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Supplier: Nordson EFD
Description: Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and
- Chemical / Polymer System Type: Specialty / Other
- Composition: Unfilled
- Cure Type / Technology: Single Component System
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Richardson RFPD
Description: The 126 Series is a nontoxic, synthetic, ester-based (nonsilicone) Thermal Joint Compound with metal oxide fillers designed to enhance thermal performance characteristics of plastic and metal package devices exceeding that of silicone-based compounds. Solved
- Compound Type: Thermally Conductive
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Supplier: Richardson RFPD
Description: The 126 Series is a nontoxic, synthetic, ester-based (nonsilicone) Thermal Joint Compound with metal oxide fillers designed to enhance thermal performance characteristics of plastic and metal package devices exceeding that of silicone-based compounds. Solved
- Compound Type: Thermally Conductive
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Supplier: Richardson RFPD
Description: The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of only 0.05°C/W for a 0.001
- Compound Type: Thermally Conductive
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Supplier: Richardson RFPD
Description: The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of only 0.05°C/W for a 0.001
- Compound Type: Thermally Conductive
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 975 TC is a 1-part thermally conductive paste that is curing into self-adhesive gap filling silicone. The thermal paste is able to efficiently fill finest gaps of heat generating and ablating substrates and thus helps to minimize contact resistance. Thermal
- Coeff. of Thermal Expansion (CTE): 8.33 µin/in-F
- Cure Type / Technology: Single Component System
- Dielectric Strength: 279 kV/in
- Elongation: 10 %
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Encapsulants and Potting Compounds - Techsil® Non Silicone Heat Transfer Compound 620gm -- TEOT04005Supplier: Techsil Limited
Description: Techsil® HTC is a non-silicone heat transfer compound with a high thermal conductivity (0.9W/mK) designed for thermal coupling of electrical components. HTC is recommended where the efficient and reliable thermal coupling of electrical and electronic components is
- Compound Type: Thermal Compound / Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Use Temperature: -50 to 130 F
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Supplier: Techsil Limited
Description: MG Chemicals 860 Silicone Heat Transfer Compound is a low thermal resistance grease with a silicone base. It is electrically insulating, non-corrosive and used to improve the thermal interface contact conductivity between heat sinks, LEDs, motors, and heat
- Chemistry / Constituents: Silicone
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Supplier: MacDermid Alpha Electronics Solutions
Description: Provides the ultimate in thermal conductivity with a very wide temperature range obtained by using silicone base oils. Product Overview HTSP Silicone Heat Transfer Compound Plus is a modified "Plus" version of Electrolube’s successful HTS, offering superior
- Chemical / Polymer System Type: Silicone
- Features: Electrical Insulation / Dielectric
- Industry: Electronics, Semiconductors / IC Packaging
- Material Type: Grease / Paste
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Supplier: Fujipoly® America Corp.
Description: the benefits of a silicone-based compound without the problem of contamination. FEATURES: Silicone and non-silicone formulations Thermal conductivity up to 2.6 W/m°K Low bleed and evaporation No migration for non-silicone formulations over wide
- Chemical / Polymer System Type: Specialty / Other
- Dielectric Strength: 314 kV/in
- Industry: Electronics, Semiconductors / IC Packaging
- Material Type: Grease / Paste
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Supplier: MacDermid Alpha Electronics Solutions
Description: Offers the best thermal conductivity performance, combined with the advantage of using a non-silicone base oil. Product Overview HTCP Non-Silicone Thermal Interface Material is a "Plus" version of Electrolube’s successful HTC, offering ultimate thermal
- Chemical / Polymer System Type: Silicone
- Features: Electrical Insulation / Dielectric
- Industry: Electronics, Semiconductors / IC Packaging
- Material Type: Grease / Paste
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Supplier: MacDermid Alpha Electronics Solutions
Description: Heat transfer compound for efficient and reliable thermal coupling of electrical and electronic components. Product Overview HTC Heat Transfer Compound is a non-silicone thermal interface material recommended for efficient and reliable thermal coupling of
- Chemical / Polymer System Type: Silicone
- Industry: Electronics, Semiconductors / IC Packaging
- Material Type: Grease / Paste
- Thermal Conductivity: 0.9000 W/m-K
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST GAP FILLER TGF 1400SL, Thermally conductive, Silicone based, Two-part, Low Viscosity, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 1400SL is a two-part, thermally conductive, silicone based, liquid gap filling material. This material has
- Chemical / Polymer System Type: Silicone
- Material Type: Gap Filling Compound
- Thermal Conductivity: 1.4 W/m-K
- Use Temperature: 76 to 392 F
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Supplier: Fujipoly® America Corp.
Description: greases offer all the benefits of a silicone-based compound without the problem of contamination. FEATURES: Silicone and non-silicone formulations Thermal conductivity up to 2.6 W/m°K Low bleed and evaporation No migration for non-silicone
- Chemical / Polymer System Type: Silicone
- Dielectric Strength: 386 kV/in
- Industry: Electronics, Semiconductors / IC Packaging
- Material Type: Grease / Paste
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST GAP PAD TGP HC3000, High-Compliance, Thermally Conductive, Low Modulus, Fiberglass reinforced, Silicone Based Pad BERGQUIST® GAP PAD TGP HC3000 is a soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. The material offers exceptional
- Chemical / Polymer System Type: Silicone
- Material Type: Gap Filling Compound
- Thermal Conductivity: 0.3000 W/m-K
- Use Temperature: 76 to 392 F
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Supplier: Bluestar Silicones USA Corp.
Description: Metal Oxide Thickened Methylalkyl Silicone Compound Description Bluesil V-742 is a metal oxide thickened methylalkyl silicone compound. It offers higher thermal conductivity than other similar compounds based on dimethyl silicones. Bluesil
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Dielectric Constant (Relative Permittivity): 4.3
- Dielectric Strength: 160 kV/in
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST GAP PAD TGP 3500ULM, Highly Conformable, Thermally Conductive, Ultra-Low Modulus, Fiberglass Reinforced, Silicone Based Pad BERGQUIST® GAP PAD TGP 3500ULM (ultra low-modulus) is an extremely soft gap filling material rated at a thermal conductivity of 3.5 W/m-K.
- Chemical / Polymer System Type: Silicone
- Material Type: Gap Filling Compound
- Thermal Conductivity: 3.5 W/m-K
- Use Temperature: 76 to 392 F
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST GAP PAD TGP 1500, Thermally Conductive, Un-Reinforced, Silicone Based Pad BERGQUIST® GAP PAD TGP 1500 has an ideal filler blend that gives it a low modulus characteristic that maintains optimal thermal performance yet still allows for easy handling. The natural
- Chemical / Polymer System Type: Silicone
- Thermal Conductivity: 1.5 W/m-K
- Use Temperature: 76 to 392 F
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Supplier: Xoxide
Description: Introducing Arctic Alumina Thermal Compound, the first ceramic-based, polysynthetic thermal compound for use between modern high-power CPUs and high performance heatsinks or water-cooling solutions. Features: Made with micronized aluminum oxide and boron nitride:
- Compound Type: Thermally Conductive
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Description: BERGQUIST® GAP PAD TGP 5000 is a silicone based, thermally conductive, fiberglass reinforced and S-class soft gap pad. Its highly conformable nature and S-class softness ensures that it conforms to demanding contours and maintains structural integrity. Fiberglass reinforcement
- Chemical / Polymer System Type: Silicone
- Dielectric Constant (Relative Permittivity): 7.5
- Industry: OEM / Industrial
- Material Type: Pad
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Supplier: Wacker Chemical Corp.
Description: WACKER’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive
- Industry: Electronics, OEM / Industrial
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Supplier: Techsil Limited
Description: Techsil® TIM11021G is a silicone compound that provides high thermal conductivity. It exhibits virtually no oil separation and minimal weight loss at elevated temperatures, which contributes to stability of TIM interface under broad operational temperature ranges. Techsil® TIM-
- Chemical / Polymer System Type: Silicone, Rubber Based / Elastomeric
- Features: Thermal Compound / Interface (Thermally Conductive)
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Supplier: Xoxide
Description: Introducing Innovation Cooling's latest offering, the IC Perihelion! This high-performance ceramic thermal compound features a ceramic base with a high bulk loading of over 91% to prevent pump out due to thermal cycling. It is completely silicone-free and
- Compound Type: Thermally Conductive
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Supplier: Xoxide
Description: Introducing Arctic Alumina Thermal Compound, the first ceramic-based, polysynthetic thermal compound for use between modern high-power CPUs and high performance heatsinks or water-cooling solutions. Features: Made with micronized aluminum oxide and boron nitride:
- Compound Type: Thermally Conductive
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Supplier: Xoxide
Description: The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions. Made with micronized aluminum oxide, boron nitride and zinc oxide. Ceramique uses a high-density layered composite of five
- Compound Type: Thermally Conductive
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Supplier: Techsil Limited
Description: TSE3281-G is a thermally conductive silicone adhesive from Momentive Performance Materials. This one component material is non-corrosive and has excellent adhesion properties to a wide variety of substrates. Potential applications for TSE3281-G include sealing and bonding for
- Chemical / Polymer System Type: Silicone, Rubber Based / Elastomeric
- Features: Thermal Compound / Interface (Thermally Conductive)
- Industry: Electronics
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Description: The SHEEN's SE Series two-component Thermal Gel are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 2.0 to 8.0 W/m·K. ? Soft and elastic after curing, maintaining the required thickness and
- Chemical / Polymer System Type: Silicone
- Dielectric Constant (Relative Permittivity): 4
- Industry: Electronics
- Thermal Conductivity: 2 W/m-K
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Description: The SHEEN's SE Series two-component Thermal Gel are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 2.0 to 8.0 W/m·K. ? Soft and elastic after curing, maintaining the required thickness and
- Chemical / Polymer System Type: Silicone
- Dielectric Constant (Relative Permittivity): 7
- Industry: Electronics
- Thermal Conductivity: 4 W/m-K
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Description: The SHEEN's SE Series two-component Thermal Gel are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 2.0 to 8.0 W/m·K. ? Soft and elastic after curing, maintaining the required thickness and
- Chemical / Polymer System Type: Silicone
- Dielectric Constant (Relative Permittivity): 6.5
- Industry: Electronics
- Thermal Conductivity: 3 W/m-K
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Description: The SHEEN's SE Series two-component Thermal Gel are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 2.0 to 8.0 W/m·K. ? Soft and elastic after curing, maintaining the required thickness and
- Chemical / Polymer System Type: Silicone
- Dielectric Constant (Relative Permittivity): 7.5
- Industry: Electronics
- Thermal Conductivity: 8 W/m-K
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Supplier: Tooling Technology
Description: Thermoforming is about heat-the primary objective is heating and cooling the plastic as fast as possible. Available in convenient 14.5 oz. tubes and applicator gun, Segen's special thermoforming compound is a silicon-based zinc oxide that dramatically increases thermal transfer
- Chemical / Polymer System Type: Silicone
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Supplier: Fujipoly® America Corp.
Description: When placed between high-power, heat generating components and a nearby heat sink, the silicone-based material completely fills air gaps between uneven components, board protrusions and recessed areas. This maximizes heat transfer and dissipation, thereby improving overall performance.
- Applied Thickness / Gap Fill: 0.0118 to 0.0787 inch
- Chemical / Polymer System Type: Silicone
- Dielectric Constant (Relative Permittivity): 7.97 to 9.44
- Dielectric Strength: 178 kV/in
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Single Component System, Specialty / Other
- Dielectric Strength: 635 kV/in
- Elongation: 170 %
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Description: BERGQUIST® LIQUI FORM TLF 6000HG thermally conductive gel interface material is designed to meet the demanding requirements in certain telecom market applications. Its unique formulation assures a balanced mix of high thermal conductivity, good dispensing efficiency and high
- Compound Type: Thermal Compound / Heat Conductive
- Industry: OEM / Industrial
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Supplier: Saint-Gobain Tape Solutions
Description: Saint-Gobain Performance Plastics ThermaCool R-10404 is a thermally conductive closed cell silicone sponge rubber. This material offers thermal conductivity along with electrical isolation. R-10404 is the superior choice for battery pack gap filling, optimizing the efficiency
- Chemical / Polymer System Type: Silicone
- Dielectric Strength: 100 kV/in
- Features: Thermally Conductive
- Filler Material: Mineral, Other
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Supplier: Wacker Chemical Corp.
Description: WACKER’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in
- Chemical / Polymer System Type: Silicone
- Industry: Electronics
- Rubber Based / Elastomeric: Yes
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY TEM96B is a thermally conductive absorber based upon soft magnetic materials dispersed in a polymeric resin. It has a thermal conductivity of 3.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues.
- Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
- Compound Type: Thermal Compound / Heat Conductive
- Features: UL Approved
- Industry: Electronics
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY TT3000 is a Nano type thermal interface material based on a unique formula. TT3000 is a highly reliable thermal grease made of Non-Solvent silicone oil compounds and thermal fillers. TT3000 provides superior performance and reliability while
- Applications & Features: Electrical / Electronic
- Chemistry / Constituents: Synthetic / Semi-synthetic, Silicone, Specialty / Other
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY TEM96D is a thermally conductive absorber based upon soft magnetic materials dispersed in a polymeric resin. It has a thermalconductivity of 5.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues.
- Applied Thickness / Gap Fill: 0.0197 to 0.3937 inch
- Chemical / Polymer System Type: Silicone
- Features: Electrical Insulation / Dielectric, EMI / RFI Shielding Material, UL Approved
- Industry: Electronics, Electrical Power / HV, Optoelectronics / Photonics, Semiconductors / IC Packaging, Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
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Supplier: Win Source Electronics
Description: x 140.00mm Material: Silicone Shape: Rectangular Adhesive: Tacky - One Side Backing, Carrier: Fiberglass Thermal Conductivity: 1.8W/m-K ECCN: EAR99 Fake Threat In the Open Market: 52 pct. MSL Level: Not Applicable Shelf Life: 24 Months HTSUS: 3921.19.0000 Mfr: t-Global Technology
- Compound Type: Thermally Conductive
- Thermal Conductivity: 1.8 W/m-K
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Supplier: Win Source Electronics
Description: Material: Silicone Elastomer Shape: Rectangular Adhesive: Tacky - Both Sides Thermal Conductivity: 2.0W/m-K ECCN: EAR99 Fake Threat In the Open Market: 44 pct. MSL Level: 1 (Unlimited) Shelf Life: 24 Months HTSUS: 8546.90.0000 Mfr: t-Global Technology Base Product Number:
- Compound Type: Thermally Conductive
- Thermal Conductivity: 2 W/m-K
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Supplier: Ellsworth Adhesives
Description: HumiSeal® TS 300 TempSeal Masking Compound is a high temperature, non-flammable, temporary mask that is used to protect and cover circuit boards during conformal coatings. It can be easily peeled, contains no ammonia, and will not prevent thermal cure of silicone coatings. It is
- Chemistry: Water Based
- Type: Masking Compounds
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 987 GR is a non-slump, thermally curable, addition curing one-part silicone rubber.
- Chemical / Polymer System Type: Silicone, Rubber Based / Elastomeric
- Elongation: 200 %
- Features: Flexible / Dampening
- Industry: Electronics
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Supplier: RS Components, Ltd.
Description: Aavid Thermalloy In-Sil-8 series thermal interface pads provide thermal conductance and electrical isolation in one package. In-Sil-8 pads are silicone-based insulators that come with thermally conductive fillers to isolate up to 6000 volts AC. In-Sil-8 pads withstand the
- Chemical / Polymer System Type: Silicone
- Material Type: Pad
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Supplier: RS Components, Ltd.
Description: Aavid Thermalloy In-Sil-8 series thermal interface pads provide thermal conductance and electrical isolation in one package. In-Sil-8 pads are silicone-based insulators that come with thermally conductive fillers to isolate up to 6000 volts AC. In-Sil-8 pads withstand the
- Chemical / Polymer System Type: Silicone
- Material Type: Pad
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Supplier: RS Components, Ltd.
Description: Aavid Thermalloy In-Sil-8 series thermal interface pads provide thermal conductance and electrical isolation in one package. In-Sil-8 pads are silicone-based insulators that come with thermally conductive fillers to isolate up to 6000 volts AC. In-Sil-8 pads withstand the
- Chemical / Polymer System Type: Silicone
- Material Type: Pad
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Supplier: RS Components, Ltd.
Description: Aavid Thermalloy In-Sil-8 series thermal interface pads provide thermal conductance and electrical isolation in one package. In-Sil-8 pads are silicone-based insulators that come with thermally conductive fillers to isolate up to 6000 volts AC. In-Sil-8 pads withstand the
- Chemical / Polymer System Type: Silicone
- Material Type: Pad
Find Suppliers by Category Top
Featured Products Top
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MORE CONDUCTIVITY - LESS COMPRESSION Thermal gap fillers are used to fill air gaps between components in an electronic assembly or electronic system to enhance thermal behavior. These materials are ideal for filling gap openings that result from design restraints that (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
Roadside and highway information displays must deliver crisp, readable images 24/7. Yet a hidden materials problem can quietly undermine that performance: tiny silane/siloxane molecules from silicone-based thermal interface materials evaporate or migrate, condense on optical surfaces, and (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
Silicone-free resin base prevents siloxane outgassing and oil bleeding Thermal conductivity up to 8.0 W/m·K for demanding server cooling (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
In automotive electrics, small contaminants become big problems: residue on sensors, deposits on contact surfaces, and microscopic particulates that compromise long-term reliability. SF500 was developed with those realities in mind — a silicone-based thermal (read more)
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silicone-based thermal interface materials (TIMs) pose a significant hidden risk. Over time and under heat, they release volatile silicone vapors that condense on delicate lenses and laser emitters within the LiDAR assembly, leading to clouding, signal scattering, and measurement drift. This (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
. With a one-component, non-curing formulation, AE Series fills complex gaps between heat-generating components and heatsinks while delivering reliable thermal transfer. Its silicone-free base helps eliminate siloxane volatility and reduces the risk of silicone oil bleed, making it a (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
heat sink hinder the transfer of heat,thereby affecting the cooling performance. Silicone insulator pads are silicone polymer elastomers reinforced with fiberglass as the base material.These pads effectively reduce the thermal resistance between electronic components and heat sinks while (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
-suited for environments with operating temperatures ranging from -40 to +150°C. When placed between high-power, heat generating components and a nearby heat sink, the silicone-based material completely fills air gaps between uneven components, board protrusions and recessed areas. This maximizes heat transfer and dissipation, thereby improving overall performance. (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
performance is not determined by one factor alone. The base material affects how well heat-conductive fillers disperse through the film. The type, shape, and loading of fillers also matter, since they directly influence thermal conductivity and heat flow (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
thermal silicone pads, phase change thermal material, thermal conductive insulating film, thermal grease, thermal gels, carbon fiber thermal pads, and non-silicone thermal pad. Each type has unique features tailored to specific product requirements. 5G smartphones, base stations, and servers are (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd.
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Thermal Management for LED Applications
Thermal performance of silicone - based thermal compounds is exceptionally good relative to many other types of TIMs and relative to material cost.
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CR4 - Thread: Corrosion Pattern on Press-Fit SCR Pole Faces
Water- based (not silicone ) thermal compound is then spread on both mounting surfaces, then removed with a clean cloth, in order to leave compound only where necessary.
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Insights into Cold-Start DISI Combustion in an Optical Engine Operating at −7°C
The thermocouple was coated with a silicone - based thermal compound to achieve good thermal contact with the cylinder head surface.
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Thermal and mechanical analysis and design of the IBM Power 775 water cooled supercomputing central electronics complex
The first way was to replace the traditionally used, non- silicone based Advanced Thermal Compound [12] with a cure-in-place silicone elastomer.
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Integrated on‐capillary instrumentation for gene expression measurement directly from cells
Moreover, we used silver- based thermal compound instead of silicone grease to increase heat conductivity between the capillary and the brass sheets.
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Advances in Metallurgical and Mining Engineering
Key words: caustic calcined dolomite based compound desulfurizer; silicone thermal reduction; fluxing agent; heating agent .
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Advances in Materials and Materials Processing
Therefore, it is necessary to develop a new silicone thermal reduction caustic calcined dolomite based compound desulfurization[6].
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“Dry-to-the-touch” thermal grease
The non- silicone compound is a synthetic- based thermal grease used to insure quick, efficient heat transfer and dissipation.
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Experimental and numerical investigation into the influence of printed circuit board construction on component operating temperature in natural convection
However, in this instance a sili- cone based heat transfer compound with a thermal conductivity of 3.0 W/mK from Electrolube was used.
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http://www.alliedelec.com/catalog/catalogpages/201112/780.pdf
This solid, silicone -free, paraffin- based thermal compound changes phase at 60°C, with a concurrent volumetric expansion that fills gaps between the mating surfaces.