TABLE OF CONTENTS IPC-7351, Section 8.0, pp. 44 70.
IPC-D-330, Section 5.
(see also Land Patterns)
IPC-1902 (grid resolution considerations).
IPC-2221A, Section 7.2.3, p. 51; Section 8.0, p. 55.
IPC-7351, Section 3.4, p. 20 (SMD).
IPC-AJ-820.
IPC-CM-770E, Section 8.1, p. 44.
IPC-D-330, Fig. 11-64, p. 65.
Coombs Printed Circuits Handbook, 5th ed., Clyde F. Coombs, Jr., McGraw Hill, 2001, Section 49.4.
Avoiding Passive-Component Pitfalls, Doug Grant and Scott Wurcer, Analog Devices Application Note AN-348.
Biasing and Decoupling Op Amps in Single Supply Applications, Charles Kitchin, Analog Devices Application Note AN-581.
EMC and the Printed Circuit Board: Design, Theory, and Layout Made Simple, Mark I. Montrose, IEEE Press Series on Electronics Technology, 1999, p. 126.
High-Speed Digital Design: a Handbook of Black Magic, Howard Johnson and Martin Graham, Prentice Hall, 1993, pp. 281 288.
Noise Reduction Techniques in Electronic Systems, 2nd ed., Henry W. Ott, Wiley, 1988, p. 129.
Printed Circuit Board Design Techniques for EMC Compliance, 2nd ed., Mark I. Montrose, IEEE Press Series on Electronics Technology, 2000, Chap. 3.
IPC-2221A, Section 3.4.4, p. 22.
IPC-CM-770E, Section 8.4, p. 46.
IPC-2221A, Section 8.1.3, p. 57.
IPC-7351, Section 3.1, pp. 9 16 (SMD footprint design).
Coombs Printed Circuits Handbook, 5th ed., Clyde F. Coombs, Jr., McGraw Hill, 2001, Section 43.7.8.
IPC-CM-770E, Section 7.2, p. 35.
Coombs Printed Circuits Handbook, 5th ed., Clyde F. Coombs, Jr., McGraw Hill, 2001, Section 19.5.1.
