Wafer Handling Robot

Description: The six-axis SV3CR robot is designed for use in a Class 1 cleanroom environment and is suitable for wafer handling and interbay applications. It can also be used for wafer cassette handling, disk substrate, media handling, and flat panel display

• Number of Axes: 6 #
• Load Capacity: 3 kg
• Reach: 677 mm
• Robot Type: Articulated Robot

Description: payload and longer reach.bsp; This robot can easily be repositioned for inverse kinematics. By using the Motoman CR20, a flexible handling system can be achieved under high-level clean conditions.bsp; It is ISO Class 3 and is capable of wafer cassette handling and large

• Number of Axes: 6 #
• Load Capacity: 20 kg
• Reach: 1,658 mm
• Robot Type: Articulated Robot

Description: The Motoman CR3 Clean Robot is a six-axis vertically articulated robot made for cleanroom applications. The CR3 is Class 1 approved for the highest clean environmental conditions according to Federal standards. It has a wide freedom of movement for handling work.bsp; With 6

• Number of Axes: 6 #
• Load Capacity: 3 kg
• Reach: 694 mm
• Robot Type: Articulated Robot

Description: End effectors, also referred to as semiconductor handling "blades", are the robot's hand to handle and move semiconductor wafers between positions. So end effectors must be dimensionally precise and thermally stable, while having a smooth, abrasion-resistant surface to safely

• Features: Alumina / Aluminum Oxide, Carbide Materials, Silica / Silicate Materials, Specialty Ceramic
• Specialty Ceramic Type: Aluminum Nitride, Quartz, Silicon Carbide, Yttria
• Applications: Chemical / Materials Processing, Wear Parts / Tooling
• Shape / Form: Wafer Carrier / Holder

Description: Ask for current prices. Visit Genmark Automation for more information on these Axcelis tool wafer handling robots.

Description: Ask for current prices. Visit Genmark Automation for more information on these Axcelis tool wafer handling robots.

Description: Alumina Ceramic Robot Arm F Type CNC machined The ceramic robot arm provided by our company is mainly divided into clamping type, bearing type and vacuum adsorption type. The sizes are 2 ", 4", 6 ", 8", 12 ", and non-standard sizes can be customized. The F-type left and right vacuum

• Density: 3.8999975386044725 g/cc
• Compressive / Crushing Strength: 377,095.7823287122 psi
• Material Type: Alumina / Aluminum Oxide

Description: PAVS6 is designed for use in cleanroom environments, making it ideal for handling delicate and sensitive components in the semiconductor and electronics industries. It is typically used in applications such as wafer handling, material transfer, and other similar tasks in the

• Number of Axes: 6 #
• Load Capacity: 7 kg
• Reach: 770 mm
• Industry / Application: Assembly, Inspection, Material Handling (e.g., Loading/Unloading, Palletizing)

Description: assembly, and inspection. The PP100 is designed for use in cleanroom environments, making it ideal for handling delicate and sensitive components in the semiconductor and electronics industries. It is typically used in applications such as wafer handling, material transfer, and

• Number of Axes: 6 #
• Load Capacity: 2 kg
• Reach: 663 mm
• Industry / Application: Assembly, Inspection, Material Handling (e.g., Loading/Unloading, Palletizing)

Description: This fully automated particle deposition system deposits PSL and SiO2 spheres as small as 20 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom 300 mm and 200 mm calibration standards. Robotic wafer

• Maximum Wafer / Part Size: 200 to 300.00000000000006 mm
• Applications: CVD / PVD Films, Semiconductor Wafers
• Mounting / Loading: Floor Mounted / Stand-alone
• Features: Other

Description: This fully automated particle deposition system deposits PSL and SiO2 spheres as small as 10 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom 300 mm and 200 mm calibration standards. Robotic wafer

• Maximum Wafer / Part Size: 200 to 300.00000000000006 mm
• Applications: CVD / PVD Films, Semiconductor Wafers
• Mounting / Loading: Floor Mounted / Stand-alone
• Features: Other

Description: DISCONTINUED BY MANUFACTURER, SERVO POSITIONING CONTROLLER, WAFER HANDLING ROBOT CONTROLLER, 90-132 VAC, 47-66 HZ, 15 AMP/ 250 V. FREE 2 YEAR RADWELL WARRANTY

• Continuous Output Current: 15 amps
• Supply Voltage (AC): 132 volts

Description: semiautomatic 150 mm system that meets their precise specifications and requirements. The Probe System for Life (PS4L) family of wafer probing systems is designed based on SemiProbe's patented adaptive architecture. Unlike traditional probe systems, all foundation modules - bases, stages,

• Maximum Wafer / Part Size: 150.00000000000003 mm
• Measurements: Electrical Test - Parametric / In-line
• Mounting / Loading: Manual Loading
• Technology: Optical / Imaging System

Description: High purity, Perlast® and Kimura® materials are widely used in wafer handling applications as end-effector pads because they provide optimized friction to maintain wafer positional accuracy, and prevent particulation due to their wholly organic nature. PPE are experts in

Description: These couplings are especially designed for precision instruments. encoder drives. robotics. aircraft equipment. radar. laser. optical/mechanical devices. computers. precision remote controls. UNEQUALED PERFORMANCE. Some of the features are: Zero backlash. Low inertia. Handles offset and angular

• Bore Diameter: 0.09 to 0.185 inch
• Coupling Diameter: 0.75 inch
• Rated Torque: 1.875 In-lbs
• Rated Speed: 5,000 rpm

Description: notch finding, automatic on-board baselining, an enclosed measurement stage with motion interlock, an industrial computer with pre-installed software, and cassette-to-cassette robotic wafer handling. The different F60-c instruments are distinguished primarily by thickness and

• Measurements: Area Mapping
• Applications: CVD / PVD Films, Semiconductor Wafers
• Mounting / Loading: In-situ / System Mounted
• Form Factor: Monitor / Instrument

Description: baselining, an enclosed measurement stage with motion interlock, an industrial computer with pre-installed software, and the option to upgrade to fully robotic wafer handling. The different F60-t instruments are distinguished primarily by thickness and wavelength range. Generally

• Measurements: Area Mapping
• Applications: CVD / PVD Films, Semiconductor Wafers
• Mounting / Loading: In-situ / System Mounted
• Form Factor: Monitor / Instrument

Description: servo and stepper motor feedback systems, robotic arms and wafer-handling machines. Avago also offers a wide range of accessories to complement its encoder products. These accessories include cables, connectors, code wheels and alignment tools. The company offers the industry encoder

• Operating Temperature: -40 to 185 F
• Features: Digital, Incremental, Optical, Signal Quadrature
• Sensor Technology: Linear Encoder

Description: dispense exact volumes of chemicals. They are essential for applications requiring precise recipe control, such as photoresist coating or wafer cleaning. By automating the dispense cycle, CDUs eliminate the variability and safety risks associated with manual handling. Semi & Fully

• Body Material: Stainless Steel