Precision (0.00035”) AuSn Preforms

Featured Product from Indium Corporation

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Indium Corporation now offers precision AuSn preforms—AuLTRA® ThInFORMS™—for die-attach applications

Indium Corporation’s AuLTRA® ThInFORMS™ are a 0.00035” (0.00889mm) thin 80Au20Sn preform for die-attach applications. They reduce solder volume, solder wicking, and voiding thereby improving thermal transfer and the overall operational efficiency of the package.

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Indium Corporation also offers Pb-free and RoHS-compliant AuSn solder preforms available in a variety of standard and custom-engineered designs. The Gold Preform Quick Turn Program offers engineering support from design to production and a quick turnaround for new design, tool, or prototype quantities.

Learn more about the properties and benefits of AuSn

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