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Supplier: Epoxies Etc...
Description: 50-1225 is a low viscosity, room temperature curing, RTV silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package.
- Viscosity: 32,000 cP
- Use Temperature: -85 to 410 F
- Thermal Conductivity: 1.7307348 W/m-K
- Tensile Strength (Break): 850 psi
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Supplier: Shenzhen You-San Technology Co., Ltd.
Description: Thermally conductive silicone pad is a kind of thermally conductive medium, which is used to reduce the contact thermal resistance between the surface of the heat source and the contact surface of the heat dissipation device. It is specially produced for the design
- Thickness: 0.011811023622047244 to 0.47244094488188976 inches
- Temperature Resistance: -40 to 200 C
- Features: Anti-static / ESD Control, Dielectric / Insulating, Electrical, Electrically Conductive, Other
- Backing: Plastic / Polymer
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 970 TC A/B is a pasty, but still flowable addition-curing, two component elastomeric silicone that cures at elevated temperature to an thermally conductive silicone rubber. Special features two-component thermal conductivity pasty, still flowable almost
- Viscosity: 25,000 to 120,000 cP
- Thermal Conductivity: 0.8 W/m-K
- Tensile Strength (Break): 580.147357428788 psi
- Elongation: 90 %
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Gaskets and Gasketing - Gasketing Foams, Silicone, Thermally Conductive Silicone -- ThermaCool TF400Supplier: Saint-Gobain Tape Solutions
Description: ThermaCool TF400 series are thermally conductive, silicone-coated fabrics offering high temperature capability and conformability in a heat sink gasket. Fiberglass fabric supports the thermally conductive silicone rubber impregnation and adds dimensional
- Thickness: 0.007086618 to 0.008661422 inch
- Operating Temperature: -79.6 F
- Features: Color Options
- Material: Foam, Silicone Rubber
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Description: The SHEEN's TIV800 Series RTV Thermal Conductive Adhesive are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 1.0 to 2.0 W/m·K. ◆ High bonding performance. ◆ Good stability, long-term high temperature resistance,
- Use Temperature: -58 to 392 F
- Thermal Conductivity: 1.2 W/m-K
- Industry: Electronics
- Chemical System: Silicone
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Supplier: Wacker Chemical Corp.
Description: WACKER’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in
- Features: Electrically Conductive, Gel, Rubber Based / Elastomeric
- Industry: Electronics, OEM / Industrial
- Chemical System: Silicone
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Chemence Inc.
Description: KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that when
- Viscosity: 150,000 cP
- Features: Die Bonding Adhesive / Compound, Grease / Paste
- Industry: Electronics
- Substrate Compatibility: Plastic
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Supplier: Chemence Inc.
Description: KSC1802 is a low viscosity, high performance, thermally conductive, liquid gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1802 is supplied as a two part, 1:1 mix ratio silicone that
- Viscosity: 11,000 to 14,000 cP
- Features: Die Bonding Adhesive / Compound, Gap Filling Sealant / FIP Gasket
- Industry: Electronics
- Type / Form: Grease / Paste
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Supplier: CHT USA Inc.
Description: CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low
- Use Temperature: -94 to 482 F
- Thermal Conductivity: 1.17 W/m-K
- Elongation: 30 %
- Tensile Strength (Break): 117.47983987932957 psi
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Description: The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m·K. ◆ Available in various thicknesses from 0.3 to 10.0 mm. ◆ Highly compressible, soft, reducing assembly
- Use Temperature: -58 to 392 F
- Thermal Conductivity: 3 W/m-K
- Elongation: 10 %
- Dielectric Strength: 0.00012700000000000027 kV/in
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Description: The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆ Free from
- Use Temperature: -40 to 257 F
- Thermal Conductivity: 3 W/m-K
- Tensile Strength (Break): 7.977026164645835 psi
- Elongation: 70 %
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Description: The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m·K. ◆ Available in various thicknesses from 0.15 to 15.0 mm. ◆ Highly compressible, soft, reducing assembly
- Use Temperature: -58 to 392 F
- Thermal Conductivity: 1.5 W/m-K
- Elongation: 4 %
- Dielectric Strength: 0.0002032000000000004 kV/in
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Supplier: CHT USA Inc.
Description: low modulus, QSil 553 will minimize cooefficient of thermal expansion (CTE) strain. QSil 553 is thermally conductive to aid in efficient heat dissipation. This silicone elastomer is also flame retardant and is UL Listed in file QMFZ2.E205830.
- Use Temperature: -67 to 464 F
- Thermal Conductivity: 0.68 W/m-K
- Elongation: 240 %
- Tensile Strength (Break): 249.46336369437884 psi
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Thermal Compounds and Thermal Interface Materials - Non-Silicone Thermal Conductive Putty -- N-PuttySupplier: Shiu Li Technology Co., Ltd
Description: LiPOLY N-putty series is silicone-free and dispensable thermally conductive material. With a thermal conductivity from 3.5 W/m*K, this product can be used successfully to remove manufacturing tolerances. It is ideally suited for dispensing using the N-putty dispensing robot.
- Viscosity: 15,000 cP
- Use Temperature: -76 to 302 F
- Thermal Conductivity: 3.5 W/m-K
- Dielectric Strength: 300 kV/in
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Supplier: Master Bond, Inc.
Description: MasterSil 323AO-LO is a two component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications. This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the
- Applied Thickness / Gap Fill: 0.002 to 0.003 inch
- Viscosity: 300,000 to 400,000 cP
- Use Temperature: -65 to 400 F
- Thermal Conductivity: 1.15 to 1.3 W/m-K
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Supplier: Shiu Li Technology Co., Ltd
Description: Non-Silicone Thermal Compound N800AH is made of non-silicon resin material and none low-molecular-weight siloxane. N800AH helps avoid electrical contact problems. N800 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is
- Applied Thickness / Gap Fill: 0.01968505 to 0.1968505 inch
- Use Temperature: -76 to 257 F
- Thermal Conductivity: 7 W/m-K
- Dielectric Strength: 203.20000000000041 kV/in
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Supplier: CHT USA Inc.
Description: CHT’s AS1803 is a white, non-corrosive, neutral cure 1-part RTV silicone adhesive sealant. This product will not corrode copper or its alloys and is designed for use with electronic components. It is part of CHT's range of Acetone cure products which are all solvent free. It features a fast
- Viscosity: 350,000 cP
- Use Temperature: -58 to 428 F
- Thermal Conductivity: 1.55 W/m-K
- Tensile Strength (Break): 406.1031502001516 psi
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Supplier: Fujipoly® America Corp.
Description: benefits of a silicone-based compound without the problem of contamination. FEATURES: Silicone and non-silicone formulations Thermal conductivity up to 2.6 W/m°K Low bleed and evaporation No migration for non-silicone formulations over wide temperature range Non-toxic
- Use Temperature: -67 to 401 F
- Thermal Conductivity: 2.6 W/m-K
- Dielectric Strength: 411.9999999999988 kV/in
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Master Bond, Inc.
Description: Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9
- Viscosity: 35,000 to 50,000 cP
- Use Temperature: -65 to 221 F
- Thermal Conductivity: 1.1538 to 1.2981 W/m-K
- Coeff. of Thermal Expansion (CTE): 61.11 to 77.77999999999999 µin/in-F
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Supplier: CHT USA Inc.
Description: CHT's AS1707 is a 1-part, alkoxy cured, thermally conductive, low volatile, RTV silicone adhesive paste. AS1707 is formulated to meet the requirements for use as a space grade adhesive. AS1707 has low thermal outgassing properties and a wide operational temperature range. In
- Use Temperature: -85 to 446 F
- Thermal Conductivity: 3.3 W/m-K
- Tensile Strength (Break): 263.96704763009853 psi
- Elongation: 11 %
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Supplier: Henkel Corporation - Electronics
Description: (Known as E&C STYCAST 5952 A/B thermally conductive silicone encapsulant ) LOCTITE STYCAST 5952 RD PTA is a filled, addition cured, silicone encapsulant. It features good thermal conductivity, excellent electrical insulation properties. It was designed for encapsulating
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY's NL-putty series is a silicone free, low-density gel filling material. Its low density and lightweight characteristics enhance product performance, reduce production costs. Commonly used in electronic products and automotive electronic devices, this series has a thermal conductivity
- Applied Thickness / Gap Fill: 0.00393701 to 0.05905515 inch
- Viscosity: 10,000,000 cP
- Use Temperature: -76 to 257 F
- Thermal Conductivity: 10 W/m-K
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY EP770 is a two-part epoxy material for gap filling. Extremely low viscosity and flowability. Good dispersion and no delamination. The high deformation material, which filling the gap closely, cover the tolerance, and has outstanding conductivity, makes is suitable for filling the peculiar
- Viscosity: 100,000 cP
- Use Temperature: -76 to 302 F
- Thermal Conductivity: 2.5 W/m-K
- Dielectric Strength: 350 kV/in
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Supplier: Fujipoly® America Corp.
Description: Sarcon ® XR-e is highly conformable/thermally conductive gel materials, 11watt/m-K (No electricity conductive) in a versatile sheet form that easily fit and adhere e to most all shapes and sizes of components, and makes reliable and complete physical contact. The surface
- Applied Thickness / Gap Fill: 0.0393701 to 0.0787402 inch
- Thermal Conductivity: 11 W/m-K
- Tensile Strength (Break): 29.0073678714394 psi
- Elongation: 40 %
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Supplier: Master Bond, Inc.
Description: Master Bond MasterSil 705TC is a one component, thermally conductive, electrically isolating silicone for bonding, sealing and coating applications. It features outstanding thermal conductivity and is well suited for applications that require flexibility and high temperature
- Use Temperature: -60 to 400 F
- Thermal Conductivity: 2.1 W/m-K
- Tensile Strength (Break): 210 psi
- Elongation: 70 %
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Supplier: Fujipoly® America Corp.
Description: SARCON® NR-c is a highly conformable, thermally conductive, non-flammable acrylate resin (non-silicone) sheet with thermally conductive fillers. Available in sheets and die-cut forms for formal interface uses wherever gap filler pads are traditionally used. No
- Applied Thickness / Gap Fill: 0.01968505 inch
- Use Temperature: -40 to 221 F
- Thermal Conductivity: 1.5 W/m-K
- Chemical System: Acrylic / Polyacrylate
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Supplier: Newark, An Avnet Company
Description: THERMALLY CONDUCTIVE INSULATOR; Thermal Conductivity:1.1W/m.K; Thickness:0.152mm; Thermal Impedance:0.82°C/W; Dielectric Strength:-; Product Range:-; Breakdown Voltage Vbr:6kV; External Depth:0.15mm; Material:Silicone/Film RoHS Compliant: Yes
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Supplier: Fujipoly® America Corp.
Description: Sarcon® SPG-20A is highly conformable/thermally conductive, low viscosity and easier dispensable type silicone compound. It provides a thermal solution for the recent trends of higher frequencies and integration in the development of electronic devices. Sarcon® SPG-20A easily
- Use Temperature: -40 to 302 F
- Thermal Conductivity: 2 W/m-K
- Industry: Electronics, Semiconductors / IC Packaging
- Form / Shape: Gap Filling Compound
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Supplier: Accuris
Description: INSULATING SHEETS, ELECTRICAL, SILICONE RUBBER THERMALLY CONDUCTIVE, FIBERGLASS REINFORCED
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST TGR 1500A, High Performance, Value Compound for High-End Computer Processors BERGQUIST® TGR 1500A is a high performance, thermally conductive compound intended for use as a thermal interface material between a high end computer processor and a heat sink. Other high watt
- Use Temperature: 302 F
- Thermal Conductivity: 1.5 W/m-K
- Chemical System: Silicone
- Features: Thermal / Heat Conductive
Find Suppliers by Category Top
Featured Products Top
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directly impacts the performance and lifespan of the devices. To solve this problem, SHEEN thermal conductive silicone sheets have been introduced into Bluetooth speaker designs, acting like an invisible pair of wings that allow the music to soar and release its true charm. SHEEN (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
MasterSil 151TC is an addition cured silicone offering both flexibility and high temperature resistance. It has very fine particles of a thermally conductive filler that allows it to be applied in sections as thin as 10-15 microns. MasterSil 151TC fits well in applications involving sensitive optical and electronic components where optimum heat dissipation is critical. (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
Adhesive product page. Thermally Conductive Adhesives The SILCOTHERM® range includes range includes thermally (read more)
Browse Elastomers and Rubber Compounds Datasheets for CHT USA Inc. -
Adhesive Sealants The benefits of having a thermally conductive adhesive mean you can permanently bond your component to some form of heat sink and eliminate the need for additional mechanical fastening systems. It will also prevent the possibility of movement and air (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc. -
heat generating components. Once installed, Fujipoly’s unique thermally conductive silicone-based materials efficiently remove excess heat to the surrounding environment or nearby heatsinks. Depending on thickness and your selection of Sarcon® TR or HR (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants & adhesives. Applications Automotive vehicle lighting Signage and displays for sports and advertising Back lighting for LCD (read more)
Browse Datasheets for CHT USA Inc. -
expensive mixing equipment Neutral cure, non-corrosive Thermally conductive Adhesion promoters are added to improve adhesion across a range of substrates. As with all addition cure materials, adhesion can be improved with longer cure times, higher cure temperatures, post (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc. -
applications? Silicones have become widely used by LED design engineers to provide improved light performance, environmental protection and extended product life. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants (read more)
Browse Datasheets for CHT USA Inc. -
applications? Silicones have become widely used by LED design engineers to provide improved light performance, environmental protection and extended product life. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants (read more)
Browse Industrial Adhesives Datasheets for CHT USA Inc. -
. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants & adhesives. Applications Automotive vehicle lighting Signage and displays for sports and advertising Back lighting for LCD (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc.
Conduct Research Top
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Highly Conductive Insulation for Large, High-Speed Machines
. This paper investigates functional electrical insulation integrity of highly thermally-conductive silicone-impregnated-fiberglass insulation through short-term, highly accelerated aging tests. This insulation system offers up to three times the thermal conductivity of traditional insulation, which
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Key Benefits of Choosing Non-Silicone Gap Filler Material
As its name suggests, thermal interface materials (TIMs) are used to optimize thermal heat transfer between various interfaces. Generally, thermal gap fillers are made from a silicone polymer and add various auxiliary materials such as ceramic particles, silicone oil and thermally conductive
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Silicone Based Insulation Material for High Speed/Voltage Rotating Machines
on silicone, epoxy, polyester, polyesterimide, and other polymers. Among all of these insulation materials, silicone based insulation best fits into many rotating machinery applications because of stability across a wide temperature range and the ability for highly thermally conductive designs
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Silicone Based Electrical Insulation Material for High Speed/Voltage Rotating Machines
on silicone, epoxy, polyester, polyesterimide, and other polymers. Among all of these insulation materials, silicone based insulation best fits into many rotating machinery applications because of stability across a wide temperature range and the ability for highly thermally conductive designs
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Case Study - Repositionable Thermal Interface
Our customer, an EMI shielding manufacturer, was producing a conductive, semi-cured silicone at their local location. They reached out to Budnick in hopes of finding a solution for a new application. The customer's new thermal interface material required a repositionable adhesive that would
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Managing Heat Transfer With Potting Compounds
and require additional power to operate. Molded plastics are used in place of metal enclosures due to cost control and weight savings. In most cases, these plastics are not as effective at transferring heat away from its source. Thermally conductive potting compounds are an effective way to control
More Information Top
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Highly thermally conductive room‐temperature‐vulcanized silicone rubber and silicone grease
Such thermally conductive silicone rubber and sili- cone grease are widely used in aviation, electronic devices, and so on.
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Advanced Materials for Thermal Management of Electronic Packaging
Other materials are the thermally conductive silicone grease composition comprising an organopolysiloxane, SiC, and aerosol silica (Yamada 2001), and the thermally conductive silicone oil compound comprising a hydroxyl group-containing organo- polysiloxane having a viscosity of 10–100,000 cs (centistokes) wherein the …
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High speed multichip modules using flip chip mount technology for 10 Gbps optical transmission systems
The heat spreader is attached to the backside of each LSI through thermally conductive silicone compound for highly effective cooling.
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Thermal conductivity of silicone rubber filled with ZnO
Such thermally conductive silicone rubbers are widely used in aviation, electronic devices, and so on.
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Novel heat‐conductive composite silicone rubber
Furthermore, a new type of thermally conductive silicone rubber composites, possessing thermal conductivity of 0.92 W/mK, good electrical insulation, and mechanical properties, was developed using electrical glass cloth as reinforcement.
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http://etd.auburn.edu/bitstream/handle/10415/1624/Yuquan%20%20disseration%200409%20final.pdf?sequence=1
A thermally conductive silicone was used as the thermal interface material.
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Ablation properties of aluminum silicate ceramic fibers and calcium carbonate filled silicone rubber composites
m21 K21 ) and aluminum silicate ceramic fiber (ASF; thermal conductivity: 0.128 W m21 K21 ) were selected as a fiber/particle complex filler; this was considered to obtain low thermally con- ductive silicone rubber and generate a firm and thermal insulat- ing layer …
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Highly Conductive Insulation for Large, High-Speed Machines
This paper investigates the electrical integrity of highly thermally conductive silicone -impregnated-fiberglass .
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silicon thermal pad - offers from silicon thermal pad manufacturers, suppliers, exporters & wholesalers
Thermally Conductive Silicone Interface Pad .
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http://www.polysciences.com/SiteData/docs/201415PROD/fdc6998e52f8c3b4/2014-15%20PRODUCT%20CATALOG.pdf
Thermally conductive Silicone , long pot life HV300 .