TABLE OF CONTENTS Electronic packaging is the means by which system components are interconnected and integrated to create a product with a desired functionality. Electronic packaging must provide for electrical connections between components, physical support of each component, thermal management for the heat dissipated by each component, and connection of the system to the outside world.
The most common form of electronic packaging is the printed circuit assembly (PCA). The printed circuit assembly consists of the printed circuit board (PCB) and the various electronic components that are attached to it, including integrated circuits (ICs), discrete components, connectors, and modules. Modules are often smaller PCAs that are connected to a larger PCA (motherboard).
Through-hole and surface mount technology (SMT) are terms that describe the set of processes that comprise the assembly of PCAs. While through-hole assembly was once the predominant technology for electronic assembly, SMT is now the technology of choice, particularly for portable electronic systems. A highly simplified explanation of SMT processing is as follows:
The production line is kitted with the required PCB substrate and components for a particular PCA. Assembly instructions are downloaded to the automated assembly equipment.
The PCB substrate is loaded into a screen printer that deposits solder paste onto the component connection points.
The PCB is transferred to the pick and place station where robotic arms pick individual components out of a dispenser and place them onto the circuit board.
The PCB is transferred to a reflow oven where the solder...
