ALPHA OM-220 innovative chemistry enables peak reflow temperatures below 150°C, making it ideal for soldering heat sensitive components and sub-assemblies.  ALPHA OM-220 permits cascaded / hierarchical soldering, as well as novel hermetic sealing solutions. This technology is well suited for a broad range of end use applications including computers, smartphones, various consumer electronics, in-cabin automotive electronics, and medical devices.

Key Benefits:

• Low reflow peak temperature < 150 °C
• Enables use of lower cost substrates & components
• Reduction of warpage (component & substrate) vs SAC process
• Excellent electrical reliability; passes JIS Z 3197 & J-STD-004B SIR testing
• Exhibits low voiding characteristics; passes IPC Class 3 voiding on BGA components
• Halide-free & zero-halogen compliant