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Counter Type:

Counter Category:

Counter Direction:

Supply Voltage:

Presettable Counter?

Number of Bits (Stages):

bits

Clock Frequency:

Operating Current:

Power Dissipation:

Operating Temperature:

Allow up to: overrange/margin
Use the overrange/margin to restrict your search to items whose full-scale range is close to your requirements.
(Overrange/margin requires both 'From' and 'To' values to work.)

IC Package Type:

Logic Family:

Pin Count:

Number of Counters in the Chip:

Programmable?

Schmitt Trigger Inputs?

Asynchronous Inputs?

Bus hold Support?

Radiation Tolerant?

ESD Protection?

Output Characteristics:

Help with Logic Counters specifications:

General Specifications
   Counter Type       
   Your choices are...         
   BCD / Decade Counter       Binary coded decimal (BCD) is a four-bit code used to represent each digit of a decimal number by its four-bit binary equivalent. Decade counters are 4-bit truncated counters that produce a counting sequence from 00002 (0) to 10012 (9). 
   MOD-N Binary Counter       MOD-N binary counters sequence through N different states. For a non-truncated counter the MOD (modulus) number is the given as 2n, where n is the number of stages (flip-flops) of the counter. For a truncated counter N is the total number of different counting states. These counters are also knows as divide-by-N counters. 
   Johnson Counter       Johnson counters create counting sequences that resemble those of shift registers. The division ratio is restricted to twice the number of flip-flops.  The number of logic gates is always low, and so these counters are fast.  
   Ring Counter       A loop or ring of "counter" stages, in which only one flip-flop will be set at any given time.  An input trigger pulse causes the "on" state to move to the adjacent stage. Thus, the "on" state moves around the loop. 
   Bi-quinary       Decade counters in which the most significant bit (MSB) is low for five states and high for the other five (two counts of five states). This produces a 50% duty cycle on the output (square wave). 
   Other       Other unlisted types. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Counter Category       
   Your choices are...         
   Synchronous       Synchronous counters provide output bits that change state simultaneously, with no ripple. These devices must be designed using connected J-K flip-flops, where each flip-flop receives the exact same clock pulse at the exact same time. 
   Asynchronous (Ripple)       In asynchronous counters, the external clock pulse clocks first flip-flop, and then each successive flip-flop is clocked by one of the outputs of the previous flip-flop. 
   Synchronous / Asynchronous       Counters that can operate either as synchronous or asynchronous counters. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Counter Direction       
   Your choices are...         
   UP       The counter counts in an increasing sequence only. 
   DOWN       The counter counts in a decreasing sequence only. 
   Bidirectional (UP/DOWN)       The counter counts in an increasing or decreasing sequence. These types of counters are known as bidirectional counters. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Supply Voltage:       
   Your choices are...         
   -5 V         
   -4.5 V       The chip operates with -4.5 volts. 
   -3.3 V         
   -3 V         
   1.2 V       The chip operates with 1.2 volts. 
   1.5 V       The chip operates with 1.5 volts. 
   1.8 V       The chip operates with 1.8 volts. 
   2.5 V       The chip operates with 2.5 volts. 
   3 V       The chip operates with 3 volts. 
   3.3 V       The chip operates with 3.3 volts. 
   3.6 V       The chip operates with 3.6 volts. 
   5 V       The chip operates with 5 volts. 
   Other       Other unlisted supply voltages. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Presettable Counter       The counter has inputs to preset its count to any value different from zero. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
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Performance
   Number of Bits (Stages)       The number of flip-flops in the counter. The maximum counting states is 2n, where n is the number of bits (FFs).  The division ratio is the maximum number by which the input frequency will be divided. For a non-truncated divider this number is 2n, where n is the number of flip-flops (bits) in the divider. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Clock Frequency       The highest clock rate (in hertz) at which the counter or the divider can reliably operate. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Operating Current       The minimum current needed for active chip operation. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Power Dissipation       Power dissipation is the total power consumption of the device. It is generally expressed in watts or milliwatts. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Operating Temperature:       This is the full-required range of ambient operating temperature. 
   Search Logic:      User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.
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IC Chip Specifications
   IC Package Type       
   Your choices are...         
   BGA       Ball-grid array (BGA) places output pins in a solder ball matrix. Generally, BGA traces are fabricated on laminated (BT-based) substrates or polyimide-based films. Therefore, the entire area of substrates or films can be used to route the interconnection. BGA has another advantage of lower ground or power inductance by assigning ground or power nets via a shorter current path to PCB. Thermally enhanced mechanisms (heat sink, thermal balls, etc.) can be applied to BGA to reduce the thermal resistance. The sophisticated capabilities make BGA the desirable package to implement electrical and thermal enhancement in response to the need for high power and high speed ICs. 
   PBGA       Plastic ball-grid array (PBGA) is the general terminology for the BGA package adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA refers to an overall thickness of over 1.7mm. 
   TBGA       Tape ball-grid array (TBGA) uses a fine, polyimide substrate and provides good thermal performance with high pin counts. 
   FLGA       Fine-pitch land-grid array (FLGA) is extremely compact and lightweight, making it suitable for miniature disc drives and digital cameras. 
   QFP       Quad flat packages (QFP) contain a large number of fine, flexible, gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processors, controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipsets, and other applications.  
   LQFP       Low quad flat package (LQFP). 
   TQFP       Thin quad flat package (TQFP). 
   SOP       Small outline package (SOP). 
   SOIC       Small outline integrated circuit (SOIC). 
   TSOP Type I, II       Thin small outline package (TSOP) is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II. 
   SSOP       Shrink small outline package (SSOP). 
   TSSOP       Thin shrink small outline L-leaded package (TSSOP). 
   TVSOP       Thin very small outline package (TVSOP). 
   SOJ       Small outline J-lead (SOJ) is a common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device. 
   HSOF       Small outline flat-leaded package with heat sink (HSOF). 
   PLCC       Plastic leaded chip carrier (PLCC). 
   LCCC       Leadless ceramic chip carrier (LCCC). 
   DIP       Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. 
   PDIP       Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics and telecommunications. 
   CDIP       Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade. 
   SIP       Single in-line package (SIP). 
   SDIP       Shrink dual in-line package (SDIP). 
   SZIP       Shrink zigzag in-line package (SZIP). 
   Other       Other unlisted, specialized, or proprietary IC packages. 
   Search Logic:      Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Logic Family       
   Your choices are...         
   TTL       Transistor-transistor logic (TTL) is a class of digital circuits built from bipolar junction transistors (BJT), diodes and resistors. It is notable, as it was the base for the first widespread semiconductor integrated circuit (IC) technology. All TTL circuits operate with a 5 V power supply. TTL signals are defined as "low" or L when between 0 V and 0.8 V with respect to the ground terminal, and "high" or H when between 2 V and 5 V. The first logic devices designed from bipolar transistors were referred to as standard TTL. The addition of Schottky diodes to the base collector of bipolar transistor was called Schottky logic (S-TTL). Schottky diodes shorten propagation delays within TTL by preventing the collector from going into what is called “deep saturation.”  Other TTL technologies include low-power Schottky (LS-TTL), advanced Schottky (AS-TTL), advanced low-power Schottky (ALS-TTL), and low-voltage TTL (LVTTL). 
   FAST       Fairchild advanced Schottky TTL (FAST) technology was created in late 1970 when advances in IC technology allowed the speed and drive of S-TTL to be combined with the lower power of LS-TTL to form a new logic. An advanced related family is the FASTr, which is faster then FAST, has a higher driving capability (IOL, IOH), and produces much lower noise. The “r” in FASTr refers to the various speed grades, such as A, B and C, where an “A” designation means low speed and “C” means high speed. 
   Standard CMOS / CMOS (4000)       Complementary metal-oxide semiconductor (CMOS) logic uses a combination of p-type and n-type metal-oxide-semiconductor field effect transistors (MOSFET) to implement logic gates and other digital circuits found in computers, telecommunications and signal processing equipment. It is the technology of choice for many present-day digital integrated circuits. CMOS 4000 refers to the series 4000 that is true CMOS with non-TTL levels. 
   FCT       Fast CMOS technology (FCT) was introduced in 1986. With this technology the speed gap between CMOS and TTL was closed. Since FCT is the CMOS version of FAST, it has the low power consumption of CMOS but speed comparable with TTL. Advanced versions of the FCT standard are FCTx and FCTx-T. The x in FCTx and FCTx-T refers to the various speed grades, such as A, B and C, where an “A” designation means low speed and “C” means high speed. 
   High-Speed CMOS (HCMOS)       High-speed CMOS technology (HCMOS) is also known as HC / HCT. There are several basic flavors of HCMOS technology: high-speed CMOS (HC), high-speed CMOS with TTL input (HCT), advanced high-speed CMOS (AHC), and advanced high-speed CMOS with TTL inputs (AHCT). 
   Advanced CMOS       Advanced CMOS is a much higher speed version of HCMOS.  It is also known as AC / ACT.  Advanced CMOS technology comes in different flavors: standard advanced CMOS (AC), advanced CMOS with TTL inputs (ACT), advanced CMOS with quiet outputs (ACQ), advanced CMOS with TTL inputs and quiet outputs (ACTQ), advanced ultra-Low voltage CMOS (AUC), advanced ultra-low power CMOS (AUP), advanced very-low voltage CMOS (AVC), advanced low voltage HCMOS (ALVC), and advanced low voltage CMOS with bus hold (ALVCH).  ACQ / ACTQ are second generation Advanced CMOS with much lower noise. While ACQ has the CMOS input level, ACQT is equipped with TTL level input. 
   Low Voltage CMOS       There are several low voltage CMOS technologies: standard low voltage (LV), low voltage high performance HCMOS (LVC), low voltage CMOS technology with TTL inputs (LVT), Low voltage with TTL inputs and high impedance (LVTC), advanced low voltage CMOS with bus hold (ALVCH), low voltage CMOS that operates with 3 V or 5 V (LCX), and low voltage CMOS that operates with 1.8 V or 3.6 V (VCX). 
   BiCMOS Technology       BiCMOS is a SiGe Bipolar technology that combines the high speed of bipolar TTL with the low power consumption of CMOS. There are a number of BiCMOS flavors including advanced BiCMOS technology (ABT), advanced BiCMOS technology with enhanced transceiver logic (ABTE), advanced low-voltage BiCMOS (ALB), advanced low-voltage BiCMOS technology (ALVT), BiCMOS with TTL inputs (BCT), BiCMOS with backplane and transceiver logic (BTL), and low-voltage BiCMOS technology (LVT). 
   ECL       Emitter coupled logic (ECL) uses transistors to steer current through gates that compute logical functions. By comparison, TTL and related families use transistors as digital switches, where the transistors are either cut off or saturated, depending on the state of the circuit. This distinction explains ECL's chief advantage: that because the transistors are always in the active region, they can change state very rapidly, so ECL circuits can operate at very high speed; and also its major disadvantage: the transistors are continually drawing current, which means the circuits require high power, and thus generate large amounts of waste heat. ECL gates use differential amplifier configurations at the input stage. A bias configuration supplies a constant voltage at the midrange of the low and high logic levels to the differential amplifier, so that the appropriate logical function of the input voltages will control the amplifier and the base of the output transistor. The propagation time for this arrangement can be less than a nanosecond. Other noteworthy characteristics of the ECL family include the fact that the large current requirement is approximately constant, and does not depend significantly on the state of the circuit. This means that ECL circuits generate relatively little power noise, unlike many other logic types that typically draw far more current when switching than quiescent, for which power noise can become problematic. ECL circuits operate with negative power supplies, and logic levels incompatible with other families, which means that interoperation between ECL and other designs are difficult. The fact that the high and low logic levels are relatively close mean that ECL suffers from small noise margins, which can be troublesome in some circumstances. 
   Integrated Injection Logic (I2L)       Integrated injection logic (I2L) is based on bipolar transistor logic. It is commonly referred to as "I-square-L." 
   Silicon on Sapphire (SOS)       Silicon on sapphire (SOS) is a hetero-epitaxial process wherein a thin layer of silicon is “grown” on a sapphire (Al2O3) wafer. SOS is part of the silicon on insulator (SOI) family of CMOS technologies. SOS is primarily used in military and space applications because of its inherent resistance to radiation. It has seen little commercial use to date because of difficulties in fabricating the very small transistors used in modern high-density applications. Problematically, the SOS process often results in the formation of dislocations from crystal lattice disparities between the sapphire and silicon.  This leads to unusable wafers and drives up the production cost. 
   GaAs       Gallium arsenide (GaAs) is a compound semiconductor mixing the strength of two elements, gallium (Ga) and arsenic (As). Gallium is a byproduct of the smelting of other metals, notably aluminum and zinc, and is rarer than gold. Arsenic is not rare, but it is poisonous. Gallium arsenide has many uses including being used in some diodes, field-effect transistors (FETs), and integrated circuits (ICs). GaAs components are useful at ultra-high radio frequencies and in fast electronic switching applications. GaAs devices generate less noise than most other types of semiconductor components and, as a result, are useful in weak-signal amplification applications. Gallium arsenide is used in the manufacture of light-emitting diodes (LEDs), which are found in optical communications and control systems. Gallium arsenide can replace silicon in the manufacture of linear and digital ICs. Digital devices are used for electronic switching, and also in computer systems. 
   CBT       Cross-bar switch technology (CBT) enables a bus-interface to function as a very fast bus switch, isolating buses when the switch is open and offering very little delay when the switch is closed. Supplier: Texas Instruments. It is also knows as quick switch (QS), fast switch technology (FST), or Pericom Interface (PI5C). When the switch is open it provides circuit isolation (high impedance). When the switch is closed, it provides a near-zero propagation delay through a 5-Ohm resistance.  CBT devices operate 4.5 and 5.0 V. Bus switch technology is used in PLDs to provide a better performance to the device. There are many modalities in this technology, such as CBT with an internal Schottky diode (CBTS) that provides negative voltage undershoot protection for both input and output; series damping resistor option (CBTR) that includes an internal resistor to better terminate both inputs and outputs that connect to the transmission line for better signal integrity; low-voltage CBT (CBTLV) that features simple n-channel and p-channel MOS transistors optimized for 3.3 V operation while maintaining low propagation delays and low current supply; very low voltage bus switch (CBTV) that features simple n-channel and p-channel MOS transistors optimized for 2.5 V operation while maintaining low propagation delays and low current supply. 
   Gunning Technology       Gunning transceiver logic includes standard Gunning with transceiver logic (GTL) and Gunning with transceiver logic plus (GTLP). 
   Other       Other unlisted families. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Pin Count       The number of pins in package. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Number of Counters in the Chip       The number of independent units (flip-flops or latches) in the chip. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Features
   Programmable       The user can program the divider's division ratio or modulus, up to a fixed maximum. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Schmitt Trigger Inputs?       The device has additional circuitry added to its basic gate or circuit so as to introduce hysteresis. This helps to counteract spurious behavior due to noise. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Asynchronous Inputs       In addition to preset inputs, the device has an asynchronous (independent of the clock) terminal that can be used to clear (set all the flips in the device to Q=0) all inputs. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Bus hold Support       Bus hold is a circuit that retains the last active state on the bus when the bus is disabled or has no active driver. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Radiation Tolerant       The device is radiation hardened or tolerant. 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   ESD Protection       The chip has circuitry to protect it from damage produced by electrostatic discharge (ESD). 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
   Output Characteristics       
   Your choices are...         
   3-State       The flip-flop has a 3-state output buffer. 
   Open-collector       The outputs are internally connected to the collector of a bipolar transistor. 
   Open-drain       The outputs are internally connected to the drain of a field-effect transistor. 
   Output Enable Input (OE)       The device has pins enabled for the output (OE). 
   With Master Reset       The device has a pin that can be used to reset all the flip-flops at once. 
   Buffered Output       The output signal is buffered with a buffer amplifier. 
   Other       Other unlisted output types. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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