Aluminum CPU Coolers
from USUSTK LIMITED
Application: High-power Laser Equipment [See More]
- Material: Aluminum; Copper
- Device: Liquid Cooler
from Rego Electronics Inc.
Product Series. 1U & 2U Coolers, TDP : 35 Watts to 55 Watts. Intel : Socket G2 rPGA 988, 989, 946 & BGA1288 Coolers. AMD : FP3, FP4 & FP5 Coolers. Features & Benefits. A full range of products, customized technology, high quality, high reliability, lower noise level, long term... [See More]
- Material: Aluminum; C1100
- L: 60
- Device: Active Heat Sink
- W: 60
from ToneCooling Technology Co., Ltd
This active LGA4189 CPU cooler is designed for Intel Xeon processors on rectangular motherboards within 2U server environments, delivering efficient cooling with a copper base and aluminum fin design. AI Training Clusters. Supports NVIDIA HGX H100 8-GPU sustained cooling. 100% core Turbo Boost in... [See More]
- Material: Aluminum; Copper; Copper base, aluminum fins, and 5 heat pipes .
- L: 113
- Device: Active Heat Sink
- W: 78
from USUSTK LIMITED
Application: High-power Laser Equipment [See More]
- Material: Aluminum
- Device: Liquid Cooler
from Rego Electronics Inc.
Product Series. 1U & 2U Coolers, TDP : 35 Watts to 55 Watts. Intel : Socket G2 rPGA 988, 989, 946 & BGA1288 Coolers. AMD : FP3, FP4 & FP5 Coolers. Features & Benefits. A full range of products, customized technology, high quality, high reliability, lower noise level, long term... [See More]
- Material: Aluminum; C1100
- L: 60
- Device: Active Heat Sink
- W: 60
from ToneCooling Technology Co., Ltd
This active LGA4189 CPU cooler is engineered for efficient cooling of Intel Xeon processors on rectangular motherboards within 2U server environments, combining a high-speed fan with an aluminum fin design and heat pipes. AI/ML Clusters: Supports NVIDIA HGX H100 8-GPU configurations. Zero throttling... [See More]
- Material: Aluminum; Aluminum fins and 5 heat pipes .
- L: 113
- Device: Active Heat Sink; Vapor Cooler
- W: 80
from USUSTK LIMITED
Application: High-power Laser Equipment [See More]
- Material: Aluminum; Copper
- Device: Liquid Cooler
from Rego Electronics Inc.
Product Series. 1U & 2U Coolers, TDP : 35 Watts to 55 Watts. Intel : Socket G2 rPGA 988, 989, 946 & BGA1288 Coolers. AMD : FP3, FP4 & FP5 Coolers. Features & Benefits. A full range of products, customized technology, high quality, high reliability, lower noise level, long term... [See More]
- Material: Aluminum; C1100
- L: 60
- Device: Active Heat Sink
- W: 60
from ToneCooling Technology Co., Ltd
The TC-LGA4189 CPU cooler is specifically designed for Intel Xeon processors, providing exceptional cooling performance for high-power applications. With a robust build and optimized design, this cooler is ideal for server environments that require reliable thermal management. Enterprise Data... [See More]
- Material: Aluminum; Copper; Constructed with a copper base, aluminum fins, and four heat pipes to enhance thermal conductivity and heat transfer.
- W: 200
- L: 350
- H: 25
from USUSTK LIMITED
Application: High-power laser pump sources [See More]
- Material: Aluminum
- Device: Liquid Cooler
from Rego Electronics Inc.
Product Series. 1U & 2U Coolers, TDP : 35 Watts to 55 Watts. Intel : Socket G2 rPGA 988, 989, 946 & BGA1288 Coolers. AMD : FP3, FP4 & FP5 Coolers. Features & Benefits. A full range of products, customized technology, high quality, high reliability, lower noise level, long term... [See More]
- Material: Aluminum; C1100
- L: 60
- Device: Active Heat Sink
- W: 60
from ToneCooling Technology Co., Ltd
This active TC-LGA4189 CPU cooler is designed for reliable cooling of Intel Xeon processors on rectangular motherboards within 2U server environments. It combines a copper base with aluminum fins, heat pipes, and a high-speed PWM fan to ensure efficient thermal management. Key Features: ✅... [See More]
- Material: Aluminum; Copper; Copper base, aluminum fins, and 4 heat pipes.
- W: 78
- Device: Active Heat Sink
- H: 64.5
from USUSTK LIMITED
Application: High-power laser pump sources [See More]
- Material: Aluminum
- Device: Liquid Cooler
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Aluminum
- L: 88
- Device: Active Heat Sink
- W: 88
from ToneCooling Technology Co., Ltd
This active TC-LGA4189 CPU cooler is designed for Intel Xeon processors on rectangular motherboards in 2U server environments and above. It delivers maximum cooling performance with a copper base, aluminum fins, heat pipes, and a high-speed PWM fan for systems requiring exceptional thermal... [See More]
- Material: Aluminum; Copper; Copper base, aluminum fins, and 5 heat pipes .
- L: 113
- Device: Active Heat Sink
- W: 79
from USUSTK LIMITED
Application: Hydrogen Fuel Cell Stack [See More]
- Material: Aluminum
- Device: Liquid Cooler
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Aluminum
- L: 89
- Device: Active Heat Sink
- W: 88.7
from ToneCooling Technology Co., Ltd
This low-profile TC-LGA4189 CPU cooler is designed for Intel Xeon processors, balancing a compact form factor with efficient cooling performance. It ’s ideal for server environments where space is limited but reliable thermal management is crucial. 14mm ultra-slim design, compatible with 1U... [See More]
- Material: Aluminum; Copper; Copper base, aluminum fins, and 4 heat pipes . Some coolers utilize a copper vapor chamber base for enhanced heat dissipation .
- W: 154
- L: 169
- H: 25
from USUSTK LIMITED
Application: ADAS Domain Controller [See More]
- Material: Aluminum
- Device: Liquid Cooler
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Aluminum
- L: 89
- Device: Active Heat Sink
- W: 88.7
from ToneCooling Technology Co., Ltd
This TC-LGA7529-M95 CPU cooler is designed for Intel server processors that utilize the TC-LGA 7529-M95 socket. It balances thermal performance and noise level, making it suitable for various server environments. In the era of data-driven computing, server performance hinges on efficient thermal... [See More]
- Material: Aluminum; Copper; Copper base + aluminum fins + 6 heat pipes 7 . Some coolers have 8 heat pipes .
- W: 103
- L: 127
- H: 121
from USUSTK LIMITED
Featuring a complex heat pipe layout, this design significantly enhances thermal performance and outperforms conventional VC (Vapor Chamber) solutions. [See More]
- Material: Aluminum
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Aluminum
- L: 91
- Device: Active Heat Sink
- W: 89.5
from ToneCooling Technology Co., Ltd
High Thermal Conductivity: Utilizes Friction Stir Welding (FSW) technology to enhance heat transfer efficiency. Robust Construction: Strong, durable joints created by FSW ensure long-lasting performance under high thermal and mechanical stresses. Uniform Cooling: Advanced welding techniques... [See More]
- Material: Aluminum; Aluminum Alloy
- Weight: 6000
- Device: Liquid Cooler
from USUSTK LIMITED
Application: New Energy Vehicle Battery Tray [See More]
- Material: Aluminum
- Device: Liquid Cooler
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Aluminum
- L: 88
- Device: Active Heat Sink
- W: 88
from ToneCooling Technology Co., Ltd
High Thermal Conductivity: Utilizes Friction Stir Welding (FSW) technology to enhance heat transfer efficiency. Robust Construction: Strong, durable joints created by FSW ensure long-lasting performance under high thermal and mechanical stresses. Uniform Cooling: Advanced welding techniques... [See More]
- Material: Aluminum; Aluminum
- Device: Liquid Cooler
from USUSTK LIMITED
Precision machining with innovative optical fiber coil processing technology. [See More]
- Material: Aluminum
- Device: Liquid Cooler
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Aluminum
- L: 90
- Device: Active Heat Sink
- W: 90
from ToneCooling Technology Co., Ltd
#183;High Efficiency: Provides excellent thermal conductivity for stable operation. ·Durability: Withstands high pressure and temperatures, suitable for tough conditions. ·Complex Design Flexibility: Can be custom-designed with intricate channels. ·Leak-Proof: Fully sealed to prevent... [See More]
- Material: Aluminum; Aluminum
from USUSTK LIMITED
Application: High-power Laser Equipment [See More]
- Material: Aluminum
- Device: Liquid Cooler
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Aluminum
- L: 77
- Device: Active Heat Sink
- W: 77
from ToneCooling Technology Co., Ltd
High Thermal Conductivity: Utilizes Friction Stir Welding (FSW) technology to enhance heat transfer efficiency. Robust Construction: Strong, durable joints created by FSW ensure long-lasting performance under high thermal and mechanical stresses. Uniform Cooling: Advanced welding techniques... [See More]
- Material: Aluminum; Aluminum
- Device: Liquid Cooler
from USUSTK LIMITED
Application: High-power laser pump sources [See More]
- Material: Aluminum
- Device: Liquid Cooler
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Aluminum
- L: 88
- Device: Active Heat Sink
- W: 88
from ToneCooling Technology Co., Ltd
High Thermal Conductivity: Utilizes Friction Stir Welding (FSW) technology to enhance heat transfer efficiency. Robust Construction: Strong, durable joints created by FSW ensure long-lasting performance under high thermal and mechanical stresses. Uniform Cooling: Advanced welding techniques... [See More]
- Material: Aluminum; Aluminum
- Device: Liquid Cooler
from USUSTK LIMITED
Application: Servers [See More]
- Material: Aluminum; Copper
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Aluminum; C1100
- L: 91
- Device: Active Heat Sink
- W: 85
from ToneCooling Technology Co., Ltd
This high-performance TC-LGA7529 CPU cooler is designed for Intel server processors utilizing the TC-LGA 7529 socket. It provides a balance of efficient cooling and quiet operation, making it an excellent choice for various server environments. Enterprise-Grade Virtualization Platforms. Optimized... [See More]
- Material: Aluminum; Copper; Copper base, aluminum fins, and 6 heat pipes . Some coolers have 8 heat pipes .
- W: 120
- L: 154
- H: 121
from Rego Electronics Inc.
REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment needed to... [See More]
- Material: Aluminum
- L: 90
- Device: Active Heat Sink
- W: 90
from ToneCooling Technology Co., Ltd
This high-performance TC-LGA7529-M98 CPU cooler is engineered for Intel server processors using the TC-LGA 7529-M98 socket, offering a balance of efficient cooling and quiet operation, ideal for 2U server environments. Cloud Data Centers. Designed for hyperscale cloud infrastructure, it ensures... [See More]
- Material: Aluminum; Copper; Copper base, aluminum fins, and 6 heat pipes . Some coolers have 8 heat pipes .
- W: 97.8
- L: 127
- H: 121
from ToneCooling Technology Co., Ltd
The TC-LGA 7529 socket is the platform for Intel ’s latest high-performance Xeon processors, including the “Granite Rapids AP. ” These processors are designed for demanding server and workstation applications. To maintain performance and stability, a robust cooling solution is... [See More]
- Material: Aluminum; Copper; Copper base + aluminum fins + 6 heat pipes
- W: 97.8
- L: 127
- H: 65
from ToneCooling Technology Co., Ltd
The LGA7529 CPU cooler is designed for Intel server processors with the LGA 7529 socket. These coolers come in various designs, including active heat sink, passive cooler, and liquid cooler options, to suit different server form factors and cooling requirements. Cooling Solutions: Passive Coolers:... [See More]
- Material: Aluminum; Copper; Typically made with aluminum fins, copper base, and heat pipes for efficient heat dissipation
- Device: Passive Heat Sink; Active Heat Sink
from ToneCooling Technology Co., Ltd
This compact LGA4189 CPU cooler is designed for Intel Xeon processors in space-constrained server environments (rectangular motherboard), balancing size and cooling performance. ✅ Ultra-Quiet Operation: 45 dB(A) at full load | ISO 7779 Class 3 certified for medical/education environments. [See More]
- Material: Aluminum; Copper; Copper base, aluminum fins, and 4 heat pipes.
- L: 113
- Device: Active Heat Sink; Thermo-Electric Cooler
- W: 79
from ToneCooling Technology Co., Ltd
High Thermal Conductivity: Utilizes Friction Stir Welding (FSW) technology to enhance heat transfer efficiency. Robust Construction: Strong, durable joints created by FSW ensure long-lasting performance under high thermal and mechanical stresses. Uniform Cooling: Advanced welding techniques... [See More]
- Material: Aluminum; Copper; Aluminum,Copper
from Sanyo Denki America, Inc.
CPU cooler for Intel ® PentiumIII (FC-PGA2) / 800MHz. [See More]
- Material: Aluminum
- L: 64
- Device: Active Heat Sink
- W: 50.8
from Dynatron Corp.
CPU Support : Intel ® Celeron, Celeron D, Pentium 4, Pentium D, Core 2 Duo, Core 2 Quad, Core 2 Extreme, Core i7, AMD ® Sempron, Athlon 64, Athlon 64 X2, Athlon 64 FX, Phenom, Phenom II X4. CPU Socket : INTEL socket 1366, 775, AMD: socket AM2/AM3/AM2+. Solution : Evolution serial provides... [See More]
- Material: Aluminum
- L: 122
- Device: Active Heat Sink
- W: 108
from Sanyo Denki America, Inc.
CPU cooler for Intel ® PentiumIII (FC-PGA2) / 866MHz. [See More]
- Material: Aluminum
- L: 68
- Device: Active Heat Sink
- W: 67.3
from Dynatron Corp.
CPU Support : Intel ® Core ™ i3, Core ™ i5, Socket LGA1156, Core ™ i7, Socket LGA1366, Core ™2 Quad, Socket LGA775. AMD ® Athlon ™ X2 / FX, Phenom ™ X4, Socket AM2 / AM2+ / AM3. CPU Socket : INTEL: socket 1156, 1366, 775, AMD: socket AM2/AM3/AM2+. Solution... [See More]
- Material: Aluminum
- L: 124
- Device: Active Heat Sink
- W: 148
from Sanyo Denki America, Inc.
CPU cooler for Intel ® 775-land LGA Package. [See More]
- Material: Aluminum; Copper
- L: 72
- Device: Active Heat Sink
- W: 72.1
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670 & I5-750; Xeon ® Processor 3400 Series; Core... [See More]
- Material: Aluminum; Copper; Mixed
- L: 106
- Device: Active Heat Sink
- W: 106
from Sanyo Denki America, Inc.
CPU cooler for Intel Pentium 4 Processor (775-land LGA Package) [See More]
- Material: Aluminum
- L: 72
- Device: Active Heat Sink
- W: 72.1
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® 2nd Generation Core ™ i7-2600, i5-2500 series & Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670... [See More]
- Material: Aluminum; Copper; Mixed
- L: 106
- Device: Active Heat Sink
- W: 106
from Sanyo Denki America, Inc.
CPU cooler for Intel ® Pentium4 (Socket478) / 2.80GHz. [See More]
- Material: Aluminum
- L: 95
- Device: Active Heat Sink
- W: 90
from Dynatron Corp.
CPU Support : AMD Athlon 64 3700+ Athlon 64 4000+ Sempron 3300+ Athlon 64 FX 53. CPU Socket : 754/939/940. Solution : 70 x 70 x 15mm fan, Aluminum Heatsink, Desktop solution [See More]
- Material: Aluminum
- L: 110
- Device: Active Heat Sink
- W: 78
from Sanyo Denki America, Inc.
CPU cooler for Intel ® Pentium4 (Socket478) / 3.06GHz. [See More]
- Material: Aluminum
- L: 95
- Device: Active Heat Sink
- W: 90
from Dynatron Corp.
CPU Support : AMD up to Athlon ™ 64 X2 Dual-Core 5200+ and Next-Generation AMD Opteron ™ 2.8Ghz. CPU Socket : AM2/AM2+/AM3. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 106
- Device: Active Heat Sink
- W: 77
from Sanyo Denki America, Inc.
CPU cooler for Intel ® Pentium4 (Socket478). [See More]
- Material: Aluminum; Copper
- L: 95
- Device: Active Heat Sink
- W: 90
from Dynatron Corp.
CPU Support : AMD ® Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 100
- Device: Active Heat Sink
- W: 77.2
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series up to 135 Watts. CPU Socket : G34. Solution : 77 x 77 x 20mm fan with PWM function, Copper Base & Aluminum Stacked Fins with Heatpipes embeded 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 114
- Device: Active Heat Sink
- W: 75.5
from Dynatron Corp.
CPU Support : AMD ®:K7 AMD ® Recommended up to XP2100+, MP2100+ & Sempron 3000+; Intel ®: 933MHZ and 1/1.26GHZ and 1.40 Ghz &. CPU Socket : A/462/370. Solution : 60 x 60 x 10mm fan, Aluminum Heatsink, Desktop solution [See More]
- Material: Aluminum
- L: 70
- Device: Active Heat Sink
- W: 63
from Dynatron Corp.
CPU Support : Intel ® P4 3.4Ghz and P4EE up to 3.4GHz. CPU Socket : 478. Solution : 60 x 60 x 10mm fan, Aluminum Heatsink, 2U&Up server & Desktop solution [See More]
- Material: Aluminum
- L: 90
- Device: Active Heat Sink
- W: 76
from Dynatron Corp.
CPU Support : AMD ® AMD ® Socket C32 Opetron 4100 Series & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : C32/F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server... [See More]
- Material: Aluminum; Copper; Mixed
- L: 100
- Device: Active Heat Sink
- W: 78
from Dynatron Corp.
CPU Support : AMD ® Socket C32 Opetron 4100 Series & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : C32/F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Material: Aluminum; Copper; Mixed
- L: 100
- Device: Active Heat Sink
- W: 78
from Dynatron Corp.
CPU Support : AMD ® Socket C32 Opetron 4100 Series & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : C32/F 1207. Solution : 77 x 77 x 20mm fan with PWM function, Copper Base & Aluminum Fins with Heatpipes embedded, 3U server... [See More]
- Material: Aluminum; Copper; Mixed
- L: 100
- Device: Active Heat Sink
- W: 78
from Dynatron Corp.
CPU Support : AMD ® Socket C32 Opetron 4100 Series & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series. CPU Socket : C32/F 1207. Solution : 60 x 60 x 25mm fan, Aluminum Heatsink, 2U&Up server solution [See More]
- Material: Aluminum
- L: 100
- Device: Active Heat Sink
- W: 71
from Dynatron Corp.
CPU Support : AMD ® Socket C32 Opetron 4100 Series & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series. CPU Socket : C32/F 1207. Solution : 60 x 60 x 25mm fan, Aluminum Heatsink, 2U&Up server solution [See More]
- Material: Aluminum
- L: 100
- Device: Active Heat Sink
- W: 71
from Dynatron Corp.
CPU Support : Intel ® Xeon ™ 5500 Series Nehalem EP Processor Socket LGA 1366 E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5508, L5518. CPU Socket : 1366. Solution : Aluminum Heatsink, 1U server solution [See More]
- Material: Aluminum
- W: 90
- L: 90
- H: 27
from Dynatron Corp.
CPU Support : Intel ® Xeon ® Processor 5000 Series, W3690, W3680, W3670, W3580, W3570, W3550, W3540, W3530, W3520. CPU Socket : 1366. Solution : Low-noise à ˜92x25 PWM fan, HCC(Heatpipe Contact CPU) technology heatpipe CPU cooler with pre-printed Shin-Etsu G751 Thermal... [See More]
- Material: Aluminum
- L: 91
- Device: Active Heat Sink
- W: 91
from Dynatron Corp.
CPU Support : Intel ® Xeon ™ 5600 series Westmere Processor E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518, L5508. CPU Socket : 1366. Solution : Extrusion Aluminum Heatsink 2U&Up... [See More]
- Material: Aluminum
- W: 90
- L: 90
- H: 64.5
from Dynatron Corp.
CPU Support : Intel ® Xeon ™ 5600 series Westmere Processor X5670, X5667, X5660, X5650, E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor W5580, X5570, X5560, X5550, E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518, L5508. CPU... [See More]
- Material: Aluminum; Copper; Mixed
- L: 94
- Device: Active Heat Sink
- W: 89.5
from Dynatron Corp.
CPU Support : Intel ® Xeon ™ 5600 series Westmere Processor X5680, X5677, X5670, X5667, X5660, X5650, E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor W5580, X5570, X5560, X5550, E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518,... [See More]
- Material: Aluminum; Copper; Mixed
- W: 90
- L: 90
- H: 64
from Dynatron Corp.
CPU Support : Intel ® Xeon ™ 5600 series Westmere Processor E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518, L5508. CPU Socket : 1366. Solution : 60 x 60 x 25 mm fan with PWM... [See More]
- Material: Aluminum; Copper; Mixed
- L: 90
- Device: Active Heat Sink
- W: 90
from Dynatron Corp.
CPU Support : Intel ® Xeon ™ 5600 series Westmere Processor X5680, X5677, X5670, X5667, X5660, X5650, E5645, E5640, E5630, E5620, L5640, L5638, L5630, L5618, L5609 & 5500 Series Nehalem EP Processor W5580, X5570, X5560, X5550, E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506, L5518,... [See More]
- Material: Aluminum; Copper; Mixed
- L: 90
- Device: Active Heat Sink
- W: 90