Electronic Materials and Processes Handbook, Third Edition

8.11: Thick Film Resistor Materials

8.11 Thick Film Resistor Materials

Thick film resistors are formed by mixing metal oxide particles with glass particles and firing the mixture at a temperature/time combination sufficient to melt the glass and sinter the oxide particles together. The resulting structure consists of a series of three-dimensional chains of metal oxide particles embedded in a glass matrix. The higher the metal oxide-to-glass ratio, the lower will be the resistivity of the fired film and vice versa.

Thick film resistor materials are blended approximately to Lichtenecker s logarithmic mixing rule,

(8.21)

where R m = bulk resistivity of the mixture

V j = volume fraction of the individual component

R j = bulk resistivity of the component

Referring to Fig. 8.20, the electrical resistance of a material in the shape of a rectangular solid is given by the classic formula,


Figure 8.20: Definition of resistance.
(8.22)

where R = electrical resistance in ohms

? B = bulk resistivity of the material in ohms-length

L = length of the sample in the appropriate units

W = width of the sample in the appropriate units

T = thickness of...

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