BGA FLASH Memory Chips
from DigiKey
IC FLSH RAM 512MBIT HYPRBS 24BGA [See More]
- Package Type: BGA; 24-BGA
- Operating Temperature: -40 to 105
- Density: 512000
- Supply Voltage: 2.7V ~ 3.6V
from Acme Chip Technology Co., Limited
IC FLSH RAM 32GBYTE EMMC 144FBGA [See More]
- Package Type: BGA; 144-FBGA (8x9.5)
- Supply Voltage: -25degC ~ 85degC
- Density: 256000000
from LCSC Electronics Technology (HK) Limited
VFBGA-63 NAND FLASH ROHS [See More]
- Package Type: BGA
- Technology: NAND
from Shenzhen Shengyu Electronics Technology Limited
IC FLSH RAM 4GBYTE EMMC 221VFBGA [See More]
- Package Type: BGA
- Supply Voltage: -25degC ~ 85degC
- Density: 32000000
from Rochester Electronics
AM29DL323 - NOR Flash, 2MX16, 120ns [See More]
- Package Type: BGA; FBGA63
- Technology: Sectored
from Win Source Electronics
Manufacturer: Cypress Semiconductor Corp. Storage Condition: Dry storage cabinet & Humidity protection package. Win Source Part Number: 1154832-AM29SL800DB90WAD. Number of Pins: 48. Categories: Custom Parts. Case / Package: FBGA. Popularity: Medium. Fake Threat In the Open Market: 53 pct. Supply... [See More]
- Package Type: BGA; FBGA
- Pins: 48
from RS Components, Ltd.
High performance. Low pin-count Quad SPI (Serial Peripheral Interface). Memory Size = 128Mbit. Interface Type = SPI. Package Type = BGA. Pin Count = 24. Organisation = 128M x 1 bit, 32M x 4 bit, 64M x 2 bit. Mounting Type = Surface Mount. Cell Type = NOR. Minimum Operating Supply Voltage = 2.7 V. [See More]
- Package Type: BGA
- Technology: Sectored
- Density: 128000
- Supply Voltage: 3.6 V, 2.7 V; 2.7V; 3V; 3.3V; 3.6V
from Quarktwin Technology Ltd.
FLASH - NAND, DRAM - LPDDR Memory IC 4GByte (NAND), 4Gbit (LPDDR3 DRAM) eMMC 5.1 HS400 + LPDDR3 221-VFBGA (13x11.5) [See More]
- Package Type: BGA; 221-VFBGA
- Technology: NAND
- Density: 32000000
- Operating Temperature: -25 to 85
from DigiKey
4GB EMMC MLC -25C +85C 153B [See More]
- Package Type: BGA; 153-BGA
- Operating Temperature: -25 to 85
- Technology: NAND
- Supply Voltage: 1.8V ~ 3.3V
from Acme Chip Technology Co., Limited
IC FLASH 128GBIT EMMC 153BGA [See More]
- Package Type: BGA; 153-BGA (11.5x13)
- Supply Voltage: -40degC ~ 105degC
- Density: 128000000
from LCSC Electronics Technology (HK) Limited
TBGA-100(14x18) NAND FLASH ROHS [See More]
- Package Type: BGA
- Technology: NAND
from Shenzhen Shengyu Electronics Technology Limited
IC FLSH RAM 8GBYTE EMMC 221VFBGA [See More]
- Package Type: BGA
- Supply Voltage: -25degC ~ 85degC
- Density: 64000000
from Rochester Electronics
AM29DL323 - NOR Flash, 2MX16, 120ns [See More]
- Package Type: BGA; FBGA63
- Technology: Sectored
from Win Source Electronics
Manufacturer: Micron Technology Inc. Win Source Part Number: 197454-28F256K3C. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH - NOR. Memory Size: 256Mb (16M x 16). Access Time: 120ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85... [See More]
- Package Type: BGA; 64-EasyBGA (10x13)
- Operating Temperature: -40 to 85
- Access Time: 120
- Supply Voltage: 2.7 V ~ 3.6 V
from RS Components, Ltd.
High performance. Low pin-count Quad SPI (Serial Peripheral Interface). Memory Size = 512Mbit. Interface Type = SPI. Package Type = BGA. Pin Count = 24. Organisation = 128M x 4 bit, 256M x 2 bit, 512M x 1 bit. Mounting Type = Surface Mount. Cell Type = NOR. Minimum Operating Supply Voltage = 2.7 V. [See More]
- Package Type: BGA
- Technology: Sectored
- Density: 512000
- Supply Voltage: 3.6 V, 2.7 V; 2.7V; 3V; 3.3V; 3.6V
from Quarktwin Technology Ltd.
FLASH - NAND, DRAM - LPDDR Memory IC 8GByte (NAND), 8Gbit (LPDDR3 DRAM) eMMC 5.1 HS400 + LPDDR3 221-VFBGA (13x11.5) [See More]
- Package Type: BGA; 221-VFBGA
- Technology: NAND
- Density: 64000000
- Operating Temperature: -25 to 85
from DigiKey
FLASH - NAND (MLC) Memory IC 32Gb (4G x 8) eMMC 153-FBGA (11.5x13) [See More]
- Package Type: BGA; 153-BGA
- Operating Temperature: -40 to 85
- Technology: NAND
- Supply Voltage: 1.8V ~ 3.3V
from Acme Chip Technology Co., Limited
IC FLASH 8MBIT PARALLEL 48FBGA [See More]
- Package Type: BGA; 48-FBGA (6x9)
- Supply Voltage: 0degC ~ 70degC (TA)
- Density: 8000
from LCSC Electronics Technology (HK) Limited
TFBGA-153(11.5x13) NAND FLASH ROHS [See More]
- Package Type: BGA
- Technology: NAND
from Shenzhen Shengyu Electronics Technology Limited
IC FLASH 64GBIT EMMC 153BGA [See More]
- Package Type: BGA
- Supply Voltage: -40degC ~ 85degC
- Density: 64000000
from Rochester Electronics
AM29DL800 - NOR Flash, 512KX16, 120ns [See More]
- Package Type: BGA; PBGA48
- Technology: Sectored
from Win Source Electronics
Manufacturer: Micron Technology Inc. Win Source Part Number: 075697-320W18BE. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH - NOR. Memory Size: 32Mb (2M x 16). Access Time: 60ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85... [See More]
- Package Type: BGA; 56-VFBGA
- Operating Temperature: -40 to 85
- Access Time: 60
- Supply Voltage: 1.7 V ~ 1.95 V
from Quarktwin Technology Ltd.
FLASH - NAND, DRAM - LPDDR Memory IC 8GByte (NAND), 8Gbit (LPDDR3 DRAM) eMMC 5.1 HS400 + LPDDR3 136-FBGA (10x10) [See More]
- Package Type: BGA; 136-FBGA
- Technology: NAND
- Density: 64000000
- Operating Temperature: -25 to 85
from DigiKey
IC FLASH 1TBIT EMMC 5.1 153FBGA [See More]
- Package Type: BGA; 153-BGA
- Operating Temperature: -40 to 85
- Technology: NAND
from Acme Chip Technology Co., Limited
MEMORY [See More]
- Package Type: BGA; 153-FBGA (11.5x13)
- Supply Voltage: -40degC ~ 85degC (TA)
- Density: 64000000
from LCSC Electronics Technology (HK) Limited
DBGA-8 NOR FLASH ROHS [See More]
- Package Type: BGA
- Technology: Sectored
from Shenzhen Shengyu Electronics Technology Limited
IC FLASH 32MBIT SPI 66MHZ 24CBGA [See More]
- Package Type: BGA
- Supply Voltage: -40degC ~ 85degC (TC)
- Density: 32000
from Rochester Electronics
AM29DS163 - Flash, 1MX16, 100ns, PBGA48 [See More]
- Package Type: BGA; BGA48
from Win Source Electronics
Manufacturer: Microchip Technology. Win Source Part Number: 162214-45DB041B. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 4Mb (264 Bytes x 2048 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: 0 °C to 70 °C (TC). Case /... [See More]
- Package Type: BGA; 14-CBGA (4.5x7)
- Supply Voltage: 2.7 V ~ 3.6 V
- Operating Temperature: 0 to 70
from Quarktwin Technology Ltd.
FLASH - NAND, DRAM - LPDDR Memory IC 16GByte (NAND), 16Gbit (LPDDR4 DRAM) eMMC 5.1 HS400 + LPDDR4X 254-FBGA (11.5x13x1.0) [See More]
- Package Type: BGA; 254-FBGA
- Technology: NAND
- Density: 128000000
- Operating Temperature: -25 to 85
from DigiKey
IC FLASH 1TBIT EMMC 5.1 153FBGA [See More]
- Package Type: BGA; 153-BGA
- Operating Temperature: -40 to 85
- Technology: NAND
from Acme Chip Technology Co., Limited
IC FLASH 32GBIT EMMC 100FBGA [See More]
- Package Type: BGA; 100-FBGA (14x18)
- Supply Voltage: -40degC ~ 85degC
- Density: 32000000
from LCSC Electronics Technology (HK) Limited
512Mbit SPI TPBGA-24(6x8) NOR FLASH ROHS [See More]
- Package Type: BGA
- Technology: Sectored
- Density: 512000
- Operating Temperature: -40 to 85
from Shenzhen Shengyu Electronics Technology Limited
IC FLASH 64MBIT SPI 85MHZ 9UBGA [See More]
- Package Type: BGA
- Supply Voltage: -40degC ~ 85degC (TC)
- Density: 64000
from Rochester Electronics
AM29DS323 - NOR Flash, 2MX16, 110ns [See More]
- Package Type: BGA; FPBGA48
- Technology: Sectored
from Win Source Electronics
Manufacturer: Microchip Technology. Win Source Part Number: 1019454-AT45DB011B-CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 1Mb (264 Bytes x 512 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85 °C (TC). [See More]
- Package Type: BGA; 9-CBGA (5x5)
- Supply Voltage: 2.7 V ~ 3.6 V
- Operating Temperature: -40 to 85
from Quarktwin Technology Ltd.
FLASH - NAND, DRAM - LPDDR Memory IC 32GByte (NAND), 16Gbit (LPDDR4 DRAM) eMMC 5.1 HS400 + LPDDR4X 254-FBGA (11.5x13x1.0) [See More]
- Package Type: BGA; 254-FBGA
- Technology: NAND
- Density: 256000000
- Operating Temperature: -25 to 85
from DigiKey
IC FLASH 2TBIT EMMC 5.1 153FBGA [See More]
- Package Type: BGA; 153-BGA
- Operating Temperature: -40 to 85
- Technology: NAND
from Acme Chip Technology Co., Limited
IC FLASH 256GBIT EMMC 153VFBGA [See More]
- Package Type: BGA; 153-VFBGA (11.5x13)
- Supply Voltage: -40degC ~ 85degC (TA)
- Density: 256000000
from Shenzhen Shengyu Electronics Technology Limited
IC FLASH 32MBIT SPI/QUAD 24CBGA [See More]
- Package Type: BGA
- Supply Voltage: -40degC ~ 85degC
- Density: 32000
from Rochester Electronics
AT49BV640D - 64-Mbit (4M x 16), Sectored Flash [See More]
- Package Type: BGA; CABGA48
from Win Source Electronics
Manufacturer: Microchip Technology. Win Source Part Number: 221124-AT45DB021B-CC. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 2Mb (264 Bytes x 1024 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: 0 °C to 70 °C (TC). [See More]
- Package Type: BGA; 9-CBGA (5x5)
- Supply Voltage: 2.7 V ~ 3.6 V
- Operating Temperature: 0 to 70
from Quarktwin Technology Ltd.
FLASH - NAND, DRAM - LPDDR Memory IC 32GByte (NAND), 16Gbit (LPDDR4 DRAM) eMMC 5.1 HS400 + LPDDR4X 144-FBGA (8x9.5) [See More]
- Package Type: BGA; 144-FBGA
- Technology: NAND
- Density: 256000000
- Operating Temperature: -25 to 85
from DigiKey
IC FLASH 2TBIT EMMC 5.1 153FBGA [See More]
- Package Type: BGA; 153-BGA
- Operating Temperature: -40 to 85
- Technology: NAND
from Acme Chip Technology Co., Limited
IC FLASH 256GBIT EMMC 100LFBGA [See More]
- Package Type: BGA; 100-LFBGA (14x18)
- Supply Voltage: -40degC ~ 85degC (TA)
- Density: 256000000
from Shenzhen Shengyu Electronics Technology Limited
IC FLASH 32GBIT EMMC 153FBGA [See More]
- Package Type: BGA
- Supply Voltage: -25degC ~ 85degC
- Density: 32000000
from Rochester Electronics
Compactflash Bus-Interface Chip with +/-15-Kv Esd Protection, Translation, and Card-Detect Circuitry, PBGA114 [See More]
- Package Type: BGA; LFBGA114
from Win Source Electronics
Manufacturer: Microchip Technology. Win Source Part Number: 221132-AT45DB041B-CC. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 4Mb (264 Bytes x 2048 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: 0 °C to 70 °C (TC). [See More]
- Package Type: BGA; 14-CBGA (4.5x7)
- Supply Voltage: 2.7 V ~ 3.6 V
- Operating Temperature: 0 to 70
from Quarktwin Technology Ltd.
FLASH - NAND, DRAM - LPDDR Memory IC 32GByte (NAND), 16Gbit (LPDDR4 DRAM) eMMC 5.1 HS400 + LPDDR4X 144-FBGA (8x9.5) [See More]
- Package Type: BGA; 144-FBGA
- Technology: NAND
- Density: 256000000
- Operating Temperature: -25 to 85
from DigiKey
FLASH - NAND (TLC) Memory IC 256Gb eMMC 153-FBGA (11.5x13x0.8) [See More]
- Package Type: BGA; 153-BGA
- Operating Temperature: -25 to 85
- Technology: NAND
from Acme Chip Technology Co., Limited
IC FLASH 64MBIT SPI/OCTL 24TFBGA [See More]
- Package Type: BGA; 24-TFBGA (6x8)
- Supply Voltage: -40degC ~ 105degC (TA)
- Density: 64000
from Shenzhen Shengyu Electronics Technology Limited
IC FLASH 16GBIT EMMC 153FBGA [See More]
- Package Type: BGA
- Supply Voltage: -40degC ~ 85degC
- Density: 16000000
from Rochester Electronics
S40FC004C1 - Flash Memory, 4GB e.MMC5.1 [See More]
- Package Type: BGA; VFBGA153
from Win Source Electronics
Manufacturer: Microchip Technology. Win Source Part Number: 221133-AT45DB041B-CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 4Mb (264 Bytes x 2048 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85 °C (TC). [See More]
- Package Type: BGA; 14-CBGA (4.5x7)
- Supply Voltage: 2.7 V ~ 3.6 V
- Operating Temperature: -40 to 85
from Quarktwin Technology Ltd.
FLASH - NAND (pSLC) Memory IC 64Gbit eMMC 153-BGA (11.5x13) [See More]
- Package Type: BGA; 153-FBGA
- Technology: NAND
- Density: 64000000
- Operating Temperature: -40 to 105
from DigiKey
IC FLSH 512GBIT EMMC 5.1 153FBGA [See More]
- Package Type: BGA; 153-BGA
- Operating Temperature: -40 to 85
- Technology: NAND
from Acme Chip Technology Co., Limited
IC FLASH 32MBIT PARALLEL 48TFBGA [See More]
- Package Type: BGA; 48-TFBGA (6x8)
- Supply Voltage: -40degC ~ 85degC (TA)
- Density: 32000
from Shenzhen Shengyu Electronics Technology Limited
IC FLASH 128GBIT EMMC 153FBGA [See More]
- Package Type: BGA
- Supply Voltage: -40degC ~ 85degC
- Density: 128000000
from Rochester Electronics
IS26KS256 - 256MBit HyperFlash Non Volatile Memory [See More]
- Package Type: BGA; VFBGA24
from Win Source Electronics
Manufacturer: Microchip Technology. Win Source Part Number: 221151-AT45DB081B-CC. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 8Mb (264 Bytes x 4096 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: 0 °C to 70 °C (TC). [See More]
- Package Type: BGA; 14-CBGA (4.5x7)
- Supply Voltage: 2.7 V ~ 3.6 V
- Operating Temperature: 0 to 70
from Quarktwin Technology Ltd.
FLASH Memory IC 32Mbit Parallel 90 ns 63-FBGA (8x14) [See More]
- Package Type: BGA; 63-TFBGA
- Access Time: 90
- Density: 32000
- Operating Temperature: -40 to 85
from DigiKey
FLASH - NAND (TLC) Memory IC 64Gb eMMC 153-FBGA (11.5x13x0.8) [See More]
- Package Type: BGA; 153-BGA
- Operating Temperature: -25 to 85
- Technology: NAND
from Acme Chip Technology Co., Limited
IC FLASH 128MBIT SPI 24TPBGA [See More]
- Package Type: BGA; 24-T-PBGA (6x8)
- Supply Voltage: -40degC ~ 125degC (TA)
- Density: 128000
from Shenzhen Shengyu Electronics Technology Limited
IC FLASH 256GBIT EMMC 100FBGA [See More]
- Package Type: BGA
- Supply Voltage: -40degC ~ 85degC
- Density: 256000000
from Rochester Electronics
LM3556 LM3556 1.5A Inductive White LED Camera Flash Device [See More]
- Package Type: BGA; DSBGA16
from Win Source Electronics
Manufacturer: Microchip Technology. Win Source Part Number: 1019493-AT45DB161-CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (528 Bytes x 4096 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85 °C... [See More]
- Package Type: BGA; 24-CBGA
- Supply Voltage: 2.7 V ~ 3.6 V
- Operating Temperature: -40 to 85
from Quarktwin Technology Ltd.
FLASH Memory IC 8Mbit Parallel 120 ns 48-FBGA (6x9) [See More]
- Package Type: BGA; 48-TFBGA
- Access Time: 120
- Density: 8000
- Operating Temperature: 0 to 70
from DigiKey
FLASH - NAND (TLC) Memory IC 128Gb eMMC 153-FBGA (11.5x13x0.8) [See More]
- Package Type: BGA; 153-BGA
- Operating Temperature: -25 to 85
- Technology: NAND
from Acme Chip Technology Co., Limited
IC FLASH 128GBIT PAR 132VBGA [See More]
- Package Type: BGA; 132-VBGA (12x18)
- Supply Voltage: 0degC ~ 70degC (TA)
- Density: 128000000
from Shenzhen Shengyu Electronics Technology Limited
IC FLASH 64MBIT PARALLEL 48VFBGA [See More]
- Package Type: BGA
- Supply Voltage: -40degC ~ 85degC (TA)
- Density: 64000
from Rochester Electronics
28F160C3 - NOR Flash 16MBIT, 1MX16, 70ns, 64EASYBGA [See More]
- Package Type: BGA; PBGA64
- Technology: Sectored
from Win Source Electronics
Manufacturer: Microchip Technology. Win Source Part Number: 221160-AT45DB161B-CC. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (528 Bytes x 4096 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: 0 °C to 70 °C (TC). [See More]
- Package Type: BGA; 24-CBGA
- Supply Voltage: 2.7 V ~ 3.6 V
- Operating Temperature: 0 to 70
from Quarktwin Technology Ltd.
FLASH - NAND Memory IC 32Gbit MMC 200 MHz 153-FBGA (11.5x13) [See More]
- Package Type: BGA; 153-VFBGA
- Technology: NAND
- Density: 32000000
- Operating Temperature: -40 to 85
from DigiKey
IC FLSH 512GBIT EMMC 5.1 153FBGA [See More]
- Package Type: BGA; 153-BGA
- Operating Temperature: -40 to 85
- Technology: NAND
from Acme Chip Technology Co., Limited
UFS 4T [See More]
- Package Type: BGA; 153-VFBGA (11.5x13)
- Supply Voltage: -25degC ~ 85degC
- Density: 4000000000
from Shenzhen Shengyu Electronics Technology Limited
IC FLASH 8MBIT CUI 48UBGA [See More]
- Package Type: BGA
- Supply Voltage: -40degC ~ 85degC (TA)
- Density: 8000
from Rochester Electronics
Flash Memory Drive, PBGA209 [See More]
- Package Type: BGA; BGA209
from Win Source Electronics
Manufacturer: Microchip Technology. Win Source Part Number: 221161-AT45DB161B-CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (528 Bytes x 4096 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85 °C... [See More]
- Package Type: BGA; 24-CBGA
- Supply Voltage: 2.7 V ~ 3.6 V
- Operating Temperature: -40 to 85
from Quarktwin Technology Ltd.
FLASH Memory IC 4Mbit SPI 104 MHz 8-WLCSP (1.63x1.58) [See More]
- Package Type: BGA; 8-XFBGA, WLCSP
- Operating Temperature: -40 to 85
- Density: 4000
- Supply Voltage: 1.65V ~ 3.6V; 3.6V
from DigiKey
FLASH - NAND (SLC) Memory IC 4Gb (512M x 8) Parallel 63-BGA (9x11) [See More]
- Package Type: BGA; 63-BGA
- Operating Temperature: -40 to 85
- Technology: NAND
- Supply Voltage: 2.7V ~ 3.6V
from Acme Chip Technology Co., Limited
MEMORY [See More]
- Package Type: BGA; 24-CSPBGA (6x8)
- Supply Voltage: -40degC ~ 105degC (TA)
- Density: 512000
from Shenzhen Shengyu Electronics Technology Limited
IC FLASH 32MBIT PARALLEL 47TFBGA [See More]
- Package Type: BGA
- Supply Voltage: -40degC ~ 85degC (TA)
- Density: 32000
from Rochester Electronics
Flash, 2MX16, 70ns, PBGA56 [See More]
- Package Type: BGA; BGA56
from Win Source Electronics
Manufacturer: Microchip Technology. Win Source Part Number: 1019495-AT45DB161D-CU. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (528 Bytes x 4096 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85 °C... [See More]
- Package Type: BGA; 24-CBGA
- Supply Voltage: 2.7 V ~ 3.6 V
- Operating Temperature: -40 to 85
from Quarktwin Technology Ltd.
FLASH Memory IC 32Mbit SPI 100 MHz 9-UBGA (6x6) [See More]
- Package Type: BGA; 9-UBGA
- Operating Temperature: -40 to 85
- Density: 32000
- Supply Voltage: 2.7V ~ 3.6V; 3.6V
from Acme Chip Technology Co., Limited
IC FLASH 4GBIT ONFI 63VFBGA [See More]
- Package Type: BGA; 63-VFBGA (9x11)
- Supply Voltage: -40degC ~ 85degC (TA)
- Density: 4000000
from Shenzhen Shengyu Electronics Technology Limited
IC FLASH 32MBIT PARALLEL 64TFBGA [See More]
- Package Type: BGA
- Supply Voltage: -40degC ~ 85degC (TA)
- Density: 32000
from Rochester Electronics
S29AL008J - 8-MBit (1M x 8-Bit/512K x 16-Bit), 3V, Boot Sector Flash [See More]
- Package Type: BGA; FBGA
- Density: 0 to 0
from Win Source Electronics
Manufacturer: Microchip Technology. Win Source Part Number: 221171-AT45DB321B-CC. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 32Mb (528 Bytes x 8192 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: 0 °C to 70 °C (TC). [See More]
- Package Type: BGA; 44-CBGA (6x12)
- Supply Voltage: 2.7 V ~ 3.6 V
- Operating Temperature: 0 to 70
from Quarktwin Technology Ltd.
FLASH Memory IC 8Mbit SPI 100 MHz 8-WLCSP (4x2) [See More]
- Package Type: BGA; 8-XFBGA, WLCSP
- Operating Temperature: -40 to 85
- Density: 8000
- Supply Voltage: 1.65V ~ 1.95V
from Acme Chip Technology Co., Limited
IC FLASH 256MBIT SPI/QUAD 24BGA [See More]
- Package Type: BGA; 24-BGA (8x6)
- Supply Voltage: -40degC ~ 105degC (TA)
- Density: 256000
from Shenzhen Shengyu Electronics Technology Limited
IC FLASH 16MBIT PARALLEL 48TFBGA [See More]
- Package Type: BGA
- Supply Voltage: -40degC ~ 85degC (TA)
- Density: 16000
from Rochester Electronics
S29CD016J - Dual Boot, Simultaneous Read/Write, Burst Flash [See More]
- Package Type: BGA; FBGA
from Win Source Electronics
Manufacturer: Microchip Technology. Win Source Part Number: 221172-AT45DB321B-CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 32Mb (528 Bytes x 8192 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85 °C... [See More]
- Package Type: BGA; 44-CBGA (6x12)
- Supply Voltage: 2.7 V ~ 3.6 V
- Operating Temperature: -40 to 85
from Quarktwin Technology Ltd.
FLASH - NOR Memory IC 4Mbit SPI - Quad I/O 104 MHz 8-WLCSP (1.77x1.74) [See More]
- Package Type: BGA; 8-XFBGA, WLCSP
- Technology: Sectored
- Density: 4000
- Operating Temperature: -40 to 85
from Acme Chip Technology Co., Limited
IC FLASH 1GBIT SPI/QUAD 24FBGA [See More]
- Package Type: BGA; 24-BGA (8x6)
- Supply Voltage: -40degC ~ 85degC (TA)
- Density: 1000000
from Shenzhen Shengyu Electronics Technology Limited
IC FLASH 128MBIT PARALLEL 80LBGA [See More]
- Package Type: BGA
- Supply Voltage: -40degC ~ 85degC (TA)
- Density: 128000
from Rochester Electronics
S29CD016J - Dual Boot, Simultaneous Read/Write, Burst Flash [See More]
- Package Type: BGA; PBGA80
from Win Source Electronics
Manufacturer: Microchip Technology. Win Source Part Number: 1019506-AT45DB321C-CC. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 32Mb (528 Bytes x 8192 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: 0 °C to 70 °C (TC). [See More]
- Package Type: BGA; 24-CBGA
- Supply Voltage: 2.7 V ~ 3.6 V
- Operating Temperature: 0 to 70
from Quarktwin Technology Ltd.
FLASH Memory IC 128Mbit SPI - Quad I/O, QPI 104 MHz 21-WLCSP (3.02x3.29) [See More]
- Package Type: BGA; 21-UFBGA, WLCSP
- Operating Temperature: -40 to 85
- Density: 128000
- Supply Voltage: 1.7V ~ 2V
from Acme Chip Technology Co., Limited
IC FLASH 2GBIT SPI/QUAD 24FBGA [See More]
- Package Type: BGA; 24-FBGA (8x8)
- Supply Voltage: -40degC ~ 105degC (TA)
- Density: 2000000
from Shenzhen Shengyu Electronics Technology Limited
IC FLASH 1GBIT PARALLEL 69FBGA [See More]
- Package Type: BGA
- Supply Voltage: -40degC ~ 85degC (TA)
- Density: 1000000
from Rochester Electronics
S29VS064R - 1.8 V, Multiplexed, Burst MirrorBit Flash [See More]
- Package Type: BGA; BGA44
from Win Source Electronics
Manufacturer: Microchip Technology. Win Source Part Number: 1019507-AT45DB321C-CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 32Mb (528 Bytes x 8192 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85 °C... [See More]
- Package Type: BGA; 24-CBGA
- Supply Voltage: 2.7 V ~ 3.6 V
- Operating Temperature: -40 to 85
from Quarktwin Technology Ltd.
FLASH Memory IC 32Mbit SPI - Quad I/O, QPI 104 MHz 8-WLCSP (1.55x2.28) [See More]
- Package Type: BGA; 8-UFBGA, WLCSP
- Operating Temperature: -40 to 85
- Density: 32000
- Supply Voltage: 1.7V ~ 2V
from Acme Chip Technology Co., Limited
IC FLASH 1GBIT PARALLEL 64FBGA [See More]
- Package Type: BGA; 64-FBGA (13x11)
- Supply Voltage: -40degC ~ 85degC (TA)
- Density: 1000000
from Shenzhen Shengyu Electronics Technology Limited
IC FLASH 1GBIT SPI 24TPBGA [See More]
- Package Type: BGA
- Supply Voltage: -40degC ~ 105degC (TA)
- Density: 1000000
from Rochester Electronics
S34ML01G1 - Flash Memory, SLC,1Gb,4x,3V,x8,1bit,VBM63, [See More]
- Package Type: BGA; BGA63
from Win Source Electronics
Manufacturer: Microchip Technology. Win Source Part Number: 1019508-AT45DB321C-CU. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 32Mb (528 Bytes x 8192 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85 °C... [See More]
- Package Type: BGA; 24-CBGA
- Supply Voltage: 2.7 V ~ 3.6 V
- Operating Temperature: -40 to 85
from Quarktwin Technology Ltd.
FLASH Memory IC 64Mbit SPI - Quad I/O, QPI 104 MHz 8-WLCSP (1.92x3.01) [See More]
- Package Type: BGA; 8-UFBGA, WLCSP
- Operating Temperature: -40 to 85
- Density: 64000
- Supply Voltage: 1.7V ~ 2V
from Acme Chip Technology Co., Limited
IC FLASH 80GBIT EMMC 153BGA [See More]
- Package Type: BGA; 153-BGA (11.5x13)
- Supply Voltage: -40degC ~ 85degC
- Density: 80000000
from Shenzhen Shengyu Electronics Technology Limited
IC FLASH 1GBIT SPI 24TPBGA [See More]
- Package Type: BGA
- Supply Voltage: -40degC ~ 125degC (TA)
- Density: 1000000
from Rochester Electronics
S34ML02G1 - 2Gb, 3 V, 1-bit ECC, SLC NAND Flash for Embedded [See More]
- Package Type: BGA; BGA63
- Technology: NAND
from Win Source Electronics
Manufacturer: Microchip Technology. Win Source Part Number: 078943-AT49BV1604-11UI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (2M x 8, 1M x 16). Access Time: 110ms. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to... [See More]
- Package Type: BGA; 48-μBGA (6.75x8.5)
- Operating Temperature: -40 to 85
- Access Time: 1.10E8
- Supply Voltage: 2.7 V ~ 3.3 V
from Quarktwin Technology Ltd.
FLASH - NOR Memory IC 16Mbit SPI - Quad I/O 108 MHz 8-WLCSP (1.61x1.35) [See More]
- Package Type: BGA; 8-XFBGA, WLCSP
- Technology: Sectored
- Density: 16000
- Operating Temperature: -40 to 85
from Acme Chip Technology Co., Limited
IC FLASH 1TBIT EMMC 153BGA [See More]
- Package Type: BGA; 153-BGA (11.5x13)
- Supply Voltage: -40degC ~ 105degC (TA)
- Density: 1000000000
from Shenzhen Shengyu Electronics Technology Limited
IC FLASH 256MBIT SPI 24TPBGA [See More]
- Package Type: BGA
- Supply Voltage: -40degC ~ 105degC (TA)
- Density: 256000
from Rochester Electronics
4 Gb, 1-bit ECC, 1.8V SLC NAND Flash [See More]
- Package Type: BGA; FBGA63
- Technology: NAND
from Win Source Electronics
Manufacturer: Microchip Technology. Win Source Part Number: 1019548-AT49BV160C-70CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (1M x 16). Access Time: 70ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85... [See More]
- Package Type: BGA; 46-CBGA (6.5x7.5)
- Operating Temperature: -40 to 85
- Access Time: 70
- Supply Voltage: 2.65 V ~ 3.6 V
from Quarktwin Technology Ltd.
FLASH Memory IC 4Mbit SPI 20 MHz 14-CBGA (4.5x7) [See More]
- Package Type: BGA; 14-LBGA, CSPBGA
- Operating Temperature: 0 to 70
- Density: 4000
- Supply Voltage: 2.7V ~ 3.6V; 3.6V
from Acme Chip Technology Co., Limited
IC FLASH 1TBIT EMMC 100BGA [See More]
- Package Type: BGA; 100-BGA (14x18)
- Supply Voltage: -40degC ~ 85degC
- Density: 1000000000
from Shenzhen Shengyu Electronics Technology Limited
IC FLASH 1GBIT PARALLEL 64LBGA [See More]
- Package Type: BGA
- Supply Voltage: -40degC ~ 85degC (TA)
- Density: 1000000
from Rochester Electronics
SST39VF1601C - 2.7V to 3.6V 16Mbit Multi-Purpose Flash [See More]
- Package Type: BGA; TFBGA48
from Win Source Electronics
Manufacturer: Microchip Technology. Win Source Part Number: 078944-AT49BV160S-70CU. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (1M x 16). Access Time: 70ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85... [See More]
- Package Type: BGA; 64-CBGA (9x10)
- Operating Temperature: -40 to 85
- Access Time: 70
- Supply Voltage: 2.65 V ~ 3.6 V
from Quarktwin Technology Ltd.
FLASH Memory IC 16Mbit SPI 13 MHz 24-CBGA (7x9.5) [See More]
- Package Type: BGA; 24-LBGA, CSPBGA
- Operating Temperature: -40 to 85
- Density: 16000
- Supply Voltage: 2.7V ~ 3.6V; 3.6V
from Acme Chip Technology Co., Limited
IC FLASH 32GBIT EMMC 153BGA [See More]
- Package Type: BGA; 153-BGA (11.5x13)
- Supply Voltage: -40degC ~ 85degC
- Density: 32000000
from Shenzhen Shengyu Electronics Technology Limited
IC FLASH RAM 4GBIT PAR 162VFBGA [See More]
- Package Type: BGA
- Supply Voltage: -40degC ~ 105degC (TA)
- Density: 4000000
from Win Source Electronics
Manufacturer: Microchip Technology. Win Source Part Number: 078945-AT49BV160ST-70CU. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (1M x 16). Access Time: 70ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85... [See More]
- Package Type: BGA; 64-CBGA (9x10)
- Operating Temperature: -40 to 85
- Access Time: 70
- Supply Voltage: 2.65 V ~ 3.6 V
from Quarktwin Technology Ltd.
FLASH Memory IC 16Mbit SPI 66 MHz 24-CBGA (6x8) [See More]
- Package Type: BGA; 24-LBGA, CSPBGA
- Operating Temperature: -40 to 85
- Density: 16000
- Supply Voltage: 2.7V ~ 3.6V; 3.6V
from Acme Chip Technology Co., Limited
IC FLASH 160GBIT EMMC 100BGA [See More]
- Package Type: BGA; 100-BGA (14x18)
- Supply Voltage: -40degC ~ 85degC
- Density: 160000000
from Shenzhen Shengyu Electronics Technology Limited
IC FLASH RAM 1GBIT PAR 130VFBGA [See More]
- Package Type: BGA
- Supply Voltage: -40degC ~ 85degC (TA)
- Density: 1000000
from Win Source Electronics
Manufacturer: Microchip Technology. Win Source Part Number: 1019551-AT49BV160T-70CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (2M x 8, 1M x 16). Access Time: 70ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to... [See More]
- Package Type: BGA; 45-CBGA (6.5x7.5)
- Operating Temperature: -40 to 85
- Access Time: 70
- Supply Voltage: 2.65 V ~ 3.3 V
from Quarktwin Technology Ltd.
FLASH Memory IC 32Mbit SPI 20 MHz 44-CBGA (6x12) [See More]
- Package Type: BGA; 44-TBGA, CSPBGA
- Operating Temperature: 0 to 70
- Density: 32000
- Supply Voltage: 2.7V ~ 3.6V; 3.6V
from Acme Chip Technology Co., Limited
Ferri-UFS BGA 153-b eMMC 3D TLC [See More]
- Package Type: BGA; 153-BGA (11.5x13)
- Supply Voltage: -40degC ~ 85degC
- Density: 160000000
from Shenzhen Shengyu Electronics Technology Limited
IC FLASH RAM 4GBIT PAR 137VFBGA [See More]
- Package Type: BGA
- Supply Voltage: -25degC ~ 85degC (TA)
- Density: 4000000
from Win Source Electronics
Manufacturer: Microchip Technology. Win Source Part Number: 078946-AT49BV1614AT-90CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (2M x 8, 1M x 16). Access Time: 90ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to... [See More]
- Package Type: BGA; 48-CBGA (6x8)
- Operating Temperature: -40 to 85
- Access Time: 90
- Supply Voltage: 2.65 V ~ 3.3 V
from Quarktwin Technology Ltd.
FLASH Memory IC 64Mbit SPI 85 MHz 44-WLCSP (3.52x4.22) [See More]
- Package Type: BGA; 44-UFBGA, WLCSP
- Operating Temperature: -40 to 85
- Density: 64000
- Supply Voltage: 1.7V ~ 3.6V; 3.6V
from Acme Chip Technology Co., Limited
IC FLASH UFS2.1 153BGA [See More]
- Package Type: BGA; 153-BGA (11.5x13)
- Supply Voltage: -40degC ~ 85degC
from Shenzhen Shengyu Electronics Technology Limited
IC FLASH RAM 4GBIT PAR 168WFBGA [See More]
- Package Type: BGA
- Supply Voltage: -25degC ~ 85degC (TA)
- Density: 4000000
from Win Source Electronics
Manufacturer: Microchip Technology. Win Source Part Number: 1019558-AT49BV161T-70CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (2M x 8, 1M x 16). Access Time: 70ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to... [See More]
- Package Type: BGA; 48-CBGA (6x8)
- Operating Temperature: -40 to 85
- Access Time: 70
- Supply Voltage: 2.65 V ~ 3.3 V
from Quarktwin Technology Ltd.
FLASH Memory IC 16Mbit Parallel 70 ns 46-CBGA (6.5x7.5) [See More]
- Package Type: BGA; 46-VFBGA, CSBGA
- Access Time: 70
- Density: 16000
- Operating Temperature: -40 to 85
from Cypress Semiconductor Corp.
Cypress HyperBus Memory is a portfolio of high-speed, low-pin-count memory products that uses our HyperBus interface technology. The HyperBus interface draws upon the legacy features of both parallel and serial interface memories, while enhancing system performance, ease of design, and system... [See More]
- Package Type: BGA
- Supply Voltage: 1.8V; 3V
- Density: 64000 to 512000
- Operating Range: Commercial; Industrial