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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile
- Use Temperature: 617 F
- Thermal Conductivity: 1.7 W/m-K
- Coeff. of Thermal Expansion (CTE): 15 to 75.55555555555556 µin/in-F
- Dielectric Constant: 3.73
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2762 Black is a two component, highly filled, epoxy encapsulant that is used for potting and casting electronic components. It offers low shrinkage, low coefficient of thermal expansion, and high thermal conductivity. It is resistant to chemicals and high temperatures.
- Thermal Conductivity: 1.37 W/m-K
- Dielectric Strength: 381.0000000000008 kV/in
- Viscosity: 50,000 cP
- Features: Encapsulant / Potting Compound
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Supplier: Master Bond, Inc.
Description: Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. Its low exotherm makes it well suited for large castings and potting applications. It withstands rigorous thermal cycling,
- Applied Thickness / Gap Fill: 0.002 to 0.004 inch
- Viscosity: 3,000 to 6,000 cP
- Use Temperature: -100 to 400 F
- Tensile Strength (Break): 4,000 to 6,000 psi
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2762 FT Black, formally Emerson and Cuming, is a two component, highly filled, epoxy encapsulant that is used for potting and casting electronic components. It offers low shrinkage, low coefficient of thermal expansion, and high thermal conductivity. It is resistant to
- Thermal Conductivity: 1.34 W/m-K
- Dielectric Strength: 400.00000000000006 kV/in
- Viscosity: 250,000 cP
- Features: Encapsulant / Potting Compound
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile
- Use Temperature: 572 F
- Thermal Conductivity: 0.9 W/m-K
- Coeff. of Thermal Expansion (CTE): 8.333333333333334 to 35.55555555555556 µin/in-F
- Dielectric Constant: 4.22
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile
- Use Temperature: 572 F
- Thermal Conductivity: 0.5 W/m-K
- Coeff. of Thermal Expansion (CTE): 8.88888888888889 to 37.77777777777778 µin/in-F
- Dielectric Constant: 4.9
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile
- Use Temperature: 572 F
- Thermal Conductivity: 0.4 W/m-K
- Coeff. of Thermal Expansion (CTE): 22.22222222222222 to 105.55555555555556 µin/in-F
- Dielectric Constant: 4.97
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Supplier: Ellsworth Adhesives
Description: ResinLab EP1285 Black is a two component, highly filled casting resin that is used for applications that require low CTE and high thermal conductivity. It is medium viscosity and resistance to bases, acids, water, and most organic solvents. Resin only, 1 gal Pail.
- Thermal Conductivity: 0.79 to 1.2 W/m-K
- Elongation: 1.5 %
- Tensile Strength (Break): 4,000 to 6,900 psi
- Dielectric Strength: 365.00000000000006 to 400.00000000000006 kV/in
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Supplier: Ellsworth Adhesives
Description: ResinLab EP1285 Black is a two component, highly filled casting resin that is used for applications that require low CTE and high thermal conductivity. It is medium viscosity and resistance to bases, acids, water, and most organic solvents. Resin only, 1 qt Can.
- Thermal Conductivity: 0.79 to 1.2 W/m-K
- Elongation: 1.5 %
- Tensile Strength (Break): 4,000 to 6,900 psi
- Dielectric Strength: 365.00000000000006 to 400.00000000000006 kV/in
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Compound EP45HTAO is a two component thermally conductive epoxy compound for high performance structural bonding, and casting. It is suitable for applications where long term exposure to temperatures from -60° to +500°F is required. lt is 100% reactive and
- Use Temperature: -60 to 500 F
- Thermal Conductivity: 1.2980511 to 1.442279 W/m-K
- Tensile Strength (Break): 12,800 psi
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Marine, Military / Government (MIL-SPEC / GG), OEM / Industrial, Photonics / Optoelectronics, Semiconductors / IC Packaging, Tooling / Mold Material
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Supplier: Epoxies Etc...
Description: 70-3810 is a low viscosity, aluminum filled epoxy casting and tooling resin. This system is used for making heat resistant cast tools or parts that require high heat resistance and thermal conductivity. 70-3810 utilizes a new polymer resin that offers better heat resistance than
- Use Temperature: -103 to 572 F
- Thermal Conductivity: 1.80284875 W/m-K
- Coeff. of Thermal Expansion (CTE): 2.5 µin/in-F
- Tensile Strength (Break): 14,500 psi
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Supplier: Epoxies Etc...
Description: 20-3652 is a filled epoxy casting, potting, and encapsulating resin system. This system exhibits excellent physical, thermal, and electrical insulation properties. 20-3652 is easily machined and exhibits outstanding adhesion to metals, ceramics and plastics. When cured with Catalyst
- Use Temperature: -85 to 320 F
- Thermal Conductivity: 0.66344834 W/m-K
- Tensile Strength (Break): 9,000 psi
- Dielectric Strength: 449.9999999999993 kV/in
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Supplier: Epoxies Etc...
Description: 20-3652\40 is a filled epoxy casting, potting, and encapsulating resin system. This is a lower viscosity version of the 20-3652. This system exhibits excellent physical, thermal, and electrical insulation properties. 20-3652\40 is easily machined and exhibits outstanding adhesion to
- Use Temperature: -85 to 311 F
- Thermal Conductivity: 0.66344834 W/m-K
- Tensile Strength (Break): 6,100 to 9,200 psi
- Dielectric Strength: 449.9999999999993 kV/in
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Supplier: Master Bond, Inc.
Description: Master Bond EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring superb optical clarity as well as outstanding non-yellowing properties. This system has a forgiving mix ratio of 100 to 60 by weight. It will cure readily at 75°F in 3-5 days or 3-4 hours at 150-200°F. The
- Deflection Temperature (@ 264 psi, 1.8 MPa): 180 F
- Thermal Conductivity: 0.288 to 0.432 W/m-K
- Coeff. of Thermal Expansion (CTE): 22 to 33 µin/in-F
- Tensile Strength (Break): 7,600 psi
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Supplier: Master Bond, Inc.
Description: Key Features Free flowing viscosity High temperature resistance Exceptionally long open time Passes NASA low outgassing Product Description Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation. The mix ratio is 100:80 by weight. This system
- Use Temperature: -80 to 550 F
- Thermal Conductivity: 0.5769116 to 0.7211395 W/m-K
- Viscosity: 10,000 to 25,000 cP
- Industry: Aerospace, Electric Power, Electronics, Industrial, Optoelectronics, Semiconductor / IC's
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Supplier: Hapco, Inc.
Description: Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are
- Use Temperature: 284 F
- Thermal Conductivity: 0.40383812 W/m-K
- Tensile Strength (Break): 2,100 psi
- Elongation: 100 %
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Supplier: Hapco, Inc.
Description: DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity) Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to
- Use Temperature: 248 F
- Thermal Conductivity: 0.38941533 W/m-K
- Tensile Strength (Break): 5,300 psi
- Elongation: 0.14 %
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Supplier: Epoxies Etc...
Description: 20-2125 is formulated for electronic potting, encapsulating and casting applications. The 20-2125 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does not contain TDI, MbOCA or Mercury. 20-2125 will cushion and protect sensitive
- Use Temperature: -22 to 257 F
- Thermal Conductivity: 0.297109474 W/m-K
- Elongation: 225 to 295 %
- Tensile Strength (Break): 155 to 1,750 psi
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Supplier: Wacker Chemical Corp.
Description: very good heat resistance high thermal conductivity outstanding resistance to common casting resins Application Being an addition-curing and thus a non-shrink vulcanizing rubber with high hardness, ELASTOSIL® M 4370 A/B is particularly suitable for molding applications in which high
- Tensile Strength (Break): 652.665777107386 psi
- Elongation: 120 %
- Type: Elastomer / Rubber
- Chemical System: Silicone
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Supplier: Sauereisen, Inc.
Description: Sauereisen Refractory Coating No. 360 is a heat-cured refractory coating for expendable thermocouple tubes and induction furnace linings. No. 360 exhibits excellent coating properties and may be applied by rolling, dipping or casting. No. 360 is also available in chemical-set formulation.
- Use Temperature: 2,200 F
- Coeff. of Thermal Expansion (CTE): 16.3 µin/in-F
- Tensile Strength (Break): 150 psi
- Chemical System: Ceramic / Inorganic Cement
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Supplier: Protavic America, Inc.
Description: PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150°C.
- Viscosity: 40,000 cP
- Use Temperature: -55 to 150 F
- Thermal Conductivity: 1.15 W/m-K
- Coeff. of Thermal Expansion (CTE): 12.222222222222221 µin/in-F
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Supplier: Protavic America, Inc.
Description: PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include
- Viscosity: 8,000 to 10,000 cP
- Use Temperature: -67 to 392 F
- Thermal Conductivity: 1.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 111.11111111111111 µin/in-F
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Supplier: Protavic America, Inc.
Description: ANA-97174 UV is a clear Ultraviolet/ Visible light curing adhesive. It is a low viscosity urethane modified acrylic casting system. It was developed for adhesive and coating applications. It is recommended for small electrical/electronic casting and encapsulating applications that
- Viscosity: 625 cP
- Use Temperature: -85 to 347 F
- Dielectric Constant (Relative Permittivity): 4.3
- Water Absorption: 1.5 %
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Supplier: Protavic America, Inc.
Description: PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include
- Viscosity: 8,000 to 10,000 cP
- Use Temperature: -55 to 200 F
- Thermal Conductivity: 1.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 111.11111111111111 µin/in-F
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Supplier: Greene, Tweed & Co.
Description: traditional thermoset resins, such as epoxies, including higher service temperature capability, lower moisture uptake, improved toughness, and increased chemical resistance. Thermoplastic composites can also be reheated and reformed, providing benefits for manufacturing processes such as
- Industry: Aerospace, Electric Power, Semiconductor / IC's
- Filler: Aramid Fiber, Carbon / Graphite, Fiber Glass
- Material Type: Composite Material, Thermoplastic
- Chemical System: PEEK
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Chemical Tradename Dictionary
[Emerson &0 OJming) Qne.component epoxy casting resins incL general pmpose, thermally conductive , and .
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Getting a Grip on the Transverse Motion in a Zeeman Decelerator
Each coil is wound around a PEEK bobbin (6 mm inner diameter, 500 µm wall thickness) and cast into an aluminum shell using thermally conductive epoxy resin .
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New ‘monolithic’ templates and improved protocols for soft lithography and microchip
fabrication
Different polymeric resins (such as two-component polyester or thermally conductive PDMS) can be cast on the PDMS template (figure 6) to obtain elastomeric and thermoset templates.
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Encyclopedia of Plastics, Polymers, and Resins Volume 2
Chem. Descrip.: Resin /hardener system Category/Applications: Unusually high thermally conductive black casting sys- tem for applications requiring heat dis- sipation or transfer; use hardener HD- 3615 for high temp. applications; mix ratios: 100/3 and 100/5 by wt. respec- .
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The Moon
The mandrel is a cast high-temperature epoxy resin mixed with aluminum powder and granules to make it thermally conductive .
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Properties of high-thermal conductive composite with two kinds of fillers
In cast resin apparatuses, which are advantageous to environment compared with apparatuses equipped with SF6 or oil, a thermally conductive insulation has been required to increase electrical stress, leading to thick insulation.
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Ceramic filled thermoplastic encapsulation as a design feature for a BLDC motor in a disk drive
Thermally conductive resins solidify signifi- cantly quicker than other resins and are generally considered to mold 60–70% faster than aluminum casting .
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Adhesive bonding
Auger electron spectroscopy 300 training 540, 541, 589 -, leaflets 590 -, guidelines 590 expansion, thermal 367 expansion characteristic of adhesives 228 coefficient of … … adhesive 225 -, values 148, 149, 312 outgassing characteristic -, conductive adhesives 228 -, polymers 814 release, casting resins 259 hardening, s.
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Adhesive bonding
Auger electron spectroscopy 300 training 540, 541, 589 -, leaflets 590 -, guidelines 590 expansion, thermal 367 expansion characteristic of adhesives 228 coefficient of … … adhesive 225 -, values 148, 149, 312 outgassing characteristic -, conductive adhesives 228 -, polymers 814 release, casting resins 259 hardening, s.