Active Heat Sink CPU Coolers
from ToneCooling Technology Co., Ltd
This active LGA4189 CPU cooler is designed for Intel Xeon processors on rectangular motherboards within 2U server environments, delivering efficient cooling with a copper base and aluminum fin design. AI Training Clusters. Supports NVIDIA HGX H100 8-GPU sustained cooling. 100% core Turbo Boost in... [See More]
- Device: Active Heat Sink
- W: 78
- L: 113
- H: 64.5
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Device: Active Heat Sink
- W: 83
- L: 83
- H: 35.9
from ToneCooling Technology Co., Ltd
This active LGA4189 CPU cooler is engineered for efficient cooling of Intel Xeon processors on rectangular motherboards within 2U server environments, combining a high-speed fan with an aluminum fin design and heat pipes. AI/ML Clusters: Supports NVIDIA HGX H100 8-GPU configurations. Zero throttling... [See More]
- Device: Active Heat Sink; Vapor Cooler
- W: 80
- L: 113
- H: 66.3
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Device: Active Heat Sink
- W: 83
- L: 83
- H: 25.5
from ToneCooling Technology Co., Ltd
This active TC-LGA4189 CPU cooler is designed for reliable cooling of Intel Xeon processors on rectangular motherboards within 2U server environments. It combines a copper base with aluminum fins, heat pipes, and a high-speed PWM fan to ensure efficient thermal management. Key Features: ✅... [See More]
- Device: Active Heat Sink
- H: 64.5
- W: 78
- Material: Aluminum; Copper; Copper base, aluminum fins, and 4 heat pipes.
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Device: Active Heat Sink
- W: 83
- L: 83
- H: 50.6
from ToneCooling Technology Co., Ltd
This active TC-LGA4189 CPU cooler is designed for Intel Xeon processors on rectangular motherboards in 2U server environments and above. It delivers maximum cooling performance with a copper base, aluminum fins, heat pipes, and a high-speed PWM fan for systems requiring exceptional thermal... [See More]
- Device: Active Heat Sink
- W: 79
- L: 113
- H: 64.5
from Rego Electronics Inc.
Heat Sink : Forged AL1070 60 x 60 x 16 mm / Skived AL6063 60 x 58 x 14 mm. Fan : 50 x 50 x 10mm / 52 x 52 x 15 mm / 50 x 50 x 20 mm, Two Ball Bearing. Connector Type : 3 ways / 4 ways. Screw & Back Plate : rPGA Socket CPU / BGA Package CPU [See More]
- Device: Active Heat Sink
- W: 58
- L: 60
- H: 14
from ToneCooling Technology Co., Ltd
This active TC-LGA4189 CPU cooler is engineered to provide reliable cooling for Intel Xeon processors in 1U server environments, using a copper vapor chamber (VC) base and copper fins to maximize heat dissipation in constrained spaces. Cloud Data Centers. Supports AWS EC2 C7i 300W burst loads. [See More]
- Device: Active Heat Sink
- W: 80
- L: 113
- H: 28
from Rego Electronics Inc.
Product Series -. Chip Size : 35mm x 35mm to 52mm x 52mm, Height : 8.5mm to 10 mm, TDP : 10 Watts to 20 Watts. Features & Benefits -. A full range of products, High quality, Lower noise level, Long term supply, Customization available. Target Market -. Storage, Industrial PC, Embedded Board,... [See More]
- Device: Active Heat Sink
- W: 40
- L: 40
- H: 8
from ToneCooling Technology Co., Ltd
The LGA7529 CPU cooler is designed for Intel server processors with the LGA 7529 socket. These coolers come in various designs, including active heat sink, passive cooler, and liquid cooler options, to suit different server form factors and cooling requirements. Cooling Solutions: Passive Coolers:... [See More]
- Device: Passive Heat Sink; Active Heat Sink
- Material: Aluminum; Copper; Typically made with aluminum fins, copper base, and heat pipes for efficient heat dissipation
from Rego Electronics Inc.
We are excited to announce that we have just released new CPU cooler products for Intel ® new generation mobile CPU processors - Haswell and Boardwell. They are for applications used in markets such as Industrial Computers, Embedded Boards, Medical Computing, Point of Sale, etc. These CPU... [See More]
- Device: Active Heat Sink
- W: 60
- L: 60
- H: 33
from ToneCooling Technology Co., Ltd
This compact LGA4189 CPU cooler is designed for Intel Xeon processors in space-constrained server environments (rectangular motherboard), balancing size and cooling performance. ✅ Ultra-Quiet Operation: 45 dB(A) at full load | ISO 7779 Class 3 certified for medical/education environments. [See More]
- Device: Active Heat Sink; Thermo-Electric Cooler
- W: 79
- L: 113
- H: 25
from Rego Electronics Inc.
Product Series. 1U & 2U Coolers, TDP : 35 Watts to 55 Watts. Intel : Socket G2 rPGA 988, 989, 946 & BGA1288 Coolers. AMD : FP3, FP4 & FP5 Coolers. Features & Benefits. A full range of products, customized technology, high quality, high reliability, lower noise level, long term... [See More]
- Device: Active Heat Sink
- W: 60
- L: 60
- H: 43
from Rego Electronics Inc.
Product Series. 1U & 2U Coolers, TDP : 35 Watts to 55 Watts. Intel : Socket G2 rPGA 988, 989, 946 & BGA1288 Coolers. AMD : FP3, FP4 & FP5 Coolers. Features & Benefits. A full range of products, customized technology, high quality, high reliability, lower noise level, long term... [See More]
- Device: Active Heat Sink
- W: 60
- L: 60
- H: 43
from Rego Electronics Inc.
Product Series. 1U & 2U Coolers, TDP : 35 Watts to 55 Watts. Intel : Socket G2 rPGA 988, 989, 946 & BGA1288 Coolers. AMD : FP3, FP4 & FP5 Coolers. Features & Benefits. A full range of products, customized technology, high quality, high reliability, lower noise level, long term... [See More]
- Device: Active Heat Sink
- W: 60
- L: 60
- H: 33
from Rego Electronics Inc.
Product Series. 1U & 2U Coolers, TDP : 35 Watts to 55 Watts. Intel : Socket G2 rPGA 988, 989, 946 & BGA1288 Coolers. AMD : FP3, FP4 & FP5 Coolers. Features & Benefits. A full range of products, customized technology, high quality, high reliability, lower noise level, long term... [See More]
- Device: Active Heat Sink
- W: 60
- L: 60
- H: 33
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Device: Active Heat Sink
- W: 88
- L: 88
- H: 51.6
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Device: Active Heat Sink
- W: 88.7
- L: 89
- H: 76.6
from Rego Electronics Inc.
Solution : 2U &Up Server. CPU Socket : 1155/1156/1150. Outline Dimension : 90.75 x 89.50 x 65.25mm. Heat Sink : 78.0 x 62.5 x 61.6mm, Copper Base & Aluminum Fins with Heatpipes embedded. Fan : 60 x 60 x 25 mm, Two Ball Bearing, Manufacturer : Sanyo Denki. Connector Type : 4 ways (PWM... [See More]
- Device: Active Heat Sink
- W: 89.5
- L: 91
- H: 65.25
from Rego Electronics Inc.
We offer a full range of cooler solutions for various Intel ® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Our products are well designed in thermal performance based on our professional manufacturing know how. We also have the sophisticated equipment needed... [See More]
- Device: Active Heat Sink
- W: 80
- L: 82
- H: 25.5
from Rego Electronics Inc.
We offer a full range of cooler solutions for various Intel ® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Our products are well designed in thermal performance based on our professional manufacturing know how. We also have the sophisticated equipment needed... [See More]
- Device: Active Heat Sink
- W: 80
- L: 88
- H: 36.7
from Rego Electronics Inc.
We offer a full range of cooler solutions for various Intel ® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Our products are well designed in thermal performance based on our professional manufacturing know how. We also have the sophisticated equipment needed... [See More]
- Device: Active Heat Sink
- W: 88.5
- L: 88
- H: 41.5
from Rego Electronics Inc.
Features & Benefits -. High quality, high reliability, lower noise level, long term supply, customization available. Target Market -. Industrial PC, Point of Sale, Embedded Board, Gaming, Kiosk. Outline Dimension : 49 x 49 x 22.5 mm. Heat Sink : Extruded AL6063, 49 x 49 x 12 mm. Fan : 40 x 40 x... [See More]
- Device: Active Heat Sink
- W: 49
- L: 49
- H: 22.5
from Rego Electronics Inc.
Outline Dimension : 53.25 x 50 x 22.5 mm. Heat Sink : Stamped C1100, 49 x 31.5 x 12 mm. Fan : 40 x 40 x 10.5 mm, Two Ball Bearing, 6000 RPM, Noise Level : 25 dB(A). Connector Type : 2510-3P. Thermal Resistance : 0.99 ℃/W. Weight : 86 g [See More]
- Device: Active Heat Sink
- W: 50
- L: 53
- H: 22.5
from Rego Electronics Inc.
Outline Dimension : 49 x 49 x 22.5 mm. Heat Sink : Extruded AL6063, 49 x 49 x 12 mm. Fan : 40 x 40 x 10.5 mm, Two Ball Bearing, 6000 RPM, Noise Level : 25 dB(A). Connector Type : 2510-3P. Thermal Resistance : 1.25 ℃/W. Weight : 43 g [See More]
- Device: Active Heat Sink
- W: 49
- L: 49
- H: 22.5
from Rego Electronics Inc.
Features & Benefits -. High quality, high reliability, lower noise level, long term supply, customization available. Target Market -. Automation Computer, Point of Sale, Embedded Board, Gaming, Kiosk, Digital Healthcare [See More]
- Device: Active Heat Sink
- Mounting: Socket
- Heat sink Fin Style:: Straight
from Rego Electronics Inc.
Product Series -. 1U & 2U Coolers, TDP : 35 Watts to 55 Watts. Features & Benefits -. A full range of products, customized technology, high quality, high reliability, lower noise level, long term supply. Target Market -. Industrial PC, Point of Sale, Embedded Board, Gaming, Kiosk [See More]
- Device: Active Heat Sink
- Mounting: Socket
- Heat sink Fin Style:: Straight
from Rego Electronics Inc.
We offer a full range of cooler solutions for various Intel ® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Our products are well designed in thermal performance based on our professional manufacturing know how. We also have the sophisticated equipment needed... [See More]
- Device: Active Heat Sink
- W: 81
- L: 88
- H: 27
from Rego Electronics Inc.
We offer a full range of cooler solutions for various Intel ® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Our products are well designed in thermal performance based on our professional manufacturing know how. We also have the sophisticated equipment needed... [See More]
- Device: Active Heat Sink
- W: 90
- L: 90
- H: 28.15
from Rego Electronics Inc.
We are excited to announce that we have just released new sunflower cooler products for Intel ® mobile processors – Ivy Bridge and Sandy Bridge. They are for applications used in markets such as Industrial Computers, Embedded Boards, Medical Computing, Point of Sale, etc. These coolers are... [See More]
- Device: Active Heat Sink
- W: 60
- L: 60
- H: 28
from Rego Electronics Inc.
We are excited to announce that we have just released new sunflower cooler products for Intel ® new generation mobile processors - Haswell and Boardwell. They are for applications used in markets such as Industrial Computers, Embedded Boards, Medical Computing, Point of Sale, etc. These coolers... [See More]
- Device: Active Heat Sink
- W: 60
- L: 60
- H: 28
from Sanyo Denki America, Inc.
CPU cooler for Intel ® PentiumIII (FC-PGA2) / 800MHz. [See More]
- Device: Active Heat Sink
- W: 50.8
- L: 64
- H: 31
from Dynatron Corp.
CPU Support : Intel ® Celeron, Celeron D, Pentium 4, Pentium D, Core 2 Duo, Core 2 Quad, Core 2 Extreme, Core i7, AMD ® Sempron, Athlon 64, Athlon 64 X2, Athlon 64 FX, Phenom, Phenom II X4. CPU Socket : INTEL socket 1366, 775, AMD: socket AM2/AM3/AM2+. Solution : Evolution serial provides... [See More]
- Device: Active Heat Sink
- W: 108
- L: 122
- H: 157
from Sanyo Denki America, Inc.
CPU cooler for Intel ® PentiumIII (FC-PGA2) / 866MHz. [See More]
- Device: Active Heat Sink
- W: 67.3
- L: 68
- H: 45
from Dynatron Corp.
CPU Support : Intel ® Core ™ i3, Core ™ i5, Socket LGA1156, Core ™ i7, Socket LGA1366, Core ™2 Quad, Socket LGA775. AMD ® Athlon ™ X2 / FX, Phenom ™ X4, Socket AM2 / AM2+ / AM3. CPU Socket : INTEL: socket 1156, 1366, 775, AMD: socket AM2/AM3/AM2+. Solution... [See More]
- Device: Active Heat Sink
- W: 148
- L: 124
- H: 120
from Sanyo Denki America, Inc.
CPU cooler for Intel ® 775-land LGA Package. [See More]
- Device: Active Heat Sink
- W: 72.1
- L: 72
- H: 62.6
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670 & I5-750; Xeon ® Processor 3400 Series; Core... [See More]
- Device: Active Heat Sink
- W: 106
- L: 106
- H: 72.6
from Sanyo Denki America, Inc.
CPU cooler for Intel Pentium 4 Processor (775-land LGA Package) [See More]
- Device: Active Heat Sink
- W: 72.1
- L: 72
- H: 62.6
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® 2nd Generation Core ™ i7-2600, i5-2500 series & Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670... [See More]
- Device: Active Heat Sink
- W: 106
- L: 106
- H: 72.6
from Sanyo Denki America, Inc.
CPU cooler for Intel ® Pentium4 (Socket478) / 2.80GHz. [See More]
- Device: Active Heat Sink
- W: 90
- L: 95
- H: 62.5
from Dynatron Corp.
CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Device: Active Heat Sink
- W: 79
- L: 106
- H: 27.5
from Sanyo Denki America, Inc.
CPU cooler for Intel ® Pentium4 (Socket478) / 3.06GHz. [See More]
- Device: Active Heat Sink
- W: 90
- L: 95
- H: 62
from Dynatron Corp.
CPU Support : AMD Athlon 64 3700+ Athlon 64 4000+ Sempron 3300+ Athlon 64 FX 53. CPU Socket : 754/939/940. Solution : 70 x 70 x 15mm fan, Aluminum Heatsink, Desktop solution [See More]
- Device: Active Heat Sink
- W: 78
- L: 110
- H: 60
from Sanyo Denki America, Inc.
CPU cooler for Intel ® Pentium4 (Socket478). [See More]
- Device: Active Heat Sink
- W: 90
- L: 95
- H: 62
from Dynatron Corp.
CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 60 x 60 x 25mm fan, Copper Heatsink with L Fin, 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 73
- L: 106
- H: 66
from Dynatron Corp.
CPU Support : Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 60 x 60 x 25mm fan with PWM function, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 71
- L: 100
- H: 65.5
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series. CPU Socket : G34. Solution : Copper heatsink with Aluminum 70x70x15mm blower for 1U Server solution. [See More]
- Device: Active Heat Sink
- W: 75
- L: 115
- H: 27.5
from Dynatron Corp.
CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 70 x 70 x 15 aluminum blower, Copper Heatsink, 1U server solution [See More]
- Device: Active Heat Sink
- W: 79
- L: 106
- H: 27.5
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series. CPU Socket : G34. Solution : 60 x 60 x 25mm PWM fan, Copper Hestink with Stacked Fin, 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 72
- L: 115
- H: 65.5
from Dynatron Corp.
CPU Support : AMD up to Athlon ™ 64 X2 Dual-Core 5200+ and Next-Generation AMD Opteron ™ 2.8Ghz. CPU Socket : AM2/AM2+/AM3. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 77
- L: 106
- H: 63
from Dynatron Corp.
CPU Support : AMD ® Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 77.2
- L: 100
- H: 63
from Dynatron Corp.
CPU Support : AMD ® Next Generation ™ Opteron. CPU Socket : F 1207(4.1 Mounting Pitch). Solution : 77 x 77 x 20mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 77.2
- L: 114
- H: 63
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series up to 135 Watts. CPU Socket : G34. Solution : 77 x 77 x 20mm fan with PWM function, Copper Base & Aluminum Stacked Fins with Heatpipes embeded 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 75.5
- L: 114
- H: 66.7
from Dynatron Corp.
CPU Support : AMD Dual-Core Opteron. CPU Socket : 754/939/940. Solution : 60 x 60 x 25mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 71
- L: 100
- H: 65.5
from Dynatron Corp.
CPU Support : AMD ® K8 and Opteron Athlon 64 FX Opteron 150/250/850. CPU Socket : 754/939/940. Solution : 60 x 60 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Device: Active Heat Sink
- W: 74
- L: 100
- H: 27
from Dynatron Corp.
CPU Support : AMD ® Socket C32 Opetron 4100 Series & & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series. CPU Socket : C32/F 1207/754/939/940. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Device: Active Heat Sink
- W: 74
- L: 100
- H: 27.5
from Dynatron Corp.
CPU Support : AMD ® Opteron 150/250/850. CPU Socket : 754/939/940. Solution : 70 x 70 x 15mm aluminum blower, Copper Heatsink, 1U server solution [See More]
- Device: Active Heat Sink
- W: 74
- L: 100
- H: 27.5
from Dynatron Corp.
CPU Support : AMD ® Dual-Core 4.1" Mounting Pitch. CPU Socket : F 1207. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Device: Active Heat Sink
- W: 77
- L: 115
- H: 27
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6100 Series. CPU Socket : G34. Solution : 75x15mm Aluminum blower, Copper heatsink with heatpipes embedded for 1U Server solution [See More]
- Device: Active Heat Sink
- W: 79
- L: 115
- H: 27.8
from Dynatron Corp.
CPU Support : AMD ® Dual-Core. CPU Socket : F 1207(4.1 Mounting Pitch). Solution : 60 x 60 x 25mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 72
- L: 115
- H: 66
from Dynatron Corp.
CPU Support : AMD ® Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 60 x 60 x 25mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Device: Active Heat Sink
- W: 71
- L: 100
- H: 65.5
from Dynatron Corp.
CPU Support : AMD ® Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Device: Active Heat Sink
- W: 77
- L: 100
- H: 27.5
from Dynatron Corp.
CPU Support : AMD ®:K7 AMD ® Recommended up to XP2100+, MP2100+ & Sempron 3000+; Intel ®: 933MHZ and 1/1.26GHZ and 1.40 Ghz &. CPU Socket : A/462/370. Solution : 60 x 60 x 10mm fan, Aluminum Heatsink, Desktop solution [See More]
- Device: Active Heat Sink
- W: 63
- L: 70
- H: 46