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Description: It is a fast curing reactive hot melt adhesive and sealant. It is a 100% solid, one-component material with a secondary moisture curing system. The material can be heated and solidified immediately, allowing processing without the need for thermal curing. It has good adhesion to common
- Viscosity: 7,500 to 10,500 cP
- Use Temperature: -40 to 176 F
- Substrate Compatibility: Ceramic / Glass, Metal, Plastic
- Cure / Technology: Reactive / Moisture Cured, Single Component System, Thermoplastic / Hot Melt
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Supplier: Accuris
Description: Curative for Two Component Polyurethane Adhesive
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Supplier: Accuris
Description: Resin for Two Component Polyurethane Adhesive
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Supplier: Protavic America, Inc.
Description: PNU-56200™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide
- Viscosity: 5,000 cP
- Use Temperature: -55 to 120 F
- Tensile Strength (Break): 2,000 psi
- Dielectric Constant (Relative Permittivity): 4.41 to 4.63
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Supplier: Accuris
Description: PERFORMANCE, ADHESIVE, POLYURETHANE, TWO COMPONENT REPAIR
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Supplier: Accuris
Description: ADHESIVE, TWO COMPONENT, POLYURETHANE, SOLVENT RELEASE
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Supplier: Epoxies Etc...
Description: The 10-2080 and 10-2080 HV were developed to produce a general purpose, semi rigid polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE)
- Viscosity: 3,000 to 9,000 cP
- Thermal Conductivity: 0.11538232 W/m-K
- Dielectric Strength: 400.000000000001 kV/in
- Features: Die Bonding Adhesive / Compound, Grease / Paste, Polyurethane (PU, PUR), Room Temp. Cure / Vulcanizing, Thermal / Heat Conductive
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Supplier: Epoxies Etc...
Description: The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion
- Viscosity: 3,000 to 8,000 cP
- Thermal Conductivity: 0.11538232 W/m-K
- Dielectric Strength: 400.000000000001 kV/in
- Features: Die Bonding Adhesive / Compound, Flexible / Dampening, Grease / Paste, Polyurethane (PU, PUR), Room Temp. Cure / Vulcanizing, Thermal / Heat Conductive
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite UK 3173 is one part of a two part polyurethane system that can be used with a variety of Loctite Hysol hardeners including Loctite Hysol 3184. When mixed with Loctite Hysol 3184 it forms a low viscosity, flame retardant potting compound. 1 gal Pail.
- Viscosity: 2,250 cP
- Features: Polyurethane (PU, PUR)
- Cure / Technology: Two Component System
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Supplier: Ellsworth Adhesives
Description: ResinLab UR7001 Polyurethane Adhesive Clear is a two component adhesive with excellent adhesion to a wide variety of substrates such as PVC, ABS, polycarbonate, acrylic, 304 stainless steel and aluminum. 1:1 mix ratio by volume, 400 mL Cartridge.
- Viscosity: 10,500 cP
- Tensile Strength (Break): 5,700 psi
- Elongation: 9 %
- Features: Polyurethane (PU, PUR)
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Supplier: Ellsworth Adhesives
Description: ResinLab UR7001 Polyurethane Adhesive Clear is a two component adhesive with excellent adhesion to a wide variety of substrates such as PVC, ABS, polycarbonate, acrylic, 304 stainless steel and aluminum. 1:1 mix ratio by volume, 50 mL Cartridge.
- Viscosity: 10,500 cP
- Tensile Strength (Break): 5,700 psi
- Elongation: 9 %
- Features: Polyurethane (PU, PUR)
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite 24N-HV-100K Polyurethane Adhesive is a two component, high impact, rapid curing adhesive used for general purpose bonding of metal, glass, butyrate, and wood. 50 mL Bottle.
- Tensile Strength (Break): 1,700 psi
- Elongation: 200 %
- Substrate Compatibility: Metal, Wood / Wood Product
- Features: Polyurethane (PU, PUR)
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDCN is a two component, nickel filled, electrically conductive, adhesive for high performance bonding, formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive epoxy
- Use Temperature: -100 to 275 F
- Thermal Conductivity: 1.585 W/m-K
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Tensile Strength (Break): 6,000 to 6,500 psi
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most noteworthy properties are its high flexibility and
- Use Temperature: -452 to 250 F
- Thermal Conductivity: 1.441 W/m-K
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Tensile Strength (Break): 6,000 psi
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Polyurethane Adhesives and Sealants - Two Component, Silver Conductive Epoxy Adhesive -- EP21TDCS-LOSupplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver
- Use Temperature: -452 to 250 F
- Thermal Conductivity: 1.585 W/m-K
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Tensile Strength (Break): 6,000 to 6,500 psi
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of
- Use Temperature: -60 to 250 F
- Thermal Conductivity: 0.288 to 0.432 W/m-K
- Coeff. of Thermal Expansion (CTE): 39 to 50 µin/in-F
- Tensile Strength (Break): 3,200 psi
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Supplier: ACCRAbond, Inc.
Description: CONATHANE® FP-1302 is a two-component, room temperature curing flexible polyurethane elastomer system.
- Features: Polyurethane (PU, PUR)
- Cure / Technology: Two Component System
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE® 3184 Hysol Polyurethane Hardener, Flame Retardant is one part of a two part epoxy system to be used with LOCTITE 3173 Hysol Resin. LOCTITE 3173/3184 Hysol Polyurethane System meet UL 94V-O Flammability Rating at 3/8 inch thickness.
- Features: Polyurethane (PU, PUR)
- Cure / Technology: Two Component System
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Supplier: Epoxies Etc...
Description: 20-2100 is a high performance two component flexible urethane system. This easy to use polyurethane is very low in viscosity and ideal for potting or encapsulating delicate electronic components. 20-2100 exhibits very low shrinkage, stress, and exotherm throughout the
- Viscosity: 1,600 cP
- Use Temperature: -67 to 266 F
- Coeff. of Thermal Expansion (CTE): 83.33333333333333 µin/in-F
- Tensile Strength (Break): 1,600 psi
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Description: 3M™ Scotch-Weld™ 3532 B/A Urethane Adhesive is a two-component, polyurethane adhesive which cures at room temperature or with heat to form tough, impact-resistant structural bonds. Provides excellent adhesion to many primed or painted metal and plastic substrates
- Viscosity: 10,000 to 55,000 cP
- Tensile Strength (Break): 3,000 psi
- Elongation: 96 %
- Industry: Aerospace, OEM / Industrial
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Supplier: Epoxies Etc...
Description: 20-2365 is a new low viscosity polyurethane designed for low stress on sensitive components during and after cure. This filled polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. 20-2365 has a
- Viscosity: 150 to 6,000 cP
- Use Temperature: -85 to 275 F
- Thermal Conductivity: 0.50479765 W/m-K
- Coeff. of Thermal Expansion (CTE): 90 µin/in-F
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Supplier: Henkel Corporation - Industrial
Description: Thick urethane rubber and belt repair kit which contains all the materials needed to make a durable repair to conveyor belts and other rubber parts. LOCTITE® MR 5023 is a black, 2-part, thick urethane rubber and belt repair kit which contains all the materials needed to make a durable repair to
- Features: Polyurethane (PU, PUR)
- Cure / Technology: Two Component System
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Supplier: Protavic America, Inc.
Description: PNU-46202™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide
- Viscosity: 8,000 cP
- Use Temperature: -55 to 120 F
- Tensile Strength (Break): 2,000 psi
- Dielectric Constant (Relative Permittivity): 4.41 to 4.63
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Supplier: FSI
Description: FoamNail® is the two-part industrial strength adhesive from FSI that’s extremely effective, but costs significantly less to use compared to other adhesive options. This time-tested, dependable adhesive has many uses – in fact, it’s been a mainstay in the manufactured
- Industry: Building / Construction, OEM / Industrial
- Substrate Compatibility: Dissimilar Substrates, Plastic, Wood / Wood Product
- Features: Laminating / Composites, Polyurethane (PU, PUR), Thermal / Heat Insulating
- Cure / Technology: Single Component System
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Supplier: Protavic America, Inc.
Description: PNU 46220™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide
- Viscosity: 1,500 cP
- Use Temperature: -55 to 125 F
- Dielectric Constant (Relative Permittivity): 4.41 to 4.63
- Substrate Compatibility: Ceramic / Glass, Metal, Paper / Paperboard, Plastic
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Polyurethane Adhesives and Sealants - Techsil® PU20965 Black Polyurethane Sealant 250gm -- TEPU14439Supplier: Techsil Limited
Description: Techsil® PU20965 is a fast curing, two component polyurethane designed for outdoor sealing applications. Black in color with a cured shore hardness of between 60-70 Shore A. Product Specifications Low Viscosity Rapid Gel Time (8 mins) Rapid Demold Time (4 hours) Cures to a
- Features: Polyurethane (PU, PUR)
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Supplier: FSI
Description: OnePart is FSI’s moisture-cure adhesive with time-tested results in a wide variety of commercial and industrial applications, including entry and garage doors, recreational vehicle components, building and construction products (like SIPs, structural insulated panels) and more. It’s
- Industry: Building / Construction, OEM / Industrial
- Substrate Compatibility: Dissimilar Substrates, Plastic, Wood / Wood Product
- Features: Laminating / Composites, Polyurethane (PU, PUR), Thermal / Heat Insulating
- Cure / Technology: Reactive / Moisture Cured, Two Component System
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Supplier: Saint-Gobain Tape Solutions
Description: Thermalbond V2100 spacer tape is available in a wide range of thicknesses and configurations with black or grey color, utilizing high-strength acrylic adhesive on both sides of the foam. The two-sided adhesive configuration delivers secure temporary bonding, insuring stability
- Thickness: 0.12598425196850394 to 0.5 inches
- Temperature Resistance: -40 C
- Adhesive: Acrylic
- Features: Double-Sided Adhesive
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Supplier: Protavic America, Inc.
Description: PNU-46203™ is an electronics grade, two-component polyurethane adhesive or encapsulant for high temperature resistance. PNU-46203™ is designed for the encapsulation by casting of completed circuit boards. Cured PNU-46203™ is expected to meet the flammability requirements
- Viscosity: 15,000 cP
- Use Temperature: -55 to 125 F
- Dielectric Constant (Relative Permittivity): 6.89 to 7.01
- Substrate Compatibility: Ceramic / Glass, Metal, Paper / Paperboard, Plastic
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Supplier: ND Industries, Inc.
Description: Vibra-Tite Structural adhesives are a methacrylate technology, room temperature curing, two part, no mix system comprised of resin and hardener. Structural adhesives work on metal, composites, plastic, wood, ceramic and many other substrates. Since it is a two part
- Use Temperature: -65 to 300 F
- Chemical System: Acrylic / Polyacrylate
- Substrate Compatibility: Ceramic / Glass, Composites, Metal, Plastic, Wood / Wood Product
- Cure / Technology: Reactive / Moisture Cured, Two Component System
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Supplier: GS Polymers, Inc.
Description: No Description Provided
- Use Temperature: 230 F
- Substrate Compatibility: Ceramic / Glass, Composites, Concrete / Masonry, Dissimilar Substrates, Metal, Paper / Paperboard, Porous Surfaces
- Features: Epoxy (EP), Other, Polyurethane (PU, PUR), Rubber Based / Elastomeric
- Industry: Medical / Food (Sanitary / FDA), OEM / Industrial
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Description: The SHEEN's PU4500 Series Thermal Conductive PU Adhesive are renowned for their distinctive characteristics, which include: ◆ Thermal conductivity ranging from 1.0 to 2.0 W/m·K. ◆ Two-component adhesive, cures at room temperature or with heat. ◆ 100% solid content,
- Use Temperature: -40 to 185 F
- Industry: Electronics
- Features: Glue / Gum, Polyurethane (PU, PUR), Thermal / Heat Conductive
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview UR5634 Optically Clear Polyurethane Light-Emitting Diode (LED) Potting Compound is a two-part, semi-rigid polyurethane resin. It is formulated with a carefully selected blend of components specifically to be optically clear, making it ideal for LED
- Industry: Electronics, Optical Grade / Material, Semiconductors / IC Packaging
- Compound Type: Encapsulating / Potting
- Features: Polyurethane (PU, PUR)
- Cure / Technology: Two Component System
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MasterSil 170 Gel is a two component, addition curing silicone gel for sealing, potting and encapsulation. It is super soft upon curing, features convenient handling, provides great optical clarity and is a superb electrical insulator. (read more)
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Parker LORD® 7542A-B Urethane Adhesive is a two-component adhesive system that is used for bonding primed metals, SMC, FRP, and plastics. It is environmentally friendly, non-flammable, and resistant to weathering, chemicals, sunlight, and humidity. 1:1 mix ratio by volume. (read more)
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Make two-component dispensing easy with the Fluid Research® S-Series Meter Mix Dispense System. Our compact system with Corliolis flow meter offers real-time monitoring and control of key process parameters. The S-Series intelligence system, Sentinel Logic®, manages variable dispensing ratios and an extensive number of programmed shots. To see how the S-Series can help with your meter mix needs, click to learn more. (read more)
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Became the fiber by the experimental structure used in the frame of this research project according to image 1 in parallel claimed ZwischenhoÈlzer on the querzugbeanspruchten VollholzpruÈfkoÈrper with a adhered two components polyurethane adhesive .
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