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Supplier: Epoxies Etc...
Description: 10-3044 is a two component epoxy adhesive and sealant. This structural adhesive has excellent chemical and heat resistance. 10-3044 is widely used as a stencil and screen adhesive due to its bonding strength and toughness. It has been used extensively to bond polyester mesh to
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.8
- Dielectric Strength: 450 kV/in
- Features: Filled
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Supplier: Intertape Polymer Group, Inc.
Description: Intertape® and American® Brand Masking Tapes are designed for superior performance in a variety of applications such as paint masking, holding, light-duty, splicing, bundling, packaging and many more. The premium grade products have set the standard for the most demanding industrial, painting and
- Adhesive: Pressure Sensitive (PSA), Rubber
- Backing: Paper
- Peel Strength / Adhesion: 1.56 lbs/in
- Thickness: 0.0061 inches
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Supplier: Richardson RFPD
Description: adhesive. The gasket material consists of a polytetrafluroethyle ne (PTFE) matrix loaded with highly conductive nickel-based particles. The SMT-SAMPLEKIT includes an assortment of the popular ground pad offerings with tweezers and solder preforms. For details on kit contents, please
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Supplier: Protavic America, Inc.
Description: Amber epoxy system for high strength applications. Bonds well to metals, plastics and wood. Can be use as a general- purpose adhesive. 20-minute gel time. Available in colors and higher or lower viscosities.Passes NASA outgassing requirements.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Description: Patco 5100 Permanent Screen Block for SMT Stencils Metallized Pol1ter film with acrylic-based pressure sensitive adhesive. Applications *Protective mask for use as a block out tape for surface mount stencil printing to block out mesh around the stencil plate
- Adhesive: Acrylic
- Backing: Plastic / Polymer, PET / Polyester
- Features: Permanent
- Peel Strength / Adhesion: 3.75 lbs/in
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Supplier: Henkel Corporation - Industrial
Description: performance using standard SMT equipment. LOCTITE ABLESTIK XCE 3104XL cures completely using a typical solder eutectic reflow cycle or at lower temperatures when required. LOCTITE ABLESTIK XCE 3104XL won the SMT Vision Award in 2002 in the best adhesive/encapsulant /coating
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Single Component System
- Features: Leveling / Filling Compound
- Substrate / Material Compatibility: Metal
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Supplier: Protavic America, Inc.
Description: PNU-56200™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Protavic America, Inc.
Description: Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging.
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Dielectric Constant (Relative Permittivity): 4 to 5
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Supplier: Hi-Tech Seals, Inc.
Description: HERNON® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive”
- Chemical / Polymer System Type: Acrylic / Polyacrylate
- Coeff. of Thermal Expansion (CTE): 3.94E-4 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Reactive / Moisture Cured, Two Component System
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Supplier: Protavic America, Inc.
Description: Amber epoxy system . Excellent for use in high heat (steam) and chemical environments. 2 hour gel time.Bonds well to metal, plastics and wood. High thermal shock resistance. Available in colors and higher or lower viscosities. Passes NASA outgassingrequirements.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: LexJet Corporation
Description: LexJet Simple MTS Adhesive Vinyl (Multi-Textured Surfaces) is a 3.5-mil opaque, bight white matte vinyl with a 2-mil high-performance, aggressive adhesive. MTS solves the challenge of posting temporary advertising graphics and wraps on rough-textured concrete walls, construction
- Length: 50 yd
- Polymer Fiber: Other Polymer Fibers
- Thickness: 12 mil
- Width: 54 inch
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Supplier: LexJet Corporation
Description: LexJet Simple MTS Adhesive Vinyl (Multi-Textured Surfaces) is a 3.5-mil opaque, bight white matte vinyl with a 2-mil high-performance, aggressive adhesive. MTS solves the challenge of posting temporary advertising graphics and wraps on rough-textured concrete walls, construction
- Length: 50 yd
- Polymer Fiber: Other Polymer Fibers
- Thickness: 12 mil
- Width: 60 inch
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Supplier: DuPont Electronics & Imaging
Description: DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications for over 35 years with a proven record of consistency and dependability. Features:
- Chemical / Polymer System Type: Specialty / Other, Acrylic / Polyacrylate
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
- Industry Applications: OEM / Industrial
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Supplier: DuPont Electronics & Imaging
Description: DuPont™ Pyralux® FR products are acrylic-based flame retardant copper clad laminates, coverlays, bonpdplys and sheet adhesives for products requiring UL rating. Features: High bond strength High thermal resistance No refrigeration required
- Chemical / Polymer System Type: Specialty / Other, Acrylic / Polyacrylate
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
- Industry Applications: OEM / Industrial
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Supplier: Epoxies Etc...
Description: 10-3012 is a high strength, fast setting epoxy adhesive. This epoxy adhesive and potting compound is specially formulated for high clarity, good impact strength and water resistance.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Metalor Technologies USA Corporation
Description: Electrically and thermally conductive adhesives for microelectronic applications Working in partnership with valued customers, we have carried out extensive development programmes to customize silver flakes and powders to suit many electronic applications. We are acknowledged as a leading
- Compound Type: Electrically Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Chemence Inc.
Description: Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture
- Applied Thickness / Gap Fill: 0.0500 inch
- Cure Type / Technology: UV / Radiation Cured (also EB, Light), Reactive / Moisture Cured, Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
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Supplier: Chemence Inc.
Description: Krylex KU3104 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture
- Applied Thickness / Gap Fill: 0.1500 inch
- Cure Type / Technology: UV / Radiation Cured (also EB, Light), Reactive / Moisture Cured, Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating properties. It’s
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Single Component System, Specialty / Other
- Dielectric Strength: 635 kV/in
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Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical,
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 21.11 to 52.22 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical,
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 26.11 to 110 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Description: It is a two-component epoxy structural adhesive. At room temperature (25°C), the operating time is 6 minutes, the curing time is 5 minutes, and the curing is complete in 12 hours. After being fully cured, it has the characteristics of high shear, high peeling, and good impact resistance. It
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Industry Applications: Electronics (PCB / SMT Assembly)
- Use Temperature: -40 to 302 F
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Supplier: Epoxies Etc...
Description: 50-3122 is a one component (no mixing is necessary) epoxy adhesive with a unique combination of physical properties. This adhesive provides both high shear and high peel strengths. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205°C. 50
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical,
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 26.67 to 83.33 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Epoxies Etc...
Description: 20-2182 is a unique high performance two component urethane system. The 20-2182 is engineered for demanding applications where flow control is necessary to limit mold leaking, seeping around cable entries and substrate wicking. This product offers outstanding durability and adhesion to a variety of
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 3.4
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Description: Used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. This product is usually used from -53°C to 204°C.
- Cure Type / Technology: UV / Radiation Cured (also EB, Light)
- Elongation: 15 %
- Industry Applications: Electronics (PCB / SMT Assembly)
- Use Temperature: -63.4 to 399 F
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Description: Fast curing at low temperature, used for the assembly of CCD or CMOS components and VCM motors. This product is specifically designed for heat-sensitive applications that require low-temperature curing. It can quickly provide customers with high-throughput applications, such as attaching light
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Specialty / Other
- Industry Applications: Electronics (PCB / SMT Assembly)
- Viscosity: 7000 to 27000 cP
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Supplier: PCB Piezotronics, Inc.
Description: Accelerometer, PR, 20,000 g, undamped, adhesive mount, 10V excitation
- Frequency Range: 50000 Hz
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Supplier: RS Components, Ltd.
Description: These self-adhesive PCB contact strips from Roth Elektronik are available in a range of pitches with the following features: Base Material = Epoxy Glass Fabric Laminate Number of Sides = 1 Dimensions = 100 x 90mm Copper Thickness = 35µm Hole Pitch = 0.5mm FR Material Grade = FR4 Length =
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Supplier: RS Components, Ltd.
Description: These self-adhesive PCB adapters from Roth Elektronik are available with a range of contact options and sizes with the following features: SMD Component Type = SO Base Material = Epoxy Glass Fabric Laminate Number of Sides = 1 Dimensions = 67.25 x 19mm Copper Thickness = 35µm FR Material
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Supplier: RS Components, Ltd.
Description: These self-adhesive PCB contact strips from Roth Elektronik are available in a range of pitches with the following features: Base Material = Epoxy Glass Fabric Laminate Number of Sides = 1 Dimensions = 100 x 90mm Copper Thickness = 35µm Hole Pitch = 0.635mm FR Material Grade = FR4 Length =
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Supplier: RS Components, Ltd.
Description: These self-adhesive PCB adapters from Roth Elektronik are available with a range of contact options and sizes with the following features: SMD Component Type = SM Base Material = Epoxy Glass Fabric Laminate Number of Sides = 1 Dimensions = 113.3 x 36.5mm Copper Thickness = 35µm FR Material
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Supplier: Henkel Corporation - Electronics
Description: HYSOL ECCOBOND 281 BLK one component epoxy adhesive is formualted for use in applications requiring excellent thermal conductivity. It has high thermal conductivity, good chemical resistance and is electrically insulating. It is designed to not flow or sag even on vertical surfaces.
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Richardson RFPD
Description: GORE-SHIELD® SMT EMI Gaskets are electrically conductive EMI gasket building blocks. They are comprised of a conformable electrically conductive gasket material bonded to a thin, solderable metal support layer via an electrically conductive adhesive. The gasket material consists of a
- Thickness: 0.0256 inch
- Width: 0.0492 inch
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 979 EC is a RTV-1 amine cure silicone rubber that cures on contact with moisture in the air. Special features Low volume resistivity Thixotropic paste Solvated Excellent adhesion to many substrates Application SEMICOSIL® 979 EC is an electrically conductive adhesive for use in the
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrically Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Reactive / Moisture Cured, Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Epoxy adhesives are known for their high strength and durability, making them suitable for a wide range of applications, including electronics. SMT epoxy adhesives are formulated to meet the specific requirements of SMT processes. They typically have the following characteristics (read more)
Browse Epoxy Adhesives Datasheets for Shenzhen DeepMaterial Technologies Co., Ltd -
and supplier in china. DeepMaterial mainly offering one component epoxy adhesive,two component epoxy adhesive,epoxy encapsulant,UV Curing optical adhesives,epoxy conformal coating,smt epoxy adhesives,epoxy potting compound,waterproof epoxy and so on. DeepMaterial waterproof epoxy adhesive is (read more)
Browse Electrical and Electronic Resins Datasheets for Shenzhen DeepMaterial Technologies Co., Ltd -
Introduction: Polyimide tape,polyimide film as a substrate, coated on high-performance silicone pressure-sensitive adhesive. It has excellent insulation, Breakdown Voltage resistance, 260 ? high temperature resistance and other characteristics. Application (read more)
Browse Industrial Tapes Datasheets for Shenzhen You-San Technology Co., Ltd. -
Introduction: Polyimide tape,polyimide film as a substrate, coated on high-performance silicone pressure-sensitive adhesive. It has excellent insulation, Breakdown Voltage resistance, 260 ? high temperature resistance and other characteristics. Application (read more)
Browse Industrial Tapes Datasheets for Shenzhen You-San Technology Co., Ltd. -
Introduction: Double sided kapton tape is based on polyimide film, coated with high-performance silicone pressure-sensitive adhesive on both sides, and then laminated on both sides by single-sided fluoroplastic release film or double-sided fluoroplastic release film on one side Composite (read more)
Browse Specialty Tapes Datasheets for Shenzhen You-San Technology Co., Ltd.
Conduct Research Top
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Do We Still Need SMT Adhesives?
SMT Adhesives are used in the semiconductor industry to bond films and other materials to substrates. This article will discuss what SMT adhesives are, their importance in the electronics industry, how they are made, and whether another technology can replace them.
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SMT Adhesive Dispensing (.pdf)
The adhesive dispensing process, can be defined as the process of transferring adhesive onto the PCB solder mask in a position suitable for holding the later placed components until the PCB is wave soldered. In some cases, this process is also used to hold heavy components in the second pass
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SMT Adhesive Selection: Factors to Consider for Different Assembly Processes
MT adhesives, also known as structural adhesives, are a type of adhesive that is commonly used in assembly processes. These adhesives are designed to provide strong and durable bonds between different substrates, such as metals, plastics, and composites. The selection of the right adhesive
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What Is SMT Epoxy Adhesive? And How to Apply SMD Epoxy Adhesive ?
It is a durable and robust adhesive perfect for bonding and sealing composite substrates. Read on to learn more about SMT epoxy adhesive, including how it can be used in various applications such as bonding dissimilar materials, sealing joints, and repairing surfaces.
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When To Use Surface Mount Adhesive Glue To Bond SMT Components And Bottom Side Underfill Chip Bonding
Several situations call for the use of an adhesive to bond SMT components. Find out how you can determine which type of adhesive is needed and what conditions will require a different bonding method altogether.
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Best bga underfill epoxy adhesive glue solutions for excellent surface mount SMT component performance
There are many challenges that manufacturers face in different industries. These issues can only be handled by the use of underfill adhesives. There are many partial or full underfill solutions that allow fast cure and flowability at room temperature. It is important to find the best underfill
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How to use a smt underfill epoxy adhesive in various applications
Underfill is a liquid polymer type applied to PCBs after going through a reflow process. After the underfill is placed, it is then allowed to cure, encapsulating the bottom side of a chip covering fragile interconnected pads between the board's top side and the chip's bottom side. Underfills offers
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Using PCB smt underfill epoxy and bga underfill material for different applications
Underfill applications make use of different adhesive compounds to fill up gaps that exist between PCBs and microchip packages. This is very important because different chip packages, like chip scale packages and ball grid arrays, have to be surface mounted.
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What is Electronic Glue?
Electronic adhesive, also known as electronic adhesive or conductive adhesive, is a specialized adhesive designed for electronic applications, used for bonding, sealing, potting, coating, structural bonding, co coating, and SMT mounting of electronic and electrical components. Its formula can bond
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Large Thin Organic PTFE Substrates for Multichip Applications
involved using a. 0.47mm thick PTFE substrate in a 65mm size format, having 8 memory devices surrounding a central ASIC, with numerous capacitors, in double-sided format. The application was developed as a pluggable module by using SMT attached pin/socket, and has a heatspreader which is in thermal contact
More Information Top
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Electronic Materials and Processes Handbook, Third Edition > Adhesives, Underfills, and Coatings in Electronics Assemblies
Marongelli, S.R., Dixon, D., Porcari, S., Cummings, W., Murch, F., and Osterhout, A., “Practical Production Uses of SMT Adhesives ,” http://www.uic.com/wcms/WCMS.nsf/index/Material_Dispensing_10.html.
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ZASMHBA0003047
SMT adhesives can be electrically or thermally conductive and/or dielectric in nature and yet be used to mount small parts.
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A substrateless process for sustainable manufacture of electronic assemblies
The oval features surrounding some of the chip components are the SMT adhesive .
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Sensors, Measurement and Intelligent Materials
A series of SMT adhesives were used in the simulation, which have the same thermal expansion coefficient of 5×10-6/℃, and their Young’s modulus varies from 0 to 40 GPa.
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Modeling and control of dispensing processes for surface mount technology
[9] A. A. West, D. J. Williams, C. J. Hinde, and C. H. Messom, “A benchmark of intelligent control techniques for surface mount technology ( SMT ) adhesive dispensing: Process overview and the application of a structured neural network controller,” in ASME Winter …
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Surface mount technology-a study of safety considerations: silver migration and adhesive flammability
The vertical burning test was conducted in accordance with the Standard For Safety, Tests For Flammability OfPlastic Ma- terials, UL 94, Third Edition, on surface mount adhesives to acquire data on the effect that SMT adhesives have on the flammability classificationof a …