Products/Services for Wafer Board Siding
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Siding and Exterior Wall Coverings - (281 companies)Siding is used to cover the exterior of a building for protective and decorative purposes. These building products are made of a variety of materials. Choices include aluminum, brick, cedar, composite or engineering materials, fiber cement, steel...IndustryTypeFire Resistance -
Plywood - (92 companies)Plywood is a type of board made from thin sheets of wood. The layers are glued together, each with its grain at right angles to adjacent layers for greater strength. Plywood is made from logs that are cut into blocks between 8 and 10 feet long...
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Wafer Cassettes - (14 companies)Wafer cassettes are used to transport and store wafers during semiconductor manufacturing operations. They are designed to house or carry several wafers of the same size and are available in a range of materials to support specific applications...
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Board to Board Connectors - (259 companies)Board to board connectors are used to connect printed circuit boards (PCB). Each terminal connects to a PCB. Board to board connectors are used to connect printed circuit boards (PCB). Each terminal connects to a separate PCB. Board to board... -
Wafer Chucks - (22 companies)Wafer chucks are used to handle semiconductor wafers during wafer processing applications. Common work clamping technologies include vacuum and electrostatic. Wafer chucks handle or hold wafers or substrates during wafer processing applications...
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Wafer and Thin Film Instrumentation - (347 companies)Instruments such as quartz crystal microbalance (QCM) monitors, ellipsometers, RHEED systems, imaging stations, CD-SEMs, ion mills, C-V systems specifically designed for wafer metrology or in-situ monitoring of thin film parameters during thin film...
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Board Cameras - (34 companies)Board cameras, a.k.a. PCB cameras, are video cameras with image sensors mounted directly onto circuit boards. These devices are favored for their flexibility and comprehensiveness with a small footprint. These cameras are prominent in mobile devices...
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Board Mount Connectors - (295 companies)Board Mounted Connectors or Circuit Board Connectors are connectors that can be used as components embedded on a computer board. Single row connector. USB connector. Image Credit: Digi-Key Female wire-to-board connector. Image Credit: samtec. Board...
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Wire to Board Connectors - (205 companies)Description. Wire-to-board connectors are used to interconnect printed circuit boards (PCBs) by using connectors attached to wires. Specifications. Specifications for a wire to board connector include the following. Wire-entry angle...
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Single Board Computers (SBC) - (342 companies)Single board computers (SBC) serve as the motherboard for instrumentation systems including modern PCs. SBCs are composed of a microprocessor, memory chip, and serial and parallel interfaces to communicate with other devices. Processor or CPU type...
Product News
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Cosmic Equipment SpA
Wafer HV The FTI-1000 is designed for high-coverage wafer-level testing of semiconductor devices and wide-bandgap technologies, with strong suitability for multisite probe applications. FTI-1000 addresses the characterization needs of DC and AC parameters directly at wafer probe, supporting both engineering characterization and high-volume wafer testing. Thanks to its modular Tester-per-Channel Board architecture, users can configure independent resources into a single flexible and scalable platform... (read more)Browse Wafer and Thin Film Instrumentation Datasheets for Cosmic Equipment SpA -
MP Metal Products
B-123 Siding Starter Strip for Secure Installs B-123. 0.2" x 1.8", B-123 Pittsburgh lock starter strip. Starter Strip is a required accessory to start many siding installation jobs. Starter Strip is used at the bottom of each side of the home to lock the first course of siding in place. Typically the bottom of the starter strip (the part that the first bottom panel hooks on to) should be at least 1 in. below the top of the foundation, but the lower the siding is installed, the better. As a coil-based process, economical production... (read more) -
Micross Components, Inc.
Wafer Bumping & Wafer Level Packaging Wafer Bumping & WLP. Micross Advanced Interconnect Technology (Micross AIT) is home to one of the premier wafer bumping and wafer level packaging facilities in the U.S., with 20+ years of experience in developing and providing leading edge interconnect and integration technologies to customers around the world. We have the unique ability to support early stage development needs as well as low-to-mid volume production for more mature applications. Our ITAR Registered facility supports wafer... (read more) -
New Yorker Electronics Co., Inc.
Board to Board Socket The FPBBS-4 series from Major League Electronics is a compact, 0.4 mm pitch SMT socket designed to meet the demands of modern high-density board-to-board applications. Engineered for reliability and versatility, this series offers single- and dual-row configurations with 10 to 60 contacts per row. The sockets support stack heights from 0.057" (1.45 mm) to 0.156" (3.96 mm), making them an excellent choice for space-constrained environments in advanced electronics design. With optional alignment... (read more)Browse Edge Connectors Datasheets for New Yorker Electronics Co., Inc. -
Precision Polymer Engineering Ltd.
Wafer Handling Components PPE are experts in providing low contact force solutions for your wafer handling requirements. The PPE range of materials includes elastomers with both low and high coefficients of friction, to allow tailoring of wafer retention force. High purity elastomer materials, such as PPE's Perlast (R) (FFKM) and Kimura (HPE) grades, are widely utilized for wafer handling components, such as end-effector pads, as they prevent particulation due to their wholly organic nature. NEW - PPE will launching... (read more) -
Xiamen Innovacera Advanced Materials Co., Ltd.
Aluminum Nitride Wafer Substrates The Importance of Aluminum Nitride Wafer Substrates. Aluminum Nitride Wafer Substrates play an essential role in the semiconductor industry. One of the key reasons for their popularity is their thermal profile, which closely matches that of silicon. This similarity makes AIN substrates an excellent choice for semiconductor applications where thermal management is critical. Innovacera, a leading provider of these substrates, offers Aluminum Nitride Wafer Substrates in various diameters, ranging... (read more)Browse Specialty Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
Precision Polymer Engineering Ltd.
Wafer Handling Components Wafer handling components utilizing advanced dissipative elastomers to reduce electrostatic discharge damage. PPE has developed a range of dissipative elastomers specifically designed for use in semiconductor manufacturing applications. These materials do not contain any metal components and other incompatible and undesirable elements that can cause contamination. Semiconductor wafers and processes, by the nature of materials required, are conducive to creating charge imbalances. Electrostatic... (read more) -
Xiamen Unipretec Ceramic Technology Co., Ltd.
Precision Ceramic Wafer Chuck In advanced semiconductor production, unstable wafer positioning, thermal distortion, and contamination risks can directly impact yield, process repeatability, and device reliability --especially during lithography, plasma processing, and bonding steps. Manufactured from high-performance ceramics including Alumina (Al2O3), Silicon Carbide (SiC), and Silicon Nitride (Si3N4), this wafer chuck provides: High thermal stability to maintain flatness and dimensional accuracy under elevated... (read more)Browse Industrial Ceramic Materials Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
Fountyl Technologies Pte. Ltd.
Advanced Electrostatic Wafer Chuck Semiconductor fabrication faces critical challenges such as inconsistent wafer clamping, thermal non-uniformity, and compatibility issues with diverse materials like silicon, sapphire, and silicon carbide. Engineers often struggle with process instability, high defect rates, and costly equipment adjustments in ion implantation, etching, and thin-film deposition processes. Our electrostatic chucks deliver high-density, durable, and customizable solutions that address these challenges: Polymer... (read more)Browse Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
PI (Physik Instrumente) L.P.
Electro-Optical Wafer Probing PI Introduces Miniaturized Alignment Engine Platform for Scalable, Parallel E/O Wafer-Level Test. PI (Physik Instrumente) announced a new technology platform for electro-optical wafer-level testing designed to validate electrical and optical device functions simultaneously in high-volume production. The system combines high-density electrical probing with automated photonic alignment in a compact architecture built for ATE compatibility. Parallel Operation and Scalability. Designed... (read more)Browse Multi-axis Positioning Systems Datasheets for PI (Physik Instrumente) L.P.
More Information
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Building thermal envelope systems and materials (BTESM) progress report for DOE Office of Buildings Energy Research
The five materials includedvinyl-coveredgypsum board, asphalt-impregnatedkraft paper, wafer board siding with latex paint applied to the exterior surface,fuam core sheathing,and wood fiber board.
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Mechanical Behavior of Nailed Joints with Various Side Member Materials
Joints made with hardboard, OSB, particleboard, and wafer - board side members demonstrated a highly significant difference in stiffness as a function of whether the main member was Doug- las-fir or Engelmann spruce.
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Infrared / Microscopes
From a socket board to a 300 mm double- sided wafer prober, the PHEMOS-1000 flexibly corresponds to device environment and set-up.
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Infrared / Cameras / NIR / Wafer
From a socket board to a 300 mm double- sided wafer prober, the PHEMOS-1000 flexibly corresponds to device environment and set-up.
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Infrared / NIR / Hamamatsu Photonics K.K.
From a socket board to a 300 mm double- sided wafer prober, the PHEMOS-1000 flexibly corresponds to device environment and set-up.
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Infrared / Microscopes / NIR
From a socket board to a 300 mm double- sided wafer prober, the PHEMOS-1000 flexibly corresponds to device environment and set-up.
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NIR / Cameras
From a socket board to a 300 mm double- sided wafer prober, the PHEMOS-1000 flexibly corresponds to device environment and set-up.
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A compact self-shielding prober for accurate measurement of on-wafer electron devices
In the prober, a wafer and a wafer-stage are set in a very small shielded re- gion mainly enclosed by a plane top- board , a wafer -stage shield, and a side -wall shielding-ring.
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Electrical impedance tomography based sensors for semiconductor manufacturing
An edge board connector, which fits on one side of the wafer , is used to connect the electrodes, via the contact pads, to a data acquisition (DAQ) system.
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Pluggable Connectors for Josephson Computers
… nominally, 83.2 percent SiO,, 10.9 wt% B,Os, 2.54 wt% A&O,, and 2.21 wt% Na,O) [13], 1.5~pmthick, is deposited onto one side of each board half as the bonding agent Each wafer is then cleaved to …
