Products/Services for CMP Paste
-
Abrasive Compounds and Abrasive Slurries - (281 companies)Abrasive compounds and abrasive slurries are used to improve surface finish or flatness. They consist of fine abrasives in slurry, bar, powder, or paste form. Types of Abrasive Compounds and Abrasive Slurries There are many different types... -
Laps and Lapping Tools - (55 companies)Laps and lapping tools are used for precision surface finishing, often in conjunction with loose abrasive compounds. -
Buffs and Buffing Wheels - (105 companies)Buffs and buffing wheels are used to hold finishing compounds and polish parts made of metal, plastic, ceramic, glass, wood, stone, silicon, or optical materials. -
Chemical Mechanical Planarization (CMP) Slurries - (19 companies)Chemical mechanical planarization (CMP) slurries consist of surface active chemicals and microabrasive grains in a liquid dispersion. Chemical mechanical planarization (CMP) slurries are liquid dispersions containing active chemicals...
-
Honing, Lapping, and Super-finishing Machines - (129 companies)...mirrors finishes are common), and produces a close fit between mating surfaces. Lapping media, compounds, pastes, or slurries consist of fine-grained loose abrasive particles suspended in a viscous or liquid carrier. Examples of carriers include... -
Superabrasives and Diamond Tools - (402 companies)Superabrasives and diamond tools include grinding wheels, abrasive saw blades, wheel dressers, single-point tools, and other products that use diamond or cubic boron nitride (CBM) abrasive grains.
-
Semiconductor Foundry Services - (178 companies)Processes Performed. Semiconductor foundry services perform processes such as chemical mechanical polishing (CMP), physical vapor deposition (PVD), chemical vapor deposition (CVD), screen printing, dry etching, wet etching, photolithography, wafer...
-
Semiconductor Wet Process Equipment - (119 companies)Semiconductor wet process equipment performs a variety of wet processing applications including etching, washing, chemical mechanical polishing (CMP), and spin coating in semiconductor or microelectronics manufacturing. Semiconductor wet process...
-
Nanomaterials - (255 companies)...of biomarkers and cells, electronics such as mircoprocessors and nanorobotos,. NanopowdersImage Credit: TPL, INC. Composed of nanoparticles having an average diameter below 50nm. Targeted drug delivery, solid fuels, conducting pastes, and specialized...
-
Solder - (246 companies)Solders include low melting point metal alloys usually in wire, powder, preform or paste forms. Solders are metal alloys with low melting points that are used to join metals together. Solder is a metal alloy used to join metals together. The term...
Product News
-
Ensinger, Inc.
TECAPEEK CMP natural TECAPEEK CMP is a Victrex (R) PEEK polymer specially modified for applications in the semiconductor industry, and more specfically for parts in CMP (chemical mechanical planarization) equipment. The material maintains the outstanding property profile inherant to PEEK, which includes high mechanical strength and dimensional stability for tightest part tolerances, along with a low tendency to creep. TECAPEEK CMP is of a higher purity level than standard TECAPEEK. This combined with excellent... (read more)Browse Plastic Plate, Rod, and Stock Shapes Datasheets for Ensinger, Inc. -
MacDermid Alpha Electronics Solutions
Alpha® Solder Pastes Our offering includes leading lead-free, no-clean, halogen-free solder paste technologies for applications such as fine feature printing, low temperature processing, and many others. Alpha's (R) solder pastes are available in a wide range of alloy offerings, including low-Ag SACX Plus (R) that offers excellent soldering performance at an alloy cost approximately 30% less than SAC305. The SACX Plus (R) alloy is also offered in Alpha (R) solder bar, preforms, wire, and spheres for assured alloy... (read more)Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
MacDermid Alpha Electronics Solutions
Next-generation Ultra-low Voiding Solder Paste ALPHA OM-362, next-generation ultra-low voiding solder paste. This lead-free, zero-halogen, no-clean paste can deliver less than 10% voiding on Bottom Termination Components (BTCs). The design characteristics of BTCs create void removal challenges during the soldering process, which can lead to ineffective thermal dissipation and mechanical strength in post-reflow applications. Low-voiding solder pastes are an important material in improving board level reliability by reducing this effect... (read more)Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
MacDermid Alpha Electronics Solutions
New Packaging Option - ALPHA Argomax Sinter Paste To meet customer requirements, MacDermid Alpha is now able to supply a jar which has a hole in the bottom (dispense port) from which paste can be dispensed. The new jar with dispense port is in addition to standard jars and the 600 gram and 3000 gram cartridges already available. The new jar reduces material waste, allowing customers to utilize >=99% of the ALPHA Argomax sinter paste, and reduces downtime changing containers with the jar available in sizes up to 250 grams. The jar is compatible... (read more)Browse Nanomaterials Datasheets for MacDermid Alpha Electronics Solutions -
MacDermid Alpha Electronics Solutions
Low Residue Solder Paste for Fine-Pitch Components ALPHA OM-372 is designed for superior performance on assemblies with ultra-fine pitch components requiring excellent stencil transfer efficiency and high electrical reliability, such as those found in mobile and wearables, computing, and medical assemblies. Innovative solder paste enabling next generation high density assembly designs. ALPHA OM-372 provides best-in-class electrochemical reliability on fine pitch, low standoff components, requiring excellent stencil transfer efficiency and high... (read more)Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
Saint-Gobain Tape Solutions
Skived PTFE, Paste Extruded and UHMW Film it possible to control to the tightest tolerances in the world. Fluorowrap paste extruded PTFE is produced by blending fine-powder PTFE with a lubricant and pressing the film through an extrusion die. Multiple series of calendar rollers and dry cans set the dimensions of the film and drive off the lubricant. Paste extruded film is unsintered. Applications include wire insulation and battery/fuel cell components; the most common use is in plumber's thread seal tape. Saint-Gobain services... (read more)Browse Electrical Insulation and Dielectric Materials Datasheets for Saint-Gobain Tape Solutions -
ARDE Barinco, Inc.
Mix, Knead, Stir High Viscosity Mixtures and Paste The helical blades create a positive folding action that results in fast, efficient mixing of high-viscosity liquids, pastes, dry or moist powders...even media as viscous as wet sand. All Double Helixx mixers ensure thorough mixing throughout the entire batch because they operate in planetary fashion. Larger models accomplish this by either a motorized base that rotates the mixing vessel, or mechanical rotation of the dual mixing tools themselves. Medium-size models have a free-swivelling base... (read more)Browse Industrial Mixers Datasheets for ARDE Barinco, Inc. -
MacDermid Alpha Electronics Solutions
ALPHA® OM-565 HRL3 Low Temperature Solder Paste ALPHA OM-565 HRL3 low temperature solder paste is designed to mitigate warpage induced defects in temperature sensitive chip-scale packages. The solder paste enables peak reflow temperatures of 175 C and superior wettability to minimize post reflow defects such as Non-Wet-Open (NWO) and Head-in-Pillow (HIP). The ALPHA OM-565 chemistry enhances electrochemical performance over existing low melt point solders and provides excellent compatibility when used in combination with alternative ALPHA... (read more)Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
MacDermid Alpha Electronics Solutions
ALPHA OM-220 Ultra-low Temperature Solder Paste ALPHA OM-220 innovative chemistry enables peak reflow temperatures below 150 C, making it ideal for soldering heat sensitive components and sub-assemblies. ALPHA OM-220 permits cascaded / hierarchical soldering, as well as novel hermetic sealing solutions. This technology is well suited for a broad range of end use applications including computers, smartphones, various consumer electronics, in-cabin automotive electronics, and medical devices. Key Benefits: Low reflow peak temperature < 150 C. (read more)Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
Ensinger, Inc.
TECAPEEK SE natural TECAPEEK SE is a Victrex (R) PEEK polymer modified for Semiconductor industry applications. Due to its low ionic impurities, this material is well suited to applications where high purity is of great concern, such as are found in semiconductor or CMP applications. High dimensional stability and excellent chemical, abrasion and wear resistance, make it an excellent choice for parts with tight tolerances or that require long wear life in harsh environments. (read more)Browse Plastic Plate, Rod, and Stock Shapes Datasheets for Ensinger, Inc.
More Information
Indicates content that may require registration and/or purchase.
-
Physicochemical Properties and Biocompatibility of White Dextrin Modified Injectable Calcium–Magnesium Phosphate Cement
The results showed that WD imparted anti‐washout to the as‐ CMP paste , whereas MPC simultaneously improved the paste anti‐washout and fast‐setting.
-
Vasovagal Syncope
Table 23.2 Clinical features suggesting a cardiac etiology of syncope Family history: Early myocardial infarction Unexplained sudden death in family members <40 years old Known familial arrhythmia or heart disease (LQTS, SQTS, CMP ) Past medical history: Symptoms suggesting heart disease Known …
-
Effect of rhBMP‐2 on tibial plateau fractures in a canine model
In the BMP and CPX groups, the BMP or CMP paste was then injected into the subchondral void using a 3.0 cc syringe and 18-gauge spinal needle.
-
Microelectronic Applications of Chemical Mechanical Planarization
Past CMP technologies have been notorious for the high number of defects they produce and as a consequence actually slowing yield learning rather than enhancing it.
-
http://dspace.mit.edu/bitstream/handle/1721.1/3901/IMST005.pdf?sequence=2
Past CMP test masks have generally consisted primarily of “up” regions with smaller areas of down .
-
Curating Research Careers The Cedar Mesa Project, Uta
The publications, reports, and records produced by past CMP research .
-
First Joint Meeting of The Wound Healing Society and the European Tissue Repair Society
Collagen Microbeads Paste ( CMP ) is a sterile paste of microbeads prepared with human type Ill+I collagen (crosslinked by periodic acid) by a prilling process (Dumas et al., 1992, Drug Dev.
-
http://dspace.mit.edu/bitstream/handle/1721.1/17983/57189433-MIT.pdf?sequence=2
In Chapter 2, we provided an in depth examination of past CMP .
-
Pharmacist prescribing in Northern Ireland: a quantitative assessment
In this present study, onerous paperwork associated with the CMP was cited as a barrier when pharmacists first qualified; in the past CMPs (supplementary prescribing only) were con- sidered restrictive, time consuming and unsuitable in get- ting agreement from the IP [8].
-
A diode-based bolometer implemented on micromachined CMOS technology for terahertz radiation detection
[4] Courtois, B., Di Pendina, G., and Torki, K., “MEMS fabrication at CMP : past and present,” MEMS: Technology, Fabrication Processes and Applications, Nova Science Publishers, (2009).
