Many applications call for a TIM (thermal interface material) that can easily be placed on a chip, on a lid, or, perhaps, just against a heat source and a cooling solution contact plate. We developed a metal TIM which works as a compressible Interface Solution for such an application. Our pressure range is 35 psi to 100+ psi.

An SMA-TIM (soft metal alloy) made of indium offers uniform thermal resistance at lower applied stresses in compressed interfaces. The malleability of indium minimizes surface resistance and increases heat flow (conductance). Our patented Heat-Spring®® technology further reduces the thermal resistance and enhances cooling.

The Heat-Spring® is a patented technology and is available in many different thicknesses and form factors. Heat-Springs can be packaged in tape & reel or bundle packs.

 To determine the best fit for your project or application visit the Heat-Spring® Kits page on our website.  

Querstions?  E mail us via the links on this page - we welcome your inquiries