Products/Services for Wax Potting Electronic

More >>

Product News for Wax Potting Electronic

More >>

Conduct Research

...or unintended. These occasions are where a mold release agent. can play an important role. Where Can Mold Release Agents Be Used?. Mold release agents are used for: • Preventing adhesion to unintended surfaces in potting and casting electronics. • Coating a mold to be used for molding epoxy into various...

More Information on: Wax Potting Electronic

Lock Indicates content that may require registration and/or purchase. Powered by IHS Goldfire

  • Ultra-high impact resistant digital data recorder for missile flight testing
    The technique most often cited by these test labs for high impact shock survival was to fully encapsulate all electronic components in a high-stiffness, low-density potting material (usually some type of filled epoxy or wax ).
  • Handbook of Paint and Coating Raw Materials Volume 1 and 2
    ...EINECS/ELINCS 264-038-1 Uses: Used in hot-melt coatings and adhesives, paper coatings, printing inks, lacquers, paints, varnishes; binder in ceramics; for potting , filling in elec./ electronic components; lubricant and processing... ...in investment castings; emulsion wax size in papermaking; fabric...
  • Handbook of Cosmetic and Personal Care Additives Volume 1
    ...EINECS/ELINCS 264-038-1 Uses: Used in hot-melt coatings and adhesives, paper coatings, printing inks, lacquers, paints, varnishes; binder in ceramics; for potting , filling in elec./ electronic components; lubricant and processing... ...in investment castings; emulsion wax size in papermaking; fabric...
  • Handbook of PLASTIC AND RUBBER ADDITIVES Volume 1 and 2
    ...EINECS/ELINCS 264-038-1 Uses: Used in hot-melt coatings and adhesives, paper coatings, printing inks, lacquers, paints, varnishes; binder in ceramics; for potting , filling in elec./ electronic components; lubricant and processing... ...in investment castings; emulsion wax size in papermaking; fabric...
  • Handbook of Lubricants
    ...hot-melt coatings and adhesives, cup and paper coatings, printing inks; lubricant and processing aid in plastics; lacquers; paints; varnishes; binder in ceramics; for potting in elec./ electronic components; in investment casting... ...rubber and elastomers; emulsion wax size in papermaking; fabric...
  • Handbook of Food Packaging Chemicals and Materials
    ...EINECS/ELINCS 264-038-1 Uses: Used in hot-melt coatings and adhesives, paper coatings, printing inks, lacquers, paints, varnishes; binder in ceramics; for potting , filling in elec./ electronic components; lubricant and processing... ...in investment castings; emulsion wax size in papermaking; fabric...
  • Handbook of Preservatives
    ...hot-melt coatings and adhesives, cup and paper coatings, printing inks; lubricant and processing aid in plastics; lacquers; paints; varnishes; binder in ceramics; for potting in elec./ electronic components; in investment casting... ...rubber and elastomers; emulsion wax size in papermaking; fabric...
  • Handbook of Paper and Pulp Chemicals
    ...hot-melt coatings and adhesives; paper coatings; printing inks; lubricant and processing aid in plastics modification; lacquers, paints, and varnishes; binder in ceramics, potting /impregnant in elec./ electronic components; rubber and elastomers... ...antisunchecking, antiblock, antiozonant); emulsion wax size in papermaking; fabric...
  • Handbook of Textile Processing Chemicals
    ...Uses: Release agent; hot-melt coatings/adhesives; paper coatings; food pkg.; printing inks; plastic modification (lubricant, processing aid); lacquers; paints; varnishes; binder in ceramics; potting /filling in elec./ electronic component; in investment casting... ...antisunchecking, antiozonant); as emulsion wax size in papermaking; as...
  • Micro unattended mobility system (MUMS)
    ...circuit board and covering all components with a soft potting compound such as wax , hard foam, or... Several boards may be stacked and potted together in epoxy, provided a soft potting material is first placed over the electronic components.