12 VDC CPU Coolers
from ToneCooling Technology Co., Ltd
CMc is a sandwich composite sheet with a core material of molybdenum plate and oxygen-free copper plates on both sides.It was invented by Americans in the 1990s to solve the heat dissipation of F22 fighter power devices. This material combines the characteristics of molybdenum ’s low thermal... [See More]
- Voltage: 12VDC
- W: 89.5
- L: 90
- H: 69
from Rego Electronics Inc.
Product Series -. Chip Size : 35mm x 35mm to 52mm x 52mm, Height : 8.5mm to 10 mm, TDP : 10 Watts to 20 Watts. Features & Benefits -. A full range of products, High quality, Lower noise level, Long term supply, Customization available. Target Market -. Storage, Industrial PC, Embedded Board,... [See More]
- Voltage: 12VDC
- L: 40
- Device: Active Heat Sink
- W: 40
from ToneCooling Technology Co., Ltd
CMC is a sandwich composite sheet with a core material of molybdenum plate and oxygen-free copper plates on both sides. It was invented by Americans in the 1990s to solve the heat dissipation of F22 fighter power devices. This material combines the characteristics of molybdenum ’s low thermal... [See More]
- Voltage: 12VDC
- W: 89.5
- L: 90
- H: 69
from ToneCooling Technology Co., Ltd
Copper/Kovar/Copper, Copper/Invar/Copper, and Copper/Steel/Copper series products are similar to CMC and CPC series sandwich composite materials. They combine the high thermal conductivity of copper with the low thermal expansion coefficient of Kovar, Invar, and steel. Although the thermal... [See More]
- Voltage: 12VDC
- W: 89.5
- L: 90
- H: 69
from ToneCooling Technology Co., Ltd
Diamond copper is a composite material made of diamond powder and a copper alloy. It utilizes high-quality artificial synthetic diamond powder, which boasts a thermal conductivity of about 1000W/M.K and an extremely low thermal expansion coefficient. Through the appropriate process, the diamond... [See More]
- Voltage: 12VDC
- W: 89.5
- L: 90
- H: 69
from ToneCooling Technology Co., Ltd
Lasers come in many different qualities,and carbon dioxide lasers are stillused in certain specific situations. However, solid-state lasers are currently the main type, and semiconductorlasers are the most common. The use of crystal ” oxygen-free copper heat sinks was prevalent over a decade... [See More]
- Voltage: 12VDC
- W: 89.5
- L: 90
- H: 69
from ToneCooling Technology Co., Ltd
Molybdenum copper series is also a pseudo alloy. Molybdenum and copper are not miscible. It fully combines the high thermal conductivity, high melting point, low thermal expansion coefficient, and high thermal conductivity of molybdenum. The ratio of molybdenum to copper can be adjusted arbitrarily,... [See More]
- Voltage: 12VDC
- W: 89.5
- L: 90
- H: 69
from ToneCooling Technology Co., Ltd
#183;High Thermal Performance: Efficiently dissipates heat to enhance cooling in servers and data centers. ·Customizable Designs: Tailored to specific cooling needs with various sizes and configurations. ·Robust Construction: Durable materials designed to endure high-demand server... [See More]
- Voltage: 12VDC
- W: 88
- L: 96
- H: 67
from ToneCooling Technology Co., Ltd
Top Benefits of Using Coolserver Heat Sinks for Electronic Devices. CPU coolserver W2. The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and affordable price.When... [See More]
- Voltage: 12VDC
- W: 95
- L: 108
- H: 126
from ToneCooling Technology Co., Ltd
Advanced Liquid Cooling Technology from Coolserver for Modern Data Centers. CPU coolserver W2. The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and affordable... [See More]
- Voltage: 12VDC
- W: 78
- L: 113
- H: 64
from ToneCooling Technology Co., Ltd
Optimize Your Cooling with Coolserver ’s High-Efficiency Heat Sink Solutions. CPU coolserver P9. The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and... [See More]
- Voltage: 12VDC
- W: 78
- L: 108
- H: 64
from ToneCooling Technology Co., Ltd
#183;High Thermal Performance: Efficiently dissipates heat to enhance cooling in servers and data centers. ·Customizable Designs: Tailored to specific cooling needs with various sizes and configurations. ·Robust Construction: Durable materials designed to endure high-demand server... [See More]
- Voltage: 12VDC
- W: 95
- L: 110
- H: 127
from ToneCooling Technology Co., Ltd
High-Quality Liquid Cooling Plates by Coolserver for Server Applications. CPU coolserver H2. The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and affordable... [See More]
- Voltage: 12VDC
- W: 90
- L: 91
- H: 67.3
from ToneCooling Technology Co., Ltd
Custom Heat Sink Solutions from Coolserver for Electronics Cooling. CPU coolserver B6. The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and affordable price.When... [See More]
- Voltage: 12VDC
- W: 89.5
- L: 90
- H: 69
from Sanyo Denki America, Inc.
CPU cooler for Intel ® PentiumIII (FC-PGA2) / 800MHz. [See More]
- Voltage: 12VDC
- L: 64
- Device: Active Heat Sink
- W: 50.8
from Dynatron Corp.
CPU Support : Intel ® Celeron, Celeron D, Pentium 4, Pentium D, Core 2 Duo, Core 2 Quad, Core 2 Extreme, Core i7, AMD ® Sempron, Athlon 64, Athlon 64 X2, Athlon 64 FX, Phenom, Phenom II X4. CPU Socket : INTEL socket 1366, 775, AMD: socket AM2/AM3/AM2+. Solution : Evolution serial provides... [See More]
- Voltage: 12VDC
- L: 122
- Device: Active Heat Sink
- W: 108
from Sanyo Denki America, Inc.
CPU cooler for Intel ® PentiumIII (FC-PGA2) / 866MHz. [See More]
- Voltage: 12VDC
- L: 68
- Device: Active Heat Sink
- W: 67.3
from Dynatron Corp.
CPU Support : Intel ® Core ™ i3, Core ™ i5, Socket LGA1156, Core ™ i7, Socket LGA1366, Core ™2 Quad, Socket LGA775. AMD ® Athlon ™ X2 / FX, Phenom ™ X4, Socket AM2 / AM2+ / AM3. CPU Socket : INTEL: socket 1156, 1366, 775, AMD: socket AM2/AM3/AM2+. Solution... [See More]
- Voltage: 12VDC
- L: 124
- Device: Active Heat Sink
- W: 148
from Sanyo Denki America, Inc.
CPU cooler for Intel ® 775-land LGA Package. [See More]
- Voltage: 12VDC
- L: 72
- Device: Active Heat Sink
- W: 72.1
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670 & I5-750; Xeon ® Processor 3400 Series; Core... [See More]
- Voltage: 12VDC
- L: 106
- Device: Active Heat Sink
- W: 106
from Sanyo Denki America, Inc.
CPU cooler for Intel Pentium 4 Processor (775-land LGA Package) [See More]
- Voltage: 12VDC
- L: 72
- Device: Active Heat Sink
- W: 72.1
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® 2nd Generation Core ™ i7-2600, i5-2500 series & Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670... [See More]
- Voltage: 12VDC
- L: 106
- Device: Active Heat Sink
- W: 106
from Sanyo Denki America, Inc.
CPU cooler for Intel ® Pentium4 (Socket478) / 2.80GHz. [See More]
- Voltage: 12VDC
- L: 95
- Device: Active Heat Sink
- W: 90
from Dynatron Corp.
CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Voltage: 12VDC
- L: 106
- Device: Active Heat Sink
- W: 79
from Sanyo Denki America, Inc.
CPU cooler for Intel ® Pentium4 (Socket478) / 3.06GHz. [See More]
- Voltage: 12VDC
- L: 95
- Device: Active Heat Sink
- W: 90
from Dynatron Corp.
CPU Support : AMD Athlon 64 3700+ Athlon 64 4000+ Sempron 3300+ Athlon 64 FX 53. CPU Socket : 754/939/940. Solution : 70 x 70 x 15mm fan, Aluminum Heatsink, Desktop solution [See More]
- Voltage: 12VDC
- L: 110
- Device: Active Heat Sink
- W: 78
from Sanyo Denki America, Inc.
CPU cooler for Intel ® Pentium4 (Socket478). [See More]
- Voltage: 12VDC
- L: 95
- Device: Active Heat Sink
- W: 90
from Dynatron Corp.
CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 60 x 60 x 25mm fan, Copper Heatsink with L Fin, 2U&Up server solution [See More]
- Voltage: 12VDC
- L: 106
- Device: Active Heat Sink
- W: 73
from Dynatron Corp.
CPU Support : Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 60 x 60 x 25mm fan with PWM function, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Voltage: 12VDC
- L: 100
- Device: Active Heat Sink
- W: 71
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series. CPU Socket : G34. Solution : Copper heatsink with Aluminum 70x70x15mm blower for 1U Server solution. [See More]
- Voltage: 12VDC
- L: 115
- Device: Active Heat Sink
- W: 75
from Dynatron Corp.
CPU Support : AMD ® Socket AM2/AM2+/AM3. CPU Socket : AM2/AM2+/AM3. Solution : 70 x 70 x 15 aluminum blower, Copper Heatsink, 1U server solution [See More]
- Voltage: 12VDC
- L: 106
- Device: Active Heat Sink
- W: 79
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series. CPU Socket : G34. Solution : 60 x 60 x 25mm PWM fan, Copper Hestink with Stacked Fin, 2U&Up server solution [See More]
- Voltage: 12VDC
- L: 115
- Device: Active Heat Sink
- W: 72
from Dynatron Corp.
CPU Support : AMD up to Athlon ™ 64 X2 Dual-Core 5200+ and Next-Generation AMD Opteron ™ 2.8Ghz. CPU Socket : AM2/AM2+/AM3. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Voltage: 12VDC
- L: 106
- Device: Active Heat Sink
- W: 77
from Dynatron Corp.
CPU Support : AMD ® Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 77 x 77 x 20mm fan, Copper Base & Aluminum Fins with Heatpipes embedded, 2U&Up server solution [See More]
- Voltage: 12VDC
- L: 100
- Device: Active Heat Sink
- W: 77.2
from Dynatron Corp.
CPU Support : AMD ® Next Generation ™ Opteron. CPU Socket : F 1207(4.1 Mounting Pitch). Solution : 77 x 77 x 20mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Voltage: 12VDC
- L: 114
- Device: Active Heat Sink
- W: 77.2
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6000 Series up to 135 Watts. CPU Socket : G34. Solution : 77 x 77 x 20mm fan with PWM function, Copper Base & Aluminum Stacked Fins with Heatpipes embeded 2U&Up server solution [See More]
- Voltage: 12VDC
- L: 114
- Device: Active Heat Sink
- W: 75.5
from Dynatron Corp.
CPU Support : AMD Dual-Core Opteron. CPU Socket : 754/939/940. Solution : 60 x 60 x 25mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Voltage: 12VDC
- L: 100
- Device: Active Heat Sink
- W: 71
from Dynatron Corp.
CPU Support : AMD ® K8 and Opteron Athlon 64 FX Opteron 150/250/850. CPU Socket : 754/939/940. Solution : 60 x 60 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Voltage: 12VDC
- L: 100
- Device: Active Heat Sink
- W: 74
from Dynatron Corp.
CPU Support : AMD ® Socket C32 Opetron 4100 Series & & Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series. CPU Socket : C32/F 1207/754/939/940. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Voltage: 12VDC
- L: 100
- Device: Active Heat Sink
- W: 74
from Dynatron Corp.
CPU Support : AMD ® Opteron 150/250/850. CPU Socket : 754/939/940. Solution : 70 x 70 x 15mm aluminum blower, Copper Heatsink, 1U server solution [See More]
- Voltage: 12VDC
- L: 100
- Device: Active Heat Sink
- W: 74
from Dynatron Corp.
CPU Support : AMD ® Dual-Core 4.1" Mounting Pitch. CPU Socket : F 1207. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Voltage: 12VDC
- L: 115
- Device: Active Heat Sink
- W: 77
from Dynatron Corp.
CPU Support : AMD ® Opteron ™ 6100 Series. CPU Socket : G34. Solution : 75x15mm Aluminum blower, Copper heatsink with heatpipes embedded for 1U Server solution [See More]
- Voltage: 12VDC
- L: 115
- Device: Active Heat Sink
- W: 79
from Dynatron Corp.
CPU Support : AMD ® Dual-Core. CPU Socket : F 1207(4.1 Mounting Pitch). Solution : 60 x 60 x 25mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Voltage: 12VDC
- L: 115
- Device: Active Heat Sink
- W: 72
from Dynatron Corp.
CPU Support : AMD ® Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 60 x 60 x 25mm fan, Copper Hestink with L Fin, 2U&Up server solution [See More]
- Voltage: 12VDC
- L: 100
- Device: Active Heat Sink
- W: 71
from Dynatron Corp.
CPU Support : AMD ® Shanghai & Barcelona processors -Third-Generation Opteron 2300 & 8300 series & Second-Generation Opteron. CPU Socket : F 1207. Solution : 70 x 70 x 15mm blower, Copper Heatsink, 1U server solution [See More]
- Voltage: 12VDC
- L: 100
- Device: Active Heat Sink
- W: 77
from Dynatron Corp.
CPU Support : AMD ®:K7 AMD ® Recommended up to XP2100+, MP2100+ & Sempron 3000+; Intel ®: 933MHZ and 1/1.26GHZ and 1.40 Ghz &. CPU Socket : A/462/370. Solution : 60 x 60 x 10mm fan, Aluminum Heatsink, Desktop solution [See More]
- Voltage: 12VDC
- L: 70
- Device: Active Heat Sink
- W: 63