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Supplier: Nordson EFD
Description: Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and
- Use Temperature: -40 to 392 F
- Thermal Conductivity: 0.92 W/m-K
- Features: Air Setting / Film Drying, Specialty / Other, Thermally Conductive
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 970 TC A/B is a pasty, but still flowable addition-curing, two component elastomeric silicone that cures at elevated temperature to an thermally conductive silicone rubber. Special features two-component thermal conductivity pasty, still flowable almost constant
- Viscosity: 25,000 to 120,000 cP
- Thermal Conductivity: 0.8 W/m-K
- Tensile Strength (Break): 580.147357428788 psi
- Elongation: 90 %
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Supplier: Richardson RFPD
Description: The 126 Series is a nontoxic, synthetic, ester-based (nonsilicone) Thermal Joint Compound with metal oxide fillers designed to enhance thermal performance characteristics of plastic and metal package devices exceeding that of silicone-based compounds.
- Features: Thermally Conductive
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Supplier: Fujipoly® America Corp.
Description: a silicone-based compound without the problem of contamination. FEATURES: Silicone and non-silicone formulations Thermal conductivity up to 2.6 W/m°K Low bleed and evaporation No migration for non-silicone formulations over wide temperature range
- Use Temperature: -40 to 392 F
- Thermal Conductivity: 0.75 W/m-K
- Dielectric Strength: 313.99999999999943 kV/in
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Fujipoly® America Corp.
Description: benefits of a silicone-based compound without the problem of contamination. FEATURES: Silicone and non-silicone formulations Thermal conductivity up to 2.6 W/m°K Low bleed and evaporation No migration for non-silicone formulations over wide
- Use Temperature: -67 to 401 F
- Thermal Conductivity: 2.6 W/m-K
- Dielectric Strength: 411.9999999999988 kV/in
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Allied Electronics, Inc.
Description: high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane. The Non-Silicone Heat Transfer compound is designed to eliminate the potential problems of silicone-based compounds caused by
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Supplier: Allied Electronics, Inc.
Description: heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane. The Non-Silicone Heat Transfer compound is designed to eliminate the potential problems of silicone-based compounds caused by migration and component contamination.
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Thermal Compounds and Thermal Interface Materials - Arctic Alumina Thermal Compound (14 gram) -- 408Supplier: Xoxide
Description: Introducing Arctic Alumina Thermal Compound, the first ceramic-based, polysynthetic thermal compound for use between modern high-power CPUs and high performance heatsinks or water-cooling solutions. Features: Made with micronized aluminum oxide and boron nitride:
- Features: Thermally Conductive
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Supplier: Xoxide
Description: Introducing Innovation Cooling's latest offering, the IC Perihelion! This high-performance ceramic thermal compound features a ceramic base with a high bulk loading of over 91% to prevent pump out due to thermal cycling. It is completely silicone-free and non-capacitive,
- Features: Thermally Conductive
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Supplier: Xoxide
Description: Introducing Arctic Alumina Thermal Compound, the first ceramic-based, polysynthetic thermal compound for use between modern high-power CPUs and high performance heatsinks or water-cooling solutions. Features: Made with micronized aluminum oxide and boron nitride:
- Features: Thermally Conductive
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Supplier: Wacker Chemical Corp.
Description: WACKER’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in
- Features: Electrically Conductive, Gel, Rubber Based / Elastomeric
- Industry: Electronics, OEM / Industrial
- Chemical System: Silicone
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Xoxide
Description: The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions. Made with micronized aluminum oxide, boron nitride and zinc oxide. Ceramique uses a high-density layered composite of five
- Features: Thermally Conductive
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Supplier: Epoxies Etc...
Description: 50-1225 is a low viscosity, room temperature curing, RTV silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package.
- Viscosity: 32,000 cP
- Use Temperature: -85 to 410 F
- Thermal Conductivity: 1.7307348 W/m-K
- Tensile Strength (Break): 850 psi
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Supplier: Bluestar Silicones USA Corp.
Description: Metal Oxide Thickened Methylalkyl Silicone Compound Description Bluesil V-742 is a metal oxide thickened methylalkyl silicone compound. It offers higher thermal conductivity than other similar compounds based on dimethyl silicones. Bluesil
- Use Temperature: -67 to 347 F
- Thermal Conductivity: 1.7 W/m-K
- Dielectric Strength: 159.9999999999999 kV/in
- Dielectric Constant (Relative Permittivity): 4.3
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Supplier: Allied Electronics, Inc.
Description: Ther-O-Link is a white thermal compound that cost effectively enhances the heat transfer between a semiconductor case and a heat sink. Silicone-based, and easy to apply, Ther-O-Link substantially reduces dry interface thermal resistance, while providing long life
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Supplier: MacDermid Alpha Electronics Solutions
Description: Provides the ultimate in thermal conductivity with a very wide temperature range obtained by using silicone base oils. Product Overview HTSP Silicone Heat Transfer Compound Plus is a modified "Plus" version of Electrolube’s successful HTS, offering superior thermal
- Use Temperature: 392 F
- Thermal Conductivity: 3 W/m-K
- Type: Electrical Insulation / Dielectric
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: MacDermid Alpha Electronics Solutions
Description: Offers the best thermal conductivity performance, combined with the advantage of using a non-silicone base oil. Product Overview HTCP Non-Silicone Thermal Interface Material is a "Plus" version of Electrolube’s successful HTC, offering ultimate thermal conductivity
- Use Temperature: -58 to 266 F
- Thermal Conductivity: 2.5 W/m-K
- Type: Electrical Insulation / Dielectric
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Techsil Limited
Description: Techsil® HTC is a non-silicone heat transfer compound with a high thermal conductivity (0.9W/mK) designed for thermal coupling of electrical components. HTC is recommended where the efficient and reliable thermal coupling of electrical and electronic components is
- Use Temperature: -50 to 130 F
- Industry: Electronics
- Features: Thermal Compound / Thermally Conductive
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Supplier: MacDermid Alpha Electronics Solutions
Description: Heat transfer compound for efficient and reliable thermal coupling of electrical and electronic components. Product Overview HTC Heat Transfer Compound is a non-silicone thermal interface material recommended for efficient and reliable thermal coupling of
- Use Temperature: 266 F
- Thermal Conductivity: 0.9 W/m-K
- Industry: Electronics, Semiconductors / IC Packaging
- Form / Shape: Grease / Paste
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Supplier: Techsil Limited
Description: Techsil® TIM11021G is a silicone compound that provides high thermal conductivity. It exhibits virtually no oil separation and minimal weight loss at elevated temperatures, which contributes to stability of TIM interface under broad operational temperature ranges. Techsil® TIM-
- Chemical System: Rubber Based / Elastomeric, Silicone
- Features: Thermal Compound / Heat Conductive
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Supplier: Allied Electronics, Inc.
Description: Aavid's Ultrastick is a unique phase-change thermal interface material that surpasses grease in thermal performance and long-term stability. This solid, silicone-free, paraffin-based thermal compound changes phase at 60°C, with a concurrent volumetric
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Supplier: Techsil Limited
Description: TSE3281-G is a thermally conductive silicone adhesive from Momentive Performance Materials. This one component material is non-corrosive and has excellent adhesion properties to a wide variety of substrates. Potential applications for TSE3281-G include sealing and bonding for thermally
- Industry: Electronics
- Chemical System: Rubber Based / Elastomeric, Silicone
- Features: Thermal Compound / Heat Conductive
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Supplier: Techsil Limited
Description: MG Chemicals 860 Silicone Heat Transfer Compound is a low thermal resistance grease with a silicone base. It is electrically insulating, non-corrosive and used to improve the thermal interface contact conductivity between heat sinks, LEDs, motors, and heat
- Composition / Chemistry: Silicone
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Supplier: Wacker Chemical Corp.
Description: ELASTOSIL® RT 745 A/B is a pourable, thermally curable, addition-curing, two-part silicone rubber. Special features two-part, 1 : 1 mixing ratio low viscosity low hardness low risk of inhibition rapid heat cure primerless adhesion Application encapsulation of electronic components conformal
- Viscosity: 1,000 cP
- Industry: Electronics
- Features: Encapsulating / Potting, Liquid, RTV / Room Temperature Curing, Rubber Based / Elastomeric
- Chemical System: Silicone
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Description: against puncture, shear and tear. It not only exhibits high thermal conductivity but also excellent thermal performance at low pressures. Therefore this product is ideal for high performance applications at low mounting pressures. High thermal conductivity: 5 W/m-K Highly
- Use Temperature: -76 to 392 F
- Thermal Conductivity: 5 W/m-K
- Dielectric Constant (Relative Permittivity): 7.5
- Industry: OEM / Industrial
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Supplier: Wacker Chemical Corp.
Description: WACKER’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in
- Industry: Electronics
- Features: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Chemical System: Rubber Based / Elastomeric, Silicone
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST GAP FILLER TGF 1400SL, Thermally conductive, Silicone based, Two-part, Low Viscosity, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 1400SL is a two-part, thermally conductive, silicone based, liquid gap filling material. This material has an extremely
- Use Temperature: 76 to 392 F
- Thermal Conductivity: 1.4 W/m-K
- Form / Shape: Gap Filling Compound
- Chemical System: Silicone
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY TEM96B is a thermally conductive absorber based upon soft magnetic materials dispersed in a polymeric resin. It has a thermal conductivity of 3.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues.
- Applied Thickness / Gap Fill: 0.01968505 to 0.1968505 inch
- Use Temperature: -76 to 356 F
- Thermal Conductivity: 3 W/m-K
- Industry: Electronics
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1340483-TG-A20KF-190-140-1.5 Category: Fans, Thermal Management - Thermal - Pads, Sheets Series: TG-A20KF Type: Pad, Sheet Color: Gray Package: Bulk Usage: Multi Standard Package: 1 Thickness: 0.0591" (1.500mm) Outline: 190.00mm x 140.00mm Material:
- Thermal Conductivity: 1.8 W/m-K
- Features: Thermally Conductive
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Supplier: Fujipoly® America Corp.
Description: Fujipoly® recently released Sarcon® GR130A, its newest high-performance, thermal gap filler pad. The highly conformable, gel-like sheets exhibit a thermal resistance as low as 0.02°C•in2/W at 43.5 PSI with a thermal conductivity of 13 W/m°K. Sarcon® GR130A is available in five
- Applied Thickness / Gap Fill: 0.01181103 to 0.0787402 inch
- Use Temperature: -40 to 302 F
- Thermal Conductivity: 13 W/m-K
- Dielectric Strength: 177.80000000000038 kV/in
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Description: CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application and
- Use Temperature: 320 F
- Thermal Conductivity: 30 W/m-K
- Tensile Strength (Break): 4.35110518071591 psi
- Elongation: 20 %
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST LIQUI BOND TLB EA1800, Thermally Conductive, Two-Part, Epoxy Based, Liquid-dispensable Adhesive BERGQUIST® LIQUI BOND TLB EA1800 is a two-component, epoxy based, liquid-dispensable adhesive. BERGQUIST LIQUI BOND TLB EA1800 has a thermal conductivity of 1.8 W/mK.
- Use Temperature: 40 to 257 F
- Thermal Conductivity: 1.8 W/m-K
- Chemical System: Silicone
- Features: Thermal / Heat Conductive
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating properties.
- Viscosity: 150,000 cP
- Use Temperature: -58 to 356 F
- Thermal Conductivity: 2 W/m-K
- Form / Shape: Die Bonding Adhesive / Compound, Grease / Paste
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Description: CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application and
- Use Temperature: 320 F
- Thermal Conductivity: 45 W/m-K
- Tensile Strength (Break): 4.35110518071591 psi
- Elongation: 10 %
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MORE CONDUCTIVITY - LESS COMPRESSION Thermal gap fillers are used to fill air gaps between components in an electronic assembly or electronic system to enhance thermal behavior. These materials are ideal for filling gap openings that result from design restraints that (read more)
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Roadside and highway information displays must deliver crisp, readable images 24/7. Yet a hidden materials problem can quietly undermine that performance: tiny silane/siloxane molecules from silicone-based thermal interface materials evaporate or migrate, condense on optical surfaces, and (read more)
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Silicone-free resin base prevents siloxane outgassing and oil bleeding Thermal conductivity up to 8.0 W/m·K for demanding server cooling (read more)
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In automotive electrics, small contaminants become big problems: residue on sensors, deposits on contact surfaces, and microscopic particulates that compromise long-term reliability. SF500 was developed with those realities in mind — a silicone-based thermal (read more)
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silicone-based thermal interface materials (TIMs) pose a significant hidden risk. Over time and under heat, they release volatile silicone vapors that condense on delicate lenses and laser emitters within the LiDAR assembly, leading to clouding, signal scattering, and measurement drift. This (read more)
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heat sink hinder the transfer of heat,thereby affecting the cooling performance. Silicone insulator pads are silicone polymer elastomers reinforced with fiberglass as the base material.These pads effectively reduce the thermal resistance between electronic components and heat sinks while (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
-suited for environments with operating temperatures ranging from -40 to +150°C. When placed between high-power, heat generating components and a nearby heat sink, the silicone-based material completely fills air gaps between uneven components, board protrusions and recessed areas. This maximizes heat transfer and dissipation, thereby improving overall performance. (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
performance is not determined by one factor alone. The base material affects how well heat-conductive fillers disperse through the film. The type, shape, and loading of fillers also matter, since they directly influence thermal conductivity and heat flow (read more)
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thermal silicone pads, phase change thermal material, thermal conductive insulating film, thermal grease, thermal gels, carbon fiber thermal pads, and non-silicone thermal pad. Each type has unique features tailored to specific product requirements. 5G smartphones, base stations, and servers are (read more)
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. SC900FG is engineered to meet these challenges. Built with a reinforced glass fiber or PI film base, this 0.2 mm thermal insulating film offers low thermal resistance, excellent dielectric (read more)
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More Information Top
Indicates content that may require registration and/or purchase.
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Thermal Management for LED Applications
Thermal performance of silicone - based thermal compounds is exceptionally good relative to many other types of TIMs and relative to material cost.
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CR4 - Thread: Corrosion Pattern on Press-Fit SCR Pole Faces
Water- based (not silicone ) thermal compound is then spread on both mounting surfaces, then removed with a clean cloth, in order to leave compound only where necessary.
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Insights into Cold-Start DISI Combustion in an Optical Engine Operating at −7°C
The thermocouple was coated with a silicone - based thermal compound to achieve good thermal contact with the cylinder head surface.
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Thermal and mechanical analysis and design of the IBM Power 775 water cooled supercomputing central electronics complex
The first way was to replace the traditionally used, non- silicone based Advanced Thermal Compound [12] with a cure-in-place silicone elastomer.
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Integrated on‐capillary instrumentation for gene expression measurement directly from cells
Moreover, we used silver- based thermal compound instead of silicone grease to increase heat conductivity between the capillary and the brass sheets.
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Advances in Metallurgical and Mining Engineering
Key words: caustic calcined dolomite based compound desulfurizer; silicone thermal reduction; fluxing agent; heating agent .
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Advances in Materials and Materials Processing
Therefore, it is necessary to develop a new silicone thermal reduction caustic calcined dolomite based compound desulfurization[6].
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“Dry-to-the-touch” thermal grease
The non- silicone compound is a synthetic- based thermal grease used to insure quick, efficient heat transfer and dissipation.
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Experimental and numerical investigation into the influence of printed circuit board construction on component operating temperature in natural convection
However, in this instance a sili- cone based heat transfer compound with a thermal conductivity of 3.0 W/mK from Electrolube was used.
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http://www.alliedelec.com/catalog/catalogpages/201112/780.pdf
This solid, silicone -free, paraffin- based thermal compound changes phase at 60°C, with a concurrent volumetric expansion that fills gaps between the mating surfaces.