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Supplier: Accuris
Description: German Language - CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-3: SOLDERING TESTS - TEST 12C: SOLDERABILITY, DE-WETTING
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Supplier: Accuris
Description: CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-3: SOLDERING TESTS - TEST 12C: SOLDERABILITY, DE-WETTING
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Description: Defines a standard test method to assess the ability of the terminations of a connector to remain covered with solder when being brought into contact with molten solder under specified conditions.
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Supplier: CSA Group
Description: Defines a standard test method to assess the ability of the terminations of a connector to remain covered with solder when being brought into contact with molten solder under specified conditions.
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Supplier: RS Components, Ltd.
Description: Rosin-free solder for fast and sustained soldering on copper and brass. 5 Cores of Ecosol® 105 Rosin (Colophony) free flux. Similar performance to traditional solders. High activity - no dewetting. Approximate melting point of solder: 183-188°C Wire Diameter =
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Wire
- Melting Range: 361 to 370 F
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Supplier: RS Components, Ltd.
Description: Rosin-free solder for fast and sustained soldering on copper and brass. 5 Cores of Ecosol® 105 Rosin (Colophony) free flux. Similar performance to traditional solders. High activity - no dewetting. Approximate melting point of solder: 183-188°C Wire Diameter =
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Wire
- Melting Range: 361 to 370 F
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Supplier: RS Components, Ltd.
Description: Rosin-free solder for fast and sustained soldering on copper and brass. 5 Cores of Ecosol® 105 Rosin (Colophony) free flux. Similar performance to traditional solders. High activity - no dewetting. Approximate melting point of solder: 183-188°C Wire Diameter =
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Wire
- Melting Range: 361 to 370 F
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Description: Gives information on the choice of solder and flux, temperature of test, ageing, as well as methods for the globule test, the solder bath test, the soldering iron test, solderability and de-wetting phenomena, resistance to soldering heat.
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Description: IEC 60068-2-58:2015 outlines test Td, applicable to surface mounting devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead
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Description: IEC 60068-2-58:2015+A1:2 017 outlines test Td, applicable to surface mounting devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic
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Supplier: CSA Group
Description: IEC 60068-2-58:2015+A1:2 017 outlines test Td, applicable to surface mounting devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic
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Supplier: CSA Group
Description: IEC 60068-2-58:2015 outlines test Td, applicable to surface mounting devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead
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Robust solder joint attachment of coaxial cable leads to piezoelectric ceramic electrodes
Solder dewetting was still prevalent with the Pb-In binary alloys.
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Thermal Management and Interfacial Properties in High-Power GaN-Based Light-Emitting Diodes Employing Diamond-Added Sn-3 wt.%Ag-0.5 wt.%Cu Solder as a Die-Atta...
It has been proposed that a strategy for inhibiting the detachment of interfacial compounds and solder dewetting is to thicken the wetting metallization, so that the wetting metallization would not be com- pletely consumed during the typical reflow time and the reaction …
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Transfer of metal MEMS packages using a wafer-level solder transfer technique
The surface tension of the carrier wafer is higher than the surface tension of the solder so the solder dewets the carrier wafer and becomes weakly at- tached (see Fig. 3).