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Supplier: Texas Instruments
Description: Single-Chip 2.4 GHz IEEE 802.15.4 Compliant and ZigBee? Ready RF Transceiver 48-VQFN -40 to 85
- Features: RoHS Compliant
- Device Type: Transceiver
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Supplier: Texas Instruments
Description: Second generation 2.4 GHz ZigBee/IEEE 802.15.4 RF transceiver 28-VQFN -40 to 125
- Operating Frequency: 2,400 MHz
- Data Rate: 250 kbps
- Bias / Operating Current: 18.5 mA
- TJ: -40 to 125 C
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Supplier: Skyworks Solutions, Inc.
Description: SiLabs's EM357 device. About the EM35x System-on-Chip (SoC) / Network Co-Processor (NCP) The EM351 and EM357 Ember® ZigBee chips are the industry’s leading ARM Cortex-M3 based family of ZigBee SoCs delivering unmatched performance, power consumption and code density in a
- Output Power( P1dB): 24 dBm
- Minimum Operating Voltage: 2 volts
- Maximum Operating Voltage: 3.6 volts
- Features: Other
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Supplier: Texas Instruments
Description: System-on-Chip Solution for IEEE 802.15.4 and ZigBee Applications 40-VQFN -40 to 125
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Supplier: Texas Instruments
Description: System-on-Chip Solution for 2.4 GHz IEEE 802.15.4 / ZigBee? 48-VQFN -40 to 85
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Supplier: Skyworks Solutions, Inc.
Description: The SKY66109-11 is a high-performance, fully integrated RF Front-End Module (FEM) designed for ZigBee®/Smart Energy applications. The SKY66109-11 is designed for ease of use and maximum flexibility. The device provides integrated and fully matched input baluns, an integrated interstage
- Output Power( P1dB): 21 dBm
- Minimum Operating Voltage: 2 volts
- Maximum Operating Voltage: 3.6 volts
- Features: Other
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Supplier: Rochester Electronics
Description: 2K SPI Serial EEPROM
- Memory Category: EEPROM
- Features: Other
- Package Type: SOP, SSOP, TSSOP
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Supplier: Win Source Electronics
Description: Manufacturer: ON Semiconductor Win Source Part Number: 865769-CAT24C04ZI-G Operating Temperature Range: -40°C ~ 85°C (TA) Features: EEPROM Memory IC 4Kb (512 x 8) I²C 400 kHz 900 ns 8-MSOP Package: Tube Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Mounting: Surface Mount Part Status: Obsolete
- Operating Temperature: -40 to 85 C
- Memory Category: EEPROM
- Features: Other
- Package Type: SOP, SSOP
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Supplier: Quarktwin Technology Ltd.
Description: EEPROM Memory IC 2Kbit SPI 8-MSOP
- Density: 2 kbits
- Operating Temperature: -40 to 85 C
- Memory Category: EEPROM
- Features: Full Production, Other, SPI
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Supplier: Lingto Electronic Limited
Description: IC EEPROM 2KBIT SPI 10MHZ 8MSOP
- Density: 2 kbits
- Memory Category: EEPROM
- Features: Other, SPI
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Supplier: Acme Chip Technology Co., Limited
Description: Second generation 2.4 GHz ZigBee/IEEE 802.15.4 wireless transceiver
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Description: IC EEPROM 2KBIT SPI 10MHZ 8MSOP
- Density: 2 kbits
- Cycle Time: 5,000,000 ns
- Memory Category: EEPROM
- Features: Full Production, Other, SPI
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: IC EEPROM 2KBIT SPI 10MHZ 8MSOP Product overview: CAT25020ZI-G from onsemi is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets,
- Cycle Time: 5,000,000 ns
- Operating Temperature: -40 to 85 C
- Memory Category: EEPROM
- Features: Other
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Description: IC EEPROM 4KBIT I2C 400KHZ 8MSOP
- Density: 4 kbits
- Data Rate: 0.4 MHz
- Access Time: 900 ns
- Operating Temperature: -40 to 85 C
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Supplier: Quarktwin Technology Ltd.
Description: Magnitude Comparator Bit Active High Output AB 16-PDIP
- Supply Voltage (VS): 3 to 18 volts
- Operating Temperature: -55 to 125 C
- Features: Comparators, Other
- Package Type: DIP
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Supplier: Lingto Electronic Limited
Description: TTL/CMOS TO CMOS TRANSLATOR, 6 F
- Device Type: Sensor Interface
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Supplier: Lingto Electronic Limited
Description: RS-232 TRANSCEIVER
- Device Type: Transceiver
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Supplier: Telit IoT Solutions, Inc.
Description: control, building automation, AMR, and telecom applications Pre-certified RF modules, LGA xE Form Factor, TTL RS232 interface Telit developed ZigBee PRO protocol (ZigBee Certified) and Telit Demo profile Telit developed Smart Energy 1.1 (IHD&ESI certified) and Home Automation profiles
- Operating Frequency: 2,400 to 2,483.5 MHz
- Data Rate: 9.6 to 115.2 kbps
- Bias / Operating Current: 26 to 35 mA
- TJ: -40 to 85 C
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Supplier: DigiKey
Description: IC RF TxRx + MCU 802.15.4, Bluetooth Bluetooth v4.1, ZigBee 2.4GHz 64-VFLGA
- Operating Frequency: 2,400 MHz
- Data Rate: 1,000 kbps
- Bias / Operating Current: 6.5 to 15.4 mA
- TJ: -40 to 85 C
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Supplier: TOP-electronics USA
Description: nanotron MN03SWBLE, swarm bee LE v3 module Embedded 2.4 GHz Chirp Radio Location Awareness and Concurrent Wireless Communication swarm bee LE V3 integrates nanotron’s location RF-Chip, nanoLOC, and is complemented with embedded accelerometer and temperature sensors. With low external
- Applications: Mobile / Wireless Systems
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Supplier: DigiKey
Description: IC BUFF 3V/18V 16-PDIP
- Operating Temperature: -55 to 125 C
- Supply Voltage (VS): 3 to 18 volts
- Features: Buffer, Other
- Package Type: DIP
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: 4Kb Serial EEPROM IC, 512x8, I2C, 400kHz, 5V, MSOP Product overview: CAT24C04ZI-G from onsemi is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing
- Density: 4 kbits
- Number of Words: 512 k
- Operating Current: 2 mA
- Access Time: 900 ns
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Supplier: SiTime Corporation
Description: High Temp, Single-Chip, SOT23 Oscillator
- Oscillation Frequency: 27 MHz
- Total Frequency Stability: 50 ppm
- Operating Temperature: -40 to 105 C
- Supply Voltage: 1.8 V
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Description: IC TRANSCEIVER RS232
- Device Type: Receiver, Sensor Interface
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Supplier: ODG (Origin Data Global)
Description: CONNECTED HOME/WEARABLEBLE+ZIGBE
- Features: Other
- Technology: ZigBee®
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Supplier: Utmel Electronic Limited
Description: IC EEPROM 4K I2C 400KHZ 8MSOP
- Density: 32 kbits
- Operating Current: 2 mA
- Standby Current: 0.001 mA
- Access Time: 900 ns
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Supplier: Utmel Electronic Limited
Description: IC EEPROM 16K I2C 400KHZ 8MSOP
- Density: 128 kbits
- Operating Current: 2 mA
- Standby Current: 0.001 mA
- Access Time: 900 ns
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Description: IC SWITCH DP4T 240OHM 16DIP
- TJ: -55 to 125 C
- Package Type: DIP
- Features: Other
- Device Type: Sensor Interface
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Supplier: Utmel Electronic Limited
Description: IC EEPROM 1K I2C 400KHZ 8MSOP
- Density: 8 kbits
- Operating Current: 2 mA
- Standby Current: 0.001 mA
- Access Time: 900 ns
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Supplier: DigiKey
Description: 915MHz ZigBee™ Chip RF Antenna 905MHz ~ 925MHz 3.32dBi Solder Surface Mount
- Primary Frequency Range: 915 MHz
- Gain: 3.32 dB
- VSWR: 2 :1
- Form Factor / Mounting: Internal / Chip
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Supplier: RS Components, Ltd.
Description: XBee ZigBee RF Module,Wire Antenna(TH)
- Features: Other, RoHS Compliant
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Supplier: Quarktwin Technology Ltd.
Description: 915MHz ZigBee™ Chip RF Antenna 905MHz ~ 925MHz 3.32dBi Solder Surface Mount
- Polarization: Other
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Supplier: Acme Chip Technology Co., Limited
Description: 32-bit Arm Cortex-M3 Zigbee, 6LoWPAN, and IEEE 802.15.4 wireless MCU with 512kB Flash and 32kB RAM
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Supplier: LCSC Electronics Technology (HK) Limited
Description: 802.15.4,Zigbee 2.4GHz QFN-16-EP(4x4) RF Front End Circuits ROHS
- Operating Frequency: 2,400 MHz
- Package Type: QFN
- Features: RoHS Compliant
- Technology: ZigBee®
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Supplier: VAST STOCK CO., LIMITED
Description: Zigbee Modules (802.15.4) Cortet Range Extr ZigBee HA 1.2
Find Suppliers by Category Top
Featured Products Top
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The QPG6200L is the industry’s most reliable and robust wireless multi-standard System-on-Chip. Featuring Qorvo’s ConcurrentConnect™ technology, the QPG6200L supports the latest standards for Matter (over Thread), Zigbee and (read more)
Browse RF Modules Datasheets for Qorvo -
portfolio is also part of NXP’s 15-year product longevity program to support long-term use which is especially important for industrial applications. The MCX W71x family supports simpler IoT devices with a single-chip solution or acting as a co-processor in a hosted architecture. NXP (read more)
Browse Microcontrollers (MCU) Datasheets for DigiKey
Conduct Research Top
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Developing a Low-Cost ZigBee (R) Enabled Smart Energy Meter On CC2538
This application note describes the implementation and integration of energy metering into a TI ZigBee Stack (Z-Stack TM) using the CC2538 platform. The CC2538 is a SmartRF ZigBee system-on-chip solution from TI which offers a powerful ARM (Cortex-M3) core along with IEEE 802.15.4 ZigBee radio
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ZigBee System Partitioning Considerations
For end devices and routers that do not require a host processor, the single-chip wireless SoC system partitioning approach delivers the best network performance, the lowest power consumption and the lowest overall cost. If a host processor is required by the system, the NCP system partitioning
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Electronic Design: Can CHIP Make the Seamless Smart Home Real?
manager of Qorvo's Wireless Connectivity business. In this edited interview, Links discusses how the Zigbee Alliance's nascent Project Connected Home over IP (CHIP) Working Group might catalyze convergence in the smart-home networking ecosystem.
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RF Front-end Modules Boost Wireless Performance
Not all Bluetooth (R) Low Energy (BLE), Wi-Fi or ZigBee (R) solutions are created equal. That is the inescapable conclusion of some recent tests comparing popular system-on-chip (SoC) platforms with and without. Skyworks Solutions' front-end modules (FEMs). The tests examined output power versus
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Hope dims for second-half turnaround, foundries say The post-PC era may have already arrived, but try telling that to the chip makers in Asia that are responsible for supplying a large chunk of the world's ICs. Despite a recent uptick in demand for chips used in enterprise communications equipment
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Venture capital investment retreated in April, stats show Chip market maintained 30% progress in March, says analyst KLA-Tencor's president, COO resigns; CEO assumes role Nokia losing market share in mobile handsets Philips Semiconductor revises its position on Zigbee Vendors predict first WiMAX
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
that two private-equity firms were interested in taking Freescale Semiconductor Inc. private. Oki offers ARM-based ZigBee developer's kit Oki Semiconductor is offering a low-cost, full-featured development kit for its IEEE802.15.4 based ML7065 2.4GHz ZigBee compatible radio. The kit contains the Oki
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
that two private-equity firms were interested in taking Freescale Semiconductor Inc. private. Oki offers ARM-based ZigBee developer's kit Oki Semiconductor is offering a low-cost, full-featured development kit for its IEEE802.15.4 based ML7065 2.4GHz ZigBee compatible radio. The kit contains the Oki
More Information Top
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Applied Mechatronics and Android Robotics
The way transmits by wireless ( ZigBee chips ) and wired (DAQ signal acquisition device) sensor value send to the server-side carries on remote monitoring and record etc.
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Comparison of applying sleep mode function to the smart wireless environmental sensing stations for extending the life time
The zigbee chip modules (Series 1 and Series 2) consist of a 10-bit ADC resolution, therefore the following measurements are taken into consideration: .
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Single-chip ZigBee for indoor mobile telemetry
Some ZigBee chips support general scanning but do not provide RSSI measurement tagged to a specific packet.
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Mechanics and Mechatronics
CC2430 / CC2530 integrates the 51 microcontroller core, compared to the large number of Zigbee chip , CC2430 / CC2530 is quite popular.
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Information Engineering for Mechanics and Materials Research
ZigBee chip and peripheral circuit design .
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Information Technology Applications in Industry, Computer Engineering and Materials Science
Temperature monitoring is realized through high precision thermal resistor and portable testing equipment with A/D conversion circuit of Zigbee chip .
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Wireless Zigbee strain gage sensor system for structural health monitoring
The sensor module consists of the sensor daughter ADC board, ACAM PS021 [7], ZigBee chips , MCU and a flash memory as shown in Figure 4.
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Front Matter: Volume 7314
The sensor module consists of the sensor daughter ADC board, ACAM PS021 [7], ZigBee chips , MCU and a flash memory as shown in Figure 4.
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