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  • AN102- Wave soldering and large multilayer ceramic capacitors
    Wave soldering was one of first production techniques for soldering surface mount. components, including multilayer ceramic capacitors (MLCCs), to assemblies. initially,. process problems such as inadequate preheat and excessive dwell time, and inferior ceramic capacitors [e.g. small voids
  • Wave Soldering vs. Reflow Soldering in PCB: Key Differences
    PCB manufacturers can choose between two primary forms of soldering - wave soldering or reflow soldering. Here are the key differences to keep in mind.
  • App Note: Guidelines for Pb-Free Soldering of Fairchild Components Based on JEDEC (R) J-STD 20D / IEC EN 61760-1:2006
    This app note presents Fairchild's recommendation for a starting point for SMT and wave solder profiles.
  • Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering
    This paper touches on identifying favorable flux properties, down-selecting low solids fluxes for lead-free selective wave soldering, the selective soldering process itself, and testing criteria. Topics reviewed will be the flux selection, optimizing the selective soldering process by varying
  • What is the Soldering Profile for Lead Free Solder?
    MOTIEN's converter is suitable for the PCB mountable operation and not suitable for Reflow / Vapor phase soldering like SMD products, the recommend is wave flow soldering.
  • Dispelling 10 Myths About Nitrogen Reflow
    In this paper, we will talk about reflow in an enclosed oven, although many of these discussions may pertain to wave soldering and even vacuum soldering.
  • SMT Adhesive Dispensing (.pdf)
    The adhesive dispensing process, can be defined as the process of transferring adhesive onto the PCB solder mask in a position suitable for holding the later placed components until the PCB is wave soldered. In some cases, this process is also used to hold heavy components in the second pass
  • Pin-in-Paste Application Note (.pdf)
    by hand or wave methods * Reduction in manufacturing floor space * Reduction in manufacturing equipment - consequently in investment cost * Compatible with the existing processes * Use of no-clean soldering process possible * Higher reliability at PC board level due to fewer soldering processes
  • Understanding Receptacle Carriers
    . The carrier assembly is placed into a corresponding group of holes on the circuit board, and the carrier holds the receptacles in position during the wave or reflow soldering cycle. The carrier is then removed after soldering, leaving behind a group of receptacles to be used as a socket for a leaded

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