Products/Services for Silicon Wafer Polishing Machines
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Polishing and Buffing Machines - (327 companies)...coated abrasives Types of Polishing and Buffing Machines Many types of polishers and buffing machines are available. Choices include: disc finishing machines centerless finishing machines buffers cylindrical polishers honing machines lapping... -
Grinders and Grinding Machines - (992 companies)...and chemical-mechanical polishing (CMP) machines are specialized devices that provide very flat, smooth, or low roughness average (RA) surface finishes. Very rigid machines make better use of abrasives in precision grinding applications. Types of Grinders... -
Sanders and Sanding Machines - (299 companies)...for extrusion or flow honing, thermal deburring or stripping, and wafer thinning or backgrinding. Specifications. Specifications for sanders and sanding machines include: mounting style. rotary speed. surface or linear speed. power. current. driver... -
Ultra-hard Materials Machining - (117 companies)Quartz is an ultra-hard form of silica or silicon dioxide. Glass ceramics can be fused and then molded, formed, ground or machined using conventional glass fabrication techniques. Sapphire is a high-purity, single crystalline form of aluminum oxide... -
Honing, Lapping, and Super-finishing Machines - (129 companies)...with limited stock removal. Superfinishing cannot correct geometry to the same degree as honing because of the inherent low material removal rate. Superfinishing machines are used to produce a very highly polished mirror finish with high geometric... -
Lapping Services - (102 companies)Lapping services uses a free abrasive machining process, which produces finished components without introducing stresses and heat damage associated with other processes. Lapping services use a free-abrasive machining process to produce finished...
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Semiconductor Equipment Repair Services - (43 companies)...specialize in repairing, rebuilding, and refurbishing specific types of semiconductor equipment. Categories include automation and back-end semiconductor production equipment; machines for wafer fabrication and wafer processing; wafer inspection...
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Silica, Quartz, and Silicate Materials - (180 companies)...on silicon dioxide and various chemical variations. Processing and Production. Silica and silicate materials are fused or cast with aluminum, calcium, sodium, and magnesium oxide additions to modify specific properties and impart various processing...
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Abrasive Compounds and Abrasive Slurries - (281 companies)To create a very smooth or flat surface with an extremely fine finish, lapping and polishing machines also use finishing compounds. Parts are processed between one or two large flat plates. Typically, one plate is stationary while the other rotates...
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MEMS Processing Equipment - (42 companies)...university laboratory settings. wafer fabrication facilities. MEMS research and development facilities. Specifications. MEMS processing equipment includes: silicon etching tools. wafer grinders. lapping and polishing machinery. planarization equipment...
Product News
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Shenzhen Great Precision Ceramic CO., LTD.
Engineering with Silicon Nitride Ceramics Expansion Coefficient. ~3 x 10?? /K. ~3.1 x 10?? /K. Operating Temperature (Air). up to 1300 C. up to 1400 C. Electrical Resistivity. > 10 ^1? O .cm. > 10 ^1? O .cm. Processing and Customization. Due to its high hardness and strength, machining silicon nitride requires advanced tools and processes. Great Ceramic provides full-process capability, including: Diamond grinding and precision CNC machining. Polishing, lapping, and dimensional finishing. Ceramic-to-metal joining and metallization. Laser... (read more)Browse Silicon Nitride and Silicon Nitride Ceramics Datasheets for Shenzhen Great Precision Ceramic CO., LTD. -
Shenzhen Great Precision Ceramic CO., LTD.
Silicon Carbide Tube tubes exposed to acids and corrosive gases. In semiconductor manufacturing, it functions as diffusion and oxidation tubes, or precision components for wafer processing. In power and energy systems, it works reliably as burner tubes and fuel reformer components under high thermal stress. In aerospace and defense, it provides lightweight and durable solutions for propulsion systems and gas flow control at high temperatures. Technical Specifications. The silicon carbide tube is made from high-purity... (read more)Browse Industrial Ceramic Materials Datasheets for Shenzhen Great Precision Ceramic CO., LTD. -
Shenzhen Great Precision Ceramic CO., LTD.
Silicon nitride ceramic porous tooling block preparation, porous structure forming, high-temperature sintering, precision machining, surface finishing, and quality inspection. Available processes include: Ceramic molding and forming. Pressure sintering. CNC ceramic machining. Diamond grinding and polishing. Precision porous structure processing. Advanced ceramic processing technologies are used to achieve uniform pore distribution, accurate dimensions, and stable mechanical performance. Machining Capability & Equipment. Our silicon nitride ceramic... (read more)Browse Silicon Nitride and Silicon Nitride Ceramics Datasheets for Shenzhen Great Precision Ceramic CO., LTD. -
Shenzhen Great Precision Ceramic CO., LTD.
Precision Ceramic Machining Solutions Grinding & Lapping: Surface finishes to Ra < 0.02 um. Laser Cutting & Drilling: Non-contact precision for micro-features. Electrical Discharge Machining (EDM): Intricate cavities and undercuts. Precision Drilling & Tapping: High-aspect-ratio holes with minimal chipping. Surface Polishing: Optical-quality finishes for lenses and substrates. Materials We Machine. Material. Key Attributes. Alumina (Al?O?). Wear-resistant, excellent electrical insulation. Zirconia (ZrO?). High fracture toughness, polishable. Silicon... (read more)Browse Industrial Ceramic Materials Datasheets for Shenzhen Great Precision Ceramic CO., LTD. -
3X Ceramic Parts Company Limited
SiC ceramic precision parts in lithography machine and the performance of structural materials. ? silicon carbide worktable. Take the worktable in the lithography machine as an example. The worktable is mainly responsible for completing the exposure movement, and requires high-speed, large stroke and six degrees of freedom nano ultra precision movement. For example, for the lithography machine with 100nm resolution, 33nm nesting accuracy and 10nm linewidth, the worktable positioning accuracy is required to reach 10nm, the mask silicon wafer... (read more)Browse Silicon Carbide and Silicon Carbide Ceramics Datasheets for 3X Ceramic Parts Company Limited -
Fountyl Technologies Pte. Ltd.
Silicon Carbide Wafer Pin Chuck Product Overview. Used in plasma etch chambers, CVD systems, and ion implantation equipment for wafer clamping and lift-pin support during processing. Fountyl silicon carbide wafer pin chucks integrate the clamping surface and lift pins into a single high-purity sintered SiC ( >= 99%) assembly. The material delivers density >= 3.10 g/cm3, flexural strength >= 450 MPa, Vickers hardness >= 2500 HV, and thermal conductivity >= 150 W/m.K. Maximum service temperature 1600 C in inert atmosphere... (read more)Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
Fountyl Technologies Pte. Ltd.
Silicon Carbide Wafer Pins and Chucks Silicon carbide wafer pins and chucks are used in plasma etch chambers, CVD systems, and ion implantation equipment for wafer support, lifting, and clamping during processing. The material must withstand aggressive plasma chemistry while maintaining dimensional stability and minimizing particle generation. Material Grade. Fountyl uses high-purity sintered silicon carbide (SiC) with the following specifications: - Purity -- >= 99%. - Density -- >= 3.10 g/cm3 (theoretical density > 98%... (read more)Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
3X Ceramic Parts Company Limited
Silicon Carbide(SiC) Ceramic Wafer Boat Silicon carbide (SiC) ceramic crystal boats are important components used in the manufacturing processes of semiconductors and solar cells. They are made of high-purity silicon carbide ceramics and feature excellent high-temperature resistance, corrosion resistance, wear resistance and high thermal conductivity. They can withstand harsh environments such as high temperatures, high pressures and plasma, and are not prone to deformation, ensuring long-term stable operation. The Advantages... (read more)Browse Silicon Carbide and Silicon Carbide Ceramics Datasheets for 3X Ceramic Parts Company Limited -
Vimfun Diamond Wire Saw
Wire Cutting Machine for Wafer Slicing Wafer producers frequently face kerf loss, slurry contamination, and yield instability during slicing. Traditional slurry-based cutting adds cleaning costs and environmental burden, while inconsistent cutting quality can reduce usable wafer output. This multi-wire cutting machine is designed for stable, high-volume slicing: * Continuous diamond wire system for precise multi-slice cutting. * High-throughput multi-wire design for mass production. * Low kerf loss to improve material utilization... (read more)Browse Wire Cutting Machines Datasheets for Vimfun Diamond Wire Saw -
Xiamen Innovacera Advanced Materials Co., Ltd.
Aluminum Nitride Wafer Substrates The Importance of Aluminum Nitride Wafer Substrates. Aluminum Nitride Wafer Substrates play an essential role in the semiconductor industry. One of the key reasons for their popularity is their thermal profile, which closely matches that of silicon. This similarity makes AIN substrates an excellent choice for semiconductor applications where thermal management is critical. Innovacera, a leading provider of these substrates, offers Aluminum Nitride Wafer Substrates in various diameters, ranging... (read more)Browse Specialty Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd.
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A multimedia expert system for wafer polisher maintenance
WESDA is an intelligent diagnostic system which assists in troubleshooting highly complex machines for polishing silicon wafers .
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Advances in Abrasive Technology XV
And the tool fabricated under the optimized condition was adopted for silicon wafer polishing under various machining parameters (pressure, rotating speed and polishing time) to evaluate its processing performance.
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Research on the Hydrodynamic Electro-Chemical Mechanical Polishing for Silicon Wafer with Suspension Fluid
• Influences of Machining Parameters on Silicon Wafer Polished with Gel-Coupled Ultra-Fine Abrasive Polishing Pads p.279 .
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Electrophoretic deposition grinding (EPDG) for improving the precision of microholes drilled via ECDM
Moreover, Tani et al [18] studied the electrophoretic deposited silica particles as a means of polishing silicon wafer and performing machining experiments on glass.
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Scientific.Net: Materials Science
Influences of Machining Parameters on Silicon Wafer Polished with Gel-Coupled Ultra-Fine Abrasive Polishing Pads .
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Design of Surface Finish Using Synchronous Process of Grinding and Electrochemical Finishing
• Influences of Machining Parameters on Silicon Wafer Polished with Gel-Coupled Ultra-Fine Abrasive Polishing Pads p.279 .
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Key Engineering Materials
Influences of Machining Parameters on Silicon Wafer Polished with Gel-Coupled Ultra-Fine Abrasive Polishing Pads .
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Scientific.Net: Materials Science
Influences of Machining Parameters on Silicon Wafer Polished with Gel-Coupled Ultra-Fine Abrasive Polishing Pads .
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Scientific.Net: Materials Science
Influences of Machining Parameters on Silicon Wafer Polished with Gel-Coupled Ultra-Fine Abrasive Polishing Pads .
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Study of Finishing Internal Surface Using Magnetic Force Generated by Rotating Magnetic Field in Electromotor
• Influences of Machining Parameters on Silicon Wafer Polished with Gel-Coupled Ultra-Fine Abrasive Polishing Pads p.279 .
