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Welcome to GlobalSpec - a trusted source for engineers and industrial professionals.
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CMP Paste
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Product Announcements
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Saint-Gobain Surface Conditioning Group 
Competition Chemicals, Inc. 
Competition Chemicals, Inc. 
Competition Chemicals, Inc.
Competition Chemicals, Inc.
Competition Chemicals, Inc. |
Products/Services for CMP Paste
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Abrasive Compounds and Abrasive Slurries - (291 companies)Abrasive Compounds and Abrasive Slurries Information Abrasive compounds and abrasive slurries are used to improve surface finish or flatness. They consist of fine abrasives in slurry, bar, powder or paste form. There are many different types... Search by Specification | Learn More -
Laps and Lapping Tools - (64 companies)Laps and lapping tools are used for precision surface finishing, often in conjunction with loose abrasive compounds. Learn More -
Buffs and Buffing Wheels - (108 companies)Buffs and buffing wheels are used to hold finishing compounds and polish parts made of metal, plastic, ceramic, glass, wood, stone, silicon, or optical materials. Search by Specification | Learn More -
Superabrasives and Diamond Tools - (388 companies)Superabrasives and diamond tools include grinding wheels, abrasive saw blades, wheel dressers, single-point tools, and other products that use diamond or cubic boron nitride (CBM) abrasive grains. Search by Specification | Learn More -
Semiconductor Foundry Services - (177 companies)...precursors form deposits of oxides, nitrides, dielectric ceramics or other complex compounds. Screen printing uses a metal paste or ink to form thick-film circuits or interconnects. Dry etching processes such as plasma or reactive ion etching (RIE... Search by Specification | Learn More -
Semiconductor Wet Process Equipment - (131 companies)Semiconductor wet process equipment performs a variety of wet processing applications including etching, washing, chemical mechanical polishing (CMP), and spin coating in semiconductor or microelectronics manufacturing. Semiconductor wet process... Learn More
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Solder - (224 companies)Solders include low melting point metal alloys usually in wire, powder, preform or paste forms. Solders are metal alloys with low melting points that are used to join metals together. Solders are metal alloys with low melting points that are used... Search by Specification | Learn More
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Nanomaterials - (266 companies)...of biomarkers and cells, electronics such as mircoprocessors and nanorobotos,. NanopowdersImage Credit: TPL, INC. Composed of nanoparticles having an average diameter below 50nm. Targeted drug delivery, solid fuels, conducting pastes, and specialized... Search by Specification | Learn More
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Industrial Inks - (322 companies)Industrial inks are liquids, powders or transfer tapes printed, sprayed, rolled or transferred onto substrates or media to create markings, patterns, print or graphics. Search by Specification | Learn More
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Filler Alloys and Consumables - (599 companies)Filler metal alloys and consumables used in welding, brazing or soldering include items in rod sheet, wire spool, coated stick, weld stud, powder, preform or paste forms. Consumables such as fluxes, cleaners, tungsten tips, resistance welding... Search by Specification | Learn More
Product News for CMP Paste
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Simrit
CMP Gaskets and MembranesNew process is changing the way semiconductor products are produced. Simrit, a division of Freudenberg-NOK, introduced its new product line of chemical mechanical planarization (CMP) gaskets and membranes at the SEMICON West 2007 show in San Francisco (July 16 to 20, 2007). "Simrit is excited to announce its new line of elastomer products for CMP processes," said Patrick Giorda, director, semiconductor market, Simrit. "The new line of CMP consumable parts will include membranes and gaskets... (read more) -
Saint-Gobain Surface Conditioning Group
Fine Polishing Slurries for Electronic CMPChemical Mechanical Planarization (CMP) has become one of the vital processes in the production of semiconductor devices which use slurries and pads to polish/planarize the surface of wafers to near defect free surfaces. Saint-Gobain's Polycrystalline Alumina Polishing Slurries are extremely fine particle/slurries intended for semiconductor and electronic materials CMP processes. Products are designated Gen 2, Gen 3, Gen 4, and Gen 5 Polycrystalline Alumina. (read more)Browse Abrasive Compounds and Abrasive Slurries Datasheets for Saint-Gobain Surface Conditioning Group -
Tekscan, Inc.
CMP Wafer Polishing Pressure DistributionThe I-Scan® system provides the diagnostic tools necessary to evaluate, view, and balance the forces acting on a silicon wafer during the polishing process. A study was conducted to collect and analyze the pressure distribution under a polishing head. Using a unique I-Scan pressure sensor with a sensing area of 9 1/2" X 9 3/4", measurements were taken to determine the pressure distribution of the polishing head and the wafer interface. Balancing these pressures during machine set-up can assist... (read more) -
Ferro Corporation
Conductive PastesFerro produces a wide variety of silver pastes and special products for automotive glass applications, including heating grids and antennas. Furthermore, Ferro, as a producer of enamels, frits and pigments, is in a position to also provide customers with. suitably formulated ceramic based materials, such as glass enamels which are compatible to our conductive coatings range. Ferro's Customer Service group will be pleased to discuss your requirements and recommend suitable products. tailored... (read more)Browse Conductive Compounds Datasheets for Ferro Corporation -
Lucas Milhaupt Global Brazing Solutions
Brazing & Soldering pastesBrazing & Solder Pastes. Pastes products consist of an atomized filler metal powder, a flux (when necessary) and a binder to hold the components together in suspension. Pastes, like preforms, are advantageous because with the correct dispensing equipment, tight control can be made on material usage. And because pastes are essentially formless in nature, one paste product could be suitable for a wide variety of joint configurations. Additional advantages of pastes include the ability... (read more)Browse Braze and Brazing Alloys Datasheets for Lucas Milhaupt Global Brazing Solutions -
Indium Corporation
Custom Solder Pastes & Preforms,Do you struggle with your solder paste to get consistently good, strong joints due to thinner stencils, smaller components, and smaller boards? Try Indium Corporation's Solder Fortification Preforms. We provide the right alloy with the right volume of solder in tape & reel that will integrate easily into your process. See the video below "SUPER-FAST Solder Preform Placement". Solder preforms are manufactured shapes of solder or braze metals designed to fit a specific joint configuration... (read more) -
Indium Corporation
Package-on-Package Solder PasteIndium9.88-HF is an air-reflow, halogen-free package-on-package (PoP) solder paste available in both SAC305 and SnPb alloys. It eliminates defects due to package warping, head-in-pillow, and ball non-coplanarity. It has excellent solderability, a long dipping life ( >8 hours), and can be used on devices down to 0.4 mm pitch. Package-on-Package (PoP) and System-in-Package(SiP) are an exciting new technology that allows standard SMT assembly techniques to be used to manufacture combinations... (read more) -
Indium Corporation
Wafer & Substrate Bumping with Solder PasteThere are lots of ways of forming deposits of solder in a small form factor, and solder paste printing remains one of the most reliable, although yield drops dramatically at below 120microns pitch (some say 100microns). If you are stencil printing solder paste, there are two guiding principles Sbiroli's Rule & Anglin's Rule. Sbiroli's Rule: The width of the stencil opening must be 7 particles or greater. By the word "particle", we err on the side of caution and refer to the highest... (read more) -
Indium Corporation
Solder Paste Eliminates Head in PillowIndium Corporation's Indium8.9HF-1 is a probe-testable, no-clean, halogen-free, Pb-free solder paste that eliminates graping and head-in-pillow defects. Its unique activator package and outstanding oxidation barrier allows it to coalesce and wet as good as, or better than, its halogen-containing counterparts. It also has unsurpassed print transfer efficiency and response-to-pause printing. Halogen-Free as flux and residue - view test report. Excelling Print Transfer efficiency and RtP. No Head... (read more) -
Jaygo, Inc.
Dual & Multi Shaft Mixers for Viscous Paste ProdsJaygo Dual Shaft Variable Speed Mixers and Disperser are designed to disperse low to highly viscous paste products. They have both a low speed heavy duty mixing blade, or full sweep agitator, and high-speed, high-shear dispersing blade. The heavy duty low speed blade moves the material from the container wall to the work zone of the high shear blade. Available in single or dual motor drives, through the floor mounted, tank mounted, portable tub and vacuum designs (read more)Browse Industrial Mixers Datasheets for Jaygo, Inc.
Conduct Research
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Commissioning Success Demands Collaboration
. A Commissioning Master Plan (CMP) is a practical way to define commissioning goals and align them with overall project goals. The alignment and integration of the plant s commissioning teams objectives with those of the plant project team can improve quality and save both time and money. During...
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Contract Research in China: A Catalyst for Pharmaceutical Industry Growth
with 130 Chinese manufacturers have obtained U.S. FDA cGMP certificates, and 50 manufacturers have obtained 90 European COS certificates. Among them, 10 finished drug manufacturers have received the FDA CMP certification. [9] Current Situation The 300-plus CROs in China have formed an integrated...
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MICRO:Semicon Southwest '98 - Technical/Business Programs (Oct. '98, p.127)
Stabilization of Alumina Slurries in Presence of Oxidizers for Tungsten Chemical Mechanical Polishing B.J. Palla, D.O. Shah, M. Bielmann, and R.K. Singh, University of Florida Evaluation of Manufacturing Handling Properties of Hydrogen Peroxide Based Tungsten CMP Slurry John P. Bare and Budge Johl, FSI...
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MICRO:Semicon Southwest p.2 (Oct '99)
to Abrasive Particle Size for CMP Byron J. Palla and Dinesh O. Shah, University of Florida The Performance of Two Purification Media in Their Removal of Impurities from Inert Gases Jian Wei, Dmitry Kondrashov, and Armando Colorado, Millipore Reducing Complexity of Wafer Flow to Improve Quality...
Engineering Web Search: CMP Paste
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cmp (Unix) - Wikipedia, the free encyclopedia cmp (Unix) From Wikipedia, the free encyclopedia cmp is a command line utility for computer systems that use Unix or a Unix-like operating system. |
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cron - Wikipedia, the free encyclopedia |
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IBM WebSphere Developer Technical Journal: Using relational... to create and use a CMP EJB component as the front end to stored procedures now enables you to enjoy the benefits of using CMP EJB components and See International Business Machines Corp. Information |
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Transene Company Inc. - Advanced Materials for Electronics -... Etch Paste Electroplating Chemicals Encapsulants CMP Polishing Slurries About Transene New Products See Transene Company, Inc. Information |
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Freeware List for SPARC and Solaris 10 |
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OpenBSD 4.8 changes |
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OTN Discussion Forums : Workflow that generates email with... CMP Posts: 19 Registered: 03/16/07 Workflow that generates email with link to referenced record? Posted: Jul 13, 2008 12:53 PM in response to: CMP |
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In-Container Testing with JUnit See Oracle Corporation Information |
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Market, legislative forces driving lead-free conversion, says... conversion, says report Article Id: 30000276 Site Name: eetimes Company: CMP Media LLC Publication Date: 08/24/2004 11:00:00 Authors: Spencer Chin |
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Hot connections for SMT relays - Coto Technology is now using a higher-temperature solder and solder paste for internal connections on its ultraminiature 9800-series surface-mount |
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