Product Announcements:
Materials and Chemicals

SUNBIOCERAM®Infinity Ceramic: Advancing Excellence in the Field of Orthopedics Read more...

Aluminum Nitride (AlN) offers superior properties for the electronics industry, including high insulation, strength, and thermal conductivity, making it an ideal choice for ceramic substrates and packaging materials. Read more...

Advanced cooling methods for power devices to improve thermal management, reduce junction temperature, and enhance efficiency and reliability. Read more...

Black zirconia ceramic offers superior mechanical strength, high-temperature resistance, antistatic properties, and corrosion resistance, making it ideal for electronic and industrial applications requiring durability and functionality. Read more...

If you’re heading to Boston for the American Society for Radiation Oncology (ASTRO) annual meeting this September, you already know the pressure to provide fully compliant protection from increasingly potent isotopes.

MarShield has spent more than 45 years designing, building, and improving shielding. We’ll be at ASTRO 2026 in Booth #1641 with custom shielding for onco... Read more...

Delivers unmatched cutting performance on carbon steel, boosting productivity while enhancing operator comfort for smoother, more efficient grinding in demanding workflows.

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Norton RazorStar™ Rips through carbon steel using a patented grain technology for a razor-sharp cut and unbeatable grinding performance. Read more...

Do your adhesives struggle to bond in demanding environments? Read more...

Sunan & Weijie's 420 stainless steel balls combine magnetic properties with excellent corrosion resistance and optimal hardness (HRC 50–55), delivering durability and dimensional accuracy for demanding industrial use. Suited to bearings, valves, chain wheels, motorcycle components, and petroleum industry applications requiring both precision and long-term reliability. Read more...

As optical modules evolve from 400G to 800G,1.6T and even higher data rates,the power consumption and heat density of lasers,photodetectors,TIAs,DSPs,optical engines and other key components continue to increase,making thermal management increasingly critical to module stability,signal integrity,and long term reliability. Read more...