TCAD for Si, SiGE and GaAs Integrated Circuits

Chapter 11: Passive Components

Overview

Passive components are indispensable in the design and development of microchips for high-frequency applications. Inductors in particular are used frequently in radio frequency integrated circuits (RFICs) such as low noise amplifiers (LNAs) and oscillators. Currently analog/mixed-signal/RF product designs incorporating both CMOS and bipolar active elements have emerged as a potential technology for communication applications. Radio frequency (RF) system-on-chip (SoC) designs require high-performance passive components - particularly on - chip inductors and capacitors. As chip geometries get smaller and operating speeds increase, the physical effects of parasitic capacitance, resistance and inductance become increasingly significant. For RF and wireless applications, the key requirements include high Q passive elements, superior active devices, robust frequency domain tools and accurate parasitic extraction. The technology and tool set must support building monolithic RF building blocks with an eye towards integrating the entire radio on a chip. Important requirements can be more easily understood by examining the features and technology requirements of some key wireless building blocks (see in Table 11.1).

Table 11.1: Features and requirements of basic RF wireless building blocks. (After D. Harame et al., Proc. 4th IEEE Intl. Caracas Conf. Devices, Circuits and Systems, 2002 (D052-1 D052-17).)

Circuit

Main feature

Technology requirements

LNA

Low noise figure

Low n Fmin, low HBT R b

Gain per stage

High Early voltage

High linearity

High f T/ f max

Mixer

High linearity

High Early voltage

High port isolation

High f T/ f max

Carrier leakage

Isolation technologies Small mismatch

VCO

Low phase noise

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