Help with Light Sensor Chips specifications:
Performance
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Input (Supply) Voltage | The input voltage required to operate the sensor. | ||
Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
Output Voltage | This is the output voltage of the sensor. | ||
Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
Output Current | This is the output current of the sensor. | ||
Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
Operating Temperature: | This is the full-required range of ambient operating temperature. | ||
Search Logic: | User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria. | ||
Applications
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Sensor Grade / Operating Range | |||
Your choices are... | |||
Automotive | The sensor is designed for automotive applications. | ||
Consumer | The sensor is designed for consumer product applications. | ||
Industrial | The sensor is designed for general industrial applications. | ||
Medical | The sensor is designed for medical applications. | ||
Military | The sensor is designed for military applications. | ||
Other | Other unlisted applications. | ||
Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
Packaging Characteristics
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Package Type / Mounting | |||
Your choices are... | |||
Die | Bare die devices are sold in semiconductor die form. They do not have a case or packaging. | ||
Through Hole Technology (THT) | In through-hole technology (THT), components are mounted on printed circuit boards by inserting component leads through holes in the board and then soldering. | ||
Surface Mount (SMD) | Surface mount device (SMD). | ||
Other | Other unlisted or proprietary package types or packing methods. | ||
Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
Packing Method | |||
Your choices are... | |||
Bulk Pack | Components are distributed as individual parts. | ||
Tape Reel | Components are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. A cover tape seals the carrier tape in place. This composite tape is then wound on a reel that is placed in a corrugated shipping box for transport and delivery. Customers unpack the reels and load them into industry-standard, pick-and-place board assembly equipment. Tape and reel assemblies provide component isolation and are designed for surface mount packages such as quad flat package (QFP) and thin quad flat package (TQFP). Typically, carrier tape is made from a polystyrene (PS) or PS-laminate film with a uniform film thickness between 0.2 mm to 0.4 mm. Carrier tape design is defined largely by component length, width, and thickness. Cover tape is made from a polyethylene teraphthalate (PET) film or film laminate with an adhesive applied to the underside of the film. This adhesive is usually heat and pressure sensitive to ensure a positive, consistent seal between the carrier tape and the cover tape. The reels that contain the composite tape are typically made of polystyrene and have one, two, or three parts. Reel dimensions meet EIA-481-1, EIA-481-2, and EIA-481-3 standards. | ||
Tray / Rail | Components are packed in trays (rails) that are made of carbon-powder or fiber materials and molded into rectangular outlines that contain matrices of uniformly spaced pockets. These containers protect components during shipping and provide proper component location and orientation for use with industry-standard, pick-and-place board assembly equipment. Trays are designed for components for that have leads on four sides and that require component lead isolation during shipping, handling, or processing. For example, quad flat package (QFP) and thin quad flat package (TQFP) components are often shipped in trays. To facilitate shipping and handling, trays are stacked and bound together in standard configurations. To provide rigidity, an empty cover tray is added to the top of the load. Typical stacking configurations consist of five full trays and one cover tray, and ten full trays and one cover tray. Customer requirements determine whether trays are shipped in single or multiple stacks. | ||
Shipping Tube / Stick Magazine | Components are packed in shipping tubes or stick magazines that are made of rigid polyvinylchloride (PVC) and extruded in industry-standard sizes. These containers protect components during shipping and provide proper component location and orientation for use with industry-standard, pick-and-place board assembly equipment. To facilitate shipping and handling, shipping tubes and stick magazines are usually loaded into intermediate containers such as boxes or bags to form standard quantities. Intermediate-level packing quantities for shipping tubes and stick magazines often vary by pin count and package type. | ||
Other | Other unlisted packing methods. | ||
Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
Standards and Features
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Standards | |||
Your choices are... | |||
ELV Directive | End of life vehicles (ELV) directive requires that certain automotive products be free (except for trace impurities) of mercury, cadmium, and lead as of 7/01/2003. Lead can still be used as an alloying additive in copper, steel, and aluminum and in solderable applications. | ||
RoHS Compliant | Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl and polybrominated diphenyl ether. RoHS became effective on July 1, 2006. | ||
WEEE Compliant | Waste Electrical and Electronics Equipment (WEEE) is a European Union (EU) directive that aims to encourage the reuse, recycling, and recovery of electrical and electronic equipment, and to improve the environmental impact and performance of this equipment. WEEE also establishes the requirements and criteria for the collection, treatment, recycling and recovery of this equipment. It makes producers responsible for financing these activities, and retailers and distributors must provide a means for consumers to return used or obsolete equipment without charge. | ||
Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
Features | |||
Your choices are... | |||
Customized Transfer Function | The sensor’s transfer function can be manually set. | ||
Inverse Polarity Protection | The sensor has circuitry to protect it in case a reverse polarity voltage is applied. | ||
Power Down Mode | The power down mode allows the user to operate the sensor a t a very low power consumption. | ||
Sleep Mode | Sleep mode allows the user to turn off the sensor. | ||
Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||