TABLE OF CONTENTS No presentation of active device processing is complete without context for how these steps fit in within the overall product realisation process. The steps for die separation, packaging, reliability and failure analysis are generic steps that are necessary for the manufacture of many semiconductor devices, not just GaAs devices. With the exception of reliability, the execution of these steps is more similar than different compared to Si devices. Those aspects of reliability testing that have unique bearing on processing GaAs devices will be elaborated on in succeeding chapters where such a discussion is useful and relevant. In this section, a general presentation of the basics of die separation, packaging, reliability and failure analysis is briefly introduced.
Once frontside processing is completed, a complete electrical test of all die is usually performed to identify devices that meet electrical specifications. During this process, devices that fail one or more specifications are sometimes "inked" to visually identify them as bad devices. Even though they are tracked through a database from the output of the electrical test, the ink is often used because it makes any mishandling less likely.
The wafer can now be mounted to another substrate for backside operations if the application calls for wafer thinning (as most do). A thinned GaAs wafer is extremely difficult to handle, will deform so it does not remain flat, and therefore requires the use of a host substrate. This supporting substrate is...
