Products/Services for Wafer Goniometer
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Vacuum Manipulators - (53 companies)Vacuum manipulators include components for moving or positioning wafers or items in vacuum chambers or systems such as mounting devices, load locks, wobble sticks or wafer robots. Vacuum manipulators are used to move or position wafer or items... -
Rotary Stages - (134 companies)...or similar device. Cradle positioning stages or goniometers use an external axis of rotation. Instead of rotating around the center of the stage, these devices rotate around a point in space. By contrast, gimbal-mounted stages locate the axis of rotation... -
Wafer Cassettes - (14 companies)Wafer cassettes are used to transport and store wafers during semiconductor manufacturing operations. They are designed to house or carry several wafers of the same size and are available in a range of materials to support specific applications...
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Wafer Chucks - (22 companies)Wafer chucks are used to handle semiconductor wafers during wafer processing applications. Common work clamping technologies include vacuum and electrostatic. Wafer chucks handle or hold wafers or substrates during wafer processing applications...
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Wafer and Thin Film Instrumentation - (347 companies)Instruments such as quartz crystal microbalance (QCM) monitors, ellipsometers, RHEED systems, imaging stations, CD-SEMs, ion mills, C-V systems specifically designed for wafer metrology or in-situ monitoring of thin film parameters during thin film... -
Property Testing Equipment - (405 companies)Property testers are used to determine various physical properties of samples, including cloud point, distillation, flash point, freezing point, melting point, pour point, and vapor pressure.
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Semiconductor Cluster Tools - (58 companies)Semiconductor cluster tools and equipment are used to process semiconductor wafers for the production of microelectronic components. Semiconductor cluster tools process semiconductor wafers for the fabrication of microelectronic components...
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Semiconductor Metrology Instruments - (191 companies)Semiconductor metrology instruments are designed for wafer and thin film in-line inspection after semiconductor processing. They include capacitance gages, C-V systems, electron beam probes, ellipsometers, interferometers, I-V system, magnetometers...
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MEMS Devices - (66 companies)MEMS devices integrate mechanical components, electronics, sensors and actuators on a semiconductor material, chip, or wafer. MEMS devices integrate mechanical components, electronics, sensors, and actuators on a semiconductor material, chip...
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Sapphire Materials and Components - (105 companies)...properties. Applications include jewel bearings, lasing rods, wear parts, wafer substrates and optics. Manufacture and Growth. Single crystals of sapphire materials and sapphire components are manufactured or grown in melting and deposition processes...
Product News
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PI (Physik Instrumente) L.P.
L-886 Compact and Versatile Goniometer Motorized Precision Goniometers for Optics and Photonics Alignment. Physik Instrumente (PI), a global leader in precision motion control and nanopositioning solutions, introduces the L-886 Goniometer Family, a series of high-performance motorized units designed for precise angular positioning in demanding research and industrial environments. Engineered for accuracy, flexibility, and cost efficiency, the L-886 goniometer series provides a rotation range of up to 17 , combined with a payload... (read more)Browse Rotary Stages Datasheets for PI (Physik Instrumente) L.P. -
Cosmic Equipment SpA
Wafer HV The FTI-1000 is designed for high-coverage wafer-level testing of semiconductor devices and wide-bandgap technologies, with strong suitability for multisite probe applications. FTI-1000 addresses the characterization needs of DC and AC parameters directly at wafer probe, supporting both engineering characterization and high-volume wafer testing. Thanks to its modular Tester-per-Channel Board architecture, users can configure independent resources into a single flexible and scalable platform... (read more)Browse Wafer and Thin Film Instrumentation Datasheets for Cosmic Equipment SpA -
Micross Components, Inc.
Wafer Bumping & Wafer Level Packaging Wafer Bumping & WLP. Micross Advanced Interconnect Technology (Micross AIT) is home to one of the premier wafer bumping and wafer level packaging facilities in the U.S., with 20+ years of experience in developing and providing leading edge interconnect and integration technologies to customers around the world. We have the unique ability to support early stage development needs as well as low-to-mid volume production for more mature applications. Our ITAR Registered facility supports wafer... (read more) -
Precision Polymer Engineering Ltd.
Wafer Handling Components PPE are experts in providing low contact force solutions for your wafer handling requirements. The PPE range of materials includes elastomers with both low and high coefficients of friction, to allow tailoring of wafer retention force. High purity elastomer materials, such as PPE's Perlast (R) (FFKM) and Kimura (HPE) grades, are widely utilized for wafer handling components, such as end-effector pads, as they prevent particulation due to their wholly organic nature. NEW - PPE will launching... (read more) -
Xiamen Innovacera Advanced Materials Co., Ltd.
Aluminum Nitride Wafer Substrates The Importance of Aluminum Nitride Wafer Substrates. Aluminum Nitride Wafer Substrates play an essential role in the semiconductor industry. One of the key reasons for their popularity is their thermal profile, which closely matches that of silicon. This similarity makes AIN substrates an excellent choice for semiconductor applications where thermal management is critical. Innovacera, a leading provider of these substrates, offers Aluminum Nitride Wafer Substrates in various diameters, ranging... (read more)Browse Specialty Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
Precision Polymer Engineering Ltd.
Wafer Handling Components Wafer handling components utilizing advanced dissipative elastomers to reduce electrostatic discharge damage. PPE has developed a range of dissipative elastomers specifically designed for use in semiconductor manufacturing applications. These materials do not contain any metal components and other incompatible and undesirable elements that can cause contamination. Semiconductor wafers and processes, by the nature of materials required, are conducive to creating charge imbalances. Electrostatic... (read more) -
Xiamen Unipretec Ceramic Technology Co., Ltd.
Precision Ceramic Wafer Chuck In advanced semiconductor production, unstable wafer positioning, thermal distortion, and contamination risks can directly impact yield, process repeatability, and device reliability --especially during lithography, plasma processing, and bonding steps. Manufactured from high-performance ceramics including Alumina (Al2O3), Silicon Carbide (SiC), and Silicon Nitride (Si3N4), this wafer chuck provides: High thermal stability to maintain flatness and dimensional accuracy under elevated... (read more)Browse Industrial Ceramic Materials Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
Fountyl Technologies Pte. Ltd.
Advanced Electrostatic Wafer Chuck Semiconductor fabrication faces critical challenges such as inconsistent wafer clamping, thermal non-uniformity, and compatibility issues with diverse materials like silicon, sapphire, and silicon carbide. Engineers often struggle with process instability, high defect rates, and costly equipment adjustments in ion implantation, etching, and thin-film deposition processes. Our electrostatic chucks deliver high-density, durable, and customizable solutions that address these challenges: Polymer... (read more)Browse Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
PI (Physik Instrumente) L.P.
Electro-Optical Wafer Probing PI Introduces Miniaturized Alignment Engine Platform for Scalable, Parallel E/O Wafer-Level Test. PI (Physik Instrumente) announced a new technology platform for electro-optical wafer-level testing designed to validate electrical and optical device functions simultaneously in high-volume production. The system combines high-density electrical probing with automated photonic alignment in a compact architecture built for ATE compatibility. Parallel Operation and Scalability. Designed... (read more)Browse Multi-axis Positioning Systems Datasheets for PI (Physik Instrumente) L.P. -
3X Ceramic Parts Company Limited
Zirconia Ceramic Wafer Clamp Zirconia Ceramic Wafer Clamp for Semiconductor Industry. Zirconia ceramic wafer clamp is a kind of ceramic accessory commonly used in solar photovoltaic equipment, and it is also an important component applied in photovoltaic production equipment. The processing of ceramic top gear is very difficult, mainly because of material and structure. 1. Material reason. Zirconia ceramics have the characteristics of high hardness, high brittleness and low fracture toughness, which makes ceramics prone... (read more)Browse Zirconium Oxide and Zirconia Ceramics Datasheets for 3X Ceramic Parts Company Limited
More Information
Indicates content that may require registration and/or purchase.
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Advanced Tribometer for In Situ Studies of Friction, Wear, and Contact Condition—Advanced Tribometer for Friction and Wear Studies
An electrically insulating block on the cantilever (see figure 1) and an electrically insulating coupler on the drive shaft confined electric current to flow through the carbon brush, wafer holder/ goniometer , wafer , ball, ball holder, and metal block upon application of a…
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Fundamental Principles of Optical Lithography: The Science of Microfabrication
Contact angles can be easily measured on a primed wafer using a goniome- ter , and should be in the 50–70° range for good resist adhesion11 (see Figure 1.13).
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Thickness and density measurement for new materials with combined X-ray technique
One reason is the fact that whole- wafer compatible XRD goniometer is not supplied as a fab-tool.
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Handbook of Practical X-Ray Fluorescence Analysis
The 200 mm or 300 mm wafer sits at the center of the vacuum enclosure; two arrays of solid-state detectors approach sideways the line illuminated by the beam; an external goniometer rotates the wafer for mapping the complete surface.
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X-ray photoelectron spectroscopy, high-resolution X-ray diffraction and refractive index analyses of Ti-doped lithium niobate (Ti:LiNbO3 ) nonlinear optical si...
As-grown crystals were oriented in the z-axis direction (0 0 1) using X-ray go- niometer and several wafers of ≈0.7–1 mm thickness were sliced from the grown crystals.
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Formation of α ″ iron nitride in FeN martensite: Nitrogen vacancies, iron-atom displacements, and misfit-strain energy
For each annealing step, the specimen was removed from the wafer and care was taken to replace the specimen, after tempering, at its orig- inal position on the silicon wafer and on the goniometer .
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Silicon wafers with optically specular surfaces formed by chemical polishing
The peak is not at exactly 30° for every sample because it is challenging to place the wafer pieces on the goniometer with better than 1° precision.
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Using heavy ion backscattering spectrometry (HIBS) to solve integrated circuit manufacturing problems
After insertion, a wafer is attached to a four-axis in-situ goniometer , allowing the wafer to be positioned for measurement at arbitrary x and y coordinates and for channeling of the analysis beam to reduce multiple scattering background from silicon.
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Muon cooling and acceleration experiment at TRIUMF
A 3 mm Silicon crystal wafer is mounted on a goniometer table (appropriate orientation in two planes).
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UV/Ozone Cleaning For Organics Removal On Silicon Wafers
Contact angle goniometer measurements indicated that the wafer surface reached a value of 4° prior to the time that completed visual clean occurred.
