I O Chipsets

Description: The Intel® 3200 and Intel® 3210 Chipsets are designed for use with Intel® Xeon® processors 30001 sequence, in the LGA775 package in UP server platforms. The chipset contains two components: Memory Controller Hub (MCH) and Intel® I/O Controller Hub 9 (ICH9). The MCH

Description: The Intel® 3200 and Intel® 3210 Chipsets are designed for use with Intel® Xeon® processors 30001 sequence, in the LGA775 package in UP server platforms. The chipset contains two components: Memory Controller Hub (MCH) and Intel® I/O Controller Hub 9 (ICH9). The MCH

Description: The second in a family of volume server chipsets, the Intel® E7501 chipset supports dual-processor (DP) server systems optimized for the Intel® Xeon® processor. The Intel E7501 chipset design delivers maximized system bus, memory and I/O bandwidth to enhance performance,

Description: The Intel® E7500 chipset, a volume chipset, supports dual-processor (DP) server systems optimized for the Intel® Xeon® processor with 512 KB L2 cache and Intel® NetBurst® microarchitecture. The Intel E7500 chipset design delivers maximized system bus, memory and I/O

Description: low energy System-on-Chips (SoCs) is specifically designed to help engineers meet the needs of today’s always-on world. CSR102x provides extensive and flexible I/O capabilities designed to simplify integration into each target application, eliminating expensive interface components.

• IC Package Type: QFN
• Interface: I2C
• Technology: Bluetooth

Description: I²C Input/Output Analog I/O 1 ADC 1 ADC 10-bit General Purpose IOs 15 PWM (LED) 5 Quadrature Decoder 4 Quadrature Decoder

• IC Package Type: LGA
• Interface: I2C
• Technology: Bluetooth

Description: /Output Analog I/O 2 ADC 1 ADC 10-bit General Purpose IOs 37 PWM (LED) 5 Quadrature Decoder 4 Quadrature Decoder Operating Temperature Range Maximum

• IC Package Type: QFN
• Interface: I2C
• Technology: Bluetooth

Description: UART SPI I²C Input/Output Analog I/O 3 General Purpose IOs 12 PWM 4 Quadrature Decoder 2 Hardware Quadrature Decoder Operating Temperature

• IC Package Type: QFN
• Interface: I2C
• Technology: Bluetooth

Description: W - Intel Core i7-4700MQ Processor (6M Cache, up to 3.40 GHz); 47W NOTE: The 4th Generation Intel Core Series Mobile Processors in the Socket G3 (rPGA947) package are not on the Intel Embedded Road Map and may go E.O.L. without prior notice. Please ask your sales representative for

• Chipset Type: Intel® Chipset
• LAN / Networking: 2
• Max Speed: 1.07 to 1.6 GHz
• Memory Capacity: 16 GB

Description: Micro Computer with Intel® Core™ i7/i5/i3 Processor, Intel® H110 Chipset, 5 x Expansion Slots, and 300W 80PLUS PSU 6th/7th Gen Intel® Core™ i7/i5/i3/Celeron® processer with Intel® H110 chipset 1 x PCIe x16 (3 x PCI for AIMC-3422-01), 1 x

Description: PCIe Multiple display I/O supports versatile Tri display functions for HDMI, DP, LVDS/eDP Two 260-pin SO-DIMM up to 32GB DDR4 2133 MHz SDRAM Supports Intel® Core™ core i7-6600u /i7-7600u /core i5-6300u / i5-7300u/ core i3-6100u/ i3-7100u/ celeron

• Chipset Type: Intel® Chipset, Other
• Max Speed: 2.6 GHz
• Memory Capacity: 32 GB

Description: -to-install isolated input and relay output digital I/O capabilities to any PC or embedded system with a USB port. Featuring 16 Form C (SPDT) electromechanical relays and 16 optically isolated digital inputs, the unit is the smallest of its kind for digital monitoring and control using USB

• Computer Bus: USB
• Connection to Host: USB
• Digital I/O Channels: 16 #
• Form Factor: Printed Circuit Board (PCB), DIN Rail, Stand Alone

Description: IMBA-967 encompasses the Intel® 32 nm Core? i7/i5/i3 processors and the Intel® Q67chipset and is designed with one PCI-e [x16], one PCI-e [x4], one PCI-e [x1] and four PCI interfaces for expansion flexibility. On top of that, there is a wide variety of I/O ports

• Chipset Type: Intel® Chipset
• Memory Capacity: 0.2560 GB
• On Board Features: On-board Ethernet Controller?
• Processor / CPU Type: Other

Description: 4th Gen Intel® Core™ U-series (i5/Celeron®), 3.5" MI/O-Compact SBC, DDR3L, VGA, HDMI/DP*, 48-bit LVDS, 2GbE, 2 x Mini PCIe, mSATA, Fanless, MIOe 4th Gen Intel® Core™ U-series (i5/Celeron®), 1 x DDR3L-1600/1333 SO-DIMM support up to 8 GB

• Cache Memory (L1 & L2): 3000 KB
• Chipset Type: Intel® Chipset
• Features: RJ-45 Connectors?
• Operating Temperature: -40 to 185 F

Description: 3.5" SBC supports 8th / 9th Gen Intel® Coffee Lake-S, i9 / i7 / i5 / i3 & Pentium / Celeron (35W) CPU, Intel® Q370 chipset, eDP, 5 x Intel Gb Ethernet, 8 x USB, 8DI / 8DO, 4 x COM, 1 x Mini PCIe, 1 x M.2, 1 x PCIe, 1 x SIM, SMBus LEX SYSTEM 3I370HW, with

• Chipset Type: Intel® Chipset
• Communication Networks: Ethernet
• I/O Bus Specifications: USB, Other
• Operating Temperature: -4 to 140 F

Description: i9 / i7 / i5 / i3 Pentium / Celeron (35W) CPU, Intel® Q470 chipset, eDP, 5 x Intel Gb Ethernet, 8 x USB, 8DI / 8DO, 4 x COM, 1 x Mini PCIe, 1 x M.2, 1 x PCIe, 1 x SIM, SMBus LEX SYSTEM 3I470HW, with Intel 10th Gen Comet Lake-S Core i CPU, equipped

• Chipset Type: Intel® Chipset
• Communication Networks: Ethernet
• I/O Bus Specifications: USB, Other
• Operating Temperature: -4 to 158 F

Description: The IMBM-B75A is a Micro-ATX form factor with an Intel® Core? i7-3770 or i5-3550S LGA 1155 processor and Intel® B75 Express chipset. Moreover, up to 32GB of DDR3 1066/1333/1600 (1600 for 3rd generation processor) memory is feasible with four DIMMs. Its five SATA connectors allow

• Chipset Type: Intel® Chipset
• On Board Features: Serial Interface (RS232, RS422, RS485)?, On-board Ethernet Controller?
• Processor / CPU Type: Other

Description: of I/O selections, and multiple performance chip levels to meet the most extreme industrial conditions. With hundreds embedded board level products to choose from, they are confident they can find the motherboard perfect for your industrial application.

• Chipset Type: Intel® Chipset
• Memory Capacity: 16 GB
• On Board Features: Serial Interface (RS232, RS422, RS485)?
• PCI Express: 1

Description: abundant array of I/O selections, and multiple performance chip levels to meet the most extreme industrial conditions. With hundreds embedded board level products to choose from, they are confident they can find the motherboard perfect for your industrial application.

• Chipset Type: Intel® Chipset
• Memory Capacity: 32 GB
• On Board Features: Serial Interface (RS232, RS422, RS485)?
• PCI Express: 1

Description: The EPIC-QM57 supports Intel® Core? i7/i5 processor with up to two 204-pin SODIMM sockets to support for 8GB of DDR3 800/1066 system memory. These features married up with the Intel® QM57 chipset present a high performance solution. For high-speed network communications, the

• Chipset Type: Intel® Chipset
• Features: Watchdog Timer?, RJ-45 Connectors?
• Operating Humidity: 0.0 to 90 %
• Operating Temperature: 32 to 140 F

Description: The GENE-QM77 is a 3.5" Subcompact Board with an integrated 3rd generation Intel® Core? i7 processor and mobile Intel® HM76 or Intel® QM77 Express chipset. The SODIMM socket supports up to 8GB of DDR3 memory, while two SATA 6.0Gb/s ports and one CFast? slot is available

• Chipset Type: Intel® Chipset
• Features: Watchdog Timer?, RJ-45 Connectors?
• Operating Humidity: 0.0 to 90 %
• Operating Temperature: 32 to 140 F

Description: vision and high workloads. The 2I110D combines Intel's new graphics architecture and up to 32GB DDR4 memory to ensure improved graphics performance. The 2I110D also provides high-speed I/O ports including 4 x GbE LAN ports (3 x 2.5G and 1x GbE), 3 x USB 3.0, 6 x USB 2.0 , 2 x

• Chipset Type: Intel® Chipset
• Communication Networks: Ethernet
• I/O Bus Specifications: USB, Other
• Operating Temperature: -40 to 158 F

Description: their clients with industrial motherboards featuring long life cycles, rugged components and standard form factors for seamless compatibility, reliability and manageability. Industrial PC's selection of industrial motherboards offers a wide range of temperature specs, an abundant array of I/O

• Chipset Type: Intel® Chipset
• Memory Capacity: 32 GB
• On Board Features: Serial Interface (RS232, RS422, RS485)?
• Processor / CPU Type: Other

Description: specs, an abundant array of I/O selections, and multiple performance chip levels to meet the most extreme industrial conditions. With hundreds embedded board level products to choose from, they are confident they can find the motherboard perfect for your industrial application.

• Chipset Type: Intel® Chipset
• Memory Capacity: 32 GB
• On Board Features: Serial Interface (RS232, RS422, RS485)?
• PCI Express: 1

Description: Graphics Core, VGA Support AC97 Codec Audio Daughter Board Optional Ultra ATA100 x 1, SATA 1.5Gb/s x 2, CompactFlash Type 2 x 1 USB2.0 x 5, RS-232/422/485 x 1, RS-232 x 3, Parallel x 1, IrDA x 1, Digital I/O ISA Expansion +5V, +12V Operation, AT Power

• Chipset Type: Intel® Chipset
• Communication Networks: Ethernet
• Features: Keyboard Support?, Mouse Support?, RJ-45 Connectors?
• Hard Drive Support?: IDE Interface, Other

Description: 2.5' wafer I/O Embedded IPC Board supports, Intel® Elkhart Lake ATOM® x6000E Series, HDMI, LVDS, eDP, 2 x Intel 2.5 Gb Ethernet, 6 x USB, Touch Screen, 4 x COM, 1 x Mini PCIe, 1 x M.2, 1 x Nano SIM, HD Audio, 4DI / 4DO, SMBus LEX SYSTEM 2I640HW is a 2.5” (102 x

• Chipset Type: Intel® Chipset
• Communication Networks: Ethernet
• I/O Bus Specifications: USB, Other
• Operating Temperature: -4 to 158 F

Description: support up to 8GB Intel Gen 7 DirectX®11.1 support, Dual Independent display: 18/24bit LVDS, VGA, DP/HDMI Flexible design using integrated multiple I/O: MIOe to approach vertical applications & keep domain knowhow Intel GbE support, Rich I/O interface with 2 COM, 1 SATA, 4 USB 2.0,

• CPU Speed: 1830 MHz
• Cache Memory (L1 & L2): 2000 KB
• Chipset Type: Intel® Chipset
• Operating Temperature: -40 to 185 F

Description: , even with the latest LV 1.66GHz Core Duo from Intel. Cooling is directly conductive from the CPU and chipset through a heat spreader attached to the bottom of the enclosure and isolated from expansion I/O cards. The NANO I/O Server CD is the perfect product for users ranging

Description: -based VME to PCIe-bridge that solved the end of life issue with the TSI148 VME interface chip. The XVME-6510 is a high performance 6U VME single board computer based on the 4th Generation Intel® Core™ i7 processor and utilizes the Intel 8-Series QM87 PCH chipset for extensive

• CPU Speed: 2400 MHz
• Cache Memory (L1 & L2): 6000 KB
• Chipset Type: Intel® Chipset
• Communication Networks: Ethernet

Description: inputs 8 input ranges, 4 unipolar and 4 bipolar, per 4-channel programmable Autocalibration and oversampling for real-time accurate data A/D starts via software, timer, or external trigger 2 16-bit analog outputs available 16 high-current digital I/O lines

• Analog Input Channels: 64 #
• Computer Bus: USB
• Connection to Host: USB
• Differential Channels: Yes

Description: available 16 high-current digital I/O lines 16-bit programmable counter/timer I/O connections made via DB37 and DB25 connectors Type B USB connector features industrial strength and high-retention design Now with Firmware 2.0 features! Onboard Watchdog Timer

• Analog Input Channels: 32 #
• Computer Bus: USB
• Connection to Host: USB
• Differential Channels: Yes

Description: support for a variety of internet/ intranet applications, and four digital I/O ports maximize flexibility for inter-device communication. An internal PCI Express Mini Card socket and USIM slot support extension functions, such as wireless connection (3G/WiFi/BT/GPS), video capture, Secure

• Operating System: Microsoft®
• Operating Temperature: -4 to 158 F
• Processor: Intel®
• RAM: 2 GB

Description: B3 Version Chipset Supports the Intel 2nd generation Core i7 and Core i5 processors in the 1155 package Intel P67 single chip architecture 10 Phases Power Design Support 4-DIMM DDR3-2200(OC)/2133(O C)/2000(OC)/1600(OC

• Chipset Type: Intel® Chipset
• Memory Capacity: 32 GB
• On Board Features: Serial Interface (RS232, RS422, RS485)?, On-board Ethernet Controller?
• Processor / CPU Type: Other

Description: Key Features 1. Dual AMD® Opteron™ Support, (Dual Core Ready) 1000 MHz HyperTransport Link 2. AMD® 8131 PCI-X Tunnel / AMD 8111 I/O Chipset 3. Up to 16GB DDR 400 SDRAM (or) Up to 32GB DDR 333 SDRAM (or) Up to 32GB DDR 266 SDRAM 4. Dual-port Gigabit LAN/Ethernet Controller 5. 1x 64-bit

Description: Embedded Box Computers 17 350 cd/m2 SXGA Panel PC with Intel H81 chipset, W/O CPU (TDP Max. 65W) & RAM, support iRIS-2400, black color, PSU ACE-4520C, resistive touch window, R10