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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST TGR 1500A, High Performance, Value Compound for High-End Computer Processors BERGQUIST® TGR 1500A is a high performance, thermally conductive compound intended for use as a thermal interface material between a high end computer processor and a heat sink. Other high
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Thermal Conductivity: 1.5 W/m-K
- Use Temperature: 302 F
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Description: The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ? Available in various thicknesses from 0.5 to
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 7.5
- Dielectric Strength: 2.03E-4 kV/in
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Description: The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m·K. ? Available in various thicknesses from 0.3 to 10.0 mm. ? Highly
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 9
- Dielectric Strength: 2.03E-4 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Description: The SHEEN's TIV800 Series RTV Thermal Conductive Adhesive are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 1.0 to 2.0 W/m·K. ? High bonding performance. ? Good stability, long
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Thermal Conductivity: 1.2 W/m-K
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST LIQUI BOND TLB EA1800, Thermally Conductive, Two-Part, Epoxy Based, Liquid-dispensable Adhesive BERGQUIST® LIQUI BOND TLB EA1800 is a two-component, epoxy based, liquid-dispensable adhesive. BERGQUIST LIQUI BOND TLB EA1800 has a thermal conductivity of 1.8 W/mK.
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Thermal Conductivity: 1.8 W/m-K
- Use Temperature: 40 to 257 F
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Supplier: Epoxies Etc...
Description: 50-1225 is a low viscosity, room temperature curing, RTV silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package.
- Chemical / Polymer System Type: Silicone
- Composition: Unfilled
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY N-putty series is silicone-free and dispensable thermally conductive material. With a thermal conductivity from 3.5 W/m*K, this product can be used successfully to remove manufacturing tolerances. It is ideally suited for dispensing using the N-putty dispensing
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Thermally Conductive
- Dielectric Strength: 300 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST LIQUI BOND TLB SA3500, Thermally Conductive, Two-Part, Liquid Silicone Adhesive BERGQUIST® LIQUI BOND TLB SA3500 is a higher performance, thermally conductive, liquid adhesive. This material is supplied as a two-part material and requires no
- Compound Type: Thermally Conductive
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Material Form: Grease / Paste
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Description: The SHEEN's SE Series one-component Thermal Gel are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 2.0 to 10.0 W/m·K. ? High softness and compressibility, providing low assembly stress, ideal
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 5.5
- Dielectric Strength: 1.27E-4 kV/in
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST LIQUI BOND TLB SA1800, Thermally Conductive, One-Part, Liquid Silicone Adhesive BERGQUIST® LIQUI BOND® TLB SA1800 is a high performance, liquid silicone adhesive that cures to a solid bonding elastomer. The adhesive is supplied as a one-part liquid component,
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 0.0060
- Thermal Conductivity: 1.8 W/m-K
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Supplier: Shenzhen You-San Technology Co., Ltd.
Description: Thermally conductive silicone pad is a kind of thermally conductive medium, which is used to reduce the contact thermal resistance between the surface of the heat source and the contact surface of the heat dissipation device. It is specially produced for the
- Carrier / Backing Material: Plastic / Polymer, Silicone
- Features: Anti-static / ESD Control, Dielectric / Insulating, Electrically Conductive, Other
- Temperature Resistance: -40 to 200 C
- Thickness: 0.0118 to 0.2362 inches
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 970 TC A/B is a pasty, but still flowable addition-curing, two component elastomeric silicone that cures at elevated temperature to an thermally conductive silicone rubber. Special features two-component thermal conductivity pasty, still
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: OMEGA Engineering, Inc.
Description: OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals,
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Material Form: Grease / Paste
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Supplier: Techsil Limited
Description: Techsil® TIM11021G is a silicone compound that provides high thermal conductivity. It exhibits virtually no oil separation and minimal weight loss at elevated temperatures, which contributes to stability of TIM interface under broad operational temperature ranges. Techsil® TIM- 11021G
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Rubber Based / Elastomeric: Yes
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Supplier: Techsil Limited
Description: Techsil RTV 1084G is a non-corrosive, 1-part, grey silicone rubber. RTV 1084 G has amazing thermal conductivity (2.3 W/mK) and is non corrosive, fast skinning with low linear shrinkage. It is one of a new family of products called acetone cure sealants that are solvent free. It
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Chemence Inc.
Description: KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that when
- Cure Type / Technology: Single Component System
- Industry: Electronics
- Substrate / Material Compatibility: Plastic
- Viscosity: Up to 150000 cP
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Supplier: Chemence Inc.
Description: KSC1802 is a low viscosity, high performance, thermally conductive, liquid gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1802 is supplied as a two part, 1:1 mix ratio silicone that
- Cure Type / Technology: Single Component System
- Industry: Electronics
- Substrate / Material Compatibility: Metal, Plastic
- Viscosity: 11000 to 14000 cP
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Supplier: Shiu Li Technology Co., Ltd
Description: Non-Silicone Thermal Compound N800AH is made of non-silicon resin material and none low-molecular-weight siloxane. N800AH helps avoid electrical contact problems. N800 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The
- Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Thermally Conductive
- Dielectric Strength: 203 kV/in
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Supplier: Shiu Li Technology Co., Ltd
Description: Non-Silicone Thermal Compound N700C is made of non-silicon resin material and none low-molecular-weight siloxane. N700C helps avoid electrical contact problems. N700 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The
- Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Thermally Conductive
- Dielectric Strength: 203 kV/in
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Supplier: Shiu Li Technology Co., Ltd
Description: Non-Silicone Thermal Compound N800B is made of non-silicon resin material and none low-molecular-weight siloxane. N800B helps avoid electrical contact problems. N800 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The
- Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Thermally Conductive
- Dielectric Strength: 203 kV/in
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Description: BERGQUIST® GAP FILLER TGF 3500LVO is a silicone, two-component, high thermal conductivity, liquid gap filler. This product offers the mechanical property benefits of a silicone material with the additional feature of low outgassing. It can be used in industries ranging from
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry Applications: OEM / Industrial
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 20 to 51 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 975 TC is a 1-part thermally conductive paste that is curing into self-adhesive gap filling silicone. The thermal paste is able to efficiently fill finest gaps of heat generating and ablating substrates and thus helps to minimize contact resistance.
- Coeff. of Thermal Expansion (CTE): 8.33 µin/in-F
- Cure Type / Technology: Single Component System
- Dielectric Strength: 279 kV/in
- Elongation: 10 %
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Supplier: Techsil Limited
Description: that exhibits an excellent thermal conductive property of ~2.3 W/m.K. Techsil® TIM11123 (GB) does not corrode copper or its alloys and exhibits excellent primer less adhesion to many substrates when fully cured. It been designed to be flowable and contains glass beads to control bond
- Compound Type: Electrically Conductive, Thermally Conductive
- Material Form: Gap Filling Compound
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Supplier: Master Bond, Inc.
Description: Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 61.11 to 77.78 µin/in-F
- Composition: Unfilled
- Compound Type: Thermally Conductive
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Supplier: CHT USA Inc.
Description: CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System, Specialty / Other
- Dielectric Strength: 470 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Master Bond, Inc.
Description: MasterSil 323AO-LO is a two component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications. This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the
- Applied Thickness / Gap Fill: 0.0020 to 0.0030 inch
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 77.78 to 94.44 µin/in-F
- Composition: Unfilled
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Description: BERGQUIST® LIQUI FORM TLF 6000HG thermally conductive gel interface material is designed to meet the demanding requirements in certain telecom market applications. Its unique formulation assures a balanced mix of high thermal conductivity, good dispensing efficiency and high
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Industry Applications: OEM / Industrial
- Material Form: Specialty / Other
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Supplier: Ellsworth Adhesives
Description: Parker Lord CoolTherm® SC-309 is a two component, thermally conductive silicone encapsulant that is used for electrical/electroni c encapsulating applications. It provides low stress on components, environmental resistance, and excellent flame retardancy. Resin, 1 gal Pail.
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 599 kV/in
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Supplier: Ellsworth Adhesives
Description: Parker Lord CoolTherm® SC-309 is a two component, thermally conductive silicone encapsulant that is used for electrical/electroni c encapsulating applications. It provides low stress on components, environmental resistance, and excellent flame retardancy. Hardener, 1 gal Pail.
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 599 kV/in
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Supplier: Techsil Limited
Description: TSE3281-G is a thermally conductive silicone adhesive from Momentive Performance Materials. This one component material is non-corrosive and has excellent adhesion properties to a wide variety of substrates. Potential applications for TSE3281-G include sealing and bonding for
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Rubber Based / Elastomeric: Yes
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Description: BERGQUIST® GAP PAD TGP 5000 is a silicone based, thermally conductive, fiberglass reinforced and S-class soft gap pad. Its highly conformable nature and S-class softness ensures that it conforms to demanding contours and maintains structural integrity. Fiberglass reinforcement
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 7.5
- Industry Applications: OEM / Industrial
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Supplier: Fujipoly® America Corp.
Description: Sarcon® SG-07SL and SG-26SL are highly thermally conductive, non-reactive silicone-based greases that offer low thermal resistance and maintain a nonflow able composition. Unique binding agents and product formulation ensure the lowest amount of bleed and evaporation.
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Dielectric Strength: 386 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: Fujipoly® America Corp.
Description: Sarcon ® XR-e is highly conformable/thermall y conductive gel materials, 11watt/m-K (No electricity conductive) in a versatile sheet form that easily fit and adhere e to most all shapes and sizes of components, and makes reliable and complete physical contact. The surface consistency
- Applied Thickness / Gap Fill: 0.0394 to 0.0787 inch
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Featured Products Top
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directly impacts the performance and lifespan of the devices. To solve this problem, SHEEN thermal conductive silicone sheets have been introduced into Bluetooth speaker designs, acting like an invisible pair of wings that allow the music to soar and release its true charm. SHEEN (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
MasterSil 151TC is an addition cured silicone offering both flexibility and high temperature resistance. It has very fine particles of a thermally conductive filler that allows it to be applied in sections as thin as 10-15 microns. MasterSil 151TC fits well in applications involving sensitive optical and electronic components where optimum heat dissipation is critical. (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
Adhesive product page. Thermally Conductive Adhesives The SILCOTHERM® range includes range includes thermally (read more)
Browse Elastomers and Rubber Compounds Datasheets for CHT USA Inc. -
Adhesive Sealants The benefits of having a thermally conductive adhesive mean you can permanently bond your component to some form of heat sink and eliminate the need for additional mechanical fastening systems. It will also prevent the possibility of movement and air (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc. -
heat generating components. Once installed, Fujipoly’s unique thermally conductive silicone-based materials efficiently remove excess heat to the surrounding environment or nearby heatsinks. Depending on thickness and your selection of Sarcon® TR or HR (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants & adhesives. Applications Automotive vehicle lighting Signage and displays for sports and advertising Back lighting for LCD (read more)
Browse Datasheets for CHT USA Inc. -
expensive mixing equipment Neutral cure, non-corrosive Thermally conductive Adhesion promoters are added to improve adhesion across a range of substrates. As with all addition cure materials, adhesion can be improved with longer cure times, higher cure temperatures, post (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc. -
QSil-553 2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to (read more)
Browse Conductive Compounds Datasheets for CHT USA Inc. -
applications? Silicones have become widely used by LED design engineers to provide improved light performance, environmental protection and extended product life. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants (read more)
Browse Datasheets for CHT USA Inc. -
applications? Silicones have become widely used by LED design engineers to provide improved light performance, environmental protection and extended product life. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants (read more)
Browse Industrial Adhesives Datasheets for CHT USA Inc.
Conduct Research Top
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Highly Conductive Insulation for Large, High-Speed Machines
. This paper investigates functional electrical insulation integrity of highly thermally-conductive silicone-impregnated-fiberglass insulation through short-term, highly accelerated aging tests. This insulation system offers up to three times the thermal conductivity of traditional insulation, which
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Key Benefits of Choosing Non-Silicone Gap Filler Material
As its name suggests, thermal interface materials (TIMs) are used to optimize thermal heat transfer between various interfaces. Generally, thermal gap fillers are made from a silicone polymer and add various auxiliary materials such as ceramic particles, silicone oil and thermally conductive
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Silicone Based Insulation Material for High Speed/Voltage Rotating Machines
on silicone, epoxy, polyester, polyesterimide, and other polymers. Among all of these insulation materials, silicone based insulation best fits into many rotating machinery applications because of stability across a wide temperature range and the ability for highly thermally conductive designs
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Silicone Based Electrical Insulation Material for High Speed/Voltage Rotating Machines
on silicone, epoxy, polyester, polyesterimide, and other polymers. Among all of these insulation materials, silicone based insulation best fits into many rotating machinery applications because of stability across a wide temperature range and the ability for highly thermally conductive designs
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Case Study - Repositionable Thermal Interface
Our customer, an EMI shielding manufacturer, was producing a conductive, semi-cured silicone at their local location. They reached out to Budnick in hopes of finding a solution for a new application. The customer's new thermal interface material required a repositionable adhesive that would
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Managing Heat Transfer With Potting Compounds
and require additional power to operate. Molded plastics are used in place of metal enclosures due to cost control and weight savings. In most cases, these plastics are not as effective at transferring heat away from its source. Thermally conductive potting compounds are an effective way to control
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Highly thermally conductive room‐temperature‐vulcanized silicone rubber and silicone grease
Such thermally conductive silicone rubber and sili- cone grease are widely used in aviation, electronic devices, and so on.
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Advanced Materials for Thermal Management of Electronic Packaging
Other materials are the thermally conductive silicone grease composition comprising an organopolysiloxane, SiC, and aerosol silica (Yamada 2001), and the thermally conductive silicone oil compound comprising a hydroxyl group-containing organo- polysiloxane having a viscosity of 10–100,000 cs (centistokes) wherein the …
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High speed multichip modules using flip chip mount technology for 10 Gbps optical transmission systems
The heat spreader is attached to the backside of each LSI through thermally conductive silicone compound for highly effective cooling.
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Thermal conductivity of silicone rubber filled with ZnO
Such thermally conductive silicone rubbers are widely used in aviation, electronic devices, and so on.
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Novel heat‐conductive composite silicone rubber
Furthermore, a new type of thermally conductive silicone rubber composites, possessing thermal conductivity of 0.92 W/mK, good electrical insulation, and mechanical properties, was developed using electrical glass cloth as reinforcement.
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http://etd.auburn.edu/bitstream/handle/10415/1624/Yuquan%20%20disseration%200409%20final.pdf?sequence=1
A thermally conductive silicone was used as the thermal interface material.
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Ablation properties of aluminum silicate ceramic fibers and calcium carbonate filled silicone rubber composites
m21 K21 ) and aluminum silicate ceramic fiber (ASF; thermal conductivity: 0.128 W m21 K21 ) were selected as a fiber/particle complex filler; this was considered to obtain low thermally con- ductive silicone rubber and generate a firm and thermal insulat- ing layer …
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Highly Conductive Insulation for Large, High-Speed Machines
This paper investigates the electrical integrity of highly thermally conductive silicone -impregnated-fiberglass .
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silicon thermal pad - offers from silicon thermal pad manufacturers, suppliers, exporters & wholesalers
Thermally Conductive Silicone Interface Pad .
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http://www.polysciences.com/SiteData/docs/201415PROD/fdc6998e52f8c3b4/2014-15%20PRODUCT%20CATALOG.pdf
Thermally conductive Silicone , long pot life HV300 .