Products & Services
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Supplier: Conax Technologies
Description: application shown is the introduction of a laser into a photolithography tool used for interferometry measurements. Interferometers are used to accurately control stage movement for the proper positioning of the wafer and reticle stages relative to each other. The need for high accuracy in
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Description: Novaclad® HDI is built upon the rock of our proprietary adhesiveless laminate that leverages vacuum deposition, additive copper processes, and photolithography to enable fine line circuitry coupled with laser-drilled micro-vias. Novaclad HDI circuitry withstands the toughest conditions in
- Applications: Aerospace Equipment, Automotive Equipment, Commercial Equipment, Industrial Equipment, Medical Equipment, Military Equipment
- Component Mounting: Surface Mount, Through-Hole
- Features: Single Sided, Double Sided, Shielding
- Surface Finish: Gold, Nickel, Silver, Tin
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Supplier: WDI Wise Device Inc.
Description: ranging from infrared (1064 nm) to deep ultraviolet (266 nm). This innovation facilitates efficient trimming of metals, silicon and ITO as well as open line repair, within a single piece of repair equipment. The MIC4 is fully compatible with the ATF4, ATF5, and LLC6 linear lens changer
- Applications: CVD / PVD Films, Electroplated Films, Packaged ICs / Ceramic Substrates, Photolithography / Patterning, Other
- Form Factor: Monitor / Instrument
- Measurement Capability: Defects / ADC, Other
- Mounting / Loading: Floor Mounted / Stand-alone
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Description: information provided with such machines. Excluded from the requirements of this document are: photolithography; holography; equipment used in medical applications; data storage; laser printers; and copiers.
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Supplier: Metrigraphics LLC
Description: The Metrigraphics Division of DRC is a leading worldwide supplier of ultra-high, precision, custom components for Original Equipment Manufacturers (OEMs). We have applied our core technologies of electroforming, photolithography, and thin-film sputtering to help customers increase the
- Functional / Performance: Conductive, Dielectric
- Industry: Electronics, OEM / Industrial
- Material / Substrate Capabilities: Aluminum, Ceramic, Composites, Copper / Copper Alloys, Glass, Metal, Nickel / Nickel Alloys, Precious Metals, Plastic, Stainless Steel, Steel / Steel Alloys, Titanium
- Regional Preference: North America, United States Only, Northeast US Only
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Supplier: MACOM
Description: MACOM's fixed attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metallized ground connection on the back. This ground is wrapped around on the four corners of the chip so
- Attenuation: 1 to 30 dB
- Attenuator Type: Fixed
- Package Type: Flat Pack (FPAK)
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Description: This document describes laser radiation hazards arising in laser processing machines, as defined in 3.7. It also specifies the safety requirements relating to laser radiation hazards, as well as the information to be supplied by the manufacturers of such equipment (in addition to that
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Description: dealing with noise as a hazard from laser processing machines are not included in ISO 11553-1:2005. They will be included in a subsequent amendment. ISO 11553-1:2005 is not applicable to laser products, or equipment containing such products, which are manufactured solely and expressly for the
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Description: . Requirements dealing with noise as a hazard from laser processing machines are not included in ISO 11553-1:2005. They will be included in a subsequent amendment. ISO 11553-1:2005 is not applicable to laser products, or equipment containing such products, which are manufactured solely and
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Supplier: SPIE - Education
Description: Advanced composite materials have been used successfully in optomechanical systems since the 1970s. They are being used increasingly in numerous commercial and military applications including: optical benches, telescopes, binoculars, mirrors, metrology and photolithography equipment,
- Modality: On-site / In Plant
- Technology / Subject: Design / Engineering Methods (ESDU, DFx, etc.), Photonics / Optics
- Type: Course
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Supplier: CSA Group
Description: . Requirements dealing with noise as a hazard from laser processing machines are not included in ISO 11553-1:2005. They will be included in a subsequent amendment. ISO 11553-1:2005 is not applicable to laser products, or equipment containing such products, which are manufactured solely and
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Supplier: Edmund Optics Inc.
Description: with standard microscope objectives, these components are ideal for applications requiring high throughput and excellent resolution in the UV or IR, including FTIR spectroscopy, ellipsometry, photolithography, and semiconductor inspection.The objectives feature an infinite conjugate design
- Lens Type: Objective Lens
- Magnification: 15 X
- Numerical Aperture: 0.2800 NA
- Working Distance: 23.75 mm
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Supplier: Edmund Optics Inc.
Description: with standard microscope objectives, these components are ideal for applications requiring high throughput and excellent resolution in the UV or IR, including FTIR spectroscopy, ellipsometry, photolithography, and semiconductor inspection.The objectives feature an infinite conjugate design
- Lens Type: Objective Lens
- Magnification: 15 X
- Numerical Aperture: 0.2800 NA
- Working Distance: 23.75 mm
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Supplier: Edmund Optics Inc.
Description: with standard microscope objectives, these components are ideal for applications requiring high throughput and excellent resolution in the UV or IR, including FTIR spectroscopy, ellipsometry, photolithography, and semiconductor inspection.The objectives feature an infinite conjugate design
- Lens Type: Objective Lens
- Magnification: 15 X
- Numerical Aperture: 0.2800 NA
- Working Distance: 23.75 mm
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Supplier: Edmund Optics Inc.
Description: with standard microscope objectives, these components are ideal for applications requiring high throughput and excellent resolution in the UV or IR, including FTIR spectroscopy, ellipsometry, photolithography, and semiconductor inspection.The objectives feature an infinite conjugate design
- Lens Type: Objective Lens
- Magnification: 15 X
- Numerical Aperture: 0.2800 NA
- Working Distance: 23.75 mm
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Reactive Silicones: Forging New Polymer Links Materials for adhesives, binders, ceramic coatings, dielectric coatings, encapsulants, gels, membranes, optical coatings, photolithography, polymer synthesis, and sealants. Offering silicones with a wide range of functionalities along with catalysts (read more)
Browse Silicone Adhesives and Sealants Datasheets for Gelest, Inc. -
-based biomedical and life sciences research Semiconductor inspection and photolithography Coating Options: Enhanced UV transmission coatings for improved throughput Anti-reflective coatings for reduced back reflections Hard coatings for increased durability and resistance to cleaning Customized coatings for tailored spectral requirements and unique applications (read more)
Browse Optical Filters Datasheets for Suzhou Jiujon Optics Co., Ltd -
eyes. Also Vacuum UV (VUV = 100 - 200nm) is used in semiconductor photolithography and surface cleaning. Now there are tools for measuring and monitoring the Far UV intensity. TO-Can type sensor GFUV-T10GD-L Far UV Portable Meter GFUV-T10GS7.1-LA9 These and a (read more)
Browse UV Sensors Datasheets for Electro Optical Components, Inc. -
: Spectroscopy and spectral analysis Fluorescence microscopy and imaging Photolithography and semiconductor processing Astronomy and atmospheric monitoring Industrial and scientific instrumentation Environmental and chemical analysis Optical (read more)
Browse Optical Filters Datasheets for Suzhou Jiujon Optics Co., Ltd -
Specialty PVD Coating & Processing Capabilities: • Index-Matched Coating Designs • Patterning - Photolithography/Shadow Masking • Controlled Thickness Non-Optical Films • Chemical & Damage Resistance (read more)
Browse Optical Manufacturing Services Datasheets for Abrisa Technologies -
Specialty PVD Coating & Processing Capabilities: • Index-Matched Coating Designs • Patterning - Photolithography/Shadow Masking • Controlled Thickness Non-Optical Films • Chemical & Damage Resistance (read more)
Browse Industrial Coatings Datasheets for Abrisa Technologies -
available upon request. Our high DE reflection and transmission grating is ideal for WSS and other applications in optical communication industry. Generated by our state-of-art projection photolithography, holographic and ion etching technology, the precise realization of grating (read more)
Browse Optical Lenses Datasheets for CASTECH, Inc. -
• Patterning - Photolithography/Shadow Masking • Controlled Thickness Non-Optical Films • Chemical (read more)
Browse Coating Services Datasheets for Abrisa Technologies -
(such as X-ray optics), photolithography (especially EUV lithography), Fabry-Perot etalons, and instruments for high-performance telescopes, among many other applications. Not All Super Finishes are the Same Caution - when evaluating suppliers of precision optics, be sure to (read more)
Browse Buffing and Polishing Services Datasheets for Zygo Corporation -
high precision optical components for 300 mm and 450 mm wafer handling - and even meter-class semiconductor photolithography stages. These stage components can be made in a (read more)
Browse Wafer and Thin Film Instrumentation Datasheets for Zygo Corporation
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Alumina Ceramic Parts as Photolithography Machines in the Semiconductor Industry
Alumina Ceramic parts are used for rotating parts in photolithography machines and in a vacuum state. This requires extremely high machining accuracy, and the runout of the inner circle is required to be within 2 microns. Fine ceramics have become key components of semiconductor equipment
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Semiconductor Photolithography Process Overview
Semiconductor lithography is a crucial process in the manufacturing of semiconductor devices, such as microchips and integrated circuits. It involves the precise transfer of intricate patterns onto a silicon wafer, which serves as the foundation for these electronic components. The process begins
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What is Photo Etching?
Photo etching is a process used in the creation of integrated circuits, that combines photolithography with the etching process. Photolithography is used to form patterns on semiconductor substrates coated with photoresist, resulting in selective developing of the photo-resist, when exposed
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Fabrication of GaAs Devices
Fabrication of GaAs Devices. Focusing on all aspects of GaAs processing that deal with GaAs free surfaces and interfaces between GaAs and metal contacts or dielectrics, this detailed text offers pragmatic advice on cleaning and passivation, wet and dry etching and photolithography.
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Dark Mirror Coatings
durability. They can be designed for use anywhere from the visible through the longwave infrared wavelength regions. In addition, DSI's photolithography capability enables the production of dark mirrors in precise patterns ranging from circular to more complex geometries.
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The Best Method of Controlling HMDS Use in Semiconductor Manufacturing
, their processing power and speed would increase. This has been true for the past half a century and, even though this axiom is going through some interesting growing pains, it's longevity is due, in part, to the process of photolithography.
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Rapid Microbiological Methods for a New Generation
a variety of technologies, including printing with fine-pointed pins onto glass slides, photolithography, ink-jet printing or electrochemistry. Other methods may also be used, such as in situ synthesis, whereby the probes are synthesized directly on the chip instead of spotting them on the array
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
on lithography Photolithography resists are surprisingly unaffected by contact with water, and early pattern imaging at IBM Corp.'s Almaden Research Center on wafers immersed in water has "worked much better than we thought, " said Bill Hinsberg, a research staff member here. KLA-Tencor to take on Rudolph
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http://dspace.mit.edu/bitstream/handle/1721.1/81108/858278988-MIT.pdf?sequence=2
3.4 Four key semiconductor manufacturing technology transitions (as of 2012)...........42 3.4.1 Background on the current transition to EUV Lithography.................43 3.4.2 Prior Academic Studies of the Photolithography Equipment Industry........46 3.4.3 Background on the …
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http://usitc.gov/publications/332/pub3868.pdf
Photolithography equipment is the only segment of front-end SME equipment in which U.S. manufacturers do not hold a competitive advantage.
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Application of feed-forward and feedback control to a photolithography sequence
In this paper, we describe the implementation of supervi- sory control over three photolithography equipment : a spin- coat and bake track, a stepper and a developer.
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Manufacturing Engineering and Process II
The photolithography equipment can be divided into three main parts, that is, scanner, spinner, and developer.
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Handbook of Visual Display Technology
For example, generation 8.5 photolithog- raphy equipment occupies approximately 5,800 m2 and weighs approximately 410 t.) Owing to the immense market potential (worldwide LCD panel revenue was approximately US$69 billion in 2009) [1], the drastically different set of technical challenges …
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P‐10: A Novel Stitching Design for Large‐Area TFT‐LCD TV
Of those, larger than 40‐in. size products are developed by applying stitching method for design & process to scanning photolithography equipment .
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The world's first automated reticle handling system using OHT
As a result, photolithography equipments were occasionally left idle by reticlc delivcly delays.
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Optimization of low‐temperature poly‐Si TFT‐LCDs and a large‐scale production line for large glass substrates
TABLE 6 — Comparison of the specifications of each generation of photolithography equipment .