Active Heat Sink CPU Coolers
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Device: Active Heat Sink
- W: 83
- L: 83
- H: 35.9
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Device: Active Heat Sink
- W: 83
- L: 83
- H: 25.5
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Device: Active Heat Sink
- W: 83
- L: 83
- H: 50.6
from Rego Electronics Inc.
Heat Sink : Forged AL1070 60 x 60 x 16 mm / Skived AL6063 60 x 58 x 14 mm. Fan : 50 x 50 x 10mm / 52 x 52 x 15 mm / 50 x 50 x 20 mm, Two Ball Bearing. Connector Type : 3 ways / 4 ways. Screw & Back Plate : rPGA Socket CPU / BGA Package CPU [See More]
- Device: Active Heat Sink
- W: 58
- L: 60
- H: 14
from Rego Electronics Inc.
Product Series -. Chip Size : 35mm x 35mm to 52mm x 52mm, Height : 8.5mm to 10 mm, TDP : 10 Watts to 20 Watts. Features & Benefits -. A full range of products, High quality, Lower noise level, Long term supply, Customization available. Target Market -. Storage, Industrial PC, Embedded Board,... [See More]
- Device: Active Heat Sink
- W: 40
- L: 40
- H: 8
from Rego Electronics Inc.
We are excited to announce that we have just released new CPU cooler products for Intel ® new generation mobile CPU processors - Haswell and Boardwell. They are for applications used in markets such as Industrial Computers, Embedded Boards, Medical Computing, Point of Sale, etc. These CPU... [See More]
- Device: Active Heat Sink
- W: 60
- L: 60
- H: 33
from Rego Electronics Inc.
Product Series. 1U & 2U Coolers, TDP : 35 Watts to 55 Watts. Intel : Socket G2 rPGA 988, 989, 946 & BGA1288 Coolers. AMD : FP3, FP4 & FP5 Coolers. Features & Benefits. A full range of products, customized technology, high quality, high reliability, lower noise level, long term... [See More]
- Device: Active Heat Sink
- W: 60
- L: 60
- H: 43
from Rego Electronics Inc.
Product Series. 1U & 2U Coolers, TDP : 35 Watts to 55 Watts. Intel : Socket G2 rPGA 988, 989, 946 & BGA1288 Coolers. AMD : FP3, FP4 & FP5 Coolers. Features & Benefits. A full range of products, customized technology, high quality, high reliability, lower noise level, long term... [See More]
- Device: Active Heat Sink
- W: 60
- L: 60
- H: 43
from Rego Electronics Inc.
Product Series. 1U & 2U Coolers, TDP : 35 Watts to 55 Watts. Intel : Socket G2 rPGA 988, 989, 946 & BGA1288 Coolers. AMD : FP3, FP4 & FP5 Coolers. Features & Benefits. A full range of products, customized technology, high quality, high reliability, lower noise level, long term... [See More]
- Device: Active Heat Sink
- W: 60
- L: 60
- H: 33
from Rego Electronics Inc.
Product Series. 1U & 2U Coolers, TDP : 35 Watts to 55 Watts. Intel : Socket G2 rPGA 988, 989, 946 & BGA1288 Coolers. AMD : FP3, FP4 & FP5 Coolers. Features & Benefits. A full range of products, customized technology, high quality, high reliability, lower noise level, long term... [See More]
- Device: Active Heat Sink
- W: 60
- L: 60
- H: 33
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Device: Active Heat Sink
- W: 88
- L: 88
- H: 51.6
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Device: Active Heat Sink
- W: 88.7
- L: 89
- H: 76.6
from Rego Electronics Inc.
Solution : 2U &Up Server. CPU Socket : 1155/1156/1150. Outline Dimension : 90.75 x 89.50 x 65.25mm. Heat Sink : 78.0 x 62.5 x 61.6mm, Copper Base & Aluminum Fins with Heatpipes embedded. Fan : 60 x 60 x 25 mm, Two Ball Bearing, Manufacturer : Sanyo Denki. Connector Type : 4 ways (PWM... [See More]
- Device: Active Heat Sink
- W: 89.5
- L: 91
- H: 65.25
from Rego Electronics Inc.
We offer a full range of cooler solutions for various Intel ® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Our products are well designed in thermal performance based on our professional manufacturing know how. We also have the sophisticated equipment needed... [See More]
- Device: Active Heat Sink
- W: 80
- L: 82
- H: 25.5
from Rego Electronics Inc.
We offer a full range of cooler solutions for various Intel ® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Our products are well designed in thermal performance based on our professional manufacturing know how. We also have the sophisticated equipment needed... [See More]
- Device: Active Heat Sink
- W: 80
- L: 88
- H: 36.7
from Rego Electronics Inc.
We offer a full range of cooler solutions for various Intel ® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Our products are well designed in thermal performance based on our professional manufacturing know how. We also have the sophisticated equipment needed... [See More]
- Device: Active Heat Sink
- W: 88.5
- L: 88
- H: 41.5
from Rego Electronics Inc.
Features & Benefits -. High quality, high reliability, lower noise level, long term supply, customization available. Target Market -. Industrial PC, Point of Sale, Embedded Board, Gaming, Kiosk. Outline Dimension : 49 x 49 x 22.5 mm. Heat Sink : Extruded AL6063, 49 x 49 x 12 mm. Fan : 40 x 40 x... [See More]
- Device: Active Heat Sink
- W: 49
- L: 49
- H: 22.5
from Rego Electronics Inc.
Outline Dimension : 53.25 x 50 x 22.5 mm. Heat Sink : Stamped C1100, 49 x 31.5 x 12 mm. Fan : 40 x 40 x 10.5 mm, Two Ball Bearing, 6000 RPM, Noise Level : 25 dB(A). Connector Type : 2510-3P. Thermal Resistance : 0.99 ℃/W. Weight : 86 g [See More]
- Device: Active Heat Sink
- W: 50
- L: 53
- H: 22.5
from Rego Electronics Inc.
Outline Dimension : 49 x 49 x 22.5 mm. Heat Sink : Extruded AL6063, 49 x 49 x 12 mm. Fan : 40 x 40 x 10.5 mm, Two Ball Bearing, 6000 RPM, Noise Level : 25 dB(A). Connector Type : 2510-3P. Thermal Resistance : 1.25 ℃/W. Weight : 43 g [See More]
- Device: Active Heat Sink
- W: 49
- L: 49
- H: 22.5
from Rego Electronics Inc.
Features & Benefits -. High quality, high reliability, lower noise level, long term supply, customization available. Target Market -. Automation Computer, Point of Sale, Embedded Board, Gaming, Kiosk, Digital Healthcare [See More]
- Device: Active Heat Sink
- Mounting: Socket
- Heat sink Fin Style:: Straight
from Rego Electronics Inc.
Product Series -. 1U & 2U Coolers, TDP : 35 Watts to 55 Watts. Features & Benefits -. A full range of products, customized technology, high quality, high reliability, lower noise level, long term supply. Target Market -. Industrial PC, Point of Sale, Embedded Board, Gaming, Kiosk [See More]
- Device: Active Heat Sink
- Mounting: Socket
- Heat sink Fin Style:: Straight
from Rego Electronics Inc.
We offer a full range of cooler solutions for various Intel ® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Our products are well designed in thermal performance based on our professional manufacturing know how. We also have the sophisticated equipment needed... [See More]
- Device: Active Heat Sink
- W: 81
- L: 88
- H: 27
from Rego Electronics Inc.
We offer a full range of cooler solutions for various Intel ® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Our products are well designed in thermal performance based on our professional manufacturing know how. We also have the sophisticated equipment needed... [See More]
- Device: Active Heat Sink
- W: 90
- L: 90
- H: 28.15
from Rego Electronics Inc.
We are excited to announce that we have just released new sunflower cooler products for Intel ® mobile processors – Ivy Bridge and Sandy Bridge. They are for applications used in markets such as Industrial Computers, Embedded Boards, Medical Computing, Point of Sale, etc. These coolers are... [See More]
- Device: Active Heat Sink
- W: 60
- L: 60
- H: 28
from Rego Electronics Inc.
We are excited to announce that we have just released new sunflower cooler products for Intel ® new generation mobile processors - Haswell and Boardwell. They are for applications used in markets such as Industrial Computers, Embedded Boards, Medical Computing, Point of Sale, etc. These coolers... [See More]
- Device: Active Heat Sink
- W: 60
- L: 60
- H: 28
from Sanyo Denki America, Inc.
CPU cooler for Intel ® PentiumIII (FC-PGA2) / 800MHz. [See More]
- Device: Active Heat Sink
- W: 50.8
- L: 64
- H: 31
from Dynatron Corp.
CPU Support : Intel ® Celeron, Celeron D, Pentium 4, Pentium D, Core 2 Duo, Core 2 Quad, Core 2 Extreme, Core i7, AMD ® Sempron, Athlon 64, Athlon 64 X2, Athlon 64 FX, Phenom, Phenom II X4. CPU Socket : INTEL socket 1366, 775, AMD: socket AM2/AM3/AM2+. Solution : Evolution serial provides... [See More]
- Device: Active Heat Sink
- W: 108
- L: 122
- H: 157
from Sanyo Denki America, Inc.
CPU cooler for Intel ® PentiumIII (FC-PGA2) / 866MHz. [See More]
- Device: Active Heat Sink
- W: 67.3
- L: 68
- H: 45
from Dynatron Corp.
CPU Support : Intel ® Core ™ i3, Core ™ i5, Socket LGA1156, Core ™ i7, Socket LGA1366, Core ™2 Quad, Socket LGA775. AMD ® Athlon ™ X2 / FX, Phenom ™ X4, Socket AM2 / AM2+ / AM3. CPU Socket : INTEL: socket 1156, 1366, 775, AMD: socket AM2/AM3/AM2+. Solution... [See More]
- Device: Active Heat Sink
- W: 148
- L: 124
- H: 120
from Sanyo Denki America, Inc.
CPU cooler for Intel ® 775-land LGA Package. [See More]
- Device: Active Heat Sink
- W: 72.1
- L: 72
- H: 62.6
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670 & I5-750; Xeon ® Processor 3400 Series; Core... [See More]
- Device: Active Heat Sink
- W: 106
- L: 106
- H: 72.6
from Sanyo Denki America, Inc.
CPU cooler for Intel Pentium 4 Processor (775-land LGA Package) [See More]
- Device: Active Heat Sink
- W: 72.1
- L: 72
- H: 62.6
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® 2nd Generation Core ™ i7-2600, i5-2500 series & Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670... [See More]
- Device: Active Heat Sink
- W: 106
- L: 106
- H: 72.6
from Sanyo Denki America, Inc.
CPU cooler for Intel ® Pentium4 (Socket478) / 2.80GHz. [See More]
- Device: Active Heat Sink
- W: 90
- L: 95
- H: 62.5
from Dynatron Corp.
CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Device: Active Heat Sink
- W: 79
- L: 106
- H: 27.5
from Sanyo Denki America, Inc.
CPU cooler for Intel ® Pentium4 (Socket478) / 3.06GHz. Speed adjustable based on tempearature. [See More]
- Device: Active Heat Sink
- W: 90
- L: 95
- H: 62
from Dynatron Corp.
CPU Support : AMD Athlon 64 3700+ Athlon 64 4000+ Sempron 3300+ Athlon 64 FX 53. CPU Socket : 754/939/940. Solution : 70 x 70 x 15mm fan, Aluminum Heatsink, Desktop solution [See More]
- Device: Active Heat Sink
- W: 78
- L: 110
- H: 60
from Sanyo Denki America, Inc.
CPU cooler for Intel ® Pentium4 (Socket478). [See More]
- Device: Active Heat Sink
- W: 90
- L: 95
- H: 62
from Dynatron Corp.
CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 60 x 60 x 25mm fan, Copper Heatsink with L Fin, 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 73
- L: 106
- H: 66
from Dynatron Corp.
CPU Support : Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 60 x 60 x 25mm fan with PWM function, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 71
- L: 100
- H: 65.5
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series. CPU Socket : G34. Solution : Copper heatsink with Aluminum 70x70x15mm blower for 1U Server solution. [See More]
- Device: Active Heat Sink
- W: 75
- L: 115
- H: 27.5
from Dynatron Corp.
CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 70 x 70 x 15 aluminum blower, Copper Heatsink, 1U server solution [See More]
- Device: Active Heat Sink
- W: 79
- L: 106
- H: 27.5
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series. CPU Socket : G34. Solution : 60 x 60 x 25mm PWM fan, Copper Hestink with Stacked Fin, 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 72
- L: 115
- H: 65.5
from Dynatron Corp.
CPU Support : AMD up to Athlon ™ 64 X2 Dual-Core 5200+ and Next-Generation AMD Opteron ™ 2.8Ghz. CPU Socket : AM2/AM2+/AM3. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 77
- L: 106
- H: 63
from Dynatron Corp.
CPU Support : AMD ® Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 77.2
- L: 100
- H: 63
from Dynatron Corp.
CPU Support : AMD ® Next Generation ™ Opteron. CPU Socket : F 1207(4.1 Mounting Pitch). Solution : 77 x 77 x 20mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 77.2
- L: 114
- H: 63
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series up to 135 Watts. CPU Socket : G34. Solution : 77 x 77 x 20mm fan with PWM function, Copper Base & Aluminum Stacked Fins with Heatpipes embeded 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 75.5
- L: 114
- H: 66.7
from Dynatron Corp.
CPU Support : AMD Dual-Core Opteron. CPU Socket : 754/939/940. Solution : 60 x 60 x 25mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 71
- L: 100
- H: 65.5
from Dynatron Corp.
CPU Support : AMD ® K8 and Opteron Athlon 64 FX Opteron 150/250/850. CPU Socket : 754/939/940. Solution : 60 x 60 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Device: Active Heat Sink
- W: 74
- L: 100
- H: 27
from Dynatron Corp.
CPU Support : AMD ® K8 and Opteron Athlon 64 FX Opteron 150/250/850. CPU Socket : 754/939/940. Solution : 60 x 60 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Device: Active Heat Sink
- W: 74
- L: 100
- H: 27
from Dynatron Corp.
CPU Support : AMD ® Socket C32 Opetron 4100 Series & & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series. CPU Socket : C32/F 1207/754/939/940. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Device: Active Heat Sink
- W: 74
- L: 100
- H: 27.5
from Dynatron Corp.
CPU Support : AMD ® Socket C32 Opetron 4100 Series & & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series. CPU Socket : C32/F 1207/754/939/940. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Device: Active Heat Sink
- W: 74
- L: 100
- H: 27.5
from Dynatron Corp.
CPU Support : AMD ® Opteron 150/250/850. CPU Socket : 754/939/940. Solution : 70 x 70 x 15mm aluminum blower, Copper Heatsink, 1U server solution [See More]
- Device: Active Heat Sink
- W: 74
- L: 100
- H: 27.5
from Dynatron Corp.
CPU Support : AMD ® Opteron 150/250/850. CPU Socket : 754/939/940. Solution : 70 x 70 x 15mm aluminum blower, Copper Heatsink, 1U server solution [See More]
- Device: Active Heat Sink
- W: 74
- L: 100
- H: 27.5
from Dynatron Corp.
CPU Support : AMD ® Dual-Core 4.1" Mounting Pitch. CPU Socket : F 1207. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Device: Active Heat Sink
- W: 77
- L: 115
- H: 27
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6100 Series. CPU Socket : G34. Solution : 75x15mm Aluminum blower, Copper heatsink with heatpipes embedded for 1U Server solution [See More]
- Device: Active Heat Sink
- W: 79
- L: 115
- H: 27.8
from Dynatron Corp.
CPU Support : AMD ® Dual-Core. CPU Socket : F 1207(4.1 Mounting Pitch). Solution : 60 x 60 x 25mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 72
- L: 115
- H: 66