, and zinc oxides) is the future material of choice for forming the pixel switching transistors in next-generation displays. Indium sputtering targets are commonly used with CuGa sputtering

• Applications: Electronics / Microelectronics, Photovoltaic / Solar
• Bulk Solid (Powder, Granule, Lumps, etc.): Yes
• Evaporation / Boiling Point: 3776 F
• Materials Processed: Specialty / Other

Description: applications in furnace parts and tooling along with feed stocks for the electronic and semiconductor industries. Typical Applications • Aerospace Propulsion • Radar Systems • Components • Radiation Shields • Sputtering Targets • Heating Elements • Shields & Liners

• Applications: Aerospace / Aircraft (AQ), Chemical / Materials Processing, Electrical / HV Parts, Electronics / RF-Microwave, Resistance Alloy / Heating, Wear Parts / Tooling, Other
• Features: Vacuum Arc Melted (E, VAR, etc.)
• Metal Matrix Composite: Yes
• Metal / Alloy Types: Refractory / Reactive (UNS R), Molybdenum / Molybdenum Alloy

Description: Direct Plated Copper (DPC) is a newest development in the field of Ceramic Substrate PCBs, its process is by magnetron sputtering technology to deposit a metal layer (Ti/Cu target) on the surface of the ceramic substrate which result in copper thickness' ranging from 10um to 130um, and

• Applications: Other
• Material Type: Specialty Ceramic

Description: in silicon semiconductor processing Sputtering targets Break rings for horizontal casters Wintrustek Advanced Materials is a leading ceramic materials supplier. We provide high-quality Boron Nitride ceramics at a competitive price. More Materials:

• Material Type: Aluminum Nitride, Boron Nitride

Description: in silicon semiconductor processing Sputtering targets Break rings for horizontal casters Wintrustek Advanced Materials is a leading ceramic materials supplier. We provide high-quality Boron Nitride ceramics at a competitive price. More Materials:

• Density: 1.5 to 1.6 g/cc
• Material Type: Aluminum Nitride, Boron Nitride

Description: Fittings and the lining of the plasma chamber Nonferrous metal and alloy nozzles Thermocouple protection tubes and sheath Boron doping wafers in silicon semiconductor processing Sputtering targets Break rings for horizontal casters Wintrustek

• Material Type: Boron Nitride

Description: nozzles Thermocouple protection tubes and sheath Boron doping wafers in silicon semiconductor processing Sputtering targets Break rings for horizontal casters Wintrustek Advanced Materials is a leading ceramic materials supplier. We provide high

• Material Type: Boron Nitride
• Shape / Form: Tube / Sheath - Immersion (Closed End)