BGA FLASH Memory Chips

Manufacturer: Cypress Semiconductor Corp. Storage Condition: Dry storage cabinet & Humidity protection package. Win Source Part Number: 1154832-AM29SL800DB90WAD. Number of Pins: 48. Categories: Custom Parts. Case / Package: FBGA. Popularity: Medium. Fake Threat In the Open Market: 53 pct. Supply... [See More]

• Package Type: BGA; FBGA

• Pins: 48

Cypress, S25FL128LAGBHV020 [See More]

• Package Type: BGA
• Technology: Sectored; NOR

• Density: 1024000
• Pins: 24

1 Gbit(x8, 1 bit ECC), 63 Ball V Product overview: IS34ML01G081-BLI-TR from Integrated Silicon Solution, Inc. (ISSI) is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers... [See More]

• Package Type: BGA; Tape & Reel (TR)
• Number of Words: 128000

• Density: 1000000
• Technology: NAND

IC FLASH 1GBIT SPI/QUAD 24TFBGA [See More]

• Package Type: BGA; 24-BGA
• Operating Temperature: -40 to 85

• Technology: Sectored
• Supply Voltage: 1.65V ~ 2V

Flash, 1MX8, 90ns, PBGA46 [See More]

• Package Type: BGA; BGA45

Manufacturer: Micron Technology Inc. Win Source Part Number: 197454-28F256K3C. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH - NOR. Memory Size: 256Mb (16M x 16). Access Time: 120ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85... [See More]

• Package Type: BGA; 64-EasyBGA (10x13)
• Operating Temperature: -40 to 85

• Access Time: 120
• Supply Voltage: 2.7 V ~ 3.6 V

Cypress, S25FL256LAGBHV020 [See More]

• Package Type: BGA
• Technology: Sectored; NOR

• Density: 2048000
• Pins: 24

Managed NAND Flash Serial e-MMC 1.2V 256G-bit 32G x 8 153-Pin BGA Product overview: MTFC32GBCAQTC-WT from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for... [See More]

• Package Type: BGA; Tray
• Number of Words: 32000000

• Density: 256000000
• Technology: NAND

IC FLASH 2GBIT SPI/QUAD 24CSPBGA [See More]

• Package Type: BGA; 24-BGA
• Operating Temperature: -40 to 105

• Technology: Sectored
• Supply Voltage: 1.65V ~ 2V

IS26KS128 128 MBit HyperFlash Non Volatile Memory [See More]

• Package Type: BGA; TFBGA25

Manufacturer: Micron Technology Inc. Win Source Part Number: 075697-320W18BE. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH - NOR. Memory Size: 32Mb (2M x 16). Access Time: 60ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85... [See More]

• Package Type: BGA; 56-VFBGA
• Operating Temperature: -40 to 85

• Access Time: 60
• Supply Voltage: 1.7 V ~ 1.95 V

Cypress Semiconductor, S25FL256SAGBHV200 [See More]

• Package Type: BGA
• Technology: Sectored; NOR

• Density: 2048000
• Pins: 24

Flash Card 128M-byte 1.8V/3.3V Embedded Flash Drive 115-Pin FBGA Tray Product overview: MD2534-D1G-X-P/Y from SanDisk is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for... [See More]

• Package Type: BGA; FBGA

• Technology: NAND

IC FLSH RAM 512MBIT HYPRBS 24BGA [See More]

• Package Type: BGA; 24-BGA
• Operating Temperature: -40 to 105

• Density: 512000
• Supply Voltage: 2.7V ~ 3.6V

Flash, 2MX16, 70ns, PBGA56 [See More]

• Package Type: BGA; BGA56

Manufacturer: Microchip Technology. Win Source Part Number: 162214-45DB041B. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 4Mb (264 Bytes x 2048 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: 0 °C to 70 °C (TC). Case /... [See More]

• Package Type: BGA; 14-CBGA (4.5x7)
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: 0 to 70

Cypress Semiconductor, S25FL512SAGBHI310 [See More]

• Package Type: BGA
• Technology: Sectored; NOR

• Density: 4096000
• Pins: 24

Flash PLD, 7ns, 2210 Cells, 1.8V, FBGA-324 Product overview: EPM2210GF324C3 from Intel is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing... [See More]

• Package Type: BGA; FBGA
• Operating Temperature: 0

• Operating Current: 40
• Supply Voltage: 1.71V

32GB EMMC TLC 5.1 -25C+85C IND [See More]

• Package Type: BGA; 153-BGA
• Operating Temperature: -25 to 85

• Technology: NAND
• Supply Voltage: 1.8V ~ 3.3V

Flash, 8MX16, 85ns, PBGA64 [See More]

• Package Type: BGA; PBGA64

Manufacturer: Microchip Technology. Win Source Part Number: 1019454-AT45DB011B-CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 1Mb (264 Bytes x 512 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85 °C (TC). [See More]

• Package Type: BGA; 9-CBGA (5x5)
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: -40 to 85

Cypress Semiconductor, S29GL064S70BHI030 [See More]

• Package Type: BGA
• Technology: Sectored; NOR

• Density: 512000
• Pins: 48

SLC NAND Flash Parallel 1.8V 4G-bit 512M x 8 63-Pin VFBGA Tray Product overview: MT29F4G08ABBFAH4-IT:F from Micron Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for... [See More]

• Package Type: BGA; Tray
• Number of Words: 512000

• Density: 4000000
• Technology: NAND

FLASH - NAND (SLC) Memory IC 4Gb (512M x 8) Parallel 63-BGA (9x11) [See More]

• Package Type: BGA; 63-BGA
• Operating Temperature: -40 to 85

• Technology: NAND
• Supply Voltage: 2.7V ~ 3.6V

S25FL064L - (8-MB), 3.0V FL-L SPI Flash Memory [See More]

• Package Type: BGA; PG-TFBGA-24

Manufacturer: Microchip Technology. Win Source Part Number: 221124-AT45DB021B-CC. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 2Mb (264 Bytes x 1024 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: 0 °C to 70 °C (TC). [See More]

• Package Type: BGA; 9-CBGA (5x5)
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: 0 to 70

Cypress Semiconductor, S29GL512T11FHIV20 [See More]

• Package Type: BGA
• Pins: 64

• Density: 4096000

Flash NOR Parallel , P30, 1.8V, Product overview: PF48F4400P0VBQEK from Alliance Memory, Inc. is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing... [See More]

• Package Type: BGA; CSP; Tape & Reel (TR)
• Access Time: 85

• Technology: Sectored
• Operating Temperature: -40 to 85

S25FL128S - (16-MB), 3.0 V FL-L Flash Memory [See More]

• Package Type: BGA; PG-TFBGA-24

Manufacturer: Microchip Technology. Win Source Part Number: 221132-AT45DB041B-CC. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 4Mb (264 Bytes x 2048 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: 0 °C to 70 °C (TC). [See More]

• Package Type: BGA; 14-CBGA (4.5x7)
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: 0 to 70

Cypress, NOR Flash, S25HL512TFABHI010 [See More]

• Package Type: BGA
• Supply Voltage: 3 v

• Technology: Nor
• Pins: 24

NOR FLASH PARALLEL/SERIAL 1.8V 2 Product overview: S29VS256RABBHI000 from Infineon Technologies is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing... [See More]

• Package Type: BGA; Tray
• Access Time: 80

• Technology: Sectored
• Operating Temperature: -40 to 85

S29AL008J - 8-MBit (1M x 8-Bit/512K x 16-Bit), 3V, Boot Sector Flash [See More]

• Package Type: BGA; PG-VFBGA-48

• Density: 0 to 0

Manufacturer: Microchip Technology. Win Source Part Number: 221133-AT45DB041B-CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 4Mb (264 Bytes x 2048 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85 °C (TC). [See More]

• Package Type: BGA; 14-CBGA (4.5x7)
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: -40 to 85

Cypress, NOR Flash, S25HS512TDPBHI010 [See More]

• Package Type: BGA
• Supply Voltage: 1.8 v

• Technology: Nor
• Pins: 24

Combo Mem 16Mx16 Flash + 4Mx16 PSRAM 1.8V 84-Pin FBGA Tray Product overview: S71WS256NC0BFWAM0 from Spansion is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and... [See More]

• Package Type: BGA; FBGA

S29AL008J - 8-MBit (1M x 8-Bit/512K x 16-Bit), 3V, Boot Sector Flash [See More]

• Package Type: BGA; PG-VFBGA-48

• Density: 0 to 0

Manufacturer: Microchip Technology. Win Source Part Number: 221151-AT45DB081B-CC. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 8Mb (264 Bytes x 4096 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: 0 °C to 70 °C (TC). [See More]

• Package Type: BGA; 14-CBGA (4.5x7)
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: 0 to 70

Cypress, NOR Flash, S25HS512TFABHI010 [See More]

• Package Type: BGA
• Supply Voltage: 1.8 v

• Technology: Nor
• Pins: 24

Combo Mem 16Mx16 Flash + 8Mx16 PSRAM 1.8V 84-Pin FBGA Tray Product overview: S71WS256ND0BFWYM0 from Spansion is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and... [See More]

• Package Type: BGA; FBGA

S29GL032N - 3V Page Mode MirrorBit Flash [See More]

• Package Type: BGA; PG-LFBGA

Manufacturer: Microchip Technology. Win Source Part Number: 1019493-AT45DB161-CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (528 Bytes x 4096 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85 °C... [See More]

• Package Type: BGA; 24-CBGA
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: -40 to 85

Cypress, NOR Flash, S26HL512TFPBHI000 [See More]

• Package Type: BGA
• Supply Voltage: 3 v

• Technology: Nor
• Pins: 24

Combo Mem 32Mx16 Flash + 8Mx16 PSRAM 1.8V 84-Pin FBGA Tray Product overview: S71WS512PD0HF3SR0 from Spansion is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and... [See More]

• Package Type: BGA; FBGA

• Operating Temperature: -25

S29GL128S - 128-Mbit (16 Mbyte), 3.0V, GL-S Flash Memory [See More]

• Package Type: BGA; PG-VFBGA-56

Manufacturer: Microchip Technology. Win Source Part Number: 221160-AT45DB161B-CC. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (528 Bytes x 4096 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: 0 °C to 70 °C (TC). [See More]

• Package Type: BGA; 24-CBGA
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: 0 to 70

Cypress, NOR Flash, S26HL512TFPBHI010 [See More]

• Package Type: BGA
• Supply Voltage: 3 v

• Technology: Nor
• Pins: 24

IC FLASH 8MBIT SPI 100MHZ 8WLCSP Product overview: AT25DL081-UUN-T from Renesas Electronics Corporation is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers... [See More]

• Package Type: BGA; CSP; Tape & Reel (TR)
• Supply Voltage: 1.65V ~ 1.95V

• Operating Temperature: -40 to 85

S29PL127J - 3 V, Flash with Enhanced Versatile IO [See More]

• Package Type: BGA; PG-VFBGA-8

Manufacturer: Microchip Technology. Win Source Part Number: 221161-AT45DB161B-CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (528 Bytes x 4096 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85 °C... [See More]

• Package Type: BGA; 24-CBGA
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: -40 to 85

Cypress, NOR Flash, S26HS512TGABHI010 [See More]

• Package Type: BGA
• Supply Voltage: 1.8 v

• Technology: Nor
• Pins: 24

IC FLASH 4MBIT SPI 104MHZ 8WLCSP Product overview: AT25DF041B-UUN-T from Renesas Electronics Corporation is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers... [See More]

• Package Type: BGA; CSP; Tape & Reel (TR)
• Supply Voltage: 1.65V ~ 3.6V; 3.6V

• Operating Temperature: -40 to 85

S29PL127J - 3 V, Flash with Enhanced Versatile IO [See More]

• Package Type: BGA; FBGA

Manufacturer: Microchip Technology. Win Source Part Number: 1019495-AT45DB161D-CU. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (528 Bytes x 4096 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85 °C... [See More]

• Package Type: BGA; 24-CBGA
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: -40 to 85

Infineon STD SPI S25FL128SAGBHI200 [See More]

• Package Type: BGA
• Technology: Sectored; NOR

• Density: 1024000
• Pins: 24

IC FLASH 128MBIT PARALLEL 44FBGA / FLASH - NOR Memory IC 128Mb (8M x 16) Parallel 108 MHz 80 ns 44-FBGA (7.5x5) Product overview: S29XS128RABBHW003 from Infineon Technologies is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing... [See More]

• Package Type: BGA; Tape & Reel (TR)
• Access Time: 80

• Technology: Sectored
• Operating Temperature: -25 to 85

S29VS064R - 1.8 V, Multiplexed, Burst MirrorBit Flash [See More]

• Package Type: BGA; VFBGA44

Manufacturer: Microchip Technology. Win Source Part Number: 221171-AT45DB321B-CC. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 32Mb (528 Bytes x 8192 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: 0 °C to 70 °C (TC). [See More]

• Package Type: BGA; 44-CBGA (6x12)
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: 0 to 70

Infineon STD SPI S25FL256SAGBHI200 [See More]

• Package Type: BGA
• Technology: Sectored; NOR

• Density: 2048000
• Pins: 24

IC FLASH 128MBIT PARALLEL 64FBGA / FLASH - NOR Memory IC 128Mb (16M x 8) Parallel 90 ns 64-FBGA (13x11) Product overview: S29GL128P90FFCR10A from Spansion is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and... [See More]

• Package Type: BGA; Bulk
• Access Time: 90

• Technology: Sectored
• Operating Temperature: 0 to 70

Flash, 128MX8, PBGA63 [See More]

• Package Type: BGA; BGA63

Manufacturer: Microchip Technology. Win Source Part Number: 221172-AT45DB321B-CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 32Mb (528 Bytes x 8192 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85 °C... [See More]

• Package Type: BGA; 44-CBGA (6x12)
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: -40 to 85

Infineon STD SPI S25FL256SAGBHI300 [See More]

• Package Type: BGA
• Technology: Sectored; NOR

• Density: 2048000
• Pins: 24

128Mb QPI/QSPI, 24-ball TFBGA 6x Product overview: IS25WP128F-RHLA3-TR from Integrated Silicon Solution, Inc. (ISSI) is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers... [See More]

• Package Type: BGA; Tape & Reel (TR)
• Access Time: 5.5

• Technology: Sectored
• Operating Temperature: -40 to 125

S34ML02G1 - 2Gb, 3 V, 1-bit ECC, SLC NAND Flash for Embedded [See More]

• Package Type: BGA; BGA63

• Technology: NAND

Manufacturer: Microchip Technology. Win Source Part Number: 1019506-AT45DB321C-CC. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 32Mb (528 Bytes x 8192 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: 0 °C to 70 °C (TC). [See More]

• Package Type: BGA; 24-CBGA
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: 0 to 70

IC FLASH 128MBIT PARALLEL 64FBGA / FLASH - NOR Memory IC 128Mb (16M x 8, 8M x 16) Parallel 100 ns 64-FBGA (13x11) Product overview: S29GL128N10FFI010A from Infineon Technologies is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing... [See More]

• Package Type: BGA; Bulk
• Access Time: 100

• Technology: Sectored
• Operating Temperature: -40 to 85

4 Gb, 1-bit ECC, 1.8V SLC NAND Flash [See More]

• Package Type: BGA; FBGA63

• Technology: NAND

Manufacturer: Microchip Technology. Win Source Part Number: 1019507-AT45DB321C-CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 32Mb (528 Bytes x 8192 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85 °C... [See More]

• Package Type: BGA; 24-CBGA
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: -40 to 85

PARALLEL NOR MIRRORBIT FLASH, 12 / FLASH - NOR Memory IC 128Mb (16M x 8, 8M x 16) Parallel 110 ns 64-FBGA (13x11) Product overview: S29GL128N11FFA022 from Spansion is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and... [See More]

• Package Type: BGA; Bulk
• Access Time: 110

• Technology: Sectored
• Operating Temperature: -40 to 85

4 Gb, 1-bit ECC, 1.8V SLC NAND Flash [See More]

• Package Type: BGA; FBGA165

• Technology: NAND

Manufacturer: Microchip Technology. Win Source Part Number: 1019508-AT45DB321C-CU. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 32Mb (528 Bytes x 8192 pages). Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85 °C... [See More]

• Package Type: BGA; 24-CBGA
• Supply Voltage: 2.7 V ~ 3.6 V

• Operating Temperature: -40 to 85

IC FLASH 128MBIT PARALLEL 64FBGA / FLASH - NOR Memory IC 128Mb (16M x 8) Parallel 90 ns 64-FBGA (13x11) Product overview: S29GL128P90FFSS73 from Infineon Technologies is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules,... [See More]

• Package Type: BGA; Tape & Reel (TR)
• Access Time: 90

• Technology: Sectored
• Operating Temperature: 0 to 85

SST39VF1601C - 2.7V to 3.6V 16Mbit Multi-Purpose Flash [See More]

• Package Type: BGA; TFBGA48

Manufacturer: Microchip Technology. Win Source Part Number: 078943-AT49BV1604-11UI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (2M x 8, 1M x 16). Access Time: 110ms. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to... [See More]

• Package Type: BGA; 48-μBGA (6.75x8.5)
• Operating Temperature: -40 to 85

• Access Time: 1.10E8
• Supply Voltage: 2.7 V ~ 3.3 V

IC FLASH 128MBIT PARALLEL 80FBGA / FLASH - NOR Memory IC 128Mb (8M x 16) Parallel 60 ns 80-FBGA (8x11) Product overview: S29PL127J60BAI000 from Infineon Technologies is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and... [See More]

• Package Type: BGA; Tray
• Access Time: 60

• Technology: Sectored
• Operating Temperature: -40 to 85

Manufacturer: Microchip Technology. Win Source Part Number: 1019548-AT49BV160C-70CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (1M x 16). Access Time: 70ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85... [See More]

• Package Type: BGA; 46-CBGA (6.5x7.5)
• Operating Temperature: -40 to 85

• Access Time: 70
• Supply Voltage: 2.65 V ~ 3.6 V

Integrated 2-Slot PC Card, Dedicated Flash Media Socket & 1394a-2000 OHCI 2Port-PHY/Link-Layer Contr 288-BGA MICROSTAR 0 to 70 Product overview: PCI7420GHK from Texas Instruments is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers,... [See More]

• Package Type: BGA; LFBGA

• Operating Temperature: 0

Manufacturer: Microchip Technology. Win Source Part Number: 078944-AT49BV160S-70CU. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (1M x 16). Access Time: 70ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85... [See More]

• Package Type: BGA; 64-CBGA (9x10)
• Operating Temperature: -40 to 85

• Access Time: 70
• Supply Voltage: 2.65 V ~ 3.6 V

Integrated 2-Slot PC Card, Dedicated Flash Media Socket & 1394a-2000 OHCI 2Port-PHY/Link-Layer Contr 288-BGA MICROSTAR 0 to 70 Product overview: PCI7420ZHK from Texas Instruments is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers,... [See More]

• Package Type: BGA; LFBGA

• Operating Temperature: 0

Manufacturer: Microchip Technology. Win Source Part Number: 078945-AT49BV160ST-70CU. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (1M x 16). Access Time: 70ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to 85... [See More]

• Package Type: BGA; 64-CBGA (9x10)
• Operating Temperature: -40 to 85

• Access Time: 70
• Supply Voltage: 2.65 V ~ 3.6 V

IC FLASH 16MBIT SPI 13MHZ 24CBGA Product overview: AT45DB161-CI from Microchip Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing... [See More]

• Package Type: BGA; CSP; Tray
• Supply Voltage: 2.7V ~ 3.6V; 3.6V

• Operating Temperature: -40 to 85

Manufacturer: Microchip Technology. Win Source Part Number: 1019551-AT49BV160T-70CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (2M x 8, 1M x 16). Access Time: 70ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to... [See More]

• Package Type: BGA; 45-CBGA (6.5x7.5)
• Operating Temperature: -40 to 85

• Access Time: 70
• Supply Voltage: 2.65 V ~ 3.3 V

NOR Flash Parallel 3V/3.3V 32Mbit 2M/1M x 16bit/32bit 90ns 84-Pin FBGA Product overview: AM29PL320DT90WPI from AMD is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers... [See More]

• Package Type: BGA; FBGA
• Technology: Sectored

• Density: 32000
• Access Time: 90

Manufacturer: Microchip Technology. Win Source Part Number: 078946-AT49BV1614AT-90CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (2M x 8, 1M x 16). Access Time: 90ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to... [See More]

• Package Type: BGA; 48-CBGA (6x8)
• Operating Temperature: -40 to 85

• Access Time: 90
• Supply Voltage: 2.65 V ~ 3.3 V

EMMC 5.1 (HS400) 153B 16GB Product overview: EMMC16G-TB29-70H01 from Kingston is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets,... [See More]

• Package Type: BGA; Tray
• Operating Temperature: -25 to 85

• Technology: NAND
• Supply Voltage: 1.8V~ 3.3V; -3.3V; 3.3V

Manufacturer: Microchip Technology. Win Source Part Number: 1019558-AT49BV161T-70CI. Packaging: Tray. Mounting: SMD (SMT). Technology: FLASH. Memory Size: 16Mb (2M x 8, 1M x 16). Access Time: 70ns. Categories: Integrated Circuits. Status: Obsolete(EOL). Temperature Range - Operating: -40 °C to... [See More]

• Package Type: BGA; 48-CBGA (6x8)
• Operating Temperature: -40 to 85

• Access Time: 70
• Supply Voltage: 2.65 V ~ 3.3 V

IC FLASH 16MBIT PARALLEL 80FBGA / FLASH - NOR Memory IC 16Mb (512K x 32) Parallel 66 MHz 54 ns 80-FBGA (13x11) Product overview: S29CD016J0PFFI000 from Infineon Technologies is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing... [See More]

• Package Type: BGA; Tray
• Access Time: 54

• Technology: Sectored
• Operating Temperature: -40 to 85

IC FLSH RAM 4GBYTE EMMC 221VFBGA [See More]

• Package Type: BGA
• Supply Voltage: -25degC ~ 85degC

• Density: 32000000

Cypress HyperBus Memory is a portfolio of high-speed, low-pin-count memory products that uses our HyperBus interface technology.   The HyperBus interface draws upon the legacy features of both parallel and serial interface memories, while enhancing system performance, ease of design, and system... [See More]

• Package Type: BGA
• Supply Voltage: 1.8V; 3V

• Density: 64000 to 512000
• Operating Range: Commercial; Industrial

IC FLSH RAM 32GBYTE EMMC 144FBGA [See More]

• Package Type: BGA; 144-FBGA (8x9.5)
• Supply Voltage: -25degC ~ 85degC

• Density: 256000000

VFBGA-63 NAND FLASH ROHS [See More]

• Package Type: BGA

• Technology: NAND

FLASH - NAND, DRAM - LPDDR Memory IC 4GByte (NAND), 4Gbit (LPDDR3 DRAM) eMMC 5.1 HS400 + LPDDR3 221-VFBGA (13x11.5) [See More]

• Package Type: BGA; 221-VFBGA
• Technology: NAND

• Density: 32000000
• Operating Temperature: -25 to 85

IC FLSH RAM 8GBYTE EMMC 221VFBGA [See More]

• Package Type: BGA
• Supply Voltage: -25degC ~ 85degC

• Density: 64000000

IC FLASH 128GBIT EMMC 153BGA [See More]

• Package Type: BGA; 153-BGA (11.5x13)
• Supply Voltage: -40degC ~ 105degC

• Density: 128000000

TBGA-100(14x18) NAND FLASH ROHS [See More]

• Package Type: BGA

• Technology: NAND

FLASH - NAND, DRAM - LPDDR Memory IC 8GByte (NAND), 8Gbit (LPDDR3 DRAM) eMMC 5.1 HS400 + LPDDR3 221-VFBGA (13x11.5) [See More]

• Package Type: BGA; 221-VFBGA
• Technology: NAND

• Density: 64000000
• Operating Temperature: -25 to 85

IC FLASH 64GBIT EMMC 153BGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC

• Density: 64000000

IC FLASH 8MBIT PARALLEL 48FBGA [See More]

• Package Type: BGA; 48-FBGA (6x9)
• Supply Voltage: 0degC ~ 70degC (TA)

• Density: 8000

TFBGA-153(11.5x13) NAND FLASH ROHS [See More]

• Package Type: BGA

• Technology: NAND

FLASH - NAND, DRAM - LPDDR Memory IC 8GByte (NAND), 8Gbit (LPDDR3 DRAM) eMMC 5.1 HS400 + LPDDR3 136-FBGA (10x10) [See More]

• Package Type: BGA; 136-FBGA
• Technology: NAND

• Density: 64000000
• Operating Temperature: -25 to 85

IC FLASH 32MBIT SPI 66MHZ 24CBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC (TC)

• Density: 32000

MEMORY [See More]

• Package Type: BGA; 153-FBGA (11.5x13)
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 64000000

DBGA-8 NOR FLASH ROHS [See More]

• Package Type: BGA

• Technology: Sectored

FLASH - NAND, DRAM - LPDDR Memory IC 16GByte (NAND), 16Gbit (LPDDR4 DRAM) eMMC 5.1 HS400 + LPDDR4X 254-FBGA (11.5x13x1.0) [See More]

• Package Type: BGA; 254-FBGA
• Technology: NAND

• Density: 128000000
• Operating Temperature: -25 to 85

IC FLASH 64MBIT SPI 85MHZ 9UBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC (TC)

• Density: 64000

IC FLASH 32GBIT EMMC 100FBGA [See More]

• Package Type: BGA; 100-FBGA (14x18)
• Supply Voltage: -40degC ~ 85degC

• Density: 32000000

512Mbit SPI TPBGA-24(6x8) NOR FLASH ROHS [See More]

• Package Type: BGA
• Technology: Sectored

• Density: 512000
• Operating Temperature: -40 to 85

FLASH - NAND, DRAM - LPDDR Memory IC 32GByte (NAND), 16Gbit (LPDDR4 DRAM) eMMC 5.1 HS400 + LPDDR4X 254-FBGA (11.5x13x1.0) [See More]

• Package Type: BGA; 254-FBGA
• Technology: NAND

• Density: 256000000
• Operating Temperature: -25 to 85

IC FLASH 32MBIT SPI/QUAD 24CBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC

• Density: 32000

IC FLASH 256GBIT EMMC 153VFBGA [See More]

• Package Type: BGA; 153-VFBGA (11.5x13)
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 256000000

FLASH - NAND, DRAM - LPDDR Memory IC 32GByte (NAND), 16Gbit (LPDDR4 DRAM) eMMC 5.1 HS400 + LPDDR4X 144-FBGA (8x9.5) [See More]

• Package Type: BGA; 144-FBGA
• Technology: NAND

• Density: 256000000
• Operating Temperature: -25 to 85

IC FLASH 32GBIT EMMC 153FBGA [See More]

• Package Type: BGA
• Supply Voltage: -25degC ~ 85degC

• Density: 32000000

IC FLASH 256GBIT EMMC 100LFBGA [See More]

• Package Type: BGA; 100-LFBGA (14x18)
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 256000000

FLASH - NAND, DRAM - LPDDR Memory IC 32GByte (NAND), 16Gbit (LPDDR4 DRAM) eMMC 5.1 HS400 + LPDDR4X 144-FBGA (8x9.5) [See More]

• Package Type: BGA; 144-FBGA
• Technology: NAND

• Density: 256000000
• Operating Temperature: -25 to 85

IC FLASH 16GBIT EMMC 153FBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC

• Density: 16000000

IC FLASH 64MBIT SPI/OCTL 24TFBGA [See More]

• Package Type: BGA; 24-TFBGA (6x8)
• Supply Voltage: -40degC ~ 105degC (TA)

• Density: 64000

FLASH - NAND (pSLC) Memory IC 64Gbit eMMC 153-BGA (11.5x13) [See More]

• Package Type: BGA; 153-FBGA
• Technology: NAND

• Density: 64000000
• Operating Temperature: -40 to 105

IC FLASH 128GBIT EMMC 153FBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC

• Density: 128000000

IC FLASH 32MBIT PARALLEL 48TFBGA [See More]

• Package Type: BGA; 48-TFBGA (6x8)
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 32000

FLASH Memory IC 32Mbit Parallel 90 ns 63-FBGA (8x14) [See More]

• Package Type: BGA; 63-TFBGA
• Access Time: 90

• Density: 32000
• Operating Temperature: -40 to 85

IC FLASH 256GBIT EMMC 100FBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC

• Density: 256000000

IC FLASH 128MBIT SPI 24TPBGA [See More]

• Package Type: BGA; 24-T-PBGA (6x8)
• Supply Voltage: -40degC ~ 125degC (TA)

• Density: 128000

FLASH Memory IC 8Mbit Parallel 120 ns 48-FBGA (6x9) [See More]

• Package Type: BGA; 48-TFBGA
• Access Time: 120

• Density: 8000
• Operating Temperature: 0 to 70

IC FLASH 64MBIT PARALLEL 48VFBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 64000

IC FLASH 128GBIT PAR 132VBGA [See More]

• Package Type: BGA; 132-VBGA (12x18)
• Supply Voltage: 0degC ~ 70degC (TA)

• Density: 128000000

FLASH - NAND Memory IC 32Gbit MMC 200 MHz 153-FBGA (11.5x13) [See More]

• Package Type: BGA; 153-VFBGA
• Technology: NAND

• Density: 32000000
• Operating Temperature: -40 to 85

IC FLASH 8MBIT CUI 48UBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 8000

UFS 4T [See More]

• Package Type: BGA; 153-VFBGA (11.5x13)
• Supply Voltage: -25degC ~ 85degC

• Density: 4000000000

FLASH Memory IC 4Mbit SPI 104 MHz 8-WLCSP (1.63x1.58) [See More]

• Package Type: BGA; 8-XFBGA, WLCSP
• Operating Temperature: -40 to 85

• Density: 4000
• Supply Voltage: 1.65V ~ 3.6V; 3.6V

IC FLASH 32MBIT PARALLEL 47TFBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 32000

MEMORY [See More]

• Package Type: BGA; 24-CSPBGA (6x8)
• Supply Voltage: -40degC ~ 105degC (TA)

• Density: 512000

FLASH Memory IC 32Mbit SPI 100 MHz 9-UBGA (6x6) [See More]

• Package Type: BGA; 9-UBGA
• Operating Temperature: -40 to 85

• Density: 32000
• Supply Voltage: 2.7V ~ 3.6V; 3.6V

IC FLASH 32MBIT PARALLEL 64TFBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 32000

IC FLASH 4GBIT ONFI 63VFBGA [See More]

• Package Type: BGA; 63-VFBGA (9x11)
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 4000000

FLASH Memory IC 8Mbit SPI 100 MHz 8-WLCSP (4x2) [See More]

• Package Type: BGA; 8-XFBGA, WLCSP
• Operating Temperature: -40 to 85

• Density: 8000
• Supply Voltage: 1.65V ~ 1.95V

IC FLASH 16MBIT PARALLEL 48TFBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 16000

IC FLASH 256MBIT SPI/QUAD 24BGA [See More]

• Package Type: BGA; 24-BGA (8x6)
• Supply Voltage: -40degC ~ 105degC (TA)

• Density: 256000

FLASH - NOR Memory IC 4Mbit SPI - Quad I/O 104 MHz 8-WLCSP (1.77x1.74) [See More]

• Package Type: BGA; 8-XFBGA, WLCSP
• Technology: Sectored

• Density: 4000
• Operating Temperature: -40 to 85

IC FLASH 128MBIT PARALLEL 80LBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 128000

IC FLASH 1GBIT SPI/QUAD 24FBGA [See More]

• Package Type: BGA; 24-BGA (8x6)
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 1000000

FLASH Memory IC 128Mbit SPI - Quad I/O, QPI 104 MHz 21-WLCSP (3.02x3.29) [See More]

• Package Type: BGA; 21-UFBGA, WLCSP
• Operating Temperature: -40 to 85

• Density: 128000
• Supply Voltage: 1.7V ~ 2V

IC FLASH 1GBIT PARALLEL 69FBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 1000000

IC FLASH 2GBIT SPI/QUAD 24FBGA [See More]

• Package Type: BGA; 24-FBGA (8x8)
• Supply Voltage: -40degC ~ 105degC (TA)

• Density: 2000000

FLASH Memory IC 32Mbit SPI - Quad I/O, QPI 104 MHz 8-WLCSP (1.55x2.28) [See More]

• Package Type: BGA; 8-UFBGA, WLCSP
• Operating Temperature: -40 to 85

• Density: 32000
• Supply Voltage: 1.7V ~ 2V

IC FLASH 1GBIT SPI 24TPBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 105degC (TA)

• Density: 1000000

IC FLASH 1GBIT PARALLEL 64FBGA [See More]

• Package Type: BGA; 64-FBGA (13x11)
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 1000000

FLASH Memory IC 64Mbit SPI - Quad I/O, QPI 104 MHz 8-WLCSP (1.92x3.01) [See More]

• Package Type: BGA; 8-UFBGA, WLCSP
• Operating Temperature: -40 to 85

• Density: 64000
• Supply Voltage: 1.7V ~ 2V

IC FLASH 1GBIT SPI 24TPBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 125degC (TA)

• Density: 1000000

IC FLASH 80GBIT EMMC 153BGA [See More]

• Package Type: BGA; 153-BGA (11.5x13)
• Supply Voltage: -40degC ~ 85degC

• Density: 80000000

FLASH - NOR Memory IC 16Mbit SPI - Quad I/O 108 MHz 8-WLCSP (1.61x1.35) [See More]

• Package Type: BGA; 8-XFBGA, WLCSP
• Technology: Sectored

• Density: 16000
• Operating Temperature: -40 to 85

IC FLASH 256MBIT SPI 24TPBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 105degC (TA)

• Density: 256000

IC FLASH 1TBIT EMMC 153BGA [See More]

• Package Type: BGA; 153-BGA (11.5x13)
• Supply Voltage: -40degC ~ 105degC (TA)

• Density: 1000000000

FLASH Memory IC 4Mbit SPI 20 MHz 14-CBGA (4.5x7) [See More]

• Package Type: BGA; 14-LBGA, CSPBGA
• Operating Temperature: 0 to 70

• Density: 4000
• Supply Voltage: 2.7V ~ 3.6V; 3.6V

IC FLASH 1GBIT PARALLEL 64LBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 1000000

IC FLASH 1TBIT EMMC 100BGA [See More]

• Package Type: BGA; 100-BGA (14x18)
• Supply Voltage: -40degC ~ 85degC

• Density: 1000000000

FLASH Memory IC 16Mbit SPI 13 MHz 24-CBGA (7x9.5) [See More]

• Package Type: BGA; 24-LBGA, CSPBGA
• Operating Temperature: -40 to 85

• Density: 16000
• Supply Voltage: 2.7V ~ 3.6V; 3.6V

IC FLASH RAM 4GBIT PAR 162VFBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 105degC (TA)

• Density: 4000000

IC FLASH 32GBIT EMMC 153BGA [See More]

• Package Type: BGA; 153-BGA (11.5x13)
• Supply Voltage: -40degC ~ 85degC

• Density: 32000000

FLASH Memory IC 16Mbit SPI 66 MHz 24-CBGA (6x8) [See More]

• Package Type: BGA; 24-LBGA, CSPBGA
• Operating Temperature: -40 to 85

• Density: 16000
• Supply Voltage: 2.7V ~ 3.6V; 3.6V

IC FLASH RAM 1GBIT PAR 130VFBGA [See More]

• Package Type: BGA
• Supply Voltage: -40degC ~ 85degC (TA)

• Density: 1000000

IC FLASH 160GBIT EMMC 100BGA [See More]

• Package Type: BGA; 100-BGA (14x18)
• Supply Voltage: -40degC ~ 85degC

• Density: 160000000

FLASH Memory IC 32Mbit SPI 20 MHz 44-CBGA (6x12) [See More]

• Package Type: BGA; 44-TBGA, CSPBGA
• Operating Temperature: 0 to 70

• Density: 32000
• Supply Voltage: 2.7V ~ 3.6V; 3.6V

IC FLASH RAM 4GBIT PAR 137VFBGA [See More]

• Package Type: BGA
• Supply Voltage: -25degC ~ 85degC (TA)

• Density: 4000000

Ferri-UFS BGA 153-b eMMC 3D TLC [See More]

• Package Type: BGA; 153-BGA (11.5x13)
• Supply Voltage: -40degC ~ 85degC

• Density: 160000000

FLASH Memory IC 64Mbit SPI 85 MHz 44-WLCSP (3.52x4.22) [See More]

• Package Type: BGA; 44-UFBGA, WLCSP
• Operating Temperature: -40 to 85

• Density: 64000
• Supply Voltage: 1.7V ~ 3.6V; 3.6V

IC FLASH RAM 4GBIT PAR 168WFBGA [See More]

• Package Type: BGA
• Supply Voltage: -25degC ~ 85degC (TA)

• Density: 4000000

IC FLASH UFS2.1 153BGA [See More]

• Package Type: BGA; 153-BGA (11.5x13)

• Supply Voltage: -40degC ~ 85degC

FLASH Memory IC 16Mbit Parallel 70 ns 46-CBGA (6.5x7.5) [See More]

• Package Type: BGA; 46-VFBGA, CSBGA
• Access Time: 70

• Density: 16000
• Operating Temperature: -40 to 85