High Voltage Capacitors Specifications

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General Specifications

	Technology
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	Film Capacitors		Film capacitors are made from plastics such as polyester, polypropylene, and polystyrene. There are two basic types of devices: film-foil capacitors and metallized capacitors. Film-foil capacitors are made of one or more layers of a plastic film dielectric wound alternately with metal foil electrodes. Metallized film capacitors are made of a film dielectric on which the metal electrode has been previously vapor-deposited. The layers are wound into a convoluted roll, with electrodes extending beyond the dielectric films.
	Multilayer		The dielectric is made of many layers. Multilayer devices are small in size. They provide excellent temperature stability and frequency characteristics.
	Monolithic / Single Layer		The dielectric is made of a single layer.
	Wound		Wound capacitors are built by winding foils, sometimes by hand.
	Other		Other unlisted, specialized, or proprietary types or technologies.
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	Features
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	Polarized?		Polar or polarized capacitors may be operated safely with only one direct current (DC) polarity. By contrast, nonpolar capacitors can be operated without regard to polarity. Sometimes, polar caps are combined in special ways to allow a limited ability to cope with reversing polarity. These devices are called bipolar capacitors.
	No Piezoelectric Effects		Capacitors do not exhibit capacitance variation with voltage or pressure.
	Self-healing		Capacitors can withstand high-pulsed voltages without breaking the dielectric. This feature is particularly important in high-voltage applications.
	Military Standards		Capacitors meet military standards.
	Other		Other unlisted general features.
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	Electrolytic Capacitors
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	Aluminum Oxide		The capacitor dielectric is formed in an electrolytic process. Wet electrolytic capacitors have a moist electrolyte. Dry or solid electrolytic capacitors do not. Electrolytic capacitors are popular because of their high volumetric density; however, these polar devices generally cannot withstand reverse voltages. They also have high equivalent series resistance (ESR).
	Tantalum Oxide		The capacitor dielectric is made of tantalum, a metal used to make alloys with high melting points, high strength, good ductility, etc.
	Niobium / Niobium Oxide		Niobium is a metal with similar chemical properties to tantalum; however, niobium ore is more abundant and less expensive. Niobium oxide is a hard ceramic material characterized by high conductivity.
	Other		Other, unlisted electrolytic capacitors.
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	Electrostatic Capacitors		The insulating material between the plates of the capacitor. This material is chosen for its ability to permit electrostatic attraction and repulsion to take place across it. This material will have the property that energy required to establish an electric field is recoverable in whole or in part, as electric energy. In other words, a good dielectric material is a poor conductor of electricity while being an effective supporter of electrostatic fields.
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	Air		The dielectric medium is air. Typically, these devices are used in high voltage applications.
	Ceramic		Capacitors have a solid body made of high-temperature, ceramic resistive material with bonded metal contacts.
	Ceramic COG (NPO)		Ceramic COG (NPO) capacitors have a high Q, low K, temperature-compensated dielectric and stable electrical properties under varying voltage, temperature, frequency and time. They are suitable for low-lost circuits and for timing and tuning applications. There are several unofficial, colloquial temperature coefficient designations for capacitors. The temperature coefficient is given as P for positive and N for negative, followed by a 3-digit value in ppm/°C. For example, P100 is +100 ppm/°C and N220 is -200 ppm/°C. The exception to this system is NPO where the letter “O” instead of the number “0” is used; however, the term NP0 is not uncommon. Both NPO and NP0 indicate that the capacitor is stable with temperature.
	Ceramic X7R		Ceramic X7R (BX) capacitors have moderate K values and are temperature-stable. They exhibit moderate changes in electrical properties under conditions of changing temperature, voltage, and frequency. X7R capacitors are suitable for bypass, coupling, and frequency discrimination circuit applications. X7R capacitors exhibit no more than 15% capacitance deviation over a -55 °C to +125 °C temperature range.
	Ceramic Z5U		Ceramic Z5U capacitors are Class III devices with a dielectric that exhibits a maximum capacitance change of +22% - 56% over an operating temperature range of +10 °C to + 85 °C.
	Glass		The dielectric medium is glass. These devices are used in high voltage applications.
	Mica		The dielectric medium is mica. These devices are highly stable and provide both a good temperature coefficient and excellent endurance.
	Oil		The dielectric medium is oil. These so-called "wet" capacitors often require maintenance.
	Paraffin Paper		The dielectric medium is a thin sheet of paper sandwiched between two metal foils and then rolled up. Kraft paper, a long-fiber paper made from wood pulp, is often used.
	Polyester		High dielectric constant and high dielectric strength provide good volumetric efficiency for metallized polyester film capacitors. Metallized polyester film has excellent self-healing properties. Typical applications include bypassing and coupling.
	Polycarbonate		Capacitors with a polycarbonate dielectric have a very low temperature dependency, wide operating temperature range, good long-term stability, and low losses. They are used in timers and filters and in applications with high ambient temperatures.
	Polypropylene		Capacitors with a polypropylene dielectric have very low losses, low dielectric absorption, and high dielectric strength. They also have very high insulation resistance and a negative temperature coefficient. Typical applications include stable oscillators and filters, sample and hold circuits, and pulse handle circuits.
	Polystyrene		Capacitors with a polystyrene dielectric provide extremely low losses, low dielectric absorption, good long-term stability, very high insulation resistance, and a small negative temperature coefficient. Typical applications include timers and filters.
	Teflon®		The dielectric medium is Teflon®, an extremely temperature-stable polytetrafluoroethylene (PTFE). Teflon is a registered trademark of DuPont.
	Other		Other unlisted dielectric.
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	Metallized Dielectric		The dielectric is metallized.
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RoHS Compliance

	RoHS Compliant		Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl and polybrominated diphenyl ether. RoHS will become effective on July 1, 2006.
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Performance

	Capacitance Range		The capacitance range of the capacitor. Fixed capacitors have only one value. Variable capacitors have a range of capacitance values. Capacitance measures the ability to store energy, given as C = K A/D, where A is the area of the electrodes, D is their separation, and K is a function of the dielectric between the electrodes. The formula yields a result in farads (F), but a farad is so large that the most commonly used values are expressed in microfarads (µf = 10-6F) or picofarads (pf = 10-12F).
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	Capacitance Tolerance		The precision of the capacitance produced by the capacitor, measured as a percent of the capacitance.
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	DC Rated Voltage Range (WVDC)		DC rated voltage range (WVDC) is the maximum continuous DC voltage that may be continuously applied to a capacitor at any temperature between the lower category temperature and the rated temperature. It is also known as working DC voltage (WVDC).
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	Test Voltage		Test voltage is the maximum voltage used for testing the features (dielectric, corona, insulator, etc.) of the capacitor.
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	Insulation Resistance		The insulation resistance is defined as the ratio between an applied DC voltage and the resulting leakage current after a minute of charge. It is normally expressed in MΩ
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	Dissipation Factor		The dissipation factor (DF) is the ratio between the resistive and the reactive part of the impedance of the capacitor submitted to a sinusoidal voltage of specified frequency. It is a measure of the losses in the capacitor.  DF is normally expressed as a percentage or a decimal equivalent.
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	Temperature Coefficient		The temperature coefficient is defined as the change in capacitance with temperature, measured over a specified range of temperature. It is normally expressed in parts per million per degrees Celsius (ppm/°C) and referenced at 20 °C.
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	Operating Temperature		This is the full-required range of ambient operating temperature.
	Search Logic:		User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.

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Packaging Specifications

	Lead / Termination Type:
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	Surface Mount Technology (SMT)		Devices that use surface mount technology (SMT) do not have leads. Instead, they are pad-mounted.
	Axial Leads		Axial leads extend from the ends and along the axis of the resistor, capacitor, or other axial part. They do not extend from the sides.
	Radial Leads		Radial leads extend from the sides instead of from the ends.
	Flying Leads		Flying leads project horizontally.
	Tab Leads		Tab leads are terminals that are designed for direct mounting into a circuit board socket.
	Screw Leads		Capacitor leads are designed to be fastened with screws.
	Gull Wing Leads		Gull wing leads are used widely because they are relatively inexpensive to mold and form. Gull wings are flexible and can withstand thermal expansion and contraction. It is easy to inspect the integrity of gull wings leads to circuit board solder connections.
	J-Leads		J-leads are popular because they use less PCB real estate than gull wing leads; however, the J-lead to board solder connections are hidden from inspection and the leads are more difficult to form.
	Other		Other unlisted lead types.
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	Mounting Style
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	Through Hole Technology (THT)		Through hole technology (THT) mounts components on a printed circuit board (PCB) by inserting component leads through holes in the board and then soldering the leads in place on the opposite side of the board.
	Surface Mount Technology (SMT)		Surface mount technology (SMT) adds components to a printed circuit board (PCB) by soldering component leads or terminals to the top surface of the board. SMT components have a flat surface that is soldered to a flat pad on the face of the PCB. Typically, the PCB pad is coated with a paste-like formulation of solder and flux. With careful placement, SMT components on solder paste remain in position until elevated temperatures, usually from an infrared oven, melt the paste and solder the component leads to the PCB pads.   Industry-standard pick-and-place equipment can mount SMT components quickly, accurately, and cost-effectively. SMT is a widely used alternative to mounting processes that insert pins or terminals through holes and solder leads into place on the opposite side of the board.
	Bolt Mounted		The capacitor is mounted by bolting in place. A bolt is a threaded fastener, with a head. Normally a nut is used to secure the bolt.
	Bracket Mount		Capacitor either requires or comes with bracket for mounting. A bracket is a support or fixture to hold something up. In a bracket mounted capacitor, the bracket can be bolted.
	Pole Mount		Devices mount on poles and require special pole-mounting brackets.
	Other		Other unlisted mounting types.
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	Packing Method
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	Tape Reel		Components are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. A cover tape seals the carrier tape in place. This composite tape is then wound on a reel that is placed in a corrugated shipping box for transport and delivery. Customers unpack the reels and load them into industry-standard, pick-and-place board assembly equipment. Tape and reel assemblies provide component isolation and are designed for surface mount packages such as quad flat package (QFP) and thin quad flat package (TQFP).    Typically, carrier tape is made from a polystyrene (PS) or PS-laminate film with a uniform film thickness between 0.2 mm to 0.4 mm. Carrier tape design is defined largely by component length, width, and thickness. Cover tape is made from a polyethylene teraphthalate (PET) film or film laminate with an adhesive applied to the underside of the film. This adhesive is usually heat and pressure sensitive to ensure a positive, consistent seal between the carrier tape and the cover tape. The reels that contain the composite tape are typically made of polystyrene and have one, two, or three parts. Reel dimensions meet EIA-481-1, EIA-481-2, and EIA-481-3 standards.
	Tray / Rail		Components are packed in trays (rails) that are made of carbon-powder or fiber materials and molded into rectangular outlines that contain matrices of uniformly spaced pockets. These containers protect components during shipping and provide proper component location and orientation for use with industry-standard, pick-and-place board assembly equipment. Trays are designed for components for that have leads on four sides and that require component lead isolation during shipping, handling, or processing. For example, quad flat package (QFP) and thin quad flat package (TQFP) components are often shipped in trays. To facilitate shipping and handling, trays are stacked and bound together in standard configurations. To provide rigidity, an empty cover tray is added to the top of the load. Typical stacking configurations consist of five full trays and one cover tray, and ten full trays and one cover tray. Customer requirements determine whether trays are shipped in single or multiple stacks.
	Shipping Tube / Stick Magazine		Components are packed in shipping tubes or stick magazines that are made of rigid polyvinylchloride (PVC) and extruded in industry-standard sizes. These containers protect components during shipping and provide proper component location and orientation for use with industry-standard, pick-and-place board assembly equipment.  To facilitate shipping and handling, shipping tubes and stick magazines are usually loaded into intermediate containers such as boxes or bags to form standard quantities. Intermediate-level packing quantities for shipping tubes and stick magazines often vary by pin count and package type.
	Bulk Pack		Components are distributed as individual parts.
	Other		Other unlisted, specialized or proprietary packing methods.
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