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Supplier: Precision Surfacing Solutions
Description: To complement our extensive range of Single and dual face lapping and polishing machines Lapmaster has introduced a new line of precision oscillating head polishing machines. Designated the LLCD series they are, primarily, Microprocessor controlled pad polishing
- Applications / Materials Abraded: Ceramics / Glass, Ophthalmic / Optical, Wet Finishing
- Automation: None / Manual
- Driver Technology: Electric Motor / Vibrator
- Motor Voltage and Phase: 50 Hz / International Power, Other
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Supplier: Daitron Co., Ltd.
Description: also make a Bevel machine designed to form an edge on 2 inch to 8 inch diameter wafers. The Bevel Machine can process materials such as silicon, and many other semiconductive subtrates. Contouring Vertical Polisher Machine Features Two grinding stations Enhanced
- Applications: Semiconductor Wafers
- Maximum Wafer / Part Size: 50.8 to 203 mm
- Mounting / Loading: Manual Loading
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Description: industry because it does not pose a health risk when machined. Aluminum Nitride possesses electrical insulating qualities and a coefficient of thermal expansion similar to silicon wafer material, making it a valuable material for electronics applications where high temperatures
- Material Type: Aluminum Nitride
- Shape / Form: Plate / Board (e.g., Fiberboard)
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Supplier: Zygo Corporation
Description: components can be made in a variety of custom shapes and sizes, employing precision manufacturing capabilities for monolithic, bar, and light-weighted machined optical structures. Beyond fabrication and polishing, ZYGO offers precision anti-reflective, highly reflective, or custom
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popularity is their thermal profile, which closely matches that of silicon. This similarity makes AIN substrates an excellent choice for semiconductor applications where thermal management is critical. Innovacera, a leading provider of these substrates, offers Aluminum Nitride Wafer Substrates in (read more)
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Insaco, Inc has become recognized as a worldwide leader in custom machined ceramic and sapphire parts for the semiconductor industry. Through this experience, Insaco® offers multiple hole wafer carriers in sapphire for GaAs, Indium Phosphide, and other semiconductors. Why (read more)
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as the raw material to ensure consistency and performance. Forming and sintering processes are optimized to achieve high density and strength. After sintering, the tubes are precisely machined and polished to achieve the (read more)
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. 3. Tailor-made for Many Applications and on Multitude of Machines For use on most polishing machines and fixtures, including machines that run at higher speed and higher pressure. (read more)
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A multimedia expert system for wafer polisher maintenance
WESDA is an intelligent diagnostic system which assists in troubleshooting highly complex machines for polishing silicon wafers .
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Advances in Abrasive Technology XV
And the tool fabricated under the optimized condition was adopted for silicon wafer polishing under various machining parameters (pressure, rotating speed and polishing time) to evaluate its processing performance.
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Research on the Hydrodynamic Electro-Chemical Mechanical Polishing for Silicon Wafer with Suspension Fluid
• Influences of Machining Parameters on Silicon Wafer Polished with Gel-Coupled Ultra-Fine Abrasive Polishing Pads p.279 .
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Electrophoretic deposition grinding (EPDG) for improving the precision of microholes drilled via ECDM
Moreover, Tani et al [18] studied the electrophoretic deposited silica particles as a means of polishing silicon wafer and performing machining experiments on glass.
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Scientific.Net: Materials Science
Influences of Machining Parameters on Silicon Wafer Polished with Gel-Coupled Ultra-Fine Abrasive Polishing Pads .
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Design of Surface Finish Using Synchronous Process of Grinding and Electrochemical Finishing
• Influences of Machining Parameters on Silicon Wafer Polished with Gel-Coupled Ultra-Fine Abrasive Polishing Pads p.279 .
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Key Engineering Materials
Influences of Machining Parameters on Silicon Wafer Polished with Gel-Coupled Ultra-Fine Abrasive Polishing Pads .
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Scientific.Net: Materials Science
Influences of Machining Parameters on Silicon Wafer Polished with Gel-Coupled Ultra-Fine Abrasive Polishing Pads .
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Scientific.Net: Materials Science
Influences of Machining Parameters on Silicon Wafer Polished with Gel-Coupled Ultra-Fine Abrasive Polishing Pads .
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Study of Finishing Internal Surface Using Magnetic Force Generated by Rotating Magnetic Field in Electromotor
• Influences of Machining Parameters on Silicon Wafer Polished with Gel-Coupled Ultra-Fine Abrasive Polishing Pads p.279 .