Aluminum CPU Coolers
from ToneCooling Technology Co., Ltd
High Thermal Conductivity: Utilizes Friction Stir Welding (FSW) technology to enhance heat transfer efficiency. Robust Construction: Strong, durable joints created by FSW ensure long-lasting performance under high thermal and mechanical stresses. Uniform Cooling: Advanced welding techniques... [See More]
- Material: Aluminum; Aluminum
- Device: Liquid Cooler
from Rego Electronics Inc.
Product Series. 1U & 2U Coolers, TDP : 35 Watts to 55 Watts. Intel : Socket G2 rPGA 988, 989, 946 & BGA1288 Coolers. AMD : FP3, FP4 & FP5 Coolers. Features & Benefits. A full range of products, customized technology, high quality, high reliability, lower noise level, long term... [See More]
- Material: Aluminum; C1100
- L: 60
- Device: Active Heat Sink
- W: 60
from ToneCooling Technology Co., Ltd
AlSiC Pin Fin Coolers for IGBT: We offer high-performance AlSiC coolers designed for efficient heat management. Function: Provides superior thermal dissipation for IGBT modules, ensuring stable operation and enhanced reliability. Applications: Used in power electronics and automotive systems,... [See More]
- Material: Aluminum; Copper; Mixed; Cu Base + AL Fin + 6025 Fan
- W: 89.5
- L: 90
- H: 69
from Rego Electronics Inc.
Product Series. 1U & 2U Coolers, TDP : 35 Watts to 55 Watts. Intel : Socket G2 rPGA 988, 989, 946 & BGA1288 Coolers. AMD : FP3, FP4 & FP5 Coolers. Features & Benefits. A full range of products, customized technology, high quality, high reliability, lower noise level, long term... [See More]
- Material: Aluminum; C1100
- L: 60
- Device: Active Heat Sink
- W: 60
from ToneCooling Technology Co., Ltd
High Thermal Conductivity: Utilizes Friction Stir Welding (FSW) technology to enhance heat transfer efficiency. Robust Construction: Strong, durable joints created by FSW ensure long-lasting performance under high thermal and mechanical stresses. Uniform Cooling: Advanced welding techniques... [See More]
- Material: Aluminum; Aluminum
- Device: Liquid Cooler
from Rego Electronics Inc.
Product Series. 1U & 2U Coolers, TDP : 35 Watts to 55 Watts. Intel : Socket G2 rPGA 988, 989, 946 & BGA1288 Coolers. AMD : FP3, FP4 & FP5 Coolers. Features & Benefits. A full range of products, customized technology, high quality, high reliability, lower noise level, long term... [See More]
- Material: Aluminum; C1100
- L: 60
- Device: Active Heat Sink
- W: 60
from ToneCooling Technology Co., Ltd
High Thermal Conductivity. Efficiently transfers heat from the Eagle-Stream platform ‘s CPUs or GPUs to the cooling fluid, ensuring effective heat dissipation for high-performance computing systems. Customizable Designs. Available in various sizes and configurations to fit Eagle-Stream CPUs... [See More]
- Material: Aluminum; Copper
from Rego Electronics Inc.
Product Series. 1U & 2U Coolers, TDP : 35 Watts to 55 Watts. Intel : Socket G2 rPGA 988, 989, 946 & BGA1288 Coolers. AMD : FP3, FP4 & FP5 Coolers. Features & Benefits. A full range of products, customized technology, high quality, high reliability, lower noise level, long term... [See More]
- Material: Aluminum; C1100
- L: 60
- Device: Active Heat Sink
- W: 60
from ToneCooling Technology Co., Ltd
#183;High Thermal Conductivity: Efficiently transfers heat from the CPU or GPU to the cooling fluid for effective heat dissipation. ·Customizable Designs: Available in various sizes and configurations to fit different CPUs and GPUs. ·Precision Machining: Designed with high precision to... [See More]
- Material: Aluminum; Copper
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Aluminum
- L: 88
- Device: Active Heat Sink
- W: 88
from ToneCooling Technology Co., Ltd
》Efficient heat dissipation and noise control. 》Higher performance and longer life of graphics cards. 》Compatible with and made of high thermal conductivity materials. Materials such as copper and aluminum. “Easy to install. 》Seamless and perfect joint, no leaks. [See More]
- Material: Aluminum; Copper
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Aluminum
- L: 89
- Device: Active Heat Sink
- W: 88.7
from ToneCooling Technology Co., Ltd
High Thermal Conductivity: Utilizes Friction Stir Welding (FSW) technology to enhance heat transfer efficiency. Robust Construction: Strong, durable joints created by FSW ensure long-lasting performance under high thermal and mechanical stresses. Uniform Cooling: Advanced welding techniques... [See More]
- Material: Aluminum; Aluminum
- Device: Liquid Cooler
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Aluminum
- L: 89
- Device: Active Heat Sink
- W: 88.7
from ToneCooling Technology Co., Ltd
High Thermal Conductivity: Utilizes Friction Stir Welding (FSW) technology to enhance heat transfer efficiency. Robust Construction: Strong, durable joints created by FSW ensure long-lasting performance under high thermal and mechanical stresses. Uniform Cooling: Advanced welding techniques... [See More]
- Material: Aluminum; Copper; Mixed; Aluminum,Copper
- Device: Liquid Cooler
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Aluminum
- L: 91
- Device: Active Heat Sink
- W: 89.5
from ToneCooling Technology Co., Ltd
High Thermal Conductivity: Utilizes Friction Stir Welding (FSW) technology to enhance heat transfer efficiency. Robust Construction: Strong, durable joints created by FSW ensure long-lasting performance under high thermal and mechanical stresses. Uniform Cooling: Advanced welding techniques... [See More]
- Material: Aluminum; Mixed; Aluminum Alloy
- Weight: 6000
- Device: Liquid Cooler
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Aluminum
- L: 88
- Device: Active Heat Sink
- W: 88
from ToneCooling Technology Co., Ltd
#183;High Thermal Conductivity: Efficiently transfers heat from the CPU or GPU to the cooling fluid for effective heat dissipation. ·Customizable Designs: Available in various sizes and configurations to fit different CPUs and GPUs. ·Precision Machining: Designed with high precision to... [See More]
- Material: Aluminum; Copper
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Aluminum
- L: 90
- Device: Active Heat Sink
- W: 90
from ToneCooling Technology Co., Ltd
#183;High Thermal Conductivity: Efficiently transfers heat from the CPU or GPU to the cooling fluid for effective heat dissipation. ·Customizable Designs: Available in various sizes and configurations to fit different CPUs and GPUs. ·Precision Machining: Designed with high precision to... [See More]
- Material: Aluminum; Copper
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Aluminum
- L: 77
- Device: Active Heat Sink
- W: 77
from ToneCooling Technology Co., Ltd
#183;High Thermal Conductivity: Efficiently transfers heat from the CPU or GPU to the cooling fluid for effective heat dissipation. ·Customizable Designs: Available in various sizes and configurations to fit different CPUs and GPUs. ·Precision Machining: Designed with high precision to... [See More]
- Material: Aluminum; Copper
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Aluminum
- L: 88
- Device: Active Heat Sink
- W: 88
from ToneCooling Technology Co., Ltd
#183;High Thermal Conductivity: Efficiently transfers heat from the CPU or GPU to the cooling fluid for effective heat dissipation. ·Customizable Designs: Available in various sizes and configurations to fit different CPUs and GPUs. ·Precision Machining: Designed with high precision to... [See More]
- Material: Aluminum; Copper
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Aluminum; C1100
- L: 91
- Device: Active Heat Sink
- W: 85
from ToneCooling Technology Co., Ltd
#183;High Thermal Conductivity: Efficiently transfers heat from the CPU or GPU to the cooling fluid for effective heat dissipation. ·Customizable Designs: Available in various sizes and configurations to fit different CPUs and GPUs. ·Precision Machining: Designed with high precision to... [See More]
- Material: Aluminum; Copper
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Aluminum
- L: 90
- Device: Active Heat Sink
- W: 90
from ToneCooling Technology Co., Ltd
Top Benefits of Using Coolserver Heat Sinks for Electronic Devices. CPU coolserver W2. The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and affordable price.When... [See More]
- Material: Aluminum; Mixed; AL Base + Cu Block +AL Fin + 5HP+ 9225 Fan
- W: 95
- L: 108
- H: 126
from ToneCooling Technology Co., Ltd
Advanced Liquid Cooling Technology from Coolserver for Modern Data Centers. CPU coolserver W2. The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and affordable... [See More]
- Material: Aluminum; Mixed; AL Base + Cu Block +AL Fin + 4HP + 6025 Fan
- W: 78
- L: 113
- H: 64
from ToneCooling Technology Co., Ltd
Optimize Your Cooling with Coolserver ’s High-Efficiency Heat Sink Solutions. CPU coolserver P9. The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and... [See More]
- Material: Aluminum; Mixed; AL Base + Cu Block +AL Fin + 4HP+ 6025 Fan
- W: 78
- L: 108
- H: 64
from ToneCooling Technology Co., Ltd
High-Quality Liquid Cooling Plates by Coolserver for Server Applications. CPU coolserver H2. The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and affordable... [See More]
- Material: Aluminum; Copper; Mixed; Cu Base + AL Fin + 6025 Fan
- W: 90
- L: 91
- H: 67.3
from ToneCooling Technology Co., Ltd
Custom Heat Sink Solutions from Coolserver for Electronics Cooling. CPU coolserver B6. The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and affordable price.When... [See More]
- Material: Aluminum; Copper; Mixed; Cu Base + AL Fin + 6025 Fan
- W: 89.5
- L: 90
- H: 69
from Sanyo Denki America, Inc.
CPU cooler for Intel ® PentiumIII (FC-PGA2) / 800MHz. [See More]
- Material: Aluminum
- L: 64
- Device: Active Heat Sink
- W: 50.8
from Dynatron Corp.
CPU Support : Intel ® Celeron, Celeron D, Pentium 4, Pentium D, Core 2 Duo, Core 2 Quad, Core 2 Extreme, Core i7, AMD ® Sempron, Athlon 64, Athlon 64 X2, Athlon 64 FX, Phenom, Phenom II X4. CPU Socket : INTEL socket 1366, 775, AMD: socket AM2/AM3/AM2+. Solution : Evolution serial provides... [See More]
- Material: Aluminum
- L: 122
- Device: Active Heat Sink
- W: 108
from Sanyo Denki America, Inc.
CPU cooler for Intel ® PentiumIII (FC-PGA2) / 866MHz. [See More]
- Material: Aluminum
- L: 68
- Device: Active Heat Sink
- W: 67.3
from Dynatron Corp.
CPU Support : Intel ® Core ™ i3, Core ™ i5, Socket LGA1156, Core ™ i7, Socket LGA1366, Core ™2 Quad, Socket LGA775. AMD ® Athlon ™ X2 / FX, Phenom ™ X4, Socket AM2 / AM2+ / AM3. CPU Socket : INTEL: socket 1156, 1366, 775, AMD: socket AM2/AM3/AM2+. Solution... [See More]
- Material: Aluminum
- L: 124
- Device: Active Heat Sink
- W: 148
from Sanyo Denki America, Inc.
CPU cooler for Intel ® 775-land LGA Package. [See More]
- Material: Aluminum; Copper
- L: 72
- Device: Active Heat Sink
- W: 72.1
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670 & I5-750; Xeon ® Processor 3400 Series; Core... [See More]
- Material: Aluminum; Copper; Mixed
- L: 106
- Device: Active Heat Sink
- W: 106
from Sanyo Denki America, Inc.
CPU cooler for Intel Pentium 4 Processor (775-land LGA Package) [See More]
- Material: Aluminum
- L: 72
- Device: Active Heat Sink
- W: 72.1
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® 2nd Generation Core ™ i7-2600, i5-2500 series & Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670... [See More]
- Material: Aluminum; Copper; Mixed
- L: 106
- Device: Active Heat Sink
- W: 106
from Sanyo Denki America, Inc.
CPU cooler for Intel ® Pentium4 (Socket478) / 2.80GHz. [See More]
- Material: Aluminum
- L: 95
- Device: Active Heat Sink
- W: 90
from Dynatron Corp.
CPU Support : AMD Athlon 64 3700+ Athlon 64 4000+ Sempron 3300+ Athlon 64 FX 53. CPU Socket : 754/939/940. Solution : 70 x 70 x 15mm fan, Aluminum Heatsink, Desktop solution [See More]
- Material: Aluminum
- L: 110
- Device: Active Heat Sink
- W: 78
from Sanyo Denki America, Inc.
CPU cooler for Intel ® Pentium4 (Socket478) / 3.06GHz. [See More]
- Material: Aluminum
- L: 95
- Device: Active Heat Sink
- W: 90
from Dynatron Corp.
CPU Support : AMD up to Athlon ™ 64 X2 Dual-Core 5200+ and Next-Generation AMD Opteron ™ 2.8Ghz. CPU Socket : AM2/AM2+/AM3. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 106
- Device: Active Heat Sink
- W: 77
from Sanyo Denki America, Inc.
CPU cooler for Intel ® Pentium4 (Socket478). [See More]
- Material: Aluminum; Copper
- L: 95
- Device: Active Heat Sink
- W: 90
from Dynatron Corp.
CPU Support : AMD ® Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 100
- Device: Active Heat Sink
- W: 77.2
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series up to 135 Watts. CPU Socket : G34. Solution : 77 x 77 x 20mm fan with PWM function, Copper Base & Aluminum Stacked Fins with Heatpipes embeded 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 114
- Device: Active Heat Sink
- W: 75.5
from Dynatron Corp.
CPU Support : AMD ®:K7 AMD ® Recommended up to XP2100+, MP2100+ & Sempron 3000+; Intel ®: 933MHZ and 1/1.26GHZ and 1.40 Ghz &. CPU Socket : A/462/370. Solution : 60 x 60 x 10mm fan, Aluminum Heatsink, Desktop solution [See More]
- Material: Aluminum
- L: 70
- Device: Active Heat Sink
- W: 63
from Dynatron Corp.
CPU Support : Intel ® P4 3.4Ghz and P4EE up to 3.4GHz. CPU Socket : 478. Solution : 60 x 60 x 10mm fan, Aluminum Heatsink, 2U&Up server & Desktop solution [See More]
- Material: Aluminum
- L: 90
- Device: Active Heat Sink
- W: 76
from Dynatron Corp.
CPU Support : AMD ® AMD ® Socket C32 Opetron 4100 Series & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : C32/F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server... [See More]
- Material: Aluminum; Copper; Mixed
- L: 100
- Device: Active Heat Sink
- W: 78
from Dynatron Corp.
CPU Support : AMD ® Socket C32 Opetron 4100 Series & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : C32/F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 100
- Device: Active Heat Sink
- W: 78
from Dynatron Corp.
CPU Support : AMD ® Socket C32 Opetron 4100 Series & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : C32/F 1207. Solution : 77 x 77 x 20mm fan with PWM function, Copper Base & Aluminum Fins with Heatpipes embedded, 3U server... [See More]
- Material: Aluminum; Copper; Mixed
- L: 100
- Device: Active Heat Sink
- W: 78
from Dynatron Corp.
CPU Support : AMD ® Socket C32 Opetron 4100 Series & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series. CPU Socket : C32/F 1207. Solution : 60 x 60 x 25mm fan, Aluminum Heatsink, 2U&Up server solution [See More]
- Material: Aluminum
- L: 100
- Device: Active Heat Sink
- W: 71
from Dynatron Corp.
CPU Support : AMD ® Socket C32 Opetron 4100 Series & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series. CPU Socket : C32/F 1207. Solution : 60 x 60 x 25mm fan, Aluminum Heatsink, 2U&Up server solution [See More]
- Material: Aluminum
- L: 100
- Device: Active Heat Sink
- W: 71
from Dynatron Corp.
CPU Support : Intel ® Xeon ™ 5500 Series Nehalem EP Processor Socket LGA 1366 E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5508, L5518. CPU Socket : 1366. Solution : Aluminum Heatsink, 1U server solution [See More]
- Material: Aluminum
- W: 90
- L: 90
- H: 27
from Dynatron Corp.
CPU Support : Intel ® Xeon ® Processor 5000 Series, W3690, W3680, W3670, W3580, W3570, W3550, W3540, W3530, W3520. CPU Socket : 1366. Solution : Low-noise à ˜92x25 PWM fan, HCC(Heatpipe Contact CPU) technology heatpipe CPU cooler with pre-printed Shin-Etsu G751 Thermal... [See More]
- Material: Aluminum
- L: 91
- Device: Active Heat Sink
- W: 91
from Dynatron Corp.
CPU Support : Intel ® Xeon ™ 5600 series Westmere Processor E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518, L5508. CPU Socket : 1366. Solution : Extrusion Aluminum Heatsink 2U&Up... [See More]
- Material: Aluminum
- W: 90
- L: 90
- H: 64.5
from Dynatron Corp.
CPU Support : Intel ® Xeon ™ 5600 series Westmere Processor X5670, X5667, X5660, X5650, E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor W5580, X5570, X5560, X5550, E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518, L5508. CPU... [See More]
- Material: Aluminum; Copper; Mixed
- L: 94
- Device: Active Heat Sink
- W: 89.5
from Dynatron Corp.
CPU Support : Intel ® Xeon ™ 5600 series Westmere Processor X5680, X5677, X5670, X5667, X5660, X5650, E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor W5580, X5570, X5560, X5550, E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518,... [See More]
- Material: Aluminum; Copper; Mixed
- W: 90
- L: 90
- H: 64
from Dynatron Corp.
CPU Support : Intel ® Xeon ™ 5600 series Westmere Processor E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518, L5508. CPU Socket : 1366. Solution : 60 x 60 x 25 mm fan with PWM... [See More]
- Material: Aluminum; Copper; Mixed
- L: 90
- Device: Active Heat Sink
- W: 90
from Dynatron Corp.
CPU Support : Intel ® Xeon ™ 5600 series Westmere Processor X5680, X5677, X5670, X5667, X5660, X5650, E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor W5580, X5570, X5560, X5550, E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518,... [See More]
- Material: Aluminum; Copper; Mixed
- L: 90
- Device: Active Heat Sink
- W: 90
from Dynatron Corp.
CPU Support : Intel ® Xeon ™ 5600 series Westmere Processor X5680, X5677, X5670, X5667, X5660, X5650, E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor W5580, X5570, X5560, X5550, E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518,... [See More]
- Material: Aluminum; Copper; Mixed
- L: 90
- Device: Active Heat Sink
- W: 90
from Dynatron Corp.
CPU Support : Intel ® Core i7 processors, Xeon Westmere 5600 series & Nehalem 5500 Series. CPU Socket : 1366. Solution : 92 x 92 x 25mm fan with PWM function, Aluminum Radial Fin Heatsink with Copper Inserted, Desktop&Workstation server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 110
- Device: Active Heat Sink
- W: 110
from Dynatron Corp.
CPU Support : Intel ® Xeon ® Tulsa, Paxville. CPU Socket : 604. Solution : 77 x 77 x 20mm fan with PWM function, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 94
- Device: Active Heat Sink
- W: 81