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Description: The SHEEN's AE Series one-component Silicone-free Thermal Gel are renowned for their distinctive characteristics, which include: ? Free from siloxane and the risk of silicone oil bleed. ? Good thermal conductivity, available in options ranging from 1.0 to 3.0 W/m·K.
- Compound Type: Thermal Compound / Heat Conductive
- Dielectric Constant (Relative Permittivity): 4
- Industry: Electronics
- Thermal Conductivity: 3 W/m-K
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Supplier: Wacker Chemical Corp.
Description: WACKER SilGel® 611 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a soft silicone gel. WACKER SilGel® 611 A/B is a white colored modification of WACKER SilGel® 612 with higher hardness and reactivity.
- Features: Unfilled
- Industry: Electronics, Energy Conversion (Battery/Fuel Cell/PV)
- Material Type / Grade: Elastomer / Rubber, Thermoset (Crosslinked / Vulcanized)
- Silicone: Yes
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Supplier: Wacker Chemical Corp.
Description: WACKER SilGel® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features two-part, 1 : 1 mixing ratio low viscosity rapid heat cure very low hardness (silicone
- Electrical Resistivity: 1.00E15 ohm-cm
- Features: Flame Retardant (e.g. UL 94 Rated), Optical Grade, Unfilled
- Industry: Automotive, Electronics, Energy Conversion (Battery/Fuel Cell/PV)
- Material Type / Grade: Elastomer / Rubber
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Supplier: Wacker Chemical Corp.
Description: WACKER SILGEL® 613 is a pourable, addition-curing, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features two-part, 10 : 1 mixing ratio very low viscosity rapid curing at room temperature with
- Features: Unfilled
- Industry: Electronics, Energy Conversion (Battery/Fuel Cell/PV)
- Silicone: Yes
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Supplier: Master Bond, Inc.
Description: MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation.
- Applied Thickness / Gap Fill: Over 1 inch
- Compound Type: Encapsulating / Potting, Leveling / Filling Compound, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing
- Dielectric Constant (Relative Permittivity): Over 2.7
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Supplier: Wacker Chemical Corp.
Description: WACKER SilGel® 611 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a soft silicone gel. WACKER SilGel® 611 A/B is a white colored modification of WACKER SilGel® 612 with higher hardness and reactivity.
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing
- Industry: Electronics
- Viscosity: 1000 cP
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Supplier: Techsil Limited
Description: Techsil® RTV27909 is a clear and colorless, solvent free two-component silicone gel. It is a easily pourable and is kit matched in a handy 1:1 mixing ratio; 1kg Part A & 1kg Part B. RTV 27909 cures very quickly at room temperature by an addition reaction to a tacky silicone
- Compound Type: Encapsulating / Potting
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making
- Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
- Compound Type: Thermal Compound / Heat Conductive
- Dielectric Strength: 203 kV/in
- Features: UL Approved
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY BS89 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 5.5 W/m*K. BS89 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making
- Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
- Compound Type: Thermal Compound / Heat Conductive
- Dielectric Strength: 203 kV/in
- Features: UL Approved
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Supplier: Techsil Limited
Description: Techsil® RTV27905 is a soft, adherent, clear silicone elastomer gel which is designed for the encapsulation and protection of electronic components. It is a low viscosity, 2 component system that is easily mixed in a 1:1 ratio. RTV27905 belongs to a wider family of products in a
- Compound Type: Encapsulating / Potting
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Supplier: Techsil Limited
Description: Techsil® RTV27905 is a soft, adherent, clear silicone elastomer gel which is designed for the encapsulation and protection of electronic components. It is a low viscosity, 2 component system that is easily mixed in a 1:1 ratio. RTV27905 belongs to a wider family of products in a
- Compound Type: Encapsulating / Potting
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Supplier: Techsil Limited
Description: Techsil® RTV27905 is a soft, adherent, clear silicone elastomer gel which is designed for the encapsulation and protection of electronic components. It is a low viscosity, 2 component system that is easily mixed in a 1:1 ratio. RTV27905 belongs to a wider family of products in a
- Compound Type: Encapsulating / Potting
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a
- Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
- Compound Type: Thermal Compound / Heat Conductive
- Dielectric Strength: 203 kV/in
- Features: UL Approved
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped vibration,
- Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
- Compound Type: Thermal Compound / Heat Conductive
- Dielectric Strength: 381 kV/in
- Features: UL Approved
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Description: The SHEEN's SE Series one-component Thermal Gel are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 2.0 to 10.0 W/m·K. ? High softness and compressibility, providing low assembly stress, ideal
- Compound Type: Thermal Compound / Heat Conductive
- Dielectric Constant (Relative Permittivity): 7
- Dielectric Strength: 1.27E-4 kV/in
- Industry: Electronics
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Description: The SHEEN's SE Series one-component Thermal Gel are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 2.0 to 10.0 W/m·K. ? High softness and compressibility, providing low assembly stress, ideal
- Compound Type: Thermal Compound / Heat Conductive
- Dielectric Constant (Relative Permittivity): 7
- Dielectric Strength: 1.27E-4 kV/in
- Industry: Electronics
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Description: The SHEEN's SE Series one-component Thermal Gel are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 2.0 to 10.0 W/m·K. ? High softness and compressibility, providing low assembly stress, ideal
- Compound Type: Thermal Compound / Heat Conductive
- Dielectric Constant (Relative Permittivity): 8
- Dielectric Strength: 2.03E-4 kV/in
- Industry: Electronics
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Supplier: Advanced Antivibration Components - AAC
Description: AS SEMICONDUCTORS THAT PRODUCE HEAT FEATURES: Control & dissipation of heat in electronic components Very soft sheet-type silicone gel Good electrical insulators & flame retardant. UL-94 V-0 approved Usable over a wide Temperature Range: -40°C to +200°C ( -40°F to +392°F)
- Application: Vibration Isolation
- Height or Thickness (Before loading): 0.0394 inch
- Machine Mount Type: Dampening Pad
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Supplier: Advanced Antivibration Components - AAC
Description: AS SEMICONDUCTORS THAT PRODUCE HEAT FEATURES: Control & dissipation of heat in electronic components Very soft sheet-type silicone gel Good electrical insulators & flame retardant. UL-94 V-0 approved Usable over a wide Temperature Range: -40°C to +200°C ( -40°F to +392°F)
- Application: Vibration Isolation
- Height or Thickness (Before loading): 0.0394 inch
- Machine Mount Type: Dampening Pad
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Supplier: Advanced Antivibration Components - AAC
Description: AS SEMICONDUCTORS THAT PRODUCE HEAT FEATURES: Control & dissipation of heat in electronic components Very soft sheet-type silicone gel Good electrical insulators & flame retardant. UL-94 V-0 approved Usable over a wide Temperature Range: -40°C to +200°C ( -40°F to +392°F)
- Application: Vibration Isolation
- Height or Thickness (Before loading): 0.0197 inch
- Machine Mount Type: Dampening Pad
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Supplier: Advanced Antivibration Components - AAC
Description: SEMICONDUCTORS THAT PRODUCE HEAT FEATURES: Control & dissipation of heat in electronic components Very soft sheet-type silicone gel Good electrical insulators & flame retardant. UL-94 V-0 approved Usable over a wide Temperature Range: -40°C to +200°C ( -40°F to +392°F)
- Application: Vibration Isolation
- Height or Thickness (Before loading): 0.0197 inch
- Machine Mount Type: Dampening Pad
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Electrical and Electronic Resins - 2-Part, Silicone Gel and Encapsulant with UV Tracer -- QGel-311UVSupplier: CHT USA Inc.
Description: CHT's QGEl 311UV is a 2-part, platinum cure, special purpose silicone gel. It is designed with convenient 1:1 mix ratio, and low viscosity for easy dispensing. QGel 311UV is soft, but resilient and is amoderately cross-linked silicone polymer. QGel 311UV is clear but
- Composition: Two Component System
- Cure Type / Technology: Specialty / Other
- Dielectric Strength: 500 kV/in
- Form: Gel
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Supplier: Master Bond, Inc.
Description: Featuring resounding softness and dimensional stability, Super Gel 9AO is a two component system that delivers superior thermal conductivity and electrical insulation values. Excellent flow properties and low exotherm enable it to be cast in larger sections up to 2-3 inches thick.
- Compound Type: Encapsulating / Potting, Leveling / Filling Compound, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 4.5
- Dielectric Strength: 400 to 450 kV/in
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Supplier: Dupont Molykote
Description: Silicone grease for brake caliper pins and ball joints Molykote® G-807 Low Friction Silicone Compound is a soft silicone compound containing specially formulated solid lubricants. It has excellent compatibility with plastics and rubber materials. It also has good
- Applications / Function: Automotive / Transportation
- Chemistry / Constituents: Fluoropolymer / PTFE (e.g., Teflon®), Silicone, Synthetic / Semi-synthetic
- Features: Corrosion Inhibitor / Rust Preventative
- Operating / Use Temperature: -40 to 302 F
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST GAP FILLER TGF 3600, Thermally Conductive, Two-part, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 3600 is the technology leader in thermally conductive, liquid gap filling materials, featuring ultra-high thermal performance and superior softness. The material is a two
- Compound Type: Leveling / Filling Compound, Thermal Compound / Heat Conductive
- Thermal Conductivity: 3.6 W/m-K
- Use Temperature: 76 to 392 F
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Supplier: RS Components, Ltd.
Description: These gel type silicone thermal interface pads offer high performance and come in a multitude of thermal conductivity ratings and thicknesses. They are ultra-soft and have a natural tack making instillation simple and widening their potential scope of applications. The GCS030GF
- Chemical / Polymer System Type: Silicone
- Material Type: Pad
- Thermal Conductivity: 6 W/m-K
- Use Temperature: -67 to 392 F
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Supplier: RS Components, Ltd.
Description: These gel type silicone thermal interface pads offer high performance and come in a multitude of thermal conductivity ratings and thicknesses. They are ultra-soft and have a natural tack making instillation simple and widening their potential scope of applications. The GCS030GF
- Chemical / Polymer System Type: Silicone
- Material Type: Pad
- Thermal Conductivity: 4 W/m-K
- Use Temperature: -67 to 392 F
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Supplier: RS Components, Ltd.
Description: These gel type silicone thermal interface pads offer high performance and come in a multitude of thermal conductivity ratings and thicknesses. They are ultra-soft and have a natural tack making instillation simple and widening their potential scope of applications. The GCS030GF
- Chemical / Polymer System Type: Silicone
- Material Type: Pad
- Thermal Conductivity: 4 W/m-K
- Use Temperature: -67 to 392 F
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Supplier: RS Components, Ltd.
Description: These gel type silicone thermal interface pads offer high performance and come in a multitude of thermal conductivity ratings and thicknesses. They are ultra-soft and have a natural tack making instillation simple and widening their potential scope of applications. The GCS030GF
- Chemical / Polymer System Type: Silicone
- Material Type: Pad
- Thermal Conductivity: 4 W/m-K
- Use Temperature: -67 to 392 F
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Supplier: Fujipoly® America Corp.
Description: with soft gel texture. Good workability to simply insert the product between circuit board. Self-adhesive gel surface does not require any adhesive tape for assembly.
- Applied Thickness / Gap Fill: 0.0197 to 0.0984 inch
- Chemical / Polymer System Type: Silicone
- Features: Electrical Insulation / Dielectric
- Industry: Electronics, Semiconductors / IC Packaging
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MasterSil 170 Gel is a two component, addition curing silicone gel for sealing, potting and encapsulation. It is super soft upon curing, features convenient handling, provides great optical clarity and is a superb electrical insulator. (read more)
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gaps forming which will reduce performance. These products can also be used to form gaskets which will not only transfer heat but also form a seal against moisture and other environmental contaminants. Silicone adhesives utilise two basic chemistries; condensation cure (RTV) systems which will (read more)
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be formulated to only cure with the use of heat in order to achieve a very long pot life. Silicone gels are used in numerous electronic applications when a soft and highly flexible encapsulation or potting is required. CHT’s silicone gels protect delicate components and assemblies (read more)
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In high-performance electronics, the thermal interface has to do more than move heat. It also has to stay clean, stay stable, and avoid contamination risks. The AE Series silicone-free thermal gel is designed for exactly that kind of job (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
often used when a soft and highly flexible encapsulation is required. CHT’s silicone gels are available in a variety of hardnesses, penetrations and viscosities, and typically provide a primerless, “pressure sensitive” type bond to most substrates . For (read more)
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Fujipoly America introduces SARCON® GR25B. This advanced silicone, gel-like thermal interface material delivers a thermal conductivity of 2.5 W/m•K and is a popular choice for higher power electronics applications. GR25B is offered in double sticky surfaces, hardened surfaces for easier (read more)
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dissipation, silicone encapsulants also provide protection from harsh environments, vibration and thermal shock. Of particular interest is the new development of thermally conductive gels which reduce mechanical stress on delicate wire connections. Typical applications include the (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for CHT USA Inc.
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What to Expect at Interphex 2007
By Heidi Parsons, Managing Editor MFG Tray Co. will feature trays for soft gel drying and a large variety of trays and containers used in the handling and processing of pharmaceutical products. It will also display vial trays for handling small and medium vials. The trays are available in four