LiPOLY's silicone free thermal pads are no low molecular siloxane volatilization and low total volatile gas, no electrical contact & pollution problems. They are ideally suited for applications such as optical, automotive, and sensitive electronic components. (read more)

LiPOLY® BS04 is a two-part liquid gap filler, fast cured at room temperature or elevated temperature. With a thermal conductivity of 3.6 W/m*K. It is ideally suited for dispensing using the dispensing robot or by syringe. (read more)

LiPOLY DTT13 is a one-part dispensable material with thermal conductivity 13.0 W/m*K. DTT13 is a great alternative to thermal grease and ideally suited for dispensing using the dispensing robot. It also can overcome overflow and drying problems to increase the thermal conductivity. (read more)

Applications:

• Automotive electronics
• Telecommunications
• LED light bar & LED lamp
• Between any heat-generating
• component and heat sink
• 5G base station & infrastructure
• EV electric vehicle

Applications:

• Between CPU and heat sink
• Between a component and heat sink
• High speed mass storage drives
• Telecommunication hardware
• Flat-panel displays
• Set-top box
• IP CAM

The LiPOLY NT series is a composite pad that simultaneously possesses thermal conductivity and electromagnetic wave absorption functions. It has a thermal conductivity coefficient of 2.0-4.0 W/m*K as a gap filling material, with an application frequency range of 10MHz-77GHz. It features flexibility, compressibility, and can be customized for cutting. (read more)

LiPOLY's AS series features minimal oil bleed even under high compression, preventing contamination of electronic components from silicon oil leakage or accumulation of dust, ensuring product cleanliness and appearance. (read more)

LiPOLY S818 and S393 is a product with high ductile thermal conductivity. Your best choice for shock and tolerance absorbing. (read more)

Non-silicon thermal pad does not contain silicone oil, no siloxane content. When used, no polution no volatiles, no electrical contact failure or lens fog situation. (read more)

SH-putty3 is a highly conformable gap filler, designed to replace gap pads and remove manufacturing tolerance. It’s ideally suited for mass production applications in which a dispensing robot is needed. (read more)

LiPOLY T-work9000 offers outstanding thermal conductivity at 20.0 W/m*K and extremely low thermal resistance under minimal force. T-work9000 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. (read more)

LiPOLY’s TIM14 is a two-part compound silicone base thermal conductive adhesive gel. The high deformation properties perfectly fill small air gaps to eliminate tolerances. It’s ideally suited for manual dispensing applicator and dispensing robot. Friendly design escape from high cost of cold-chain transportation and freeze preservation. (read more)

LiPOLY’s TIM12 is a two-part compound silicone base thermal conductive adhesive gel. The high deformation properties perfectly fill small air gaps to eliminate tolerances. It’s ideally suited for manual dispensing applicator and dispensing robot. Friendly design escape from high cost of cold-chain transportation and freeze preservation. (read more)

LiPOLY DM series is two-part liquid gap filler for different heights of design gap with a fast-curing feature. Low Viscosity. Thermal Conductivity: 2.2 W/m.k~7.0 W/m.k. Available for dispensing machines. (read more)

LiPOLY’s DTT series is specially designed for network communication signal transmission. It focuses on Dk and Df to reduce interference in RF modules. (read more)

Thermal Putty vs Thermal Grease vs Two-Part Fast Curing Thermal Conductive Gel (read more)

LiPOLY® TEM96 series is a thermally conductive absorber based upon soft magnetic materials dispersed in a polymeric resin. It has a thermal conductivity of 2~4.0 W/m*K. (read more)

LiPOLY® SH-putty3 is a one-part thermally conductive putty that offers outstanding thermal conductivity. (read more)

LiPOLY® has created a new advanced thermal interface material. H-putty is a tolerance filled, thermally conductive putty that maintains high compressibility with low stress, high reliability, and will not flow vertically. (read more)

LiPOLY® PK700DM is a two-part, low viscosity with good thixotropic characteristics thermal conductivity gap filler. With a thermal conductivity of 7.0 W/m*K. PK700DM provides high thermal conductivity and low thermal impedance; ultra-conforming, a gel-like material after being cured for fragile and low-stress applications. Available in 50ml and 400ml cartridges. (read more)

TT3000 provides superior performance and reliability while mitigating against pump-out and floating issues on the interface. TT3000 improves the operating process while simultaneously providing high thermal conductivity and excellent low thermal resistance. This material will handle the most demanding of applications. (read more)

LiPOLY® T-work9000 offers outstanding thermal conductivity at 20.0 W/m*K and extremely low thermal resistance under minimal force. T-work9000 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of
heat. (read more)

LiPOLY’s TIM14 is a two-part compound silicone base thermal conductive adhesive gel. The high deformation properties perfectly fill small air gaps to eliminate tolerances. It’s ideally suited for manual dispensing applicator and dispensing robot. Friendly design escape from high cost of cold-chain transportation and freeze preservation (read more)

LiPOLY’s TPS series is a two-part compound sealing glue that can be cured at room temperature or high temperature. (read more)

LiPOLY®’s BS series is an ultra-soft thermally conductive gel pad with high resilience characteristics which can avoid the deformation of PCB and other components caused by assembly stress. Hardness Shore OO/10-25 provide high flexibility, high compressibility, high insulation and good self-adhesiveness. (read more)

LiPOLY® PK700DM is a two-part liquid gap filler, fast cured at room temperature or elevated temperature. With a thermal conductivity of 7.0 W/m*K, PK700DM provides high thermal conductivity and
low thermal impedance. It is ideally suited for dispensing using the dispensing robot or by syringe. (read more)

Features

• Thermal conductivity:6.0 W/m*K
• Stable and homogeneous compound
  to ensure thermal performance
• Solvent-free formula
• Nano type thermal interface material
• High stability and reliability
  

Applications

• Notebook computers
• Heat pipe assemblies
• TV hardware
• Wireless communication hardware
• High-speed mass storage drives
• Set-top box
• IP CAM

Our customers come to us because we deliver innovative and reliable thermal interface solutions. (read more)

Our customers come to us because we deliver innovative and reliable thermal interface solutions. (read more)

Customized die-cut and shape molding are all available which can meet the special needs of customers in the face of today’s advanced products. (read more)

LiPOLY’s ST series is a thermally conductive tape with high insulation and high temperature resistance, the temperature can reach to 288°C in a short time. (read more)

LiPOLY’s G series have EMI shielding effect, they can be bent and are suitable for thin and high-performance mobile devices, especially the XY axis has excellent thermal conductivity. The heat transfer method is through uniform temperature to assists heat element for heat diffusion. (read more)

Thermal Putty is a gap filler material with high deformation amount, low thermal resistance, flexible gap adaptation, and excellent tolerance compensation. No overflow & dryness & cracking problems. Good alternative to thermal grease. (read more)

While silicone-based TIMs do have potential disadvantages to consider with specific applications, there are other aspects to consider when selecting a TIM. Generally, the silicone-free TIM should have a good thermal conductivity, high-temperature stability and low thickness after clamping. (read more)

LiPOLY DTT series is a soft thermally conductive gel pad specifically designed for networking communication applications, including 5G infrastructure/station, communication satellite…etc. It is designed to focus on Dk and Df to reduce interference in RF modules. Thermal conductivity 3~4W/m*K. (read more)

LiPOLY S282 series is the thermal conductive pad using fiberglass as a reinforced layer, featuring high dielectric breakdown, shock and vibration absorber, good mechanical strength. It is ideally suited for stamping and screw-locking. Thermal conductivity 2.5 W/m*K. (read more)

Two-part, thermal-conductive sealing glue
LiPOLY's TPS series is a two-part sealing glue with low viscosity and high fluidity. The high-deformation material can fill the gap closely, cover the tolerance and has outstanding conductivity at 2.8 W/m*K. (read more)

LiPOLY’s EP series is silicon-free two-part compound that can be cured at room temperature or high temperature. (read more)

The chemical formula indicates that the non-reactive cyclic polydimethylsiloxane Ho-[Si(CH3)2O]nH is volatile and volatilizes at any time. For example, when electronic products are in a closed space, the low volatile siloxane will cause obstacles to electrical contacts. (read more)

Non-silicon thermal pad does not contain silicone oil, no siloxane content. When used, no polution no volatiles, no electrical contact failure or lens fog situation. (read more)

Excellent Insulation, Reworkable, Fiberglass reinforced layer is available (read more)

One part dispensible thermal Putty, High Insulation, Low thermal resistance, high thermal conductivity, Bond Line Thickness from 100~3000um. (read more)