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Description: It is a fast curing reactive hot melt adhesive and sealant. It is a 100% solid, one-component material with a secondary moisture curing system. The material can be heated and solidified immediately, allowing processing without the need for thermal curing. It has good adhesion to common
- Cure Type / Technology: Thermoplastic / Hot Melt, Reactive / Moisture Cured, Single Component System
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
- Use Temperature: -40 to 176 F
- Viscosity: 7500 to 10500 cP
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Supplier: Protavic America, Inc.
Description: PNU-56200™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.41 to 4.63
- Features: Electrical Insulation / Dielectric Material
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Description: Easy to repair
- Cure Type / Technology: Thermoplastic / Hot Melt, Reactive / Moisture Cured
- Elongation: 710 %
- Use Temperature: -40 to 176 F
- Viscosity: 3500 to 6500 cP
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Description: Fast curing, high modulus, ultra-high initial adhesion, high polarity material bonding.
- Cure Type / Technology: Thermoplastic / Hot Melt, Reactive / Moisture Cured
- Elongation: 810 %
- Use Temperature: -40 to 176 F
- Viscosity: 4000 to 7000 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE® 3184 Hysol Polyurethane Hardener, Flame Retardant is one part of a two part epoxy system to be used with LOCTITE 3173 Hysol Resin. LOCTITE 3173/3184 Hysol Polyurethane System meet UL 94V-O Flammability Rating at 3/8 inch thickness.
- Cure Type / Technology: Two Component System
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Supplier: Accuris
Description: Curative for Two Component Polyurethane Adhesive
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Supplier: Accuris
Description: Resin for Two Component Polyurethane Adhesive
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Supplier: Henkel Corporation - Industrial
Description: 2-part, solvent-free polyaddition polyurethane structural adhesive with a choice of two hardeners. It can also be used for bridging wide gaps. LOCTITE® UK 1340 B30 is a green to brown, 2-part, solvent-free polyaddition polyurethane structural adhesive with a choice
- Cure Type / Technology: Two Component System
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE® MR Flex 80 Putty Pourable Repair Compound isa trowelable, two-part urethane for rebuilding and repairing rubber parts and linings, providing impact, abrasion, and corrosion-resistant protection.
- Cure Type / Technology: Two Component System
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Supplier: Henkel Corporation - Industrial
Description: 2-part, low-viscosity, industrial grade polyisocyanate urethane adhesive which cures to form an ultra-clear, highly flexible bondline, LOCTITE® UK U-09FL is an ultra clear, 2-part, low-viscosity, industrial grade polyisocyanate urethane adhesive. Once mixed, it cures at room
- Cure Type / Technology: Two Component System
- Viscosity: 5000 cP
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Supplier: Epoxies Etc...
Description: The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion
- Compound Type: Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Room Temperature Curing
- Dielectric Strength: 400 kV/in
- Features: Flexible / Dampening
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Supplier: Epoxies Etc...
Description: The 10-2080 and 10-2080 HV were developed to produce a general purpose, semi rigid polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE)
- Compound Type: Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Room Temperature Curing
- Dielectric Strength: 400 kV/in
- Industry: OEM / Industrial
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Supplier: Protavic America, Inc.
Description: PNU-46202™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.41 to 4.63
- Features: Electrical Insulation / Dielectric Material
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDCN is a two component, nickel filled, electrically conductive, adhesive for high performance bonding, formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive epoxy
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Compound Type: Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Strength: 360 to 450 kV/in
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Polyurethane Adhesives and Sealants - Two Component, Silver Conductive Epoxy Adhesive -- EP21TDCS-LOSupplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Compound Type: Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Strength: 360 to 450 kV/in
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Supplier: Ellsworth Adhesives
Description: ResinLab UR7001 Polyurethane Adhesive Clear is a two component adhesive with excellent adhesion to a wide variety of substrates such as PVC, ABS, polycarbonate, acrylic, 304 stainless steel and aluminum. 1:1 mix ratio by volume, 50 mL Cartridge.
- Cure Type / Technology: Two Component System
- Elongation: 9 %
- Tensile Strength (Break): 5700 psi
- Viscosity: 10500 cP
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Supplier: Ellsworth Adhesives
Description: ResinLab UR7001 Polyurethane Adhesive Clear is a two component adhesive with excellent adhesion to a wide variety of substrates such as PVC, ABS, polycarbonate, acrylic, 304 stainless steel and aluminum. 1:1 mix ratio by volume, 400 mL Cartridge.
- Cure Type / Technology: Two Component System
- Elongation: 9 %
- Tensile Strength (Break): 5700 psi
- Viscosity: 10500 cP
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite URA-BOND 24N Polyurethane Adhesive Clear is a two component, high impact, high viscosity adhesive that is used for general purpose bonding of metal, glass, butyrate, and wood. It has provides high impact resistant bonds. 50 mL Cartridge.
- Cure Type / Technology: Two Component System
- Elongation: 220 %
- Tensile Strength (Break): 2000 psi
- Viscosity: 10000 cP
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Supplier: Protavic America, Inc.
Description: PNU 46220™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light)
- Dielectric Constant (Relative Permittivity): 4.41 to 4.63
- Features: Electrical Insulation / Dielectric Material, Filled, Flexible / Dampening
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most noteworthy properties are its high flexibility and
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Compound Type: Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Strength: 360 to 450 kV/in
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Supplier: Protavic America, Inc.
Description: PNU-46203™ is an electronics grade, two-component polyurethane adhesive or encapsulant for high temperature resistance. PNU-46203™ is designed for the encapsulation by casting of completed circuit boards. Cured PNU-46203™ is expected to meet the flammability requirements of UL
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 6.89 to 7.01
- Features: Electrical Insulation / Dielectric Material, Filled, Flame Retardant (e.g. UL 94 Rated), Flexible / Dampening
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite 24N-HV-100K Polyurethane Adhesive is a two component, high impact, rapid curing adhesive used for general purpose bonding of metal, glass, butyrate, and wood. 50 mL Bottle.
- Cure Type / Technology: Two Component System
- Elongation: 200 %
- Substrate / Material Compatibility: Metal, Wood / Wood Product
- Tensile Strength (Break): 1700 psi
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Supplier: ACCRAbond, Inc.
Description: CONATHANE® FP-1302 is a two-component, room temperature curing flexible polyurethane elastomer system.
- Cure Type / Technology: Two Component System
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of
- Coeff. of Thermal Expansion (CTE): 39 to 50 µin/in-F
- Compound Type: Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4
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Supplier: Epoxies Etc...
Description: 20-2100 is a high performance two component flexible urethane system. This easy to use polyurethane is very low in viscosity and ideal for potting or encapsulating delicate electronic components. 20-2100 exhibits very low shrinkage, stress, and exotherm throughout the
- Coeff. of Thermal Expansion (CTE): 83.33 µin/in-F
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 4.1
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Supplier: ACCRAbond, Inc.
Description: CONATHANE® FP-1305 is a two-component, non-TDI, liquid polyurethane casting system produced under very carefully controlled conditions. This elastomeric system features excellent toughness, water resistance, and physical properties.
- Cure Type / Technology: Two Component System
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Supplier: GS Polymers, Inc.
Description: Two Part, 1:2, gels quickly, water resistant, excellent adhesive
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dissimilar Substrates: Yes
- Features: Filled
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Supplier: Epoxies Etc...
Description: 20-2365 is a new low viscosity polyurethane designed for low stress on sensitive components during and after cure. This filled polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. 20-2365 has a
- Coeff. of Thermal Expansion (CTE): 90 µin/in-F
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 4.3
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Supplier: Accuris
Description: ADHESIVE, TWO COMPONENT, POLYURETHANE, SOLVENT RELEASE
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Supplier: Accuris
Description: PERFORMANCE, ADHESIVE, POLYURETHANE, TWO COMPONENT REPAIR
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Supplier: GS Polymers, Inc.
Description: Two part, 1:1, flowable adhesive provides fast cure, 6 minute set up
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dissimilar Substrates: Yes
- Industry: OEM / Industrial, Building / Construction
- Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Paper / Paperboard, Porous Surfaces
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Supplier: GS Polymers, Inc.
Description: Two part, 1:1, adhesive, excellent choice for a filter seal
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dissimilar Substrates: Yes
- Industry: Medical / Food (Sanitary / FDA), OEM / Industrial
- Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Paper / Paperboard, Porous Surfaces
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Supplier: GS Polymers, Inc.
Description: Two part, 1:1, fast cure adhesive, 3 minute set up, form thixotropic bead
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dissimilar Substrates: Yes
- Industry: OEM / Industrial, Building / Construction
- Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Paper / Paperboard, Porous Surfaces
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Polyurethane Adhesives and Sealants - Techsil® PU20965 Black Polyurethane Sealant 250gm -- TEPU14439Supplier: Techsil Limited
Description: Techsil® PU20965 is a fast curing, two component polyurethane designed for outdoor sealing applications. Black in color with a cured shore hardness of between 60-70 Shore A. Product Specifications Low Viscosity Rapid Gel Time (8 mins) Rapid Demold Time (4 hours) Cures to a
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Description: The SHEEN's PU4500 Series Thermal Conductive PU Adhesive are renowned for their distinctive characteristics, which include: ? Thermal conductivity ranging from 1.0 to 2.0 W/m·K. ? Two-component adhesive, cures at room temperature or with heat. ? 100% solid
- Compound Type: Thermal Compound / Heat Conductive
- Industry: Electronics
- Use Temperature: -40 to 185 F
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Supplier: ACCRAbond, Inc.
Description: CONATHANE® FP-1303 White or Amber is a two-component, unfilled, fast setting polyurethane sealant designed for use in HEPA and other air filtration devices. CONATHANE ® FP-1303 is also used for potting, casting, embedding, and encapsulating of electronic circuits, components,
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System
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Supplier: MacDermid Alpha Electronics Solutions
Description: A durable two-part polyurethane encapsulation resin developed for electrical components exposed to extreme conditions. Product Overview UR5645 High Performance Polyurethane Resin has been specially developed for the encapsulation and potting of electronics, such as the
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System
- Industry: Automotive, Electronics, Marine, Semiconductors / IC Packaging
- Use Temperature: 320 F
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Parker LORD® 7542A-B Urethane Adhesive is a two-component adhesive system that is used for bonding primed metals, SMC, FRP, and plastics. It is environmentally friendly, non-flammable, and resistant to weathering, chemicals, sunlight, and humidity. 1:1 mix ratio by volume. (read more)
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Became the fiber by the experimental structure used in the frame of this research project according to image 1 in parallel claimed ZwischenhoÈlzer on the querzugbeanspruchten VollholzpruÈfkoÈrper with a adhered two components polyurethane adhesive .
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