Integral Process Controller MEMS Processing Equipment

High Vacuum MEMS Packaging Vacuum Furnace -- 3150
from Palomar Technologies, Inc

Overview. The SST 3150 is a high vacuum furnace that provides advanced packaging capabilities in vacuum levels as low as 10-7 Torr, and temperatures up to 500 °C (1000 °C optional). The clean-room compatible system may also be configured to allow for in situ separation of lid and package,... [See More]

  • Features: Controller
  • Process: Activating Getters, Sealing of Discrete MEMS Packages, and Brazing
  • Type: Free Standing System
  • Applications: MEMS
Benchtop Plasma Cleaner -- PE-50 XL
from Plasma Etch, Inc.

As in all Plasma Etch systems a capacitive parallel plate design is used for the most effective plasma generation. Competitive units with glass/quartz barrel chambers cannot penetrate the vacuum containment vessel and therefore are restricted to inductive coupling using an RF coil wrapped around the... [See More]

  • Features: Controller; Capacitive Parallel Plate Design
  • Process: Plasma Etching and Cleaning
  • Type: Laboratory or Benchtop
  • Applications: MEMS; Photovoltaic or solar cell; Research / Surface Analysis; Semiconductors; Medical; Printed Circuit Boards
Precision Oscillating Head Polishing Machine -- LLCD Optical
from Precision Surfacing Solutions

To complement our extensive range of Single and dual face lapping and polishing machines Lapmaster has introduced a new line of precision oscillating head polishing machines. Designated the LLCD series they are, primarily, Microprocessor controlled pad polishing machines specially designed for... [See More]

  • Features: Controller; Automated loading or conveyor feeding (optional feature)
  • Process: Polishing, Lapping, Planarizing
  • Type: Batch; Continuous Web or Wire Coater; Inline or Semicontinuous
  • Applications: Flat Panel Display; MEMS; Optical Coatings; Semiconductors; Magnetic storage
Multi-purpose Vacuum Box Coating Systems -- UNIVEX 400
from Leybold USA Inc.

UNIVEX 400. The UNIVEX 400 is a compact coating system for laboratory tasks, respectively pilot production runs. Due to its chamber dimensions, it is ideal for coating of small to medium sized substrates. In the vacuum chamber which is 420 mm wide, substrates respectively substrate holders up to an... [See More]

  • Features: Controller
  • Process: Physical Vapor Deposition; Resistance Evaporation (optional feature); DC Magnetron Sputtering (optional feature); Ion Beam Assisted Deposition (optional feature)
  • Type: Batch; Free Standing System
  • Applications: MEMS; Optical Coatings; Photovoltaic or solar cell; Semiconductors