BGA FLASH Memory Chips

Manufacturer: Cypress Semiconductor Corp. Storage Condition: Dry storage cabinet & Humidity protection package. Win Source Part Number: 1154832-AM29SL800DB90WAD. Number of Pins: 48. Categories: Custom Parts. Case / Package: FBGA. Popularity: Medium. Fake Threat In the Open Market: 53 pct. Supply... [See More]

• Package Type: BGA; FBGA

• Pins: 48

Cypress, S25FL128LAGBHV020 [See More]

• Package Type: BGA
• Technology: Sectored; NOR

• Density: 1024000
• Pins: 24

IC FLASH 1GBIT SPI/QUAD 24TFBGA [See More]

• Package Type: BGA; 24-BGA
• Operating Temperature: -40 to 85

• Technology: Sectored
• Supply Voltage: 1.65V ~ 2V

Flash, 1MX8, 90ns, PBGA46 [See More]

• Package Type: BGA; BGA45

Manufacturer: Micron Technology Inc. Win Source Part Number: 197454-28F256K3C. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH - NOR. Memory Size: 256Mb (16M x 16). Access Time: 120ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85... [See More]

• Package Type: BGA; 64-EasyBGA (10x13)
• Operating Temperature: -40 to 85

• Access Time: 120
• Supply Voltage: 2.7 V ~ 3.6 V

Cypress, S25FL256LAGBHV020 [See More]

• Package Type: BGA
• Technology: Sectored; NOR

• Density: 2048000
• Pins: 24

IC FLASH 2GBIT SPI/QUAD 24CSPBGA [See More]

• Package Type: BGA; 24-BGA
• Operating Temperature: -40 to 105

• Technology: Sectored
• Supply Voltage: 1.65V ~ 2V

IS26KS128 128 MBit HyperFlash Non Volatile Memory [See More]

• Package Type: BGA; TFBGA25

Manufacturer: Micron Technology Inc. Win Source Part Number: 075697-320W18BE. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH - NOR. Memory Size: 32Mb (2M x 16). Access Time: 60ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85... [See More]

• Package Type: BGA; 56-VFBGA
• Operating Temperature: -40 to 85

• Access Time: 60
• Supply Voltage: 1.7 V ~ 1.95 V

Cypress Semiconductor, S25FL256SAGBHV200 [See More]

• Package Type: BGA
• Technology: Sectored; NOR

• Density: 2048000
• Pins: 24

IC FLSH RAM 512MBIT HYPRBS 24BGA [See More]

• Package Type: BGA; 24-BGA
• Operating Temperature: -40 to 105

• Density: 512000
• Supply Voltage: 2.7V ~ 3.6V

Flash, 2MX16, 70ns, PBGA56 [See More]

• Package Type: BGA; BGA56

Manufacturer: Microchip Technology. Win Source Part Number: 162214-45DB041B. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 4Mb (264 Bytes x 2048 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: 0 °C to 70 °C (TC). Case /... [See More]

• Package Type: BGA; 14-CBGA (4.5x7)
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: 0 to 70

Cypress Semiconductor, S25FL512SAGBHI310 [See More]

• Package Type: BGA
• Technology: Sectored; NOR

• Density: 4096000
• Pins: 24

32GB EMMC TLC 5.1 -25C+85C IND [See More]

• Package Type: BGA; 153-BGA
• Operating Temperature: -25 to 85

• Technology: NAND
• Supply Voltage: 1.8V ~ 3.3V

Flash, 8MX16, 85ns, PBGA64 [See More]

• Package Type: BGA; PBGA64

Manufacturer: Microchip Technology. Win Source Part Number: 1019454-AT45DB011B-CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 1Mb (264 Bytes x 512 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85 °C (TC). [See More]

• Package Type: BGA; 9-CBGA (5x5)
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: -40 to 85

Cypress Semiconductor, S29GL064S70BHI030 [See More]

• Package Type: BGA
• Technology: Sectored; NOR

• Density: 512000
• Pins: 48

FLASH - NAND (SLC) Memory IC 4Gb (512M x 8) Parallel 63-BGA (9x11) [See More]

• Package Type: BGA; 63-BGA
• Operating Temperature: -40 to 85

• Technology: NAND
• Supply Voltage: 2.7V ~ 3.6V

S25FL064L - (8-MB), 3.0V FL-L SPI Flash Memory [See More]

• Package Type: BGA; PG-TFBGA-24

Manufacturer: Microchip Technology. Win Source Part Number: 221124-AT45DB021B-CC. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 2Mb (264 Bytes x 1024 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: 0 °C to 70 °C (TC). [See More]

• Package Type: BGA; 9-CBGA (5x5)
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: 0 to 70

Cypress Semiconductor, S29GL512T11FHIV20 [See More]

• Package Type: BGA
• Pins: 64

• Density: 4096000

S25FL128S - (16-MB), 3.0 V FL-L Flash Memory [See More]

• Package Type: BGA; PG-TFBGA-24

Manufacturer: Microchip Technology. Win Source Part Number: 221132-AT45DB041B-CC. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 4Mb (264 Bytes x 2048 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: 0 °C to 70 °C (TC). [See More]

• Package Type: BGA; 14-CBGA (4.5x7)
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: 0 to 70

Cypress, NOR Flash, S25HL512TFABHI010 [See More]

• Package Type: BGA
• Supply Voltage: 3 v

• Technology: Nor
• Pins: 24

S29AL008J - 8-MBit (1M x 8-Bit/512K x 16-Bit), 3V, Boot Sector Flash [See More]

• Package Type: BGA; PG-VFBGA-48

• Density: 0 to 0

Manufacturer: Microchip Technology. Win Source Part Number: 221133-AT45DB041B-CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 4Mb (264 Bytes x 2048 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85 °C (TC). [See More]

• Package Type: BGA; 14-CBGA (4.5x7)
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: -40 to 85

Cypress, NOR Flash, S25HS512TDPBHI010 [See More]

• Package Type: BGA
• Supply Voltage: 1.8 v

• Technology: Nor
• Pins: 24

S29AL008J - 8-MBit (1M x 8-Bit/512K x 16-Bit), 3V, Boot Sector Flash [See More]

• Package Type: BGA; PG-VFBGA-48

• Density: 0 to 0

Manufacturer: Microchip Technology. Win Source Part Number: 221151-AT45DB081B-CC. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 8Mb (264 Bytes x 4096 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: 0 °C to 70 °C (TC). [See More]

• Package Type: BGA; 14-CBGA (4.5x7)
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: 0 to 70

Cypress, NOR Flash, S25HS512TFABHI010 [See More]

• Package Type: BGA
• Supply Voltage: 1.8 v

• Technology: Nor
• Pins: 24

S29GL032N - 3V Page Mode MirrorBit Flash [See More]

• Package Type: BGA; PG-LFBGA

Manufacturer: Microchip Technology. Win Source Part Number: 1019493-AT45DB161-CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (528 Bytes x 4096 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85 °C... [See More]

• Package Type: BGA; 24-CBGA
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: -40 to 85

Cypress, NOR Flash, S26HL512TFPBHI000 [See More]

• Package Type: BGA
• Supply Voltage: 3 v

• Technology: Nor
• Pins: 24

S29GL128S - 128-Mbit (16 Mbyte), 3.0V, GL-S Flash Memory [See More]

• Package Type: BGA; PG-VFBGA-56

Manufacturer: Microchip Technology. Win Source Part Number: 221160-AT45DB161B-CC. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (528 Bytes x 4096 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: 0 °C to 70 °C (TC). [See More]

• Package Type: BGA; 24-CBGA
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: 0 to 70

Cypress, NOR Flash, S26HL512TFPBHI010 [See More]

• Package Type: BGA
• Supply Voltage: 3 v

• Technology: Nor
• Pins: 24

S29PL127J - 3 V, Flash with Enhanced Versatile IO [See More]

• Package Type: BGA; PG-VFBGA-8

Manufacturer: Microchip Technology. Win Source Part Number: 221161-AT45DB161B-CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (528 Bytes x 4096 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85 °C... [See More]

• Package Type: BGA; 24-CBGA
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: -40 to 85

Cypress, NOR Flash, S26HS512TGABHI010 [See More]

• Package Type: BGA
• Supply Voltage: 1.8 v

• Technology: Nor
• Pins: 24

S29PL127J - 3 V, Flash with Enhanced Versatile IO [See More]

• Package Type: BGA; FBGA

Manufacturer: Microchip Technology. Win Source Part Number: 1019495-AT45DB161D-CU. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (528 Bytes x 4096 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85 °C... [See More]

• Package Type: BGA; 24-CBGA
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: -40 to 85

Infineon STD SPI S25FL128SAGBHI200 [See More]

• Package Type: BGA
• Technology: Sectored; NOR

• Density: 1024000
• Pins: 24

S29VS064R - 1.8 V, Multiplexed, Burst MirrorBit Flash [See More]

• Package Type: BGA; VFBGA44

Manufacturer: Microchip Technology. Win Source Part Number: 221171-AT45DB321B-CC. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 32Mb (528 Bytes x 8192 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: 0 °C to 70 °C (TC). [See More]

• Package Type: BGA; 44-CBGA (6x12)
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: 0 to 70

Infineon STD SPI S25FL256SAGBHI200 [See More]

• Package Type: BGA
• Technology: Sectored; NOR

• Density: 2048000
• Pins: 24

Flash, 128MX8, PBGA63 [See More]

• Package Type: BGA; BGA63

Manufacturer: Microchip Technology. Win Source Part Number: 221172-AT45DB321B-CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 32Mb (528 Bytes x 8192 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85 °C... [See More]

• Package Type: BGA; 44-CBGA (6x12)
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: -40 to 85

Infineon STD SPI S25FL256SAGBHI300 [See More]

• Package Type: BGA
• Technology: Sectored; NOR

• Density: 2048000
• Pins: 24

S34ML02G1 - 2Gb, 3 V, 1-bit ECC, SLC NAND Flash for Embedded [See More]

• Package Type: BGA; BGA63

• Technology: NAND

Manufacturer: Microchip Technology. Win Source Part Number: 1019506-AT45DB321C-CC. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 32Mb (528 Bytes x 8192 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: 0 °C to 70 °C (TC). [See More]

• Package Type: BGA; 24-CBGA
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: 0 to 70

4 Gb, 1-bit ECC, 1.8V SLC NAND Flash [See More]

• Package Type: BGA; FBGA63

• Technology: NAND

Manufacturer: Microchip Technology. Win Source Part Number: 1019507-AT45DB321C-CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 32Mb (528 Bytes x 8192 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85 °C... [See More]

• Package Type: BGA; 24-CBGA
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: -40 to 85

4 Gb, 1-bit ECC, 1.8V SLC NAND Flash [See More]

• Package Type: BGA; FBGA165

• Technology: NAND

Manufacturer: Microchip Technology. Win Source Part Number: 1019508-AT45DB321C-CU. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 32Mb (528 Bytes x 8192 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85 °C... [See More]

• Package Type: BGA; 24-CBGA
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: -40 to 85

SST39VF1601C - 2.7V to 3.6V 16Mbit Multi-Purpose Flash [See More]

• Package Type: BGA; TFBGA48

Manufacturer: Microchip Technology. Win Source Part Number: 078943-AT49BV1604-11UI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (2M x 8, 1M x 16). Access Time: 110ms. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to... [See More]

• Package Type: BGA; 48-μBGA (6.75x8.5)
• Operating Temperature: -40 to 85

• Access Time: 1.10E8
• Supply Voltage: 2.7 V ~ 3.3 V

Manufacturer: Microchip Technology. Win Source Part Number: 1019548-AT49BV160C-70CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (1M x 16). Access Time: 70ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85... [See More]

• Package Type: BGA; 46-CBGA (6.5x7.5)
• Operating Temperature: -40 to 85

• Access Time: 70
• Supply Voltage: 2.65 V ~ 3.6 V

Manufacturer: Microchip Technology. Win Source Part Number: 078944-AT49BV160S-70CU. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (1M x 16). Access Time: 70ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85... [See More]

• Package Type: BGA; 64-CBGA (9x10)
• Operating Temperature: -40 to 85

• Access Time: 70
• Supply Voltage: 2.65 V ~ 3.6 V

Manufacturer: Microchip Technology. Win Source Part Number: 078945-AT49BV160ST-70CU. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (1M x 16). Access Time: 70ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85... [See More]

• Package Type: BGA; 64-CBGA (9x10)
• Operating Temperature: -40 to 85

• Access Time: 70
• Supply Voltage: 2.65 V ~ 3.6 V

Manufacturer: Microchip Technology. Win Source Part Number: 1019551-AT49BV160T-70CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (2M x 8, 1M x 16). Access Time: 70ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to... [See More]

• Package Type: BGA; 45-CBGA (6.5x7.5)
• Operating Temperature: -40 to 85

• Access Time: 70
• Supply Voltage: 2.65 V ~ 3.3 V

Manufacturer: Microchip Technology. Win Source Part Number: 078946-AT49BV1614AT-90CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (2M x 8, 1M x 16). Access Time: 90ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to... [See More]

• Package Type: BGA; 48-CBGA (6x8)
• Operating Temperature: -40 to 85

• Access Time: 90
• Supply Voltage: 2.65 V ~ 3.3 V

Manufacturer: Microchip Technology. Win Source Part Number: 1019558-AT49BV161T-70CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (2M x 8, 1M x 16). Access Time: 70ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to... [See More]

• Package Type: BGA; 48-CBGA (6x8)
• Operating Temperature: -40 to 85

• Access Time: 70
• Supply Voltage: 2.65 V ~ 3.3 V

IC FLSH RAM 4GBYTE EMMC 221VFBGA [See More]

• Package Type: BGA
• Supply Voltage: -25degC ~ 85degC

• Density: 32000000

FLASH - NAND, DRAM - LPDDR Memory IC 4GByte (NAND), 4Gbit (LPDDR3 DRAM) eMMC 5.1 HS400 + LPDDR3 221-VFBGA (13x11.5) [See More]

• Package Type: BGA; 221-VFBGA
• Technology: NAND

• Density: 32000000
• Operating Temperature: -25 to 85

IC FLSH RAM 32GBYTE EMMC 144FBGA [See More]

• Package Type: BGA; 144-FBGA (8x9.5)
• Supply Voltage: -25degC ~ 85degC

• Density: 256000000

VFBGA-63 NAND FLASH ROHS [See More]

• Package Type: BGA

• Technology: NAND

Cypress HyperBus Memory is a portfolio of high-speed, low-pin-count memory products that uses our HyperBus interface technology.   The HyperBus interface draws upon the legacy features of both parallel and serial interface memories, while enhancing system performance, ease of design, and system... [See More]

• Package Type: BGA
• Supply Voltage: 1.8V; 3V

• Density: 64000 to 512000
• Operating Range: Commercial; Industrial

IC FLSH RAM 8GBYTE EMMC 221VFBGA [See More]

• Package Type: BGA
• Supply Voltage: -25degC ~ 85degC

• Density: 64000000

FLASH - NAND, DRAM - LPDDR Memory IC 8GByte (NAND), 8Gbit (LPDDR3 DRAM) eMMC 5.1 HS400 + LPDDR3 221-VFBGA (13x11.5) [See More]

• Package Type: BGA; 221-VFBGA
• Technology: NAND

• Density: 64000000
• Operating Temperature: -25 to 85

IC FLASH 128GBIT EMMC 153BGA [See More]

• Package Type: BGA; 153-BGA (11.5x13)
• Supply Voltage: -40degC ~ 105degC

• Density: 128000000

TBGA-100(14x18) NAND FLASH ROHS [See More]

• Package Type: BGA

• Technology: NAND

IC FLASH 64GBIT EMMC 153BGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC

• Density: 64000000

FLASH - NAND, DRAM - LPDDR Memory IC 8GByte (NAND), 8Gbit (LPDDR3 DRAM) eMMC 5.1 HS400 + LPDDR3 136-FBGA (10x10) [See More]

• Package Type: BGA; 136-FBGA
• Technology: NAND

• Density: 64000000
• Operating Temperature: -25 to 85

IC FLASH 8MBIT PARALLEL 48FBGA [See More]

• Package Type: BGA; 48-FBGA (6x9)
• Supply Voltage: 0degC ~ 70degC (TA)

• Density: 8000

TFBGA-153(11.5x13) NAND FLASH ROHS [See More]

• Package Type: BGA

• Technology: NAND

IC FLASH 32MBIT SPI 66MHZ 24CBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC (TC)

• Density: 32000

FLASH - NAND, DRAM - LPDDR Memory IC 16GByte (NAND), 16Gbit (LPDDR4 DRAM) eMMC 5.1 HS400 + LPDDR4X 254-FBGA (11.5x13x1.0) [See More]

• Package Type: BGA; 254-FBGA
• Technology: NAND

• Density: 128000000
• Operating Temperature: -25 to 85

MEMORY [See More]

• Package Type: BGA; 153-FBGA (11.5x13)
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 64000000

DBGA-8 NOR FLASH ROHS [See More]

• Package Type: BGA

• Technology: Sectored

IC FLASH 64MBIT SPI 85MHZ 9UBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC (TC)

• Density: 64000

FLASH - NAND, DRAM - LPDDR Memory IC 32GByte (NAND), 16Gbit (LPDDR4 DRAM) eMMC 5.1 HS400 + LPDDR4X 254-FBGA (11.5x13x1.0) [See More]

• Package Type: BGA; 254-FBGA
• Technology: NAND

• Density: 256000000
• Operating Temperature: -25 to 85

IC FLASH 32GBIT EMMC 100FBGA [See More]

• Package Type: BGA; 100-FBGA (14x18)
• Supply Voltage: -40degC ~ 85degC

• Density: 32000000

512Mbit SPI TPBGA-24(6x8) NOR FLASH ROHS [See More]

• Package Type: BGA
• Technology: Sectored

• Density: 512000
• Operating Temperature: -40 to 85

IC FLASH 32MBIT SPI/QUAD 24CBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC

• Density: 32000

FLASH - NAND, DRAM - LPDDR Memory IC 32GByte (NAND), 16Gbit (LPDDR4 DRAM) eMMC 5.1 HS400 + LPDDR4X 144-FBGA (8x9.5) [See More]

• Package Type: BGA; 144-FBGA
• Technology: NAND

• Density: 256000000
• Operating Temperature: -25 to 85

IC FLASH 256GBIT EMMC 153VFBGA [See More]

• Package Type: BGA; 153-VFBGA (11.5x13)
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 256000000

IC FLASH 32GBIT EMMC 153FBGA [See More]

• Package Type: BGA
• Supply Voltage: -25degC ~ 85degC

• Density: 32000000

FLASH - NAND, DRAM - LPDDR Memory IC 32GByte (NAND), 16Gbit (LPDDR4 DRAM) eMMC 5.1 HS400 + LPDDR4X 144-FBGA (8x9.5) [See More]

• Package Type: BGA; 144-FBGA
• Technology: NAND

• Density: 256000000
• Operating Temperature: -25 to 85

IC FLASH 256GBIT EMMC 100LFBGA [See More]

• Package Type: BGA; 100-LFBGA (14x18)
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 256000000

IC FLASH 16GBIT EMMC 153FBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC

• Density: 16000000

FLASH - NAND (pSLC) Memory IC 64Gbit eMMC 153-BGA (11.5x13) [See More]

• Package Type: BGA; 153-FBGA
• Technology: NAND

• Density: 64000000
• Operating Temperature: -40 to 105

IC FLASH 64MBIT SPI/OCTL 24TFBGA [See More]

• Package Type: BGA; 24-TFBGA (6x8)
• Supply Voltage: -40degC ~ 105degC (TA)

• Density: 64000

IC FLASH 128GBIT EMMC 153FBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC

• Density: 128000000

FLASH Memory IC 32Mbit Parallel 90 ns 63-FBGA (8x14) [See More]

• Package Type: BGA; 63-TFBGA
• Access Time: 90

• Density: 32000
• Operating Temperature: -40 to 85

IC FLASH 32MBIT PARALLEL 48TFBGA [See More]

• Package Type: BGA; 48-TFBGA (6x8)
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 32000

IC FLASH 256GBIT EMMC 100FBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC

• Density: 256000000

FLASH Memory IC 8Mbit Parallel 120 ns 48-FBGA (6x9) [See More]

• Package Type: BGA; 48-TFBGA
• Access Time: 120

• Density: 8000
• Operating Temperature: 0 to 70

IC FLASH 128MBIT SPI 24TPBGA [See More]

• Package Type: BGA; 24-T-PBGA (6x8)
• Supply Voltage: -40degC ~ 125degC (TA)

• Density: 128000

IC FLASH 64MBIT PARALLEL 48VFBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 64000

FLASH - NAND Memory IC 32Gbit MMC 200 MHz 153-FBGA (11.5x13) [See More]

• Package Type: BGA; 153-VFBGA
• Technology: NAND

• Density: 32000000
• Operating Temperature: -40 to 85

IC FLASH 128GBIT PAR 132VBGA [See More]

• Package Type: BGA; 132-VBGA (12x18)
• Supply Voltage: 0degC ~ 70degC (TA)

• Density: 128000000

IC FLASH 8MBIT CUI 48UBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 8000

FLASH Memory IC 4Mbit SPI 104 MHz 8-WLCSP (1.63x1.58) [See More]

• Package Type: BGA; 8-XFBGA, WLCSP
• Operating Temperature: -40 to 85

• Density: 4000
• Supply Voltage: 1.65V ~ 3.6V; 3.6V

UFS 4T [See More]

• Package Type: BGA; 153-VFBGA (11.5x13)
• Supply Voltage: -25degC ~ 85degC

• Density: 4000000000

IC FLASH 32MBIT PARALLEL 47TFBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 32000

FLASH Memory IC 32Mbit SPI 100 MHz 9-UBGA (6x6) [See More]

• Package Type: BGA; 9-UBGA
• Operating Temperature: -40 to 85

• Density: 32000
• Supply Voltage: 2.7V ~ 3.6V; 3.6V

MEMORY [See More]

• Package Type: BGA; 24-CSPBGA (6x8)
• Supply Voltage: -40degC ~ 105degC (TA)

• Density: 512000

IC FLASH 32MBIT PARALLEL 64TFBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 32000

FLASH Memory IC 8Mbit SPI 100 MHz 8-WLCSP (4x2) [See More]

• Package Type: BGA; 8-XFBGA, WLCSP
• Operating Temperature: -40 to 85

• Density: 8000
• Supply Voltage: 1.65V ~ 1.95V

IC FLASH 4GBIT ONFI 63VFBGA [See More]

• Package Type: BGA; 63-VFBGA (9x11)
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 4000000

IC FLASH 16MBIT PARALLEL 48TFBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 16000

FLASH - NOR Memory IC 4Mbit SPI - Quad I/O 104 MHz 8-WLCSP (1.77x1.74) [See More]

• Package Type: BGA; 8-XFBGA, WLCSP
• Technology: Sectored

• Density: 4000
• Operating Temperature: -40 to 85

IC FLASH 256MBIT SPI/QUAD 24BGA [See More]

• Package Type: BGA; 24-BGA (8x6)
• Supply Voltage: -40degC ~ 105degC (TA)

• Density: 256000

IC FLASH 128MBIT PARALLEL 80LBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 128000

FLASH Memory IC 128Mbit SPI - Quad I/O, QPI 104 MHz 21-WLCSP (3.02x3.29) [See More]

• Package Type: BGA; 21-UFBGA, WLCSP
• Operating Temperature: -40 to 85

• Density: 128000
• Supply Voltage: 1.7V ~ 2V

IC FLASH 1GBIT SPI/QUAD 24FBGA [See More]

• Package Type: BGA; 24-BGA (8x6)
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 1000000

IC FLASH 1GBIT PARALLEL 69FBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 1000000

FLASH Memory IC 32Mbit SPI - Quad I/O, QPI 104 MHz 8-WLCSP (1.55x2.28) [See More]

• Package Type: BGA; 8-UFBGA, WLCSP
• Operating Temperature: -40 to 85

• Density: 32000
• Supply Voltage: 1.7V ~ 2V

IC FLASH 2GBIT SPI/QUAD 24FBGA [See More]

• Package Type: BGA; 24-FBGA (8x8)
• Supply Voltage: -40degC ~ 105degC (TA)

• Density: 2000000

IC FLASH 1GBIT SPI 24TPBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 105degC (TA)

• Density: 1000000

FLASH Memory IC 64Mbit SPI - Quad I/O, QPI 104 MHz 8-WLCSP (1.92x3.01) [See More]

• Package Type: BGA; 8-UFBGA, WLCSP
• Operating Temperature: -40 to 85

• Density: 64000
• Supply Voltage: 1.7V ~ 2V

IC FLASH 1GBIT PARALLEL 64FBGA [See More]

• Package Type: BGA; 64-FBGA (13x11)
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 1000000

IC FLASH 1GBIT SPI 24TPBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 125degC (TA)

• Density: 1000000

FLASH - NOR Memory IC 16Mbit SPI - Quad I/O 108 MHz 8-WLCSP (1.61x1.35) [See More]

• Package Type: BGA; 8-XFBGA, WLCSP
• Technology: Sectored

• Density: 16000
• Operating Temperature: -40 to 85

IC FLASH 80GBIT EMMC 153BGA [See More]

• Package Type: BGA; 153-BGA (11.5x13)
• Supply Voltage: -40degC ~ 85degC

• Density: 80000000

IC FLASH 256MBIT SPI 24TPBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 105degC (TA)

• Density: 256000

FLASH Memory IC 4Mbit SPI 20 MHz 14-CBGA (4.5x7) [See More]

• Package Type: BGA; 14-LBGA, CSPBGA
• Operating Temperature: 0 to 70

• Density: 4000
• Supply Voltage: 2.7V ~ 3.6V; 3.6V

IC FLASH 1TBIT EMMC 153BGA [See More]

• Package Type: BGA; 153-BGA (11.5x13)
• Supply Voltage: -40degC ~ 105degC (TA)

• Density: 1000000000

IC FLASH 1GBIT PARALLEL 64LBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 1000000

FLASH Memory IC 16Mbit SPI 13 MHz 24-CBGA (7x9.5) [See More]

• Package Type: BGA; 24-LBGA, CSPBGA
• Operating Temperature: -40 to 85

• Density: 16000
• Supply Voltage: 2.7V ~ 3.6V; 3.6V

IC FLASH 1TBIT EMMC 100BGA [See More]

• Package Type: BGA; 100-BGA (14x18)
• Supply Voltage: -40degC ~ 85degC

• Density: 1000000000

IC FLASH RAM 4GBIT PAR 162VFBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 105degC (TA)

• Density: 4000000

FLASH Memory IC 16Mbit SPI 66 MHz 24-CBGA (6x8) [See More]

• Package Type: BGA; 24-LBGA, CSPBGA
• Operating Temperature: -40 to 85

• Density: 16000
• Supply Voltage: 2.7V ~ 3.6V; 3.6V

IC FLASH 32GBIT EMMC 153BGA [See More]

• Package Type: BGA; 153-BGA (11.5x13)
• Supply Voltage: -40degC ~ 85degC

• Density: 32000000

IC FLASH RAM 1GBIT PAR 130VFBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 1000000

FLASH Memory IC 32Mbit SPI 20 MHz 44-CBGA (6x12) [See More]

• Package Type: BGA; 44-TBGA, CSPBGA
• Operating Temperature: 0 to 70

• Density: 32000
• Supply Voltage: 2.7V ~ 3.6V; 3.6V

IC FLASH 160GBIT EMMC 100BGA [See More]

• Package Type: BGA; 100-BGA (14x18)
• Supply Voltage: -40degC ~ 85degC

• Density: 160000000

IC FLASH RAM 4GBIT PAR 137VFBGA [See More]

• Package Type: BGA
• Supply Voltage: -25degC ~ 85degC (TA)

• Density: 4000000

FLASH Memory IC 64Mbit SPI 85 MHz 44-WLCSP (3.52x4.22) [See More]

• Package Type: BGA; 44-UFBGA, WLCSP
• Operating Temperature: -40 to 85

• Density: 64000
• Supply Voltage: 1.7V ~ 3.6V; 3.6V

Ferri-UFS BGA 153-b eMMC 3D TLC [See More]

• Package Type: BGA; 153-BGA (11.5x13)
• Supply Voltage: -40degC ~ 85degC

• Density: 160000000

IC FLASH RAM 4GBIT PAR 168WFBGA [See More]

• Package Type: BGA
• Supply Voltage: -25degC ~ 85degC (TA)

• Density: 4000000

FLASH Memory IC 16Mbit Parallel 70 ns 46-CBGA (6.5x7.5) [See More]

• Package Type: BGA; 46-VFBGA, CSBGA
• Access Time: 70

• Density: 16000
• Operating Temperature: -40 to 85

IC FLASH UFS2.1 153BGA [See More]

• Package Type: BGA; 153-BGA (11.5x13)

• Supply Voltage: -40degC ~ 85degC