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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 11.67 to 52.78 µin/in-F
- Dielectric Constant: 4.95
- Features: Thermally Conductive
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 8.33 to 35.56 µin/in-F
- Dielectric Constant: 4.22
- Features: Thermally Conductive
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 8.89 to 37.78 µin/in-F
- Dielectric Constant: 4.9
- Features: Thermally Conductive
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Supplier: Epoxy Technology
Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. ?Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market requires their
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 17.78 to 62.22 µin/in-F
- Features: Biocompatible, Optical Grade, Thermally Conductive
- Filler Material: Unfilled
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required.
- Chemical / Polymer System Type: Epoxy, Specialty / Other
- Dielectric Constant: 3.5 to 4
- Dielectric Strength: 440 kV/in
- Electrical Resistivity: 1.80E15 to 1.50E17 ohm-cm
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2762 FT Black, formally Emerson and Cuming, is a two component, highly filled, epoxy encapsulant that is used for potting and casting electronic components. It offers low shrinkage, low coefficient of thermal expansion, and high thermal conductivity. It is
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 400 kV/in
- Thermal Conductivity: 1.34 W/m-K
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2762 Black is a two component, highly filled, epoxy encapsulant that is used for potting and casting electronic components. It offers low shrinkage, low coefficient of thermal expansion, and high thermal conductivity. It is resistant to chemicals and high
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 381 kV/in
- Thermal Conductivity: 1.37 W/m-K
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Supplier: Epoxies Etc...
Description: 70-3810 is a low viscosity, aluminum filled epoxy casting and tooling resin. This system is used for making heat resistant cast tools or parts that require high heat resistance and thermal conductivity. 70-3810 utilizes a new polymer resin that offers better heat
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 2.5 µin/in-F
- Features: Thermally Conductive
- Filler Material: Metal
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Supplier: Master Bond, Inc.
Description: Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. Its low exotherm makes it well suited for large castings and potting applications. It withstands rigorous thermal
- Applied Thickness / Gap Fill: 0.0020 to 0.0040 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Thermally Conductive
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Supplier: Ellsworth Adhesives
Description: ResinLab EP1285 Black is a two component, highly filled casting resin that is used for applications that require low CTE and high thermal conductivity. It is medium viscosity and resistance to bases, acids, water, and most organic solvents. Resin only, 1 qt Can.
- Compound Type: Electrically Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 365 to 400 kV/in
- Elongation: 1.5 %
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Supplier: Ellsworth Adhesives
Description: ResinLab EP1285 Black is a two component, highly filled casting resin that is used for applications that require low CTE and high thermal conductivity. It is medium viscosity and resistance to bases, acids, water, and most organic solvents. Resin only, 1 gal Pail.
- Compound Type: Electrically Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 365 to 400 kV/in
- Elongation: 1.5 %
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Supplier: Master Bond, Inc.
Description: transformer bushings; outdoor switchgear components-resistor housings; interrupter tubes and instrument transformers, and in almost any potting or casting application that requires thermal conductive, electrical insulation and high temperature resistant.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Master Bond, Inc.
Description: Master Bond EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring superb optical clarity as well as outstanding non-yellowing properties. This system has a forgiving mix ratio of 100 to 60 by weight. It will cure readily at 75°F in 3-5 days or 3-4 hours at 150-200°F. The
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 22 to 33 µin/in-F
- Deflection Temperature (@ 264 psi, 1.8 MPa): 180 F
- Dielectric Constant: 3.2
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Supplier: Epoxies Etc...
Description: 20-3652 is a filled epoxy casting, potting, and encapsulating resin system. This system exhibits excellent physical, thermal, and electrical insulation properties. 20-3652 is easily machined and exhibits outstanding adhesion to metals, ceramics and plastics. When cured with
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.8
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Supplier: Epoxies Etc...
Description: 20-3652\40 is a filled epoxy casting, potting, and encapsulating resin system. This is a lower viscosity version of the 20-3652. This system exhibits excellent physical, thermal, and electrical insulation properties. 20-3652\40 is easily machined and exhibits outstanding
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Hapco, Inc.
Description: Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are
- Dielectric Constant: 4.2 to 4.5
- Dielectric Strength: 400 kV/in
- Elongation: 100 %
- Features: Flame Retardant (e.g. UL 94 Rated), Thermally Conductive, UL Approved
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Supplier: Hapco, Inc.
Description: DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity) Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to
- Dielectric Constant: 4.4 to 4.6
- Dielectric Strength: 654 kV/in
- Elongation: 0.1500 %
- Features: Flame Retardant (e.g. UL 94 Rated), Thermally Conductive, UL Approved
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Supplier: Protavic America, Inc.
Description: PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150°C.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 12.22 µin/in-F
- Composition: Two Component System, Filled
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Protavic America, Inc.
Description: ANA-97174 UV is a clear Ultraviolet/ Visible light curing adhesive. It is a low viscosity urethane modified acrylic casting system. It was developed for adhesive and coating applications. It is recommended for small electrical/electroni c casting and encapsulating applications that
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Two Component System, Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light)
- Dielectric Constant (Relative Permittivity): 4.3
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Supplier: Protavic America, Inc.
Description: PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Two Component System, Filled
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Protavic America, Inc.
Description: PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Single Component System, Filled
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Wacker Chemical Corp.
Description: high hardness (Shore A approx. 55) very good heat resistance high thermal conductivity outstanding resistance to common casting resins Application Being an addition-curing and thus a non-shrink vulcanizing rubber with high hardness, ELASTOSIL®
- Chemical / Polymer System Type: Silicone
- Elongation: 120 %
- Features: Thermally Conductive
- Industry: Tooling / Molds
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Supplier: Epoxies Etc...
Description: 20-2125 is formulated for electronic potting, encapsulating and casting applications. The 20-2125 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does not contain TDI, MbOCA or Mercury. 20-2125 will cushion and protect sensitive
- Chemical / Polymer System Type: Specialty / Other
- Composition: Two Component System
- Cure Type / Technology: Room Temp. Cure / Vulcanizing
- Dielectric Constant (Relative Permittivity): 5.5 to 5.8
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Supplier: Greene, Tweed & Co.
Description: traditional thermoset resins, such as epoxies, including higher service temperature capability, lower moisture uptake, improved toughness, and increased chemical resistance. Thermoplastic composites can also be reheated and reformed, providing benefits for manufacturing processes such as
- Chemical / Polymer System Type: PEEK, Specialty / Other
- Filler Material: Fiber Glass, Aramid Fiber, Carbon / Graphite
- Industry: Aerospace, Electric Power, Semiconductor / IC's
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Chemical Tradename Dictionary
[Emerson &0 OJming) Qne.component epoxy casting resins incL general pmpose, thermally conductive , and .
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Getting a Grip on the Transverse Motion in a Zeeman Decelerator
Each coil is wound around a PEEK bobbin (6 mm inner diameter, 500 µm wall thickness) and cast into an aluminum shell using thermally conductive epoxy resin .
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New ‘monolithic’ templates and improved protocols for soft lithography and microchip
fabrication
Different polymeric resins (such as two-component polyester or thermally conductive PDMS) can be cast on the PDMS template (figure 6) to obtain elastomeric and thermoset templates.
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Encyclopedia of Plastics, Polymers, and Resins Volume 2
Chem. Descrip.: Resin /hardener system Category/Applications: Unusually high thermally conductive black casting sys- tem for applications requiring heat dis- sipation or transfer; use hardener HD- 3615 for high temp. applications; mix ratios: 100/3 and 100/5 by wt. respec- .
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The Moon
The mandrel is a cast high-temperature epoxy resin mixed with aluminum powder and granules to make it thermally conductive .
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Properties of high-thermal conductive composite with two kinds of fillers
In cast resin apparatuses, which are advantageous to environment compared with apparatuses equipped with SF6 or oil, a thermally conductive insulation has been required to increase electrical stress, leading to thick insulation.
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Ceramic filled thermoplastic encapsulation as a design feature for a BLDC motor in a disk drive
Thermally conductive resins solidify signifi- cantly quicker than other resins and are generally considered to mold 60–70% faster than aluminum casting .
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Adhesive bonding
Auger electron spectroscopy 300 training 540, 541, 589 -, leaflets 590 -, guidelines 590 expansion, thermal 367 expansion characteristic of adhesives 228 coefficient of … … adhesive 225 -, values 148, 149, 312 outgassing characteristic -, conductive adhesives 228 -, polymers 814 release, casting resins 259 hardening, s.
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Adhesive bonding
Auger electron spectroscopy 300 training 540, 541, 589 -, leaflets 590 -, guidelines 590 expansion, thermal 367 expansion characteristic of adhesives 228 coefficient of … … adhesive 225 -, values 148, 149, 312 outgassing characteristic -, conductive adhesives 228 -, polymers 814 release, casting resins 259 hardening, s.