Two Part Polyurethane Potting Compounds

Description: This thermally conductive polyurethane encapsulation and potting compound is a two-part system with a black finish. Product Overview UR5097 Thermally Conductive Polyurethane Potting Compound exhibits excellent thermal conductivity, making it

• Type: Electrically Conductive
• Features: Electronics, Encapsulating / Potting, Flame Retardant (e.g. UL 94 Rated), Thermal Compound / Heat Conductive
• Chemical System: Polyurethane (PU, PUR)
• Industry: Semiconductors / IC Packaging

Description: High-performance polyurethane potting and encapsulation compound suitable for a wide range of applications. Product Overview UR5604 is a general-purpose two-part polyurethane potting compound designed for potting and encapsulation. This

• Features: Electronics, Encapsulating / Potting, Flame Retardant (e.g. UL 94 Rated)
• Chemical System: Polyurethane (PU, PUR)
• Industry: Semiconductors / IC Packaging
• Cure / Technology: Two Component System

Description: Specialist resin with environmental protection for LEDs and PCBs, preserving optical clarity and color after prolonged UV exposure. Product Overview UR5634 Optically Clear Polyurethane LED Potting Compound is a two-part, semi-rigid polyurethane resin. It is

• Features: Electronics, Encapsulating / Potting
• Type: Optical Grade / Material
• Chemical System: Polyurethane (PU, PUR)
• Industry: Semiconductors / IC Packaging

Description: 2-part, yellowish, polyurethane-based casting resin, NSF approved, formulated especially for spiral wound filters (RO) and application to dry substrates. Two component polyurethane adhesive. Macroplast® UK 178A with 178B is a 100% solids, room temperature curing

• Features: Leveling / Filling Compound, Other
• Chemical System: Polyurethane (PU, PUR)
• Cure / Technology: Two Component System

Description: characteristics to various substrates and are extremely moisture insensitive, making them useful for wet potting. A few of the most common applications are: medical devices & parts, and filtration & ultrafiltration potting and sealing compounds. Filter-bond™ E-3568 E-3568

• Viscosity: 43,000 to 57,000 cP
• Features: Encapsulating / Potting Compound, Medical / Food (Sanitary / FDA)
• Chemical System: Polyurethane (PU, PUR), Rubber Based / Elastomeric
• Cure / Technology: Two Component System

Description: Techsil® VT2420LV is a crystal clear two-part, low viscosity room temperature curing polyurethane resin with high shore hardness. VT2420LV offers excellent outdoor weathering properties, due to the incorporation of both UV resistant base materials and the addition of UV

• Industry: Electronics (PCB / SMT Assembly)
• Features: Encapsulant / Potting Compound
• Chemical System: Polyurethane (PU, PUR)

Description: ELANTAS PDG CONATHANE EN-1556 Polyurethane Encapsulant is a two-component polyether-based system used as an encapsulating, molding, and potting compound. It is recommended for harness breakouts, watertight electrical connectors, cables, and cable end seals. It also offers

• Viscosity: 10,040 to 18,000 cP
• Tensile Strength (Break): 1,400 to 5,000 psi
• Elongation: 400 %
• Dielectric Strength: 350 kV/in

Description: ELANTAS PDG CONATHANE EN-2553 Polyurethane Encapsulant is a two-component polyurethane potting system. It is used for potting and encapsulation of electronic components, modules, and circuit boards. It also offers low stress cure for protection of sensitive

• Viscosity: 300 cP
• Tensile Strength (Break): 1,050 psi
• Elongation: 60 %
• Dielectric Strength: 560 kV/in

Description: ELANTAS PDG CONATHANE EN-12 Polyurethane Encapsulant Amber is a two-component polyurethane system. It is used for cable and connector potting and molding. It offers thermal shock resistance, has superior hydrolytic stability, and a low dissipation factor. Part B, 1

• Viscosity: 6,000 cP
• Tensile Strength (Break): 400 psi
• Elongation: 350 %
• Dielectric Strength: 600 kV/in

Description: ELANTAS PDG CONATHANE EN-9 Polyurethane Encapsulant is a two-component polyurethane system used for cable and connector potting and molding. It has superior hydrolytic stability, thermal shock resistance, high dielectric strength, and a low dissipation factor. Part

• Viscosity: 6,800 cP
• Tensile Strength (Break): 2,000 psi
• Elongation: 450 %
• Dielectric Strength: 750 kV/in

Description: Can Product Volume (L) : 4.03 Product Availability Product Availability : Europe, Middle East & Africa, Americas, China, Asia, Australia, New Zealand & Pacific Islands Product Type Features Material System : Two-Part Polyurethane Potting Resin Product Type : Casting

• Features: Encapsulant / Potting Compound, Specialty / Other
• Chemical System: Polyurethane (PU, PUR)

Description: Techsil® PU23930 is a two-part, flexible, room temperature curing polyurethane resin designed for the potting and encapsulation of LED arrays and lighting equipment. Product Features Excellent long term UV stability Scratch and mark resistant Non-toxic High mechanical

• Industry: Electronics (PCB / SMT Assembly)
• Features: Encapsulant / Potting Compound
• Chemical System: Polyurethane (PU, PUR)

Description: The 50-2150FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical properties. 50-2150 is a two part, non-mercury, flexible

• Viscosity: 7,000 cP
• Use Temperature: -58 to 266 F
• Thermal Conductivity: 1.1538232 W/m-K
• Tensile Strength (Break): 1,500 psi

Description: A durable two-part polyurethane encapsulation resin developed for electrical components exposed to extreme conditions. Product Overview UR5645 High Performance Polyurethane Resin has been specially developed for the encapsulation and potting of electronics, such as

• Use Temperature: 320 F
• Industry: Automotive, Semiconductors / IC Packaging
• Features: Electronics, Encapsulating / Potting, Marine
• Chemical System: Polyurethane (PU, PUR)

Description: Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one to seven mix ratio by weight. The

• Viscosity: 120,000 cP
• Use Temperature: -100 to 250 F
• Thermal Conductivity: 0.288 to 0.432 W/m-K
• Tensile Strength (Break): 1,000 psi

Description: to thermal cycling and chemicals including water, inorganic salts, alkalis and acids. It has an exceptionally wide service temperature range of 4K to 220°F. Adhesion to metals, concrete, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. Color of part A is clear,

• Viscosity: 100,000 cP
• Use Temperature: -60 to 250 F
• Coeff. of Thermal Expansion (CTE): 50 µin/in-F
• Tensile Strength (Break): 1,450 psi

Description: Rigid 2-part polyisocyanate urethane adhesive for use in fiber optic components. It is designed for flame resistance and fast cure. LOCTITE® UK 3364™ is a black, rigid 2-part polyisocyanate urethane adhesive for use in fiber optic components. It is designed for flame resistance and

• Viscosity: 1,500 cP
• Use Temperature: 200 to 240 F
• Chemical System: Polyurethane (PU, PUR)
• Cure / Technology: Two Component System

Description: The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit boards. When applied in thin layers, < 0.01� it acts as an adhesive and provides excellent thermal contact between dissimilar

• Viscosity: 70,000 cP
• Use Temperature: -55 to 125 F
• Dielectric Constant (Relative Permittivity): 8.27 to 8.46
• Features: Ceramic / Glass, Electrical Insulation / Dielectric Material, Electrical Power / HV, Electronics, Encapsulanting / Potting, Filled / Reinforced, Flame Retardant (e.g. UL 94 Rated), Flexible / Dampening, Liquid, Metal, Paper / Paperboard, Plastic, UL Approved

Description: Master Bond Polymer System EP30D-7 is a versatile two component flexible epoxy featuring superior strength, toughness and abrasion resistance for high performance bonding, sealing, coating, potting and encapsulation applications. It contains the recognized advantageous performance

• Use Temperature: -60 to 250 F
• Coeff. of Thermal Expansion (CTE): 22 µin/in-F
• Tensile Strength (Break): 1,500 psi
• Elongation: 300 %

Description: enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Viscosity: 3,000 to 5,000 cP
• Use Temperature: 266 F
• Thermal Conductivity: 0.53 to 0.63 W/m-K
• Coeff. of Thermal Expansion (CTE): 30.555555555555554 to 88.88888888888889 µin/in-F

Description: coatings and potting solutions tailored for the smart meter market. Our advanced materials are designed to encapsulate and protect electronic components, defending them from moisture, contaminants, and the rigors of daily operations. This ensures that smart meters, whether monitoring electric

• Viscosity: 6,000 cP
• Industry: Aerospace, Electronics (PCB / SMT Assembly), Military / Government (MIL-SPEC / GG)
• Features: Encapsulant / Potting Compound, Liquid
• Chemical System: Polyurethane (PU, PUR)

Description: RS PRO ERUR5640RP250G Potting Compound

• Features: Encapsulating / Potting Compound, Specialty / Other
• Chemical System: Polyurethane (PU, PUR)

Description: Urethane Clear 250ml

• Form / Function: Conformal / Encapsulating Coating
• Features: Other, Specialty / Other, Tooling / Mold Material
• Chemical System: Polyurethane (PU, PUR)

Description: UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an

• Viscosity: 5,000 cP
• Features: Ceramic / Glass, Dissimilar Substrates, Elastomeric, Electronics, Encapsulanting / Potting, Flexible / Dampening, Gap Filling Sealant / FIP Gasket, Liquid, Metal, UV / Radiation Cured (EB, Light)
• Form / Function: Die Bonding Adhesive / Compound
• Industry: OEM / Industrial

Description: (Known as Hysol ECCOCOAT UV7993 ) Solvent-free, one component dual cure conformal coating.

• Viscosity: 120 cP
• Use Temperature: -40 to 221 F
• Form / Function: Conformal / Encapsulating Coating
• Industry: Electronics (PCB / SMT Assembly)

Description: No Description Provided

• Features: Ceramic / Glass, Composites, Concrete / Masonry, Dissimilar Substrates, Encapsulanting / Potting, Metal, Paper / Paperboard, Porous Surfaces
• Form / Function: Die Bonding Adhesive / Compound
• Industry: OEM / Industrial
• Chemical System: Polyurethane (PU, PUR), Rubber Based / Elastomeric

Description: This series of polyurethane systems is engineered for electronic potting, encapsulating, and casting applications. They are low in viscosity, low in toxicity and available in the popular TriggerBond® dual barrel cartridge dispensing system. These elastomeric systems are suitable for a

• Viscosity: 1,500 to 2,200 cP
• Use Temperature: -22 to 257 F
• Thermal Conductivity: 0.297109474 W/m-K
• Coeff. of Thermal Expansion (CTE): 116.66666666666666 µin/in-F

Description: (Known as Hysol ECCOCOAT PC355-1 ) LOCTITE STYCAST PC 355-1 is a lead-free, transparent, one-component protective varnish system that is dry to the touch in under 30 minutes.

• Viscosity: 300 cP
• Form / Function: Conformal / Encapsulating Coating
• Industry: Electronics (PCB / SMT Assembly)
• Chemical System: Polyurethane (PU, PUR)

Description: PNU-56200™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit

• Viscosity: 5,000 cP
• Use Temperature: -55 to 120 F
• Tensile Strength (Break): 2,000 psi
• Dielectric Constant (Relative Permittivity): 4.41 to 4.63

Description: UV Cure 60-7158 is a UV Curable Epoxy Adhesive formulated to bond rigid substrates. This adhesive bonds extremely well to aluminum while also providing good water and chemical resistance. UV Cure 60-7158 is a semi-rigid adhesive and it is well suited for bonding rigid substrates. It is thixotropic

• Viscosity: 20,000 cP
• Use Temperature: -58 to 311 F
• Tensile Strength (Break): 3,800 psi
• Features: Ceramic / Glass, Encapsulanting / Potting, Metal, Plastic

Description: PNU-46202™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit

• Viscosity: 8,000 cP
• Use Temperature: -55 to 120 F
• Tensile Strength (Break): 2,000 psi
• Dielectric Constant (Relative Permittivity): 4.41 to 4.63

Description: (Known as Hysol PC40-UM ) LOCTITE STYCAST PC 40-UM is a solvent-free, low-viscosity, rapid gel, UV-moisture cure one component conformal coating.

• Viscosity: 500 cP
• Form / Function: Conformal / Encapsulating Coating
• Industry: Electronics (PCB / SMT Assembly)
• Chemical System: Polyurethane (PU, PUR)

Description: (Known as Hysol US0154 ) Encapsulant potting urethane.

• Viscosity: 55 cP
• Coeff. of Thermal Expansion (CTE): 5.555555555555555 µin/in-F
• Elongation: 50 %
• Industry: Electronics (PCB / SMT Assembly)

Description: PNU-46203™ is an electronics grade, two-component polyurethane adhesive or encapsulant for high temperature resistance. PNU-46203™ is designed for the encapsulation by casting of completed circuit boards. Cured PNU-46203™ is expected to meet the flammability requirements of UL 94, V-0

• Viscosity: 15,000 cP
• Use Temperature: -55 to 125 F
• Dielectric Constant (Relative Permittivity): 6.89 to 7.01
• Features: Ceramic / Glass, Electrical Insulation / Dielectric Material, Electrical Power / HV, Electronics, Encapsulanting / Potting, Filled / Reinforced, Flame Retardant (e.g. UL 94 Rated), Flexible / Dampening, Liquid, Metal, Paper / Paperboard, Plastic