Medium (< 1, >10-3 torr) MEMS Processing Equipment
from Plasma Etch, Inc.
As in all Plasma Etch systems a capacitive parallel plate design is used for the most effective plasma generation. Competitive units with glass/quartz barrel chambers cannot penetrate the vacuum containment vessel and therefore are restricted to inductive coupling using an RF coil wrapped around the... [See More]
- Vacuum / Pressure Range: Low / Medium (HV < 1 torr, >10-3 torr); 0-1 Torr
- Process: Plasma Etching and Cleaning
- Type: Laboratory or Benchtop
- Applications: MEMS; Photovoltaic or solar cell; Research / Surface Analysis; Semiconductors; Medical; Printed Circuit Boards
from Plasma Etch, Inc.
This system is made for smaller production facilities, R &D facilities and universities. The system features an implosion proof 6 ” w x 6 ” d x 4 ” h Rectangular welded Aluminum Vacuum Chamber and a direct powered RF electrode. Applications include medical devices, solar cells,... [See More]
- Vacuum / Pressure Range: Low / Medium (HV < 1 torr, >10-3 torr); 0-1 Torr
- Process: Plasma Etching and Cleaning
- Type: Laboratory or Benchtop
- Applications: MEMS; Photovoltaic or solar cell; Research / Surface Analysis; Semiconductors; Medical; Printed Circuit Boards
from Plasma Etch, Inc.
This system is made for smaller production facilities, R &D facilities and universities. The system features an implosion proof 8 ” w x 8 ” d x 4 ” h Rectangular welded Aluminum Vacuum Chamber and a direct powered RF electrode. Applications include medical devices, solar cells,... [See More]
- Vacuum / Pressure Range: Low / Medium (HV < 1 torr, >10-3 torr); 0-1 Torr
- Process: Plasma Etching and Cleaning
- Type: Laboratory or Benchtop
- Applications: MEMS; Photovoltaic or solar cell; Research / Surface Analysis; Semiconductors; Medical; Printed Circuit Boards