Products & Services
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Supplier: RobotWorx
Description: longer reach.bsp; This robot can easily be repositioned for inverse kinematics. By using the Motoman CR20, a flexible handling system can be achieved under high-level clean conditions.bsp; It is ISO Class 3 and is capable of wafer cassette handling and large LCD
- Load Capacity: 20 kg
- Number of Axes: 6 #
- Reach: 1658 mm
- Type: Articulated Robot
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Supplier: RobotWorx
Description: The Motoman CR3 Clean Robot is a six-axis vertically articulated robot made for cleanroom applications. The CR3 is Class 1 approved for the highest clean environmental conditions according to Federal standards. It has a wide freedom of movement for handling work.bsp; With 6
- Load Capacity: 3 kg
- Number of Axes: 6 #
- Reach: 694 mm
- Type: Articulated Robot
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Supplier: RobotWorx
Description: The six-axis SV3CR robot is designed for use in a Class 1 cleanroom environment and is suitable for wafer handling and interbay applications. It can also be used for wafer cassette handling, disk substrate, media handling, and flat panel display
- Features: Ceiling Mounted, Wall Mounted
- Load Capacity: 3 kg
- Number of Axes: 6 #
- Reach: 677 mm
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Supplier: CoorsTek
Description: End effectors, also referred to as semiconductor handling "blades", are the robot's hand to handle and move semiconductor wafers between positions. So end effectors must be dimensionally precise and thermally stable, while having a smooth, abrasion-resistant surface to
- Applications: Chemical / Materials Processing, Wear Parts / Tooling
- Shape / Form: Wafer Carrier / Holder
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Supplier: PTB Sales, Inc.
Description: Ask for current prices. Visit Genmark Automation for more information on these Axcelis tool wafer handling robots.
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Supplier: Filmetrics, Inc.
Description: -board baselining, an enclosed measurement stage with motion interlock, an industrial computer with pre-installed software, and the option to upgrade to fully robotic wafer handling. The different F60-t instruments are distinguished primarily by thickness and wavelength range.
- Applications: Semiconductor Wafers, CVD / PVD Films
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Mounting / Loading: In-situ / System Mounted
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Supplier: Filmetrics, Inc.
Description: include automatic notch finding, automatic on-board baselining, an enclosed measurement stage with motion interlock, an industrial computer with pre-installed software, and cassette-to-cassette robotic wafer handling. The different F60-c instruments are distinguished primarily
- Applications: Semiconductor Wafers, CVD / PVD Films
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Mounting / Loading: In-situ / System Mounted
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Supplier: PTB Sales, Inc.
Description: Ask for current price. The Brooks FabExpress (FX3000) is a atmospheric bridge system designed to simultaneously handle 200mm and 300mm wafers. The FX3000 is optimized with the Brooks Reliance robotics automation component set (robot and aligner) and the Brooks family of
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Supplier: PTB Sales, Inc.
Description: Ask for current prices. Visit Genmark Automation for more information on these Axcelis tool wafer handling robots.
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Supplier: PTB Sales, Inc.
Description: Ask for current price. The Brooks Gemini Express 5000 (GX5000) is a vacuum cluster tool integration platform for 200mm to 300mm wafers, with the capability for two load locks and three process facets. The GX5000 handles wafers without mechanical changes, and is ideally suited
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Supplier: SemiProbe
Description: is available for the PS4L including probe card holders, manipulators, manipulator arms and bases, probe tips, lasers, optics, CCTV systems, material handling (robotics for auto load), vibration isolation tables, dark boxes and much more.
- Applications: Semiconductor Wafers
- Form Factor: Wafer Probing System
- Maximum Wafer / Part Size: 300 mm
- Measurement Capability: Electrical Test - Parametric / In-line
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Supplier: SemiProbe
Description: accessories is available for the PS4L including probe card holders, manipulators, manipulator arms and bases, probe tips, lasers, optics, CCTV systems, material handling (robotics for auto load), vibration isolation tables, dark boxes and much more.
- Applications: Semiconductor Wafers
- Form Factor: Wafer Probing System
- Maximum Wafer / Part Size: 100 mm
- Measurement Capability: Electrical Test - Parametric / In-line
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Supplier: SemiProbe
Description: is available for the PS4L including probe card holders, manipulators, manipulator arms and bases, probe tips, lasers, optics, CCTV systems, material handling (robotics for auto load), vibration isolation tables, dark boxes and much more.
- Applications: Semiconductor Wafers
- Form Factor: Wafer Probing System
- Maximum Wafer / Part Size: 200 mm
- Measurement Capability: Electrical Test - Parametric / In-line
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Supplier: SemiProbe
Description: accessories is available for the PS4L including probe card holders, manipulators, manipulator arms and bases, probe tips, lasers, optics, CCTV systems, material handling (robotics for auto load), dark boxes and much more.
- Applications: Semiconductor Wafers
- Form Factor: Wafer Probing System
- Maximum Wafer / Part Size: 150 mm
- Measurement Capability: Electrical Test - Parametric / In-line
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Supplier: TSI Incorporated
Description: This fully automated particle deposition system deposits PSL and SiO2 spheres as small as 10 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom 300 mm and 200 mm calibration standards. Robotic
- Applications: Semiconductor Wafers, CVD / PVD Films
- Form Factor: Other
- Maximum Wafer / Part Size: 200 to 300 mm
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: TSI Incorporated
Description: This fully automated particle deposition system deposits PSL and SiO2 spheres as small as 20 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom 300 mm and 200 mm calibration standards. Robotic
- Applications: Semiconductor Wafers, CVD / PVD Films
- Form Factor: Other
- Maximum Wafer / Part Size: 200 to 300 mm
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: 3X Ceramic Parts Company Limited
Description: vacuum ceramic arm are used on the photovaltaic equipment , a left and a right ceramic arm used in conjunction, their funtion is to handling the wafer by air suction and move it . The hole and air slot on the plate was cnc machined , and the top plate and bottom plate combined together
- Compressive / Crushing Strength: 377096 psi
- Density: 3.9 g/cc
- Material Type: Alumina / Aluminum Oxide
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Supplier: Renbrandt, Inc.
Description: These couplings are especially designed for precision instruments. encoder drives. robotics. aircraft equipment. radar. laser. optical/mechanical devices. computers. precision remote controls. UNEQUALED PERFORMANCE. Some of the features are: Zero backlash. Low inertia. Handles offset
- Bore Diameter: 0.1200 to 0.1250 inch
- Coupling Diameter: 0.7500 inch
- Coupling Type: Wafer / Flexible Disc
- Rated Speed: 5000 rpm
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Supplier: Renbrandt, Inc.
Description: mm) These couplings are especially designed for precision instruments. encoder drives. robotics. aircraft equipment. radar. laser. optical/mechanical devices. computers. precision remote controls. UNEQUALED PERFORMANCE. Some of the features are: Zero backlash. Low inertia. Handles
- Bore Diameter: 0.1562 to 0.1850 inch
- Coupling Diameter: 1 inch
- Coupling Type: Wafer / Flexible Disc
- Rated Speed: 5000 rpm
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Supplier: Renbrandt, Inc.
Description: Inch (38.1 mm) These couplings are especially designed for precision instruments. encoder drives. robotics. aircraft equipment. radar. laser. optical/mechanical devices. computers. precision remote controls. UNEQUALED PERFORMANCE. Some of the features are: Zero backlash. Low inertia.
- Bore Diameter: 0.4531 to 0.4687 inch
- Coupling Diameter: 1.5 inch
- Coupling Type: Wafer / Flexible Disc
- Rated Speed: 5000 rpm
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Supplier: Renbrandt, Inc.
Description: OUTER DIAMETER 2 1/2 Inch (63.5 mm) These couplings are especially designed for precision instruments. encoder drives. robotics. aircraft equipment. radar. laser. optical/mechanical devices. computers. precision remote controls. UNEQUALED PERFORMANCE. Some of the features are: Zero backlash.
- Bore Diameter: 0.1875 to 0.9375 inch
- Coupling Diameter: 2.5 inch
- Coupling Type: Wafer / Flexible Disc
- Rated Torque: 240 In-lbs
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Supplier: Radwell International
Description: DISCONTINUED BY MANUFACTURER, SERVO POSITIONING CONTROLLER, WAFER HANDLING ROBOT CONTROLLER, 90-132 VAC, 47-66 HZ, 15 AMP/ 250 V. FREE 2 YEAR RADWELL WARRANTY
- Continuous Output Current: 15 amps
- Supply Voltage (AC): 132 volts
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Supplier: Precision Polymer Engineering Ltd.
Description: assembly and optimum friction to allow fast robotic handling. The PPE range of materials includes elastomers with both low and high coefficients of friction, to allow tailoring of wafer retention force. In addition, PPE offers dissipative end-effectors molded from unique
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Supplier: Broadcom Inc.
Description: scanners to servo and stepper motor feedback systems, robotic arms and wafer-handling machines. Avago also offers a wide range of accessories to complement its encoder products. These accessories include cables, connectors, code wheels and alignment tools. The company offers the
- Operating Temperature: -40 to 185 F
- Technology: Linear Encoder
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Supplier: RS Components, Ltd.
Description: . wafer-handling machines Encoder Technology = Incremental Maximum Revolutions = 30000rpm Output Signal Type = Digital Supply Voltage = 4.5 - 5.5 V dc Resolution = 1000 CPR Overall Height = 10.16mm Overall Width = 26.67mm Overall Depth = 11.71mm Minimum Operating Temperature = -40°C Maximum
- Diameter or Width: 1.05 inch
- Electrical Output and Interface: Other
- Maximum Mechanical Shaft Speed: 30000 rpm
- Operating Temperature: -40 to 212 F
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Supplier: RS Components, Ltd.
Description: . wafer-handling machines Encoder Technology = Incremental Maximum Revolutions = 30000rpm Output Signal Type = Digital Supply Voltage = 4.5 - 5.5 V dc Resolution = 1024 CPR Overall Height = 10.16mm Overall Width = 26.67mm Overall Depth = 11.71mm Minimum Operating Temperature = -40°C Maximum
- Diameter or Width: 1.05 inch
- Electrical Output and Interface: Other
- Maximum Mechanical Shaft Speed: 30000 rpm
- Operating Temperature: -40 to 212 F
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Supplier: RS Components, Ltd.
Description: . wafer-handling machines Encoder Technology = Incremental Output Signal Type = Digital Supply Voltage = 4.5 - 5.5 V dc Resolution = 500 CPR Overall Height = 10.16mm Overall Width = 26.67mm Overall Depth = 11.71mm Minimum Operating Temperature = -40°C Maximum Operating Temperature = +100°C
- Diameter or Width: 1.05 inch
- Electrical Output and Interface: Other
- Operating Temperature: -40 to 212 F
- Resolution (counts per revolution): 500 (counts/revolution)
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Supplier: RS Components, Ltd.
Description: . wafer-handling machines Encoder Technology = Incremental Maximum Revolutions = 30000rpm Output Signal Type = Digital Supply Voltage = 4.5 - 5.5 V dc Resolution = 256 CPR Overall Height = 10.16mm Overall Width = 26.67mm Overall Depth = 11.71mm Minimum Operating Temperature = -40°C Maximum
- Diameter or Width: 1.05 inch
- Electrical Output and Interface: Other
- Maximum Mechanical Shaft Speed: 30000 rpm
- Operating Temperature: -40 to 212 F
Find Suppliers by Category Top
Featured Products Top
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PPE are experts in providing low contact force solutions for your wafer handling requirements. The PPE range of materials includes elastomers with both low and high coefficients of friction, to allow tailoring of wafer retention force. High purity elastomer materials, such as PPE (read more)
Browse Rubber and Elastomer Molding Services Datasheets for Precision Polymer Engineering Ltd. -
features help engineers maintain process stability and yield. For advanced wafer handling or precision automation, contact us for custom ceramic solutions. Our (read more)
Browse Industrial Ceramic Materials Datasheets for Fountyl Technologies Pte. Ltd. -
Beyond semiconductor wafer handling, these high-performance end effectors are ideal for precision machining, medical robotics demanding biocompatibility, and chemical processing equipment operating in (read more)
Browse Aluminum Oxide and Alumina Ceramics Datasheets for Fountyl Technologies Pte. Ltd. -
INSACO Offers Wafer Carriers With or Without Multiple Holes INSACO, Inc has become recognized as a worldwide leader in custom machined ceramic and sapphire parts for the semiconductor industry. Through this experience (read more)
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Watch>> - Sapphire for GaAs, Indium Phosphide, & Other Semiconductors Sapphire Wafer Carriers (read more)
Browse Wafer Cassettes Datasheets for Insaco, Inc. -
Watch>> - Sapphire for GaAs, Indium Phosphide, & Other Semiconductors Sapphire Wafer Carriers (read more)
Browse Wafer Cassettes Datasheets for Insaco, Inc. -
High-Precision Alumina Ceramic End Effector Tailored for Semiconductor Wafer Handling This end effector is made from premium alumina ceramic, combining exceptional wear and (read more)
Browse Aluminum Oxide and Alumina Ceramics Datasheets for Fountyl Technologies Pte. Ltd. -
Designed for wafer transfer in semiconductor equipment Compatible with robotic arms and vacuum handling systems Supports 8-inch and (read more)
Browse Industrial Ceramic Materials Datasheets for Fountyl Technologies Pte. Ltd. -
Semiconductor Manufacturing: Precision wafer handling, pick-and-place, and assembly Reliable Performance for Engineers XJCSENSOR multi-axis force sensors help engineers achieve accurate motion control, optimize automation (read more)
Browse Six-axis Force and Torque Sensors Datasheets for XJCSENSOR Technology Co., Ltd. -
provide a rigid guiding baseline across high-end automated infrastructure layout configurations: Semiconductor Fabrication Machinery: Wafer handling end-effectors, metrology stages, and automated track platforms requiring high repeatability. Flat Panel (read more)
Browse Aluminum Oxide and Alumina Ceramics Datasheets for Fountyl Technologies Pte. Ltd.
Conduct Research Top
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Impact of Thermal Limits on Motor Performance
For semiconductor equipment, motors are essential components, and are used in various systems such as indexing (theta) tables and wafer-handling robots. Motor torque is extremely important, but to get higher torque, you need to apply higher current. As current increases, motor winding temperature
More Information Top
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Intelligent Robotics and Applications
In the paper “A Study of Magnetic Fluid Rotary Seals for Wafer Handling Robot ” [12], we analyzed the relationship of the seal pressure differential and the tooth parameters.
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Intelligent Robotics and Applications
Decoupling Control Based on Dynamic Model of 4-DOF Wafer Handling Robot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Wafer eccentricity estimation with disturbance caused by alignment notch
Index Terms—Alignment notch, wafer handling robot , semiconductor manufacturing, Dynamic wafer handling, robot calibration .
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机械工程学报
Key words: magnetic fluid, seals, coaxial twin-shaft, magnetic field, wafer handling robot .
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Wafer admission control for clustered photolithography tools
The output of the algorithm is suggested wafer entry times to the tool and is intended to be used by the wafer handling robot as a guideline.
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Scientific.Net: Materials Science
Home > Wafer Handling Robot .
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http://repositories.lib.utexas.edu/bitstream/handle/2152/21566/COSTUROS-DISSERTATION-2013.pdf?sequence=1
DC-bias to assess system degradation on a wafer handling robot .
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A Study of Topology Optimization Design for the Wafer Handling Robot Arm
• A Study of Topology Optimization Design for the Wafer Handling Robot Arm p.471 .
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Adept Technology Announces New Wafer Handling Robots for Semiconductor Automation Industry
Adept Technology Announces New Wafer Handling Robots for Semiconductor Automation Industry .
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A review of scheduling theory and methods for semiconductor manufacturing cluster tools
Cluster tools, which combine several single-wafer process- ing modules with wafer handling robots in a closed envi- ronment, have been increasingly used for most wafer fabri- cation processes.