Indium8.9HF is a no-clean, halogen-free solder paste that delivers versatility and stability in the printing process. Under optimal process conditions, Indium8.9HF:

• Delivers excellent response-to-pause even after being left on the stencil for 60 hours
• Maintains excellent printing and reflow performance after remaining at room temperature for one month
• Demonstrates consistent printing performance for up to 12 months when refrigerated

Features:

• Halogen-free, Pb-free, no-clean
• High transfer efficiency with low variability
  • Outstanding broadband print transfer
  • Excellent response-to-pause performance
• Unique resilient oxidation barrier technology
  • Eliminates Head-in-Pillow (HiP) defects
  • Eliminates graping defects and promotes complete coalescence
• Robust reflow capability
  • Low-voiding with a vast array of thermal profiles and component styles
  • Wide processing window, which accommodates various board sizes and throughput requirements, and minimizes potential defects
• Excellent pin-in-paste printability, solderability, and hole fill
• Clear, restricted, encapsulating flux reside with enhanced electrical reliability (SIR/ECM)
• Consistent lot-to-lot performance after storage and throughout the assembly process
• Backwards compatible with Sn/Pb alloys