Mixed Material CPU Coolers
from ToneCooling Technology Co., Ltd
AlSiC Pin Fin Coolers for IGBT: We offer high-performance AlSiC coolers designed for efficient heat management. Function: Provides superior thermal dissipation for IGBT modules, ensuring stable operation and enhanced reliability. Applications: Used in power electronics and automotive systems,... [See More]
- Material: Aluminum; Copper; Mixed; Cu Base + AL Fin + 6025 Fan
- W: 89.5
- L: 90
- H: 69
from ToneCooling Technology Co., Ltd
High Thermal Conductivity: Utilizes Friction Stir Welding (FSW) technology to enhance heat transfer efficiency. Robust Construction: Strong, durable joints created by FSW ensure long-lasting performance under high thermal and mechanical stresses. Uniform Cooling: Advanced welding techniques... [See More]
- Material: Aluminum; Copper; Mixed; Aluminum,Copper
- Device: Liquid Cooler
from ToneCooling Technology Co., Ltd
High Thermal Conductivity: Utilizes Friction Stir Welding (FSW) technology to enhance heat transfer efficiency. Robust Construction: Strong, durable joints created by FSW ensure long-lasting performance under high thermal and mechanical stresses. Uniform Cooling: Advanced welding techniques... [See More]
- Material: Aluminum; Mixed; Aluminum Alloy
- Weight: 6000
- Device: Liquid Cooler
from ToneCooling Technology Co., Ltd
Top Benefits of Using Coolserver Heat Sinks for Electronic Devices. CPU coolserver W2. The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and affordable price.When... [See More]
- Material: Aluminum; Mixed; AL Base + Cu Block +AL Fin + 5HP+ 9225 Fan
- W: 95
- L: 108
- H: 126
from ToneCooling Technology Co., Ltd
Advanced Liquid Cooling Technology from Coolserver for Modern Data Centers. CPU coolserver W2. The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and affordable... [See More]
- Material: Aluminum; Mixed; AL Base + Cu Block +AL Fin + 4HP + 6025 Fan
- W: 78
- L: 113
- H: 64
from ToneCooling Technology Co., Ltd
Optimize Your Cooling with Coolserver ’s High-Efficiency Heat Sink Solutions. CPU coolserver P9. The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and... [See More]
- Material: Aluminum; Mixed; AL Base + Cu Block +AL Fin + 4HP+ 6025 Fan
- W: 78
- L: 108
- H: 64
from ToneCooling Technology Co., Ltd
High-Quality Liquid Cooling Plates by Coolserver for Server Applications. CPU coolserver H2. The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and affordable... [See More]
- Material: Aluminum; Copper; Mixed; Cu Base + AL Fin + 6025 Fan
- W: 90
- L: 91
- H: 67.3
from ToneCooling Technology Co., Ltd
Custom Heat Sink Solutions from Coolserver for Electronics Cooling. CPU coolserver B6. The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and affordable price.When... [See More]
- Material: Aluminum; Copper; Mixed; Cu Base + AL Fin + 6025 Fan
- W: 89.5
- L: 90
- H: 69
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670 & I5-750; Xeon ® Processor 3400 Series; Core... [See More]
- Material: Aluminum; Copper; Mixed
- L: 106
- Device: Active Heat Sink
- W: 106
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® 2nd Generation Core ™ i7-2600, i5-2500 series & Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670... [See More]
- Material: Aluminum; Copper; Mixed
- L: 106
- Device: Active Heat Sink
- W: 106
from Dynatron Corp.
CPU Support : AMD up to Athlon ™ 64 X2 Dual-Core 5200+ and Next-Generation AMD Opteron ™ 2.8Ghz. CPU Socket : AM2/AM2+/AM3. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 106
- Device: Active Heat Sink
- W: 77
from Dynatron Corp.
CPU Support : AMD ® Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 100
- Device: Active Heat Sink
- W: 77.2
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series up to 135 Watts. CPU Socket : G34. Solution : 77 x 77 x 20mm fan with PWM function, Copper Base & Aluminum Stacked Fins with Heatpipes embeded 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 114
- Device: Active Heat Sink
- W: 75.5
from Dynatron Corp.
CPU Support : AMD ® AMD ® Socket C32 Opetron 4100 Series & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : C32/F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server... [See More]
- Material: Aluminum; Copper; Mixed
- L: 100
- Device: Active Heat Sink
- W: 78
from Dynatron Corp.
CPU Support : AMD ® Socket C32 Opetron 4100 Series & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : C32/F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 100
- Device: Active Heat Sink
- W: 78
from Dynatron Corp.
CPU Support : AMD ® Socket C32 Opetron 4100 Series & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : C32/F 1207. Solution : 77 x 77 x 20mm fan with PWM function, Copper Base & Aluminum Fins with Heatpipes embedded, 3U server... [See More]
- Material: Aluminum; Copper; Mixed
- L: 100
- Device: Active Heat Sink
- W: 78
from Dynatron Corp.
CPU Support : Intel ® Xeon ™ 5600 series Westmere Processor X5670, X5667, X5660, X5650, E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor W5580, X5570, X5560, X5550, E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518, L5508. CPU... [See More]
- Material: Aluminum; Copper; Mixed
- L: 94
- Device: Active Heat Sink
- W: 89.5
from Dynatron Corp.
CPU Support : Intel ® Xeon ™ 5600 series Westmere Processor X5680, X5677, X5670, X5667, X5660, X5650, E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor W5580, X5570, X5560, X5550, E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518,... [See More]
- Material: Aluminum; Copper; Mixed
- W: 90
- L: 90
- H: 64
from Dynatron Corp.
CPU Support : Intel ® Xeon ™ 5600 series Westmere Processor E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518, L5508. CPU Socket : 1366. Solution : 60 x 60 x 25 mm fan with PWM... [See More]
- Material: Aluminum; Copper; Mixed
- L: 90
- Device: Active Heat Sink
- W: 90
from Dynatron Corp.
CPU Support : Intel ® Xeon ™ 5600 series Westmere Processor X5680, X5677, X5670, X5667, X5660, X5650, E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor W5580, X5570, X5560, X5550, E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518,... [See More]
- Material: Aluminum; Copper; Mixed
- L: 90
- Device: Active Heat Sink
- W: 90
from Dynatron Corp.
CPU Support : Intel ® Xeon ™ 5600 series Westmere Processor X5680, X5677, X5670, X5667, X5660, X5650, E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor W5580, X5570, X5560, X5550, E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518,... [See More]
- Material: Aluminum; Copper; Mixed
- L: 90
- Device: Active Heat Sink
- W: 90
from Dynatron Corp.
CPU Support : Intel ® Core i7 processors, Xeon Westmere 5600 series & Nehalem 5500 Series. CPU Socket : 1366. Solution : 92 x 92 x 25mm fan with PWM function, Aluminum Radial Fin Heatsink with Copper Inserted, Desktop&Workstation server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 110
- Device: Active Heat Sink
- W: 110
from Dynatron Corp.
CPU Support : Intel ® Xeon ® Tulsa, Paxville. CPU Socket : 604. Solution : 77 x 77 x 20mm fan with PWM function, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 94
- Device: Active Heat Sink
- W: 81
from Dynatron Corp.
CPU Support : Intel ® Xeon ® Quad-Core X5460/ X5482/ E5472/ E5450/ X5450/ X5472/ E5440/ E5462/ E5430/ E5420/ E5410/ E5405, Dual-Core E5205/ X5260/ X5272. CPU Socket : 771. Solution : 77 x 77 x 20mm fan with PWM function, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server... [See More]
- Material: Aluminum; Copper; Mixed
- L: 94
- Device: Active Heat Sink
- W: 81
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® 2nd Generation Core ™ i7-2600, i5-2500 series & Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280 & LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661... [See More]
- Material: Aluminum; Copper; Mixed
- L: 94
- Device: Active Heat Sink
- W: 87.5
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® 2nd Generation Core ™ i7-2600, i5-2500 series & Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA 1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661... [See More]
- Material: Aluminum; Copper; Mixed
- W: 90
- L: 90
- H: 66
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® 2nd Generation Core ™ i7-2600, i5-2500 series & Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA 1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661... [See More]
- Material: Aluminum; Copper; Mixed
- L: 88
- Device: Active Heat Sink
- W: 87
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® 2nd Generation Core ™ i7-2600, i5-2500 series & Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670... [See More]
- Material: Aluminum; Copper; Mixed
- L: 91
- Device: Active Heat Sink
- W: 85
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® 2nd Generation Core ™ i7-2600, i5-2500 series & Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670... [See More]
- Material: Aluminum; Copper; Mixed
- L: 90
- Device: Active Heat Sink
- W: 90