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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Aluminum brazing and soldering filler metals are used to join materials within the aluminum family of alloys. These materials are available in wire, strip, powder, paste (both corrosive and non-corrosive formulations) and preformed rings and shapes. Lucas-Milhaupt also offers aluminum
- Alloy: Zinc-Aluminum (Zn-Al)
- Form / Shape: Paste, Powder, Preform, Wire
- Melting Range: 725 F
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Supplier: HAVE, Inc.
Description: contacts MechanicalLifetime: > 1000 mating cycles Insertion / withdrawal force: = 20 N Retention method (Female versions only): - standard: latch lock - "-0" version: retention spring Separating force: = 20 N Materials Shell: ZnAl4Cu1, gal Ni or black Cr plating Insert: PA 6
- Connector Type: XLR Connector
- Gender: Female / Jack
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Supplier: HAVE, Inc.
Description: contacts Mechanical Lifetime: > 1000 mating cycles Insertion / withdrawal force: = 20 N Retention method (Female versions only): - standard: latch lock - "-0" version: retention spring Separating force: = 20 N Materials Shell: ZnAl4Cu1, gal Ni or black Cr plating Insert: PA 6
- Connector Type: XLR Connector
- Gender: Male / Plug
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Supplier: HAVE, Inc.
Description: contacts MechanicalLifetime: > 1000 mating cycles Insertion / withdrawal force: = 20 N Retention method (Female versions only): - standard: latch lock - "-0" version: retention spring Separating force: = 20 N Materials Shell: ZnAl4Cu1, gal Ni or black Cr plating Insert: PA 6
- Connector Type: XLR Connector
- Gender: Male / Plug
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Supplier: HAVE, Inc.
Description: contacts MechanicalLifetime: > 1000 mating cycles Insertion / withdrawal force: = 20 N Retention method (Female versions only): - standard: latch lock - "-0" version: retention spring Separating force: = 20 N Materials Shell: ZnAl4Cu1, gal Ni or black Cr plating Insert: PA 6.6 30
- Connector Type: XLR Connector
- Gender: Female / Jack
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Supplier: Visual Sound, Inc.
Description: dc Rated current: 5 A AWG: 1.0 mm2/18 AWG Capacitance between contacts Materials Shell: ZnAl4Cu1, gal Ni over Cu plating Insert: PA 6.6 30% GR (glass reinforced) Contacts: CuZn39Pb3 Contact surface: gal 2 µm Ag Strain-relief clamp: POM Antikink bushing: PUR Environmental Temperature
- Connector Type: XLR Connector
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Supplier: Visual Sound, Inc.
Description: strength: 1500 V dc Rated current: 5 A AWG: 1.0 mm2/18 AWG Capacitance between contacts: = 9 Mechanical Lifetime: >1000 cycles Insertion / withdrawal force: = 20 N Cable O.D. range: 3.5 mm - 8.0 mm Materials Shell: ZnAl4Cu1, gal Ni over Cu plating Insert: PA 6.6 30
- Connector Type: XLR Connector
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Supplier: TE Connectivity
Description: Body Features Body Material : ZnAL4Cu1, PPA GF25 Connector & Keying Code : K PCB Retention Feature Plating Material : Tin Configuration Features Number of Positions
- Contact Pitch: 2.01 mm
- Number of Contacts: 4 #
- Voltage Rating: 60 volts
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Indicates content that may require registration and/or purchase.
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Three-Layer Zn/Al/Zn Clad Solder for Die Attachment
Unlike conventional Zn - Al solders , Zn/Al/Zn clad solders were successfully bonded without flux.
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Microstructure and interfacial reaction of Sn–Zn–x(Al,Ag) near-eutectic solders on Al and Cu substrates
The Sn– Zn – Al solder possessed the best wettability on both Cu and Al substrates among the four solders.
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Die attach properties of Zn–Al–Mg–Ga based high-temperature lead-free solder on Cu lead-frame
Formation of such IMCs at the interface between Cu lead-frame and Zn – Al solder has been reported in different literatures [24].
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A Review of Pb-Free High-Temperature Solders for Power-Semiconductor Devices: Bi-Base Composite Solder and Zn–Al Base Solder
Before the reflow process, each surface of Zn – Al solder sheets was exposed to radio frequenct ͑RF͒ plasma etching to remove oxide layers.
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Effects of Bonding Conditions on Bondability Using Zn/Al/Zn Clad Solder
Key words: Zn - Al solder , Zn-Al-Cu solder, Pb-free, clad material, eutectic melting, die attachment .
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Interaction of Zn and Zn–4Al, Zn–15Al (wt-%) solder alloys with aluminium
Keywords: Zn – Al solders , Al alloy soldering, TLP, Isothermal solidification, EDS analysis, Cladding, Seam microstructure, Induction soldering .
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Microstructures formed from mixed solders on copper substrate
To investigate possible microstructures resulting from such procedure, samples were prepared using small balls of four different Sn–Ag–Cu (SAC) Pb free solders, as well as Sn– Zn – Al solder , melted together with eutectic Pb–Sn solder paste and also various SAC solder …
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Interfacial Reaction between Zn-Al-Based High-Temperature Solders and Ni Substrate
On the con- trary, there has been no report on the interfacial reaction between a Ni substrate and Zn - Al solder , where the formation and growth of some IMCs such as d (-: CoZn13), c (Ni3Zn14, D82: Cu5Zn8), and b1 (NiZn_LT, L10: AuCu …
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Interfacial Reaction Between Cu Substrates and Zn-Al Base High-Temperature Pb-Free Solders
… Cu, on the melting temperature, hardness, wettability, etc., have been reported for Zn-Al base alloys,2,4 there has been no report on the chemical reaction near the interface of the Cu substrate and Zn - Al solder , where the formation and …
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Sn-Zn-Al Pb-free solder—An inherent barrier solder for Cu contact
This is the first time to find a Sn-containing solder which, in contact with Cu, does not formCu-Snintermetalliccompoundduringheattreatmentand,thus,theSn- Zn - Al solder is termed an inherent barrier solder.