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Encapsulants and Potting Compounds - Filter-bond? Elastomeric Casting and Potting Compound -- E-3505Supplier: Hapco, Inc.
Description: Filter-bond™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond™ E-Series is manufactured to ultra-high quality standards and has been used by customers to pass
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Supplier: Henkel Corporation - Industrial
Description: 2-part, yellowish, polyurethane-based casting resin, NSF approved, formulated especially for spiral wound filters (RO) and application to dry substrates. Two component polyurethane adhesive. Macroplast® UK 178A with 178B is a 100% solids, room temperature curing
- Compound Type: Leveling / Filling Compound
- Cure Type / Technology: Two Component System
- Industry: Other
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Supplier: MacDermid Alpha Electronics Solutions
Description: High-performance polyurethane potting and encapsulation compound suitable for a wide range of applications. Product Overview UR5604 is a general-purpose two-part polyurethane potting compound designed for potting and encapsulation. This
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Flame Retardant / UL 94V-0 Rated: Yes
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Supplier: MacDermid Alpha Electronics Solutions
Description: This thermally conductive polyurethane encapsulation and potting compound is a two-part system with a black finish. Product Overview UR5097 Thermally Conductive Polyurethane Potting Compound exhibits excellent thermal conductivity, making it ideal for
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Electrically Conductive, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: MacDermid Alpha Electronics Solutions
Description: Specialist resin with environmental protection for LEDs and PCBs, preserving optical clarity and color after prolonged UV exposure. Product Overview UR5634 Optically Clear Polyurethane LED Potting Compound is a two-part, semi-rigid polyurethane resin. It is
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Form / Function: Encapsulant / Potting Compound
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Supplier: Techsil Limited
Description: Techsil® VT2420LV is a crystal clear two-part, low viscosity room temperature curing polyurethane resin with high shore hardness. VT2420LV offers excellent outdoor weathering properties, due to the incorporation of both UV resistant base materials and the addition of UV stabilizers and
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Techsil Limited
Description: Techsil PU23955 is a two part component potting compound which cures to an opaque translucent material that is stable in UV light. Once mixed, the system reacts at room temperature to produce a tough abrasion resistant material with good hydrolysis resistance. There are
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: TE Connectivity
Description: Material System : Two-Part Polyurethane Potting Resin Product Type : Casting Material Usage Conditions Flammability Performance : Non-Flame-Retardant
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Specialty / Other
- Form / Function: Encapsulant / Potting Compound
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Supplier: TE Connectivity
Description: Product Type Features Material System : Two-Part Polyurethane Potting Resin Product Type : Casting Material Usage Conditions Environmental Resistance : Water-Repellent, Hydrolysis Stable Flammability Performance : Non-Flame-Retardant
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Specialty / Other
- Form / Function: Encapsulant / Potting Compound
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Supplier: TE Connectivity
Description: Material System : Two-Part Polyurethane Potting Resin Product Type : Casting Material Usage Conditions Flammability Performance : Flame-Retardant
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Specialty / Other
- Flame Retardant / UL 94V-0 Rated: Yes
- Form / Function: Encapsulant / Potting Compound
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Supplier: TE Connectivity
Description: Material System : Two-Part Polyurethane Potting Resin Product Type : Casting Material Usage Conditions Flammability Performance : Non-Flame-Retardant
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Specialty / Other
- Form / Function: Encapsulant / Potting Compound
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Encapsulants and Potting Compounds - Techsil® PU23930 Pearl Polyurethane Twinpack 250gm -- TEEP14087Supplier: Techsil Limited
Description: Techsil® PU23930 is a two-part, flexible, room temperature curing polyurethane resin designed for the potting and encapsulation of LED arrays and lighting equipment. Product Features Excellent long term UV stability Scratch and mark resistant Non-toxic High mechanical strength
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONATHANE EN-1556 Polyurethane Encapsulant is a two-component polyether-based system used as an encapsulating, molding, and potting compound. It is recommended for harness breakouts, watertight electrical connectors, cables, and cable end seals. It also offers
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 350 kV/in
- Elongation: 400 %
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONATHANE EN-2553 Polyurethane Encapsulant is a two-component polyurethane potting system. It is used for potting and encapsulation of electronic components, modules, and circuit boards. It also offers low stress cure for protection of sensitive
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 560 kV/in
- Elongation: 60 %
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONATHANE EN-2553 Polyurethane Encapsulant Blue is a two-component polyurethane potting system. It is used for potting and encapsulation of electronic components, circuit boards, and related devices. It offers low stress cure for protection of sensitive
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 560 kV/in
- Elongation: 60 %
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONATHANE EN-12 Polyurethane Encapsulant Amber is a two-component polyurethane system. It is used for cable and connector potting and molding. It offers thermal shock resistance, has superior hydrolytic stability, and a low dissipation factor. Part B, 1
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 600 kV/in
- Elongation: 350 %
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Supplier: Epoxies Etc...
Description: The 50-2150FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical properties. 50-2150 is a two part, non-mercury, flexible
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.3
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one to seven mix ratio by weight. The
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive, Electrical Insulation / Dielectric, EMI / RFI Shielding Material, ESD Control / Anti-static
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Henkel Corporation - Industrial
Description: Polyurethane black hardener that when mixed with the appropriate resin forms a low-shrinkage, low-exotherm potting compound. LOCTITE® UK 3182 is a black polyurethane resin that when mixed with LOCTITE UK 3173 polyurethane resin forms a low-shrinkage, low-exotherm
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
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Supplier: Protavic America, Inc.
Description: The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit boards. When applied in thin layers, < 0.01� it acts as an adhesive and provides excellent thermal contact between dissimilar
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: GS Polymers, Inc.
Description: Two part, 1:2 cost-effective general purpose potting system
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Form / Function: Encapsulant / Potting Compound
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Supplier: RS Components, Ltd.
Description: Two Part high performance polyurethane. Formulated for potting and encapsulating. Good Electrical Properties. Excellent Adhesion. Low Water Absorption. Flame Retardant. Contains No Halogens. Low mixed system viscosity. Non Toxic. Long pot life Product Material =
- Form / Function: Specialty / Other, Encapsulant / Potting Compound
- Thermal Conductivity: 0.4500 W/m-K
- Use Temperature: -40 to 266 F
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30-D10 is a uniquely versatile two component, abrasion resistant elastomer featuring superior strength, toughness and chemical resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins
- Coeff. of Thermal Expansion (CTE): 50 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Strength: Over 400 kV/in
- Dissimilar Substrates: Yes
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Supplier: GS Polymers, Inc.
Description: Two part, 2:1 optically clear hard
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Rubber Based / Elastomeric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dissimilar Substrates: Yes
- Features: Encapsulating / Potting Compound
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Supplier: ELANTAS North America LLC
Description: wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 75 to 156 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric
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Supplier: ACCRAbond, Inc.
Description: CONATHANE® CE-1164 is a single-component, air drying, room temperature curing, polyurethane conformal coating which meets the requirements of MIL-I-46058-C for Type UR coatings and appears on the Qualified Products List (QPL).
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Single Component System
- Form / Function: Conformal / Encapsulating Coating
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Supplier: Henkel Corporation - Electronics
Description: HYSOL US1150 is an extended polybutadiene/MDI base, mineral filled, medium hardness, ambient cure urethane encapsulant/sealant. This material can be used for potting electronics or devices for protection against environmental hazards. It exhibits very little hardness increase when cooled
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Sauereisen, Inc.
Description: Sauereisen Universal Block Filler No. 509 is a moist-cured urethane formulation specifically designed to fill small voids, irregularities, and air pockets in concrete. No. 509 provides a smooth surface prior to application of vinyl ester and urethane protective barriers.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Unfilled
- Cure Type / Technology: Two Component System
- Industry Applications: Other
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runaway and provide protection from moisture, debris, vibration and shock for electronic components and EV battery packs. CHT’s silicone foam is also ideal where low smoke, flame and toxicity are required. CHT’s SilSo Lite 21025 is a two-part, room temperature platinum cure, self (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
Well suited for large potting and encapsulation applications, Master Bond EP29LPAO is a cost effective, two part system with a low viscosity, excellent flow properties and heat dissipation properties. Featuring convenient processing, this epoxy has a forgiving 100 to 50 mix ratio by weight and a (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
Master Bond EP30LP-2 is an optically clear epoxy with superb light transmission properties. This low viscosity, electrical insulator also features outstanding dimensional stability. Featuring easy handling, this compound has a convenient two to one mix ratio by weight or (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
EP41S-5ND Black Master Bond EP41S-5ND Black is a two part epoxy system for bonding, sealing and coating with a forgiving 100 to 25 mix ratio by weight. EP41S-5ND Black will cure at room temperature or more rapidly at elevated (read more)
Browse Electrical and Electronic Resins Datasheets for Master Bond, Inc. -
controllers, drive systems, and power units. Thermal potting adhesives are typically two-component composite materials based on silicone, epoxy, or polyurethane resins, filled with high thermal conductivity powders. These materials offer excellent (read more)
Browse Silicone Adhesives and Sealants Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
hardener, to produce a two-component polyurethane adhesive used for dry lamination, such as PET/Al/CPP, PET/Ny/Al/CPP, PET/Al/Ny/CPP, PET/Ny/CPP or Ny/CPP. TAKELAC A-670A Solvent free adhesive TAKELAC A-670A is a polyester polyol, offering several of the same benefits as (read more)
Browse Polyurethane Adhesives and Sealants Datasheets for Mitsui Chemicals America, Inc. -
-component polyurethanes that assure consistent cure and performance even in small “shot-size” potting applications (Bectron® PK materials). Dielectric gels that provide outstanding electronic protection with very low stress on (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
Supreme 11ANHT-2 Two component epoxy compound for bonding, coating and sealing Master Bond Supreme 11ANHT-2 is a two component thermally conductive, electrically insulating epoxy resin system for bonding, coating and (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
latter property is particularly useful in potting and encapsulation applications. Also, the compound allows for precise alignment with minimal fixturing and simple curing. Its service temperature range is from 4K to +300°F. The color of Part A is light cream and Part B is similar, but slightly darker (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
influenced by the proportion and type of chemicals used. Variations in chemical formulation can affect potential health risks, making it critical to understand the type of foam used in a home or workplace. There are two types of polyurethane foam: rigid and flexible (read more)
Browse Foams and Foam Materials Datasheets for General Plastics Manufacturing Co.
Conduct Research Top
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Dielectric Materials for Use in Radomes
low dielectric constants, useful in radio and microwave frequencies. This makes them ideal for applications such as in conformal antennas, where the material must be applied around a radius. Microelectronics - Non-foamed polyurethanes are often used as "potting compounds" in electronics, where
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http://waset.org/publications/9088/a-feasibility-study-of-a-micro-communications-sonobuoy-deployable-by-uav-robots
The transducers were then encapsulated with a two part polyurethane potting compound to prevent contact with any conductive fluids as shown in Figure 1.
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International Astronautical Congress (IAF) > Bone Proteomics experiment (BOP): the first proteomic analysis of mammalian cells cultured in weightlessness condi...
Dow Corning Silastic Medical Adhesive Sylicon type A, Dow Corning Medical grade two - parts Polyurethane Potting Compound , commercial vaseline and Vitton didn’t induce any morphological change up to one week of direct contact with the medium in which the cells were grown.
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Hardware development for the Bone Proteomics experiment
The Teflon membrane (Biofolie) was installed with Viton O-rings as well as a bio- compatible adhesive (Dow Corning Medical-grade two - parts Polyurethane Potting Compound ).
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Polymers for Electricity and Electronics: Materials Properties and Applications
The systems for potting and conformal coating include the following: one- and two - part silicones, one- or two-part polyurethanes , epoxies, acrylics, and thermosetting esters. The curing of the potting compounds almost always is based on chemical reactions.
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http://repositories.lib.utexas.edu/bitstream/handle/2152/ETD-UT-2011-08-4257/MORGAN-THESIS.pdf?sequence=1
Two part polyurethane potting compounds provide excellent water proofing, abrasion resistance, and acoustic properties.
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http://qspace.library.queensu.ca/jspui/bitstream/1974/12225/1/Walker_Matthew_201405_MSc.pdf
Finally, the space between the central polyethylene and outer polyurethane jacket is filled with a two - part potting compound in order to mechanically support the um- .
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Electrical insulating varnishes: an overview
Solventlesselectricalinsulating varnishes arean out- growth of compounds that are used in encapsulation, casting, and potting applications. The compounds, usually an unsaturated polyester, epoxy, or polyurethane , are packaged in two parts .