LiPOLY® Exceptionally Soft Thermal Conductive Pad
Featured Product from Shiu Li Technology Co., Ltd
LiPOLY®’s BS series is an ultra-soft thermally conductive gel pad with
thermal conductivity: 3.0~5.0W / m*K. Gel pad offers excellent
compression under minimal force with high recovery characteristics.
This product can be supplied as standard sheets, custom die-cuts or
custom molded parts.
Features
- High compression rate
- Low thermal impedance
- High recovery
- Available in a range of thicknesses
Applications
- Notebook computers
- Heat pipe assemblies
- TV hardware
- Wireless communication hardware
- High-speed mass storage drives
- Set-top-box
- IP CAM
Datasheet
Shiu Li Technology Co., LTD
Shiu Li Technology Co., LTD has established itself as a world-leading thermal management manufacturer, developing high-performance thermal solutions for product designers around the globe. Selling under its brand LiPOLY, Shi Li Technology Co. LTD has heavily invested in the development of advanced thermal conductive products for high powered modules. In 2018, Shiu Li Technology LLC was established in the United States to better serve customers in North America and Europe.
Shiu Li Technology has served more than 2000 customers worldwide, delivering thermal solutions in computer manufacturing, data communication, consumer electronics, data centers, military equipment, automotive equipment, lighting, power conversion, and more.
