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Supplier: Protavic America, Inc.
Description: PNU 46220™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and bond
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light), Two Component System
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Supplier: Henkel Corporation - Industrial
Description: Rigid 2-part polyisocyanate urethane adhesive for use in fiber optic components. It is designed for flame resistance and fast cure. LOCTITE® UK 3364™ is a black, rigid 2-part polyisocyanate urethane adhesive for use in fiber optic components. It is designed for flame resistance and
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Use Temperature: 200 to 240 F
- Viscosity: 1500 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST US 0138, Urethane, Potting and Encapsulating, Extended polybutadiene/MDI base Sealant LOCTITE® STYCAST US 0138 is an extended polybutadiene/MDI base encapsulant/sealant formulated for potting electronics or devices for protection against environmental hazards. It
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Thermal Conductivity: 0.5600 W/m-K
- UL Approved: Yes
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST US 1195, Urethane, Potting and Encapsulating LOCTITE® STYCAST US 1195 is formulated for potting electronics or devices for protection against environmental hazards. This material exhibits high hardness compared to other urethane materials allowing improved durability
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 32.22 µin/in-F
- Cure Type / Technology: Two Component System
- Thermal Conductivity: 0.6700 W/m-K
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST US 0155, Urethane, Potting and Encapsulating LOCTITE® STYCAST US 0155 is a low viscosity, flexible, flame retardant, castor oil/MDI based urethane potting/encapsulatin g compound. This material was designed for potting indoor and outdoor telephone connector
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 60.56 µin/in-F
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
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Supplier: Ellsworth Adhesives
Description: Resin Designs 51606MV Urethane Encapsulant Clear is a two component, room temperature curing polyurethane that is used for encapsulation and potting applications. It is high performance and moisture resistant. 2:1 mix ratio by volume. 50 mL Mixpac.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 400 kV/in
- Elongation: 200 %
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Supplier: Protavic America, Inc.
Description: PNU-46203™ is an electronics grade, two-component polyurethane adhesive or encapsulant for high temperature resistance. PNU-46203™ is designed for the encapsulation by casting of completed circuit boards. Cured PNU-46203™ is expected to meet the flammability requirements of UL
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Ellsworth Adhesives
Description: ResinLab UR3001HP2 Urethane Encapsulant Clear is a two component, room temperature curing, unfilled, urethane encapsulating system that is used for bonding plastics, metals, and assemblies. It is very flexible, low viscosity, good penetration, and moisture resistance. Pot life:
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 371 kV/in
- Elongation: 50 %
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Supplier: Ellsworth Adhesives
Description: ResinLab UR6001 Urethane Encapsulant Black is a two component, room temperature curing resin that is used for side by side cartridges as well as bulk meter mix dispense equipment. Flame retardant and has a vertical burn rating of V-0 at 3mm thickness. Part A, 1 gal Pail.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 350 kV/in
- Elongation: 15 %
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Supplier: Ellsworth Adhesives
Description: Resin Designs 64-50P Urethane Encapsulant is a two component, room temperature curing polyurethane that is used for encapsulation and potting applications. It is flexible, high performance, and has excellent moisture resistance. 1:2 mix ratio by volume. 50 mL Cartridge.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 400 kV/in
- Elongation: 250 %
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Supplier: Epoxies Etc...
Description: 20-2100 is a high performance two component flexible urethane system. This easy to use polyurethane is very low in viscosity and ideal for potting or encapsulating delicate electronic components. 20-2100 exhibits very low shrinkage, stress, and exotherm throughout the cure cycle. This system
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 83.33 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
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Supplier: Protavic America, Inc.
Description: PNU-46202™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and bond
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Protavic America, Inc.
Description: The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit boards. When applied in thin layers, < 0.01� it acts as an adhesive and provides excellent thermal contact between dissimilar materials such as
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Epoxies Etc...
Description: 70-2170 is a liquid, low viscosity, urethane resin formulated for casting dimensionally stable parts. Parts cast with 70-2170 have an ABS feel and appearance. 70-2170 is mercury free and does not contain TDI or MbOCA. It’s low shrinkage and low viscosity allow for the production of precision
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Elongation: 6 %
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
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Supplier: Techsil Limited
Description: MG Chemicals 4223 Urethane Conformal Coating offers a highly chemical-resistant finish that meets UL standards for indoor conformal coatings. This PU protects electric circuits against corrosive chemicals, moisture, dirt, dust, thermal shocks and scratches, alongside is also insulates against
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Conformal / Encapsulating Coating
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Supplier: DigiKey
Description: BLACK FLEXIBLE URETHANE POTTING
- Form / Function: Encapsulant / Potting Compound
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Supplier: DigiKey
Description: HIGH TEMPERATURE RIGID URETHANE
- Form / Function: Encapsulant / Potting Compound
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Supplier: Epoxies Etc...
Description: 20-3235 is a low viscosity urethane modified epoxy adhesive and potting compound.
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Epoxy (EP)
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Strength: 450 kV/in
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Supplier: DigiKey
Description: BLACK RIGID URETHANE POTTING COM
- Form / Function: Encapsulant / Potting Compound
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Supplier: Epoxies Etc...
Description: This two component urethane is a low durometer (45 Shore A), potting, casting, and encapsulating compound. It is an unfilled material engineered to provide excellent hydrolytic stability and low moisture permeability. It has outstanding thermal cycling properties, a low glass transition
- Chemical / Polymer System Type: Specialty / Other
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 4.5
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Supplier: Henkel Corporation - Electronics
Description: Encapsulant potting urethane.
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System UV21 is an easy to use one component UV curable urethane elastomer compound. It has been used for bonding, sealing, casting and formed in place high performance seals and gaskets. The UV21 is a solvent free system and has an excellent six month shelf life at ambient
- Coeff. of Thermal Expansion (CTE): Over 83 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
- Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light), Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors), Optoelectronics / Photonics, Semiconductors / IC Packaging
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Supplier: Sauereisen, Inc.
Description: Sauereisen Universal Block Filler No. 509 is a moist-cured urethane formulation specifically designed to fill small voids, irregularities, and air pockets in concrete. No. 509 provides a smooth surface prior to application of vinyl ester and urethane protective barriers.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Unfilled
- Cure Type / Technology: Two Component System
- Industry Applications: Other
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Supplier: RS Components, Ltd.
Description: The Techspray Fine-L-Kote Urethane conforming coating that has been designed for chemical, moisture and abrasion protection of your PCBs. The conforming coating has a UV indicator for black light QC inspection. Package Size = 12 oz Package Type = Aerosol Material = Urethane Colour =
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Form / Function: Specialty / Other, Conformal / Encapsulating Coating
- Use Temperature: 248 F
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Supplier: Henkel Corporation - Electronics
Description: (Known as Hysol US0154 ) Encapsulant potting urethane.
- Coeff. of Thermal Expansion (CTE): 5.56 µin/in-F
- Compound Type: Encapsulating / Potting
- Elongation: 50 %
- Industry: Electronics
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Supplier: Sonic-Shield
Description: “line of defense” against unwanted noise. Easy to handle and relatively lightweight, Sonic-Fiber is a semi-flexible non-asbestos mineral wool that provides greater sound attenuation than fiberglass bats or urethane foam. Sonic-Fiber is naturally hydrophobic (repels water), fire resistant
- Noise Reduction Coefficient (if applicable): 1.18 NRC
- Product Description: Other
- Thickness: 2 to 4 inch
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YOUR PARTNER FOR CUSTOM PACKAGING KitPackers is a premier packager of one and two component industrial chemicals including adhesives, sealants, coatings, encapsulants, lubricants, greases, cleaners, primers, and a variety of other specialty chemicals. We specialize in (read more)
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from harsh conditions such as humidity, extreme temperatures, mechanical loads, vibration and corrosive chemicals. The ELANTAS family of conformal coatings, potting resins and encapsulants is specially formulated to provide optimum protection and (read more)
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resins and encapsulants is specially formulated to provide optimum protection and dielectric integrity for today’s high performance modules. Bectron®and ELAN-Tron®products have been used in a (read more)
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http://repositories.lib.utexas.edu/bitstream/handle/2152/ETD-UT-2011-08-4257/MORGAN-THESIS.pdf?sequence=1
… Converter.............................................................................35 3.1.3 DSP 36 3.1.4 Transceiver..................................................................................37 3.1.5 Power Supplies............................................................................38 3.1.6 Prototype Node Version 1...........................................................39 3.1.7 Prototype Node Version 2...........................................................41 3.2 Urethane Encapsulation ..........................................................................44 3.3 Array …
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"UV curable urethane encapsulant for ceramic chip carriers" by John W. Wilson
UV curable urethane encapsulant for ceramic chip carriers .
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An Overview of High Reliability Transformer Encapsulation Materials
To provide high reliability components that will survive a variety of environments, SNL has developed epoxy and urethane encapsulation formulations.
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Epoxy Foam Encapsulants: Processing and Dielectric Characterization
of the dielectric characteristics of epoxy and urethane encapsulant foams found no significant differences between .
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Trends and developments in Automotive Glass Encapsulation with PUR materials
Due to its low viscosity and low temperature the Poly- URETHANE encapsulation technology seems most suited for these functional integrations.
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25th PolyMAC Conference, June 13-15, 1995
FOR THE URETHANE ENCAPSULANT .
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ES&H development activities for the W89 warhead
TDI Urethane Encapsulant TDI polyurethane encapsulant are used in the fmesetfor encapsulating areas to prevent high voltage breakdowns.
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A compact and inexpensive hydrophone with an internal ultra-low-noise preamp
The first simple calibration performed prior to the final urethane encapsulation involved mounting the MiniCan on a vibration exciter designed for calibrating small accelerometers [6].
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Epoxy encapsulation on ceramic quad flat packs (CQFPs)
[lo] J. W. Wilson, “UV curable urethane encapsulant for ceramic chip carriers,” in Proc. 44th Electronic Components & Technology Conf , 1994.
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Epoxy encapsulation on Ceramic Quad Flat Packs
W. Wilson, "UV Curable Urethane Encapsulant For Ceramic Chip Carriers," in Proceedings of the 44th Electronic Components & Technology Conference, 1994.