Help with FLASH Memory Chips specifications:
Architecture / Type
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| Density | The capacity of the memory chip expressed in bits. | ||
| Search Logic: | All matching products will have a value greater than or equal to the specified value. | ||
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| Number of Words | The number of "rows" in the organization of the memory chip. Each row stores a memory word and connects to a word line (one line of the memory bus) for addressing purposes. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Bits per Word | The number of "columns" in the organization of the memory chip. Each column connects to a sense / write circuit (a bit), which connects to data input/output lines of the chip. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Technology | |||
| Your choices are... | |||
| NAND | Serial accessed flash technology. | ||
| NOR | Random accessed flash technology. | ||
| Other | Other unlisted, specialized, or proprietary Flash memory types such as AND, DINOR, T-POLY, etc. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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| Boot Block Size | Boot block is a secured block to store boot codes. | ||
| Search Logic: | All matching products will have a value greater than or equal to the specified value. | ||
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Performance
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| Access Time | A measurement of time in nanoseconds (ns) used to indicate the speed of memory. Access time is a cycle that begins the moment the CPU sends a request to memory and ends the moment the CPU receives the data it requested. Specifically, for a synchronous device it is the time, usually in ns, from a clock edge to when data is available at the output of a device. For an asynchronous device it is the time from the initiation of the read cycle to when the data output is available. | ||
| Search Logic: | All matching products will have a value less than or equal to the specified value. | ||
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| Data Retention | The time (in years) that the memory chips can retain the data without reloading. | ||
| Search Logic: | All matching products will have a value greater than or equal to the specified value. | ||
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| Endurance | The maximum number of write / read cycles that the chip can support. | ||
| Search Logic: | All matching products will have a value greater than or equal to the specified value. | ||
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| Power Dissipation | Power dissipation is the total power consumption of the device. It is generally expressed in watts or milliwatts. | ||
| Search Logic: | All matching products will have a value less than or equal to the specified value. | ||
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| Operating Current | The minimum current needed for active chip operation. | ||
| Search Logic: | All matching products will have a value less than or equal to the specified value. | ||
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| Operating Temperature: | This is the full-required range of ambient operating temperature. | ||
| Search Logic: | User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria. | ||
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| Supply Voltage: | |||
| Your choices are... | |||
| -5 V | The chip operates with -5 volts. | ||
| -4.5 V | The chip operates with -4.5 volts. | ||
| -3.3 V | The chip operates with -3.3 volts. | ||
| -3 V | The chip operates with -3 volts. | ||
| 1.2 V | The chip operates with 1.2 volts. | ||
| 1.5 V | The chip operates with 1.5 volts. | ||
| 1.8 V | The chip operates with 1.8 volts. | ||
| 2.5 V | The chip operates with 2.5 volts. | ||
| 2.7 V | The chip operates with 2.7 volts. | ||
| 3 V | The chip operates with 3 volts. | ||
| 3.3 V | The chip operates with 3.3 volts. | ||
| 3.6 V | The chip operates with 3.6 volts. | ||
| 5 V | The chip operates with 5 volts. | ||
| Other | Other unlisted supply voltages. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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Packaging Information
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| IC Package Type | |||
| Your choices are... | |||
| BGA | Ball-grid array (BGA) places output pins in a solder ball matrix. Generally, BGA traces are fabricated on laminated (BT-based) substrates or polyimide-based films. Therefore, the entire area of substrates or films can be used to route the interconnection. BGA has another advantage of lower ground or power inductance by assigning ground or power nets via a shorter current path to PCB. Thermally enhanced mechanisms (heat sink, thermal balls, etc.) can be applied to BGA to reduce the thermal resistance. The sophisticated capabilities make BGA the desirable package to implement electrical and thermal enhancement in response to the need for high power and high speed ICs. | ||
| CSP | Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs. | ||
| FLGA | Fine-pitch land-grid array (FLGA) is extremely compact and lightweight, making it suitable for miniature disc drives and digital cameras. | ||
| QFP | Quad flat packages (QFP) contain a large number of fine, flexible, gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processors, controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipsets, and other applications. | ||
| TQFP | Thin quad flat package (TQFP). | ||
| SOP | Small outline package (SOP). | ||
| SOIC | Small outline integrated circuit (SOIC). | ||
| TSOP | Thin small outline package (TSOP) is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II. | ||
| SSOP | Shrink small outline package (SSOP). | ||
| TSSOP | Thin shrink small outline L-leaded package (TSSOP). | ||
| SOJ | Small outline J-lead (SOJ) is a common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device. | ||
| PLCC | Plastic leaded chip carrier (PLCC). | ||
| LCCC | Leadless ceramic chip carrier (LCCC). | ||
| DIP | Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. | ||
| SIP | Single in-line package (SIP). | ||
| Other | Other unlisted, specialized, or proprietary IC packages. | ||
| Search Logic: | Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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| Screening Level | |||
| Your choices are... | |||
| Commercial | Devices support a temperature range and feature mechanical and electrical specifications that are suitable for commercial applications. | ||
| Industrial | Devices support a temperature range and feature mechanical and electrical specifications that are suitable for industrial applications. | ||
| Military | Devices support a temperature range and feature mechanical and electrical specifications that are suitable for military applications. | ||
| Other | Other unlisted screening levels. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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| Pin Count | The number of pins in package or module. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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Features
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| Burst Mode Read | The chip can be read in bursts (groups) of bits. | ||
| Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
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| Page Mode Read | The chip can be read page-by-page. | ||
| Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
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| Read While Write (RWW) Operation | The chip can be read and write at the same time. | ||
| Search Logic: | "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice. | ||
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